JP2004336284A - Image pickup apparatus and camera equipped with the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an image pickup apparatus which is made thin and to provide a camera equipped with the apparatus. <P>SOLUTION: The image pickup apparatus is provided with: an image pickup device 15; an image pickup device positioning means which abuts on one face of the image pickup device and positions the image pickup device; and a printed board 17 where a land which is electrically connected to the image pickup device is formed. A camera is provided with the image pickup apparatus. The printed circuit board and the image pickup device positioning means are in a positional relation where they are not overlapped if viewed from an optical axis direction and are in the positional relation where they are overlapped if viewed from a direction orthogonal to an optical axis. Since the thickness of the printed circuit board can be absorbed in the thickness of the image pickup device positioning member, the image pickup apparatus and the camera using the apparatus can be thinned. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to an image pickup device provided with an image pickup device and a camera provided with the image pickup device, and more particularly, to a thinned image pickup device and a camera provided with the image pickup device.
[0002]
[Prior art]
2. Description of the Related Art Conventionally, a so-called digital camera that photoelectrically converts a subject image by an image sensor, processes the photoelectrically converted data, and records the processed data as an image in a recording memory has been widely used.
[0003]
Compared to conventional film cameras, these digital cameras are rapidly miniaturized due to the fact that no space is required for a patrone room, a film winding shaft, and the like, and that the screen size of an image sensor is extremely small. .
[0004]
As an approach to the technical development related to these miniaturizations, various devices have been conventionally devised regarding the reduction of dimensions related to the assembly of the image sensor and the printed circuit board.
[0005]
For example, by disposing a printed circuit board of an image pickup device between an image pickup device positioning means (positioning member) for positioning the mounting position of the image pickup device with respect to the image pickup optical system and the image pickup device, the printed circuit board can be assembled in the thickness direction. A technique for reducing the size is disclosed (for example, see Patent Document 1).
[0006]
Further, there is disclosed a technology of a holding mechanism of an image sensor package which facilitates position adjustment of an image sensor package closely attached to a printed board (for example, see Patent Document 2).
[0007]
[Patent Document 1]
JP-A-11-261904 (pages 4 to 5, FIG. 2)
[0008]
[Patent Document 2]
JP-A-2001-285696 (pages 3 to 7, FIGS. 4 to 9)
[0009]
[Problems to be solved by the invention]
In recent years, various types of digital cameras have been developed in which not only the front area but also the thickness is reduced to improve portability.
[0010]
Further, the digital camera includes an imaging device including an imaging optical system and an imaging element, an electric flash unit, a finder unit, for example, an image display unit represented by an LCD, and substrates on which electronic components for drive control are mounted. Although used as a main component unit, among these units, the imaging device that requires the most space in the thickness direction is the imaging device, and the dimension in the thickness direction of the imaging device determines the thickness of the camera. Is the current situation.
[0011]
However, the conventional imaging apparatus has a configuration in which the thickness of each of the imaging element, the imaging element positioning member, and the printed circuit board, which are arranged behind the imaging optical system, are accumulated as the minimum required dimensions. The above dimensions could not be reduced.
[0012]
SUMMARY OF THE INVENTION It is an object of the present invention to provide an imaging device which solves the above-mentioned problems and which can be made thinner, and a thin camera provided with the imaging device and which is excellent in portability.
[0013]
[Means for Solving the Problems]
The above object is achieved by the following constitutions.
[0014]
(1) An image sensor, an image sensor positioning means which is in contact with one surface of the image sensor to position the image sensor, and a printed board on which a land electrically connected to the image sensor is formed. In the imaging device having
The printed circuit board and the image sensor positioning means are arranged so as to have a positional relationship that does not overlap when viewed from the optical axis direction, and to have a positional relationship that overlaps when viewed from a direction perpendicular to the optical axis. An imaging device characterized by the following.
[0015]
(2) The printed board has an opening or a notch,
The opening or notch and the image sensor positioning means are arranged so as to have a positional relationship that does not overlap when viewed from the optical axis direction, and to have a positional relationship that overlaps when viewed from a direction perpendicular to the optical axis. The imaging device according to (1), wherein:
[0016]
(3) The imaging device according to (1) or (2), wherein the attachment position of the imaging device positioning means to the imaging device is provided near the outside of a side of the imaging device without a lead portion.
[0017]
(4) An image sensor, a printed circuit board on which a land electrically connected to the image sensor is formed, and an image sensor positioning means which is in contact with one surface of the image sensor and positions the image sensor. An imaging device arranged such that the printed circuit board and the imaging element positioning means do not overlap when viewed from the optical axis direction, and overlap when viewed from a direction perpendicular to the optical axis. A camera comprising:
[0018]
(5) The printed board has an opening or a notch,
The opening or notch and the image sensor positioning means are arranged so as not to overlap when viewed from the optical axis direction, and to overlap when viewed from a direction perpendicular to the optical axis. The camera according to (4), further comprising an imaging device.
[0019]
BEST MODE FOR CARRYING OUT THE INVENTION
A configuration of a camera including an imaging device according to an embodiment of the present invention will be described with reference to FIG.
[0020]
Hereinafter, the present invention will be described in detail with reference to embodiments, but the present invention is not limited thereto.
[0021]
FIG. 1 is an example of an external view of a camera equipped with a zoom lens provided with the imaging device of the present invention. FIG. 1A is a perspective view of the front of the camera, and FIG. 1B is a perspective view of the rear of the camera.
[0022]
In FIG. 1A, reference numeral 81 denotes a zoom variable-magnification image pickup optical system. 82 is a finder window, 83 is a release button, 84 is a flash light emitting unit, 86 is a microphone, 87 is a strap attachment unit, and 88 is a connection terminal (for example, a USB terminal) with an external device. Reference numeral 89 denotes a lens cover. When not used, the imaging optical system 81 is collapsed, and the lens cover 89 is slid to cover the front surfaces of the imaging optical system 81, the finder window 82, and the flash light emitting unit 84. ing.
[0023]
When the release button 83 is depressed one step (hereinafter referred to as ON of the switch S1), a photographing preparation operation of the camera, that is, a focusing operation or a photometric operation is performed. The operation is performed.
[0024]
In FIG. 1B, reference numeral 91 denotes a viewfinder eyepiece, and reference numeral 92 denotes red and green display lamps, which display information of AF and AE to the photographer by turning on or blinking when the switch S1 is turned on. is there. Reference numeral 93 denotes a zoom button for performing zoom up and zoom down. Reference numeral 94 denotes a speaker, which reproduces sound recorded by the microphone 86 and emits a release sound and the like. Reference numeral 95 denotes a menu / set button, reference numeral 96 denotes a selection button, which is a four-way switch, and reference numeral 100 denotes an image display unit which displays images, other character information, and the like. The menu / set button 95 has a function of displaying various menus on the image display unit 100, selecting with the select button 96, and confirming with the menu / set button 95. A reproduction button 97 is a button for reproducing a captured image. Reference numeral 98 denotes a display button for selecting display or deletion of an image displayed on the image display unit 100 or other character information. Reference numeral 99 denotes an erasing button, which is a button for erasing an image recorded and recorded. 101 is a tripod hole, and 102 is a battery / card cover. Inside the battery / card cover 102, a battery for supplying power to the camera and a card-type removable memory for recording a captured image are mounted.
[0025]
FIG. 2 is a longitudinal sectional view of the image pickup apparatus showing a state where the lens barrel is extended to the telephoto end during photographing, and FIG. 3 is a longitudinal sectional view of the image pickup apparatus showing a state where the lens barrel is collapsed when not in use.
[0026]
In the figure, 11 is a first group lens, 12 is a second group lens, 13 is a third group lens, and 14 is an optical filter (infrared cut filter and optical low pass filter). Reference numeral 15 denotes an image sensor, for example, a CCD (Charge Coupled Device) or a CMOS (Complementary Metal-Oxide Semiconductor). The first group lens 11 is held by a first group lens frame 21, the second group lens 12 is held by a second group lens frame 22, and the third group lens 13 is held by a third group lens frame 23. I have. The cam barrel 31 rotatably held by the fixed barrel 41 has a cam groove 311 and a cam groove 312 formed inside, and a pin 211 attached to the outer diameter of the first lens unit frame 21 in the cam groove 311. At the same time, a pin 221 attached to the outer diameter of the second lens barrel 22 is cam-engaged with the cam groove 312.
[0027]
The first lens group frame 21 and the second lens group frame 22 are also engaged with a known linear guide member (not shown). It has a configuration.
[0028]
The subject light is imaged on the image sensor 15 by a photographing lens constituted by the first group lens 11, the second group lens 12, and the third group lens 13, and is photoelectrically converted. The high frequency component of the subject light is removed by the optical filter 13 to prevent false colors and moiré.
[0029]
The cam barrel 31 is rotatably held by the fixed barrel 41, and a gear 313 formed on the outer diameter of the cam barrel 31 meshes with a zooming gear G1 connected to a zoom motor (not shown). The fixed body 41 is fixed integrally with the main plate 42 by screws N1, and is fixed to the frame 50 of the camera body by screws N2.
[0030]
In the vicinity of the second group lens 12 of the second lens group lens frame 22, for example, an aperture shutter unit SS capable of switching an aperture value and performing a shutter function is provided, and an aperture shutter member SS1 provided in the aperture shutter unit SS. Are located on the front surface of the second group lens 12.
[0031]
The photographing lens composed of the first group lens 11, the second group lens 12, and the third group lens 13 is a zoom lens, and the zooming motor rotates the zooming motor G1 to rotate the zooming gear G1 by a zooming operation. The first group lens 11 and the second group lens 12 are moved out of the collapsed state shown in FIG. 3 by rotating the cylinder 31, and become the widest position (not shown), and the further telephoto position shown in FIG. Move to each. When the lens barrel is retracted from the most telephoto position, the above operation is reversed.
[0032]
A third group lens frame guide shaft 421 and a focusing motor M1 are attached to the front surface of the main plate 42, and a screw G2 is fixed to the motor shaft of the focusing motor M1. A guide hole 231 that fits into the third group lens frame guide shaft 421 is formed on one side of the third group lens frame 23, and a nut portion 232 that engages with the screw G2 is formed on the other side. The guide holes of the group lens frame 23 are fitted to the third group lens frame guide shaft 421 and are slidably held.
[0033]
When the focusing motor M1 is driven by a focusing operation (for example, the switch S1 is turned ON), the rotation of the screw G2 is performed in the optical axis direction of the third lens group frame 23 because the nut 232 is engaged with the screw G2. Is converted to a straight-ahead operation to perform focus adjustment.
[0034]
FIG. 4 is a graph showing the amount of movement of the first group lens and the second group lens in the optical axis direction with respect to the rotation angle of the cam barrel of the lens barrel configured as described above.
[0035]
4, the solid line a indicates the amount of movement of the first lens frame 21 with respect to the rotation angle of the cam barrel 31, and the broken line b indicates the amount of movement of the second lens frame 22 with respect to the rotation angle of the cam cylinder 31. T indicates the rotation angle when the cam barrel 31 reaches the most telephoto position, and W indicates the rotation angle when the cam cylinder 31 reaches the widest position.
[0036]
Although not shown, the detection means for detecting the rotation angle of the cam cylinder 31 and the drive control based on the detection result are known control methods, and detailed description is omitted.
[0037]
FIG. 5 is a rear view for explaining the first embodiment of the connection of the image sensor, the image sensor positioning means, and the printed circuit board according to the present invention.
[0038]
The electrical connection between the image pickup device 15, the image pickup device positioning member 16 as the image pickup device positioning means, and the printed circuit board 17 of the image pickup device 15 is performed by using a positioning jig (not shown).
[0039]
The image pickup element 15 and the printed board 17 are electrically and mechanically connected by soldering the lead LE of the image pickup element and the land LA of the printed board in a state where the positions thereof are temporarily fixed by the positioning jig. You. Further, the imaging element 15 and the imaging element positioning member 16 are in a state where the positions thereof are temporarily fixed by the positioning jig, and the imaging end contacting the opening end face 161 of the opening 160 of the imaging element positioning member 16 with the opening end face. Bonding is performed by pouring an adhesive into a corner formed by one surface of the element 15.
[0040]
That is, as shown in FIG. 5, when viewed from the optical axis direction, the opening 170 of the printed circuit board 17 does not overlap with the outer shape of the imaging element positioning member 16 and has a size and shape having a gap. Is formed.
[0041]
Thus, the integrated image sensor 15, printed circuit board 17, and image sensor positioning member 16 are integrated with the positioning holes (reference number) formed in the image sensor positioning member 16 by the positioning pins (no reference number) attached to the base plate 42. (None), the position of the image sensor 15 is accurately set, and is fixed to the base plate 42 by the positioning member fixing screw N3 (see FIGS. 5 and 6).
[0042]
When the positional relationship between the imaging element positioning member 16 and the printed board 17 is viewed from a direction perpendicular to the optical axis, as can be seen from FIGS. 2 and 3, the opening 170 of the printed board 17 and the imaging element positioning member 16 Overlap.
[0043]
That is, in the prior art, at least the image sensor, the image sensor positioning member, and the configuration of the thickness of each of the printed circuit board is accumulated as the minimum required size, whereas the size could not be further reduced, According to the configuration based on the present invention, in the optical axis direction, part or all of the thickness of the printed circuit board is absorbed within the thickness of the imaging element positioning member.
[0044]
Furthermore, since the position of the positioning member fixing screw N3 is set to the left and right direction, avoiding the vertical direction where the lead LE of the image sensor is located, the distance from the center of the optical axis can be reduced. The size can be reduced.
[0045]
FIG. 6 is a rear view for explaining a second embodiment of the connection of the image sensor, the image sensor positioning means, and the printed circuit board according to the present invention. The difference from the first embodiment is that the printed board 17 according to the first embodiment has an opening 170, whereas the printed board 17 according to the second embodiment has a notch. 171. Since other configurations are the same, the same reference numerals are used and detailed description is omitted. However, even in such a configuration, similarly to the first embodiment, the imaging element positioning member 16 and the printed board Since the thickness of each of the imaging devices 17 and 17 is not accumulated, the thickness can be reduced as compared with the conventional imaging device.
[0046]
In the present embodiment, the imaging device 15, the imaging device positioning member 16, and the printed circuit board 17 are configured to be integrally fixed in advance and attached to the camera body. However, the imaging device 15 and the printed circuit board 17, or Alternatively, the image sensor 15 and the image sensor positioning member 16 may be fixed in advance, and then the image sensor positioning member 16 or the printed circuit board 17 may be attached, or three members may be individually attached to the camera body.
[0047]
In this embodiment, the zoom lens is described as an example. However, it goes without saying that the present invention can be applied to a single focus lens or the like.
[0048]
【The invention's effect】
According to the configuration based on the present invention, the thickness of the printed circuit board can be absorbed in the thickness of the imaging element positioning member, so that the imaging device and the camera using the imaging device can be reduced in thickness.
[0049]
In addition, by providing the mounting position of the imaging device positioning member to the imaging device near the outside of the side of the imaging device where there is no lead, the imaging device positioning member and the printed circuit board can be reduced, and the rigidity of the imaging device positioning member can be reduced. As a result, the camera can be attached to the imaging device with high accuracy, and the camera can be downsized.
[Brief description of the drawings]
FIG. 1 is an example of an external view of a camera equipped with a zoom lens provided with an imaging device of the present invention.
FIG. 2 is a vertical cross-sectional view of the imaging apparatus showing a state where a lens barrel is extended to a telephoto end during photographing.
FIG. 3 is a vertical cross-sectional view of the imaging apparatus showing a state where the lens barrel is collapsed when not in use.
FIG. 4 is a graph showing the amount of movement of a first group lens and a second group lens in the optical axis direction with respect to the rotation angle of a cam barrel.
FIG. 5 is a rear view for describing a first embodiment of connection of an image sensor, an image sensor positioning unit, and a printed circuit board according to the present invention.
FIG. 6 is a rear view for explaining a second embodiment of the connection of the imaging device, the imaging device positioning means, and the printed circuit board according to the present invention.
[Explanation of symbols]
11 first group lens 12 second group lens 13 third group lens 15 imaging device 16 imaging device positioning means (imaging device positioning member)
17 Printed Circuit Board 41 Fixed Body 42 Base Plate 170 Printed Circuit Board Opening 171 Printed Circuit Board Notch LA Printed Circuit Board Land LE Image Sensor Lead N3 Positioning Member Fixing Screw

Claims (5)

An imaging device comprising: an imaging element; an imaging element positioning unit that is in contact with one surface of the imaging element to position the imaging element; and a printed board on which a land electrically connected to the imaging element is formed. At
The printed circuit board and the image sensor positioning means are arranged so as to have a positional relationship that does not overlap when viewed from the optical axis direction, and to have a positional relationship that overlaps when viewed from a direction perpendicular to the optical axis. An imaging device characterized by the following. The printed circuit board has an opening or a notch,
The opening or notch and the image sensor positioning means are arranged so as to have a positional relationship that does not overlap when viewed from the optical axis direction, and to have a positional relationship that overlaps when viewed from a direction perpendicular to the optical axis. The imaging device according to claim 1, wherein: The image pickup apparatus according to claim 1, wherein a position where the image pickup element positioning means is attached to the image pickup apparatus is provided near an outer side of a side of the image pickup element where no lead portion is provided. An image sensor, a printed circuit board on which a land electrically connected to the image sensor is formed, and an image sensor positioning means for abutting one surface of the image sensor to position the image sensor; An image pickup device arranged so that the printed circuit board and the image pickup device positioning means have a positional relationship not overlapping when viewed from the optical axis direction, and have a positional relationship overlapping when viewed from a direction perpendicular to the optical axis. A camera characterized in that: The printed circuit board has an opening or a notch,
The opening or notch and the image sensor positioning means are arranged so as not to overlap when viewed from the optical axis direction, and to overlap when viewed from a direction perpendicular to the optical axis. The camera according to claim 4, further comprising an imaging device.

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