JP2004330362A - Mirror finishing apparatus - Google Patents

Mirror finishing apparatus Download PDF

Info

Publication number
JP2004330362A
JP2004330362A JP2003129814A JP2003129814A JP2004330362A JP 2004330362 A JP2004330362 A JP 2004330362A JP 2003129814 A JP2003129814 A JP 2003129814A JP 2003129814 A JP2003129814 A JP 2003129814A JP 2004330362 A JP2004330362 A JP 2004330362A
Authority
JP
Japan
Prior art keywords
humidity
grinding
state
mirror finishing
grindstone
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2003129814A
Other languages
Japanese (ja)
Other versions
JP4189265B2 (en
Inventor
Tetsuo Okuyama
哲雄 奥山
Shiro Murai
史朗 村井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippei Toyama Corp
Original Assignee
Nippei Toyama Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippei Toyama Corp filed Critical Nippei Toyama Corp
Priority to JP2003129814A priority Critical patent/JP4189265B2/en
Publication of JP2004330362A publication Critical patent/JP2004330362A/en
Application granted granted Critical
Publication of JP4189265B2 publication Critical patent/JP4189265B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a mirror finishing apparatus which maximizes the working efficiency and manufacturing quality of mirror finishing, and further minimizes the consumption of polishing slurry or make the polishing slurry unnecessary, even in a CMP apparatus using the polishing slurry, by keeping a mechanochemical mirror finish grinding stone in the state where the grinding stone has been slightly wetted from the completely dry state. <P>SOLUTION: The mirror finishing apparatus comprises a wetness control means for controlling the wetness of at least either of the polishing surface of the grinding stone and the surface of a workpiece to be polished. The wetness control means comprises a sliding load monitoring means for monitoring the sliding load of the polishing means, a critical state detecting means for detecting the state where the sliding load to be monitored by the sliding load monitoring means fluctuates unstably; and a control means for setting and keeping the wetness, which is in the optimum state neighboring the critical state detected by the critical state detecting means and slightly exceeds the wetness in the critical state. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

【0001】
【発明の属する技術分野】
本発明は、稼動効率および製造品質を最高ならしめる最適湿度を設定し維持すれば、容易に最適状態を保持できる化学的作用を伴う研削手段を備えた鏡面仕上げ装置に関する。
【0002】
【従来の技術】
従来、鏡面仕上げにおいては、ワークの研削面に生じたストレス、マイクロクラック等をエッチング手段で除去できるようにしたものがあった(例えば特許文献1)。この種のエッチング機能付き研削装置として、従来からポリッシングやエッチングの加工法がある。
【0003】
エッチング機能付き研削装置の代替に、例えばシリカ等の軟質砥粒を固定砥粒とした化学的作用のある砥石が開発され、砥石による鏡面仕上げ加工が試みられている。ここにいう化学的作用のある砥石とは、軟質砥粒と被加工物との接触点に生ずるメカノケミカル現象(すなわち加えられた機械エネルギーにより誘起される極微小単位の化学反応)を利用して、鏡面仕上げを行うものである。
【0004】
また、回転砥石を回転させる駆動モータの消費電力を監視することにより、砥石の目詰まりの程度を推定し、回転砥石を洗浄する洗浄液の噴射圧力を最適制御できるようにしたものがあった(例えば特許文献2)。これは、砥石の目詰まりが激しくなるとワークと砥石表面との摩擦が減少して摺動負荷が軽くなり、駆動モータの消費電力が減少する作用を利用している。すなわち、鏡面仕上げ装置の運転中にも、砥石の目詰まりを始めとして砥石の状況に関し、駆動モータの消費電力を監視することにより、制御目標から乖離した程度を推定し、洗浄液の噴射圧力を最適制御できるように制御機能部へフィードバックすることにより、回転砥石を最適の状態に維持するものである。
【0005】
【特許文献1】
特開平9−223680号公報(段落番号[0002])
【特許文献2】
特開2002−178258号公報(段落番号[0036]、図6)
【0006】
【発明が解決しようとする課題】
従来の化学的作用を伴う研削手段を備えた乾式鏡面仕上げ(ドライポリッシング)装置では、乾燥状態と湿潤状態との中間にある臨界領域湿度で前記研削面が脆くなり、前記被研削面にスクラッチを発生させる原因となり実用不適とされる臨界状態があるので、この臨界状態を回避するためにも乾燥状態を保持する必要があった。
【0007】
また、被研削面を鏡面仕上げする場合、研削加工後にポリッシングやエッチングを行っていた。しかし、ポリッシングやエッチングは時間がかかり、ポリッシングスラリー、ポリッシングパッドおよびエッチャントといった消耗品が高価なため、コストアップの原因となる上、廃液等の処理に際して環境への負担が大きいという問題があった。
【0008】
そこで、ワークの被研削面の少なくとも何れか一面を、臨界状態から僅かに超えた湿度に設定し維持すれば、鏡面仕上げ装置の稼動効率および製造品質を最高ならしめる最適状態であることが解明されつつある。しかも、臨界状態を回避できるので安全である。
【0009】
このように、最適状態を安定的に設定し維持する技術の確立を課題とし、当該技術をさらに発展させ、例えばCMP(Chemical Mechanical Polishing)装置におけるシリカ入りウレタンパッド等の潤滑剤として用いられていた高価なポリッシングスラリーの使用量を最小限または不要にすることも課題としている。
【0010】
本発明は、乾式鏡面仕上げによる鏡面仕上げ装置において、前記臨界領域湿度より僅かに乾燥させた湿度に安定的に設定し維持することにより、前記鏡面仕上げ装置を最適状態に制御して、その稼動効率および製造品質を最高ならしめ、しかもポリッシングスラリーの使用量を最小限または不要にすることのできる装置の提供を目的とする。
【0011】
【課題を解決するための手段】
前記目的を達成するために、請求項1に係る発明は、化学的作用を伴う研削手段を備えた鏡面仕上げ装置において、前記研削手段の研削面と、ワークの被研削面の少なくとも何れか一面の湿度を管理する湿度管理手段を備えたことを特徴とする鏡面仕上げ装置である。
【0012】
請求項1に係る発明によれば、化学的作用を伴う研削手段には、乾燥状態と湿潤状態との中間にある臨界領域湿度で前記研削面が脆くなり、前記被研削面にスクラッチを発生させ、実用不適とされる臨界状態があるので、前記湿度管理手段により、前記研削手段の研削面と、ワークの被研削面の少なくとも何れか一面を、前記最適湿度に設定し維持すれば、前記臨界状態を回避できる。
【0013】
さらに、前記臨界領域湿度を僅かに超えた湿度が、前記鏡面仕上げ装置の稼動効率および製造品質を最高ならしめる最適状態であるので、前記湿度管理手段により、前記最適湿度を設定し維持すれば、目的を達成できる。
【0014】
請求項2に係る発明は、前記湿度管理手段として、前記研削手段の摺動負荷を監視する摺動負荷監視手段と、前記摺動負荷監視手段により監視する摺動負荷が不安定に乱高下する状態を検出する臨界検出手段と、前記臨界検出手段が検出する臨界状態に隣り合わせた最適状態であって前記臨界状態を僅かに超えた湿度に設定し維持する制御手段と、を備えたことを特徴とする請求項1に記載の鏡面仕上げ装置である。
【0015】
請求項2に係る発明によれば、前記摺動負荷監視手段の摺動負荷監視結果と、前記最適状態との因果関係を実験により予め把握し、前記制御手段により前記臨界領域湿度を僅かに超えた湿度に設定し維持することにより、最適状態を安定かつ容易に保持できる。
【0016】
請求項3に係る発明は、前記摺動負荷監視手段として、回転砥石を駆動する駆動モータの消費電力を計測する駆動モータ消費電力計と、前記消費電力が安定か不安定かを判別する安定度判別手段と、前記制御手段として、前記安定度判別手段の判別結果が不安定となることにより前記臨界状態とし、当該臨界状態に隣り合わせた最適状態を設定目標にする制御目標設定手段と、を備えたこと特徴とする請求項1または請求項2に記載の鏡面仕上げ装置である。
【0017】
請求項3に係る発明による作用効果は、以下の通りである。
鏡面仕上げの最中、前記化学的作用を伴う研削手段である回転砥石の駆動負荷は本来滑らかであるが、前記回転砥石の研削面または前記被研削面が、乾燥状態と湿潤状態との中間にある臨界領域湿度で前記研削面が脆く崩れやすくなり、前記被研削面にスクラッチを発生させ、実用不適とされる前記臨界状態になると、前記回転砥石を駆動する駆動負荷が不安定に変動し、前記駆動モータ消費電力計の計測値も乱高下する。
【0018】
このような駆動負荷の変動特性を利用して、前記消費電力が安定か不安定かを判別する安定度判別手段の判別結果によって、前記臨界状態になったか否かを判別できる。
【0019】
従って、駆動負荷の変動特性の再現性を確認するための実験も可能となるので、前記臨界状態を客観的に把握することにより、前記摺動負荷監視手段の摺動負荷監視結果と、前記最適状態との因果関係を、実験により予め把握し、経験則に基づいた前記制御手段により、前記臨界領域湿度を僅かに超えた状態を設定し維持し、容易に鏡面仕上げ装置を最適状態に保持できる。
【0020】
請求項4に係る発明は、前記研削手段として、砥石、砥粒パット、研磨テープ、研磨シートの少なくとも一種類を用いたことを特徴とする請求項1ないし請求項3のいずれか1項に記載の鏡面仕上げ装置であり、平面研削盤以外にも、複雑な形状のワークを加工する鏡面仕上げ工具としての用途が広範囲に広がる。
【0021】
請求項5に係る発明は、前記研削手段を、CMP(Chemical Mechanical Polishing)装置に適用したことを特徴とする請求項1ないし請求項4のいずれか1項に記載の鏡面仕上げ装置である。当該鏡面仕上げ装置は、ポリッシングスラリーの使用量を必要最小限または不要にするので、当該ポリッシングスラリー、当該ポリッシングスラリー供給機構および廃液処理機能も必要最小限または不要となる。従って、設備費および運転費用の両方が節約でき、廃液処理に伴う環境への負担も軽減できる。
【0022】
請求項6に係る発明は、前記研削手段として、酸化物の材料を用いたことを特徴とする請求項1ないし請求項5のいずれか1項に記載の鏡面仕上げ装置であり、これによれば、酸化物の材料として、例えば、ヒュームドシリカ、沈降シリカ、コロイダルシリカ、溶融シリカ、凝縮シリカ、燃焼合成シリカ、シリカゲル、人工水晶、多孔質シリカの少なくとも一種類を用いた前記研削手段は、鏡面仕上げの効率を低下させない前記研削手段として好適である。また、砥粒形状としては球状のものが好ましい。
【0023】
ここで、各種材料による前記ワーク(左)に最適な酸化物砥粒(右)の組み合わせを以下に例示する。
(イ)水晶 :Fe
(ロ)Si :BaCo ,CaCO
(ハ)Si :Cr
(ニ)Fe :Fe
(ホ)AlO :SiO ,Fe ,Fe
(ヘ)Si :CaCO ,MgO ,SiO ,Fe ,Fe
(ト)ガラス :CeO
(チ)SiC :Cr ,Al
(リ)AlN :Cr
(ヌ)ZrO :SiO ,CeO
【0024】
【発明の実施の形態】
以下、図面に沿って、本発明による実施の形態について説明する。
図1は本発明の実施形態を示す鏡面仕上げ装置の断面模式図と制御手段40を示すブロック図である。図1において、例えばシリコン単結晶の円柱を薄い円盤状にスライスされ、粗研削、仕上げ研削されたワーク10が、回転テーブル20上に載置され、真空吸着により保持され、矢印J方向に毎分約10〜150回転で回転している。
【0025】
回転テーブル20の回転軸Z1から、回転半径の長さくらい離れた位置に平行に配設された主軸ヘッドの回転軸Z2に軸支された砥石ホルダ(以下、単に「ホルダ」ともいう)32に取付けられた環状のメカノケミカル砥石(以下、単に「砥石」ともいう)30が、回転テーブル20上のワーク10に対して、充分に面接触させるため、メカノケミカル砥石30がワーク10の中心を通るように部分的に覆い被さるような位置関係に配設されている。
【0026】
そして、回転するワーク10の被研削面11の一部に、メカノケミカル砥石30がモータMにより矢印K方向に回転しながら、下側の砥石面31が、その一部を摺接して、ワーク10の被研削面11の全面が研削される。
【0027】
また、被研削面11と砥石面31を適宜に摺接させるため、またワーク10が回転テーブル20上で研削工程の進捗に合わせて間欠的に載置・吸着・保持・離脱されるように、回転テーブル20と主軸ヘッドのスピンドルの下端面に固定されたメカノケミカル砥石30の少なくとも何れか一方は、その軸方向に昇降可能な昇降機構(図示せず)を有している。
【0028】
すなわち回転テーブル20のテーブル面と砥石面31の間隔を大きく広げて、前記テーブル面と砥石面31の間に、ワーク10を挿入するようにセットしてから、隙間を閉じて所定の切り込みを与え、押圧力を静かに加えながら研削加工する。なお、回転テーブル20とメカノケミカル砥石30のそれぞれの回転制御も適宜になされる。
【0029】
また、メカノケミカル砥石30の湿度に対応した電気抵抗を呈する乾湿反応素子でなる湿度センサ9が、メカノケミカル砥石30の内周に嵌着されており、制御手段40に湿度情報を入力して、湿度管理手段42を適切に動作させるように構成されている。制御手段40には湿度管理手段42の他、メカノケミカル砥石30を回転させる駆動モータの消費電力を計測し、監視する駆動モータ消費電力計Pと、監視された消費電力が乱高下したときに、その状況をメモリ44に格納された制御情報と比較して、制御目標設定手段41に働きかけ、砥石面31または被研削面11の少なくとも一面に対して、湿度管理手段42から空気またはミスト21を適宜選択して吹きかける。
【0030】
なお、湿度センサ9は、湿度管理手段42の制御目的を明瞭に説明する便宜上の構成要素であり、実際には湿度センサ9を用いなくても、摺動負荷監視手段である駆動モータ消費電力計Pおよび、安定度判別手段43の判別結果により湿度管理手段42を適切に動作させることができる。
【0031】
図2は、図1に示した鏡面仕上げ装置の制御手段におけるメカノケミカル砥石30の状況を表す指標グラフであり、同図(a)は湿度(横軸)に対する駆動モータ消費電力との相関関係、同図(b)は湿度と研削品位の相関関係を示すグラフである。図2において、横軸はメカノケミカル砥石30(図1参照)の湿度を示しており、湿度の変化に対応して、鏡面仕上げ装置の動作状態が変化することを縦軸に示しており、鏡面研削の研削品位と効率を例えばスクラッチの発生程度と切り込み速度等により数値表示可能であるが、厳密な計測値というよりは、むしろ研削品位と効率を指標にしたものである。
【0032】
同図(b)で示す各指標1〜8におけるメカノケミカル砥石30の状況を順次説明する。指標1ではメカノケミカル砥石30が完全に乾燥し、その湿度が例えば0%(空気ではないので、気象観測等でいう%表示の湿度でなく単なる目安であり図示せず)程度の場合に、安定的に得られる研削品位と効率を示している。
【0033】
そして、制御目標設定手段41(図1参照)に加湿するように働きかけ、砥石面31または被研削面11の少なくとも一面に対して、湿度管理手段42からミスト21を吹きかける。そうすると、指標7〜8で示す状況に推移し、メカノケミカル砥石30が完全に水浸しになる湿度が、例えば100%(図示せず)程度の指標8では、メカノケミカル砥石30の化学的作用が水で薄れるので研削効率を実用的でないレベルにまで低下させる。
【0034】
本発明の前提となる、乾式メカノケミカル鏡面仕上げ砥石は、PVA(ポリビニルアルコール)樹脂をベースとするメカノケミカル砥石30のシリカを取り巻くPVA樹脂の吸水性の働きにより、シリカ自体を濡らすことが極力防止でき、高いメカノケミカル効果を持続できるとされており、一般的にはメカノケミカル砥石30を乾燥させて使用するが、本願の発明者は鋭意研究の結果、メカノケミカル砥石30をある程度湿らせることにより、指標7で示す最高レベルの研削品位および研削効率が得られることを発見した。
【0035】
しかし、指標2を超えてメカノケミカル砥石30の湿度を高くすると、指標3から急激に状況が悪化し、指標4〜5に示す実用不可能な領域に陥る。この指標4〜5においては、メカノケミカル砥石30のシリカを取り巻くPVA樹脂の吸水性のバランスが崩れることにより、脆く、崩れやすくなり、シリカ粒子を保持できずにメカノケミカル砥石30から離脱させてしまい、ワーク10にスクラッチを発生するので、実用不可能となる。
【0036】
このとき、図2(a)に示す駆動モータ消費電力Wは、Wを中心にΔ1とΔ2の範囲で不安定に乱高下45を呈する。乱高下45の原因は、メカノケミカル砥石30のシリカを繋ぎ止めていたPVA樹脂が崩れて、ワーク10の被研削面11と砥石面31との間の摺動摩擦抵抗が、不安定になり、砥石ホルダ32を回転させる負荷の変動に対応して駆動モータ消費電力Wも変化するためである。この不安定で実用不可能な状態に関し、指標3に係る湿度をα、指標6に係る湿度をβとし、このα〜βに係る領域の湿度を説明の便宜上、臨界領域湿度と称す。
【0037】
そして、指標5からさらにメカノケミカル砥石30の湿度を高くすると、指標5から急激に指標6まで状況が回復する。そして、指標7では請求項2にいう「臨界状態を僅かに超えた湿度」で研削品位と効率が最高となる状況を呈する。さらに指標7を超える高い湿度でメカノケミカル砥石30を濡らしてしまうと、指標7〜8に示す右下がりの勾配に沿いながら、低効率で実用不可能な領域に陥る。逆に、メカノケミカル砥石30を完全に濡らした指標8の状態から徐々に乾燥させても指標8〜1に示す順番で状況が変化する。
【0038】
以上の結果から、制御目標設定手段41(図1)が、研削品位と効率を最高にする指標7の状況を実現させる湿度Xを目標とするように、制御手段40により湿度管理手段42を自動制御する。このことを、図1〜2を用いて具体的に説明する。
【0039】
前記臨界領域湿度α〜βは、いわば危険領域であり、素早く察知して回避する必要があるので、研削手段であるメカノケミカル砥石30を、駆動モータMにより砥石ホルダ32を介して回転させるための摺動負荷を監視する摺動負荷監視手段としての駆動モータ消費電力計Pと、前記摺動負荷監視手段により監視する摺動負荷が不安定に乱高下する状態を検出する臨界検出手段としての安定度判別手段43の判別結果を用いる。
【0040】
前述した摺動負荷監視手段と臨界検出手段は、実験段階であれば、実験結果から図2のグラフに示した相関関係を把握できるので、これら、駆動モータ消費電力Wを中心にΔ1とΔ2の間での乱高下45、メカノケミカル砥石30の湿度X,α〜βと、研削品位と効率が指標1〜指標8に変化する状況の実験データを、「再現可能な因果関係」に整理してメモリ44に格納しておく。
【0041】
制御手段40は主にマイクロコンピュータにより構成され、その中のメモリ44に格納された演算プログラムが、前述した実験データと、制御目標設定手段41、安定度判別手段43、湿度センサ9の各出力値を比較検討し、制御目標設定手段41の設定した目標とする湿度Xを実現させるように、湿度管理手段42を自動制御する。
【0042】
例えば、制御手段40が指標1の状況にあると判断したならば、湿度管理手段42により、ワーク10の被研削面11と砥石面31の両方に、ミスト21を吹き出して加湿し、駆動モータ消費電力計Pにより乱高下45を確認しながら、臨界領域湿度α〜βを速やかに通過させて、目標とする湿度Xを実現させる。この制御目標Xが、請求項2にいう「臨界状態を僅かに超えた湿度」であり、請求項3にいう「臨界状態に隣り合わせた最適状態を設定目標にする制御目標設定手段」の具体的な作用を示している。
【0043】
なお、指標1〜7の順で状況変化を示す方向に制御したのは、説明の便宜上であり、現実には指標8〜7の順で状況変化を示す方向に制御する方が、実用不可能な臨界領域湿度α〜βを経由しないので都合良い。この場合は、制御手段40が湿度センサ9の出力値を前述した実験データと、比較検討して、湿度管理手段42により、ワーク10の被研削面11と砥石面31の少なくとも一面に、乾燥した空気21を吹き出して目標とする湿度Xを実現させる。
【0044】
そして、通常動作中にも駆動モータ消費電力計Pの消費電力を常時監視し、消費電力が乱高下したときに、安定度判別手段43の判別結果を含めた状況をメモリ44に格納された制御情報と比較して、制御目標設定手段41に働きかけ、砥石面31または被研削面11の少なくとも一面に対して、湿度管理手段42から空気またはミスト21を適宜選択して吹きかけることにより、目標とする湿度Xを維持する。
【0045】
図3は本発明をCMP装置に応用した鏡面仕上げ装置の断面模式図とブロック図である。図3に示す鏡面仕上げ装置は図1に示した回転テーブル20と砥石ホルダ32の位置関係が上下逆転し、ワーク10を吸着した回転テーブル20aが上方に、シリカ入りウレタンパッド30aを上面に配設した砥石ホルダ32aが下方に位置するように構成されている。
【0046】
図3に示す鏡面仕上げ装置の場合は、湿度センサ9aの出力値を制御目標設定手段41に入力し、目標値と比較検討し、湿度管理手段42により、ワーク10の被研削面11と砥石面31aの少なくとも一面に、空気またはミスト21を適宜選択して吹きかけることにより、目標とする湿度を実現させる。
【0047】
周知のシリカ入りウレタンパッド30aは、ペースト状の水溶液にシリカ粒子が混入された潤滑研磨剤としてのポリッシングスラリー(以下、単に「スラリー」ともいう)を、砥石面31aと被研削面11の間に潤滑させながら、鏡面仕上げの研削品位と研削効率を高く維持する。
【0048】
しかし、前記スラリーは高価でしかも廃棄物処理に際して環境への負担もあるため使用量を極力減らしたいが、このスラリーに代わる潤滑研磨剤として本願の発明者はシリカ入りウレタンパッド30aの砥石面31aを、湿度管理手段42により、ある程度湿らせて、その湿度を適切に管理することにより、砥石面31aから微量ずつ剥離されるシリカ粒子が、付与される水分に混入されペースト状の潤滑研磨剤が形成されるので、高価な前記スラリーを添加せずに同等の研削品位と効率を得られる。
【0049】
図4は図3に示したCMP装置で用いたシリカ入りウレタンパッドの研削面における断面模式図であり、同図(a)は乾燥状態の拡大断面図、同図(b)は同図(a)に示すF部の拡大図である。
【0050】
図4(a)に示すように、シリカ入りウレタンパッド30aは、シリカ粒子33を砥粒として混入したPVA樹脂34をベースに構成されており、PVA樹脂34は気孔22を含むポーラス構造であるため、気泡22中にはスポンジのようにある程度の水分を含むことが可能である。
【0051】
図4(b)に示すように、鏡面仕上げの品位と効率を維持する目的で、前記スラリーを潤滑剤として併用するが、シリカ粒子33の外周面とPVA樹脂34の境界部、および気孔22の内壁面に水膜23が薄く残っている状態が、図2(b)で示した最高の研削品位と効率を得るための条件の1つと推定されている。
【0052】
例えば、乾式の鏡面仕上げ装置であっても、軟質砥粒と被加工物とのhに生ずるメカノケミカル現象(すなわち加えられた機械エネルギーにより誘起される極微小単位の化学反応)を最高ならしめるため、極く微量の水分または適度な湿度を維持することが有効に作用することに加え、鏡面仕上げ加工する際に、前記スラリーに近い潤滑作用で、凝着磨耗による面荒れを防止できる。
【0053】
なお、図4(b)に示すように、水膜23が研削接点35の近傍から、ワーク10の被研削面11に滲出する水分は、水膜23の極く僅かな断面に限られるため、洗浄冷却媒体としての水、または水を主体とする前記スラリーを用いた場合、水濡れの害は避けられる。当該鏡面仕上げ装置は、ポリッシングスラリーの使用量を必要最小限または不要にするので、当該ポリッシングスラリー、当該ポリッシングスラリー供給機構および廃液処理機能も、必要最小限または不要となる。従って、設備費および運転費用の両方が節約でき、廃液処理に伴う環境への負担も軽減できる。
【0054】
従って、本発明によれば、ワークとして水濡れを嫌う性質の鏡面仕上げ加工も両立させる。例えば、水溶性の素材である塩化ナトリウムの単結晶から削り出して赤外線プリズムにする塩化ナトリウムの鏡面仕上げ加工、あるいは水と化学反応して有毒ガスを発生する物質を素材とするワークに対する鏡面仕上げ加工、などに共通する水濡れを嫌う性質に対し、水を主体とする前記スラリーを用いずに、そのスラリーに近い潤滑作用で、凝着磨耗による面荒れを防止し、最高の研削品位と効率を得ることと、水濡れを嫌う性質の鏡面仕上げ加工との両立が可能となる。この場合は、図1に示した制御目標設定手段41を乾燥気味に設定し、湿度管理手段42により乾燥気味の空気21を吹き付ける。
【0055】
また、前記塩化ナトリウムに関し、詳しくは、通常の無水物の結晶は無色等軸晶系六面体で赤外線をよく透過するので、大きな単結晶は赤外線分光器のプリズムに用いられる。
なお、塩化ナトリウムのなかでも精製していないものは、マグネシウム、カルシウムの塩類を含むため潮解性を示すので使用不能であるが、純粋な塩化ナトリウムには潮解性がないので、水溶性のある点を考慮し、水に濡らさないように工夫して研磨加工することにより実用化できる。
【0056】
なお、例えば半導体ウェーハに対しては「研削」と称し、レンズ、プリズムおよび宝石類に対しては「研磨」と称される事が一般的であるが、本発明の研削手段の「研削」とは、砥粒を結合材によって固定した工具を使った加工をいい、これに対応する加工であれば「研磨」も同一の意味として用いる。
従って本発明の鏡面仕上げ装置は、サファイヤ等の宝石類の研磨にも適する。ただし、その機構設計に関する説明は省略する。
【0057】
そして、砥石はドーナツ(円環)状のものに限らず、円盤面を砥石面としたものでも良く、メカノケミカル砥石30,30aとターンテーブル20は上下の何れの方に位置しても構わない。
【0058】
また、メカノケミカル砥石30のシリカを取り巻くPVAの吸水性の働きにより、シリカ自体を濡らすことが極力防止でき、高いメカノケミカル効果を持続できる。なお、メカノケミカル効果を発揮させるためにシリカに限定する必要もない。また、研削手段の砥粒に用いる「酸化物」の材料として、例えば、ヒュームドシリカ、沈降シリカ、コロイダルシリカ、溶融シリカ、凝縮シリカ、燃焼合成シリカ、シリカゲル、人工水晶、多孔質シリカの少なくとも一種類を用いた前記研削手段は、鏡面仕上げの効率を低下させない前記研削手段として好適である。また、砥粒形状としては球状のものが好ましい。
【0059】
そして、洗浄冷却媒体は純水のミストでなく、油等や他の液体の混じったミストでもよく、純水または他の液体をそのままかけても良く、さらに、砥石はカップ状のものに限らず、円盤状の下面全面を砥石面としたものでも構わない。
また、実施形態では環状(カップ状)砥石の外周側から水をかけているが、逆に環状砥石の内周側から水をかける構成でもよい。
【0060】
さらに研削手段としては、回転式の砥石を用いた平面研削盤等に限定せず、砥石、砥粒パッド、研磨テープ、研磨シートの少なくとも一種類を用いた鏡面仕上げ装置に適用することにより、前記研削手段は、研磨工具としての用途が広範囲に広がる。
【0061】
これらは、単一回転運動する回転砥石とワークを吸着したワークホルダとの組み合わせによる平面研削盤に代えて、偏芯小円(オービタル)運動する定盤(プラテン)の表面に形成された砥粒パッドの研削面上にワークを吸着したワークホルダを伏せて用いる方式、あるいは、ベルトコンベア方式の研磨テープ、回転走査方式の円環状半固定硬質パッドによる部分接触走査加工、回転運動する円筒状パッド、または研磨シートの何れかの工具(パッド)による鏡面仕上げ装置に適用する。
【0062】
前述した何れかの工具(パッド)による鏡面仕上げ装置に適用され、かつ適宜に回転砥石またはワークを回転走査運動、自転公転運動または揺動運動や往復(リニア)運動させる精密機械装置、また例えば特開2001−71242、特開2001−246557、特開2001−322056、特開2001−358106、特開平3−104536、特開平4−141336等で示す構成の装置は、当業者の設計により実現可能と考えられるので更なる図解および説明は省略する。
【0063】
なお、本発明は、その技術思想の範囲内で種々の改良が可能であり、前述した実施の一形態の他にも多様な実施の形態が考えられる。それらにおいて、請求項1でいうように、化学的作用を伴う研削手段を備えた鏡面仕上げ装置において、前記研削手段の研削面と、ワークの被研削面の少なくとも何れか一面の湿度を管理する湿度管理手段を備えた場合、全て本発明に属することは当然である。
【0064】
【発明の効果】
以上説明した構成の通り、請求項1に係る発明によれば、化学的作用を伴う研削手段には、乾燥状態と湿潤状態との中間にある臨界領域湿度で前記研削面が脆くなり、前記被研削面にスクラッチを発生させ、実用不適とされる臨界状態があるので、前記湿度管理手段により、前記研削手段の研削面と、ワークの被研削面の少なくとも何れか一面を、最適湿度に設定し維持すれば、前記臨界状態を回避できる。
【0065】
さらに、前記臨界領域湿度を僅かに超えた湿度が、前記鏡面仕上げ装置の稼動効率および製造品質を最高ならしめる最適状態であるので、前記湿度管理手段により、前記最適湿度を設定し維持すれば、目的を達成できる。
【0066】
請求項2に係る発明によれば、前記摺動負荷監視手段の摺動負荷監視結果と、前記最適状態との因果関係を実験により予め把握し、前記制御手段により前記臨界領域湿度より僅かに乾燥させた湿度を設定し維持することにより、最適状態を安定かつ容易に保持できる。
【0067】
請求項3に係る発明によれば、駆動負荷の変動特性を利用して、前記消費電力が安定か不安定かを判別する安定度判別手段の判別結果によって、前記臨界状態になったか否かを判別できる。
【0068】
従って、実験により予め把握し、経験則に基づいた前記制御手段により、前記臨界領域湿度より僅かに乾燥させた状態を設定し維持することにより容易に最適状態を保持できる。
【0069】
請求項4に係る発明によれば、平面研削盤以外にも、複雑な形状のワークを加工する鏡面仕上げ工具としての用途が広範囲に広がる。
【0070】
請求項5に係る発明によれば、ポリッシングスラリーの使用量を必要最小限または不要にするので、当該ポリッシングスラリー、当該ポリッシングスラリー供給機構および廃液処理機能も必要最小限または不要となる。従って、設備費および運転費用の両方が節約でき、廃液処理に伴う環境への負担も軽減できる。
【0071】
請求項6に係る発明によれば、酸化物の材料として、例えば、ヒュームドシリカ、沈降シリカ、コロイダルシリカ、溶融シリカ、凝縮シリカ、燃焼合成シリカ、シリカゲル、人工水晶、多孔質シリカの少なくとも一種類を用いた前記研削手段は、鏡面仕上げの効率を低下させない前記研削手段として好適である。
【0072】
そして、各種材料による前記ワーク(左)に最適な酸化物砥粒(右)の組み合わせを多様に選択できる。
(イ)水晶 :Fe
(ロ)Si :BaCo ,CaCO
(ハ)Si :Cr
(ニ)Fe :Fe
(ホ)AlO :SiO ,Fe ,Fe
(ヘ)Si :CaCO ,MgO ,SiO ,Fe ,Fe
(ト)ガラス :CeO
(チ)SiC :Cr ,Al
(リ)AlN :Cr
(ヌ)ZrO :SiO ,CeO
【図面の簡単な説明】
【図1】本発明の実施形態を示す鏡面仕上げ装置の断面模式図と制御手段を示すブロック図である。
【図2】図1に示した鏡面仕上げ装置の制御手段におけるメカノケミカル砥石の状況を表す指標グラフであり、同図(a)は湿度に対する駆動モータ消費電力との相関関係、同図(b)は湿度と研削品位の相関関係を示すグラフである。
【図3】本発明をCMP装置に応用した鏡面仕上げ装置の断面模式図とブロック図である。
【図4】図3に示したCMP装置で用いたシリカ入りウレタンパッドの研削面における断面模式図であり、同図(a)は乾燥状態の拡大断面図、同図(b)は同図(a)に示すF部の拡大図である。
【符号の説明】
1〜8 メカノケミカル砥石の状況を示す指標
9,9a 湿度センサ
10 ワーク
11 被研削面
20,20a 回転テーブル
21 空気またはミスト
22 気孔
23 水膜
30,30a メカノケミカル砥石
31,31a 砥石面
32,32a 砥石ホルダ
33 シリカ粒子
34 PVA樹脂
35 シリカ粒子の研削接点
40 制御手段
41 制御目標設定手段
42 湿度管理手段
43 安定度判別手段
44 メモリ
45 乱高下
P 電力計
W 駆動モータ消費電力
Z1,Z2 回転軸
α、β 臨界領域湿度
Δ1,Δ2 乱高下の範囲
[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a mirror finishing apparatus having a grinding means with a chemical action capable of easily maintaining an optimum state by setting and maintaining an optimum humidity for maximizing operation efficiency and manufacturing quality.
[0002]
[Prior art]
Conventionally, in mirror finishing, there has been a method in which stress, micro cracks, and the like generated on a ground surface of a work can be removed by etching means (for example, Patent Document 1). As this type of grinding apparatus with an etching function, there has conventionally been a polishing or etching processing method.
[0003]
As an alternative to a grinding apparatus with an etching function, a grindstone having a chemical action using soft abrasive grains such as silica as fixed abrasive grains has been developed, and a mirror finish processing using the grindstone has been attempted. The grindstone with the chemical action referred to here is based on the mechanochemical phenomenon that occurs at the point of contact between the soft abrasive grains and the workpiece (that is, the chemical reaction of a very small unit induced by the applied mechanical energy). , Mirror finish.
[0004]
In addition, there is a type in which the degree of clogging of the grindstone is estimated by monitoring the power consumption of a drive motor that rotates the rotary grindstone, and the injection pressure of a cleaning liquid for cleaning the rotary grindstone can be optimally controlled (for example, Patent Document 2). This utilizes the effect that when clogging of the grindstone becomes severe, the friction between the workpiece and the grindstone surface is reduced, the sliding load is reduced, and the power consumption of the drive motor is reduced. That is, even during the operation of the mirror finishing device, the degree of deviation from the control target is estimated by monitoring the power consumption of the drive motor with respect to the condition of the grindstone including the grindstone, and the injection pressure of the cleaning liquid is optimized. By feeding back to the control function unit so that it can be controlled, the rotating grindstone is maintained in an optimum state.
[0005]
[Patent Document 1]
JP-A-9-223680 (paragraph number [0002])
[Patent Document 2]
JP-A-2002-178258 (paragraph number [0036], FIG. 6)
[0006]
[Problems to be solved by the invention]
In a conventional dry-type mirror finishing (dry polishing) apparatus provided with a grinding means with a chemical action, the ground surface becomes brittle at a critical region humidity between the dry state and the wet state, and a scratch is formed on the ground surface. There is a critical state which causes the generation and is not suitable for practical use. Therefore, it is necessary to maintain a dry state in order to avoid this critical state.
[0007]
Further, when the surface to be ground is mirror-finished, polishing or etching has been performed after the grinding process. However, polishing and etching take a long time, and consumables such as a polishing slurry, a polishing pad, and an etchant are expensive. Therefore, there is a problem that the cost is increased and a burden on an environment is large when a waste liquid or the like is treated.
[0008]
Therefore, it has been found that, if at least one of the surfaces to be ground of the work is set and maintained at a humidity slightly exceeding the critical state, it is an optimal state for maximizing the operation efficiency and production quality of the mirror finishing device. It is getting. Moreover, it is safe because a critical state can be avoided.
[0009]
As described above, the problem is to establish a technique for stably setting and maintaining an optimum state, and to further develop the technique, for example, it has been used as a lubricant such as a urethane pad containing silica in a CMP (Chemical Mechanical Polishing) apparatus. Another object is to minimize or eliminate the use of expensive polishing slurries.
[0010]
The present invention is directed to a mirror finishing device using dry mirror finishing, in which the mirror finishing device is controlled to an optimum state by stably setting and maintaining the humidity slightly dried from the critical region humidity, thereby improving the operation efficiency. Further, it is an object of the present invention to provide an apparatus capable of maximizing production quality and minimizing or eliminating the use amount of a polishing slurry.
[0011]
[Means for Solving the Problems]
In order to achieve the above object, the invention according to claim 1 is a mirror finishing device including a grinding unit with a chemical action, wherein at least one of a grinding surface of the grinding unit and a surface to be ground of the work is provided. This is a mirror finishing device including a humidity management means for managing humidity.
[0012]
According to the invention according to claim 1, in the grinding means involving a chemical action, the grinding surface becomes brittle at a critical region humidity intermediate between the dry state and the wet state, causing scratches on the ground surface. Since there is a critical state which is considered to be unsuitable for practical use, the humidity control means sets at least one of the grinding surface of the grinding means and the surface to be ground of the work at the optimum humidity and maintains the critical humidity. Avoid the situation.
[0013]
Further, since the humidity slightly exceeding the critical region humidity is in an optimum state for maximizing the operation efficiency and the production quality of the mirror finishing device, if the humidity management means sets and maintains the optimum humidity, You can achieve your goals.
[0014]
According to a second aspect of the present invention, as the humidity management means, a sliding load monitoring means for monitoring a sliding load of the grinding means, and a state in which the sliding load monitored by the sliding load monitoring means fluctuates irregularly. And a control means for setting and maintaining the humidity in an optimal state adjacent to the critical state detected by the criticality detecting means and slightly above the critical state. The mirror finishing device according to claim 1.
[0015]
According to the invention according to claim 2, the causal relationship between the sliding load monitoring result of the sliding load monitoring means and the optimum state is grasped in advance by an experiment, and the control means slightly exceeds the critical region humidity. The optimal state can be stably and easily maintained by setting and maintaining the humidity.
[0016]
According to a third aspect of the present invention, as the sliding load monitoring means, a driving motor power meter that measures power consumption of a driving motor that drives a rotating grindstone, and a stability that determines whether the power consumption is stable or unstable. Determining means, as the control means, control target setting means for setting the critical state when the determination result of the stability determining means becomes unstable, and setting an optimum state adjacent to the critical state as a setting target; A mirror finishing device according to claim 1 or claim 2.
[0017]
The operation and effect of the invention according to claim 3 are as follows.
During the mirror finishing, the driving load of the rotating grindstone, which is the grinding means with the chemical action, is originally smooth, but the grinding surface of the rotating grindstone or the surface to be ground is between the dry state and the wet state. At a certain critical region humidity, the grinding surface becomes brittle and easily collapses, generating a scratch on the surface to be ground, and in the critical state which is unsuitable for practical use, the driving load for driving the rotary grindstone fluctuates unstablely, The measured value of the drive motor power consumption meter also fluctuates.
[0018]
Utilizing such fluctuation characteristics of the driving load, it is possible to determine whether or not the critical state has been reached, based on the determination result of the stability determining means for determining whether the power consumption is stable or unstable.
[0019]
Therefore, an experiment for confirming the reproducibility of the fluctuation characteristic of the driving load is also possible.By objectively grasping the critical state, the sliding load monitoring result of the sliding load monitoring means and the optimal The causal relationship with the state is grasped in advance by an experiment, and the control means based on an empirical rule can set and maintain a state slightly exceeding the critical region humidity, and can easily maintain the mirror finishing device in an optimum state. .
[0020]
The invention according to claim 4 is characterized in that at least one of a grindstone, an abrasive pad, a polishing tape, and a polishing sheet is used as the grinding means. Mirror finishing equipment, and its use as a mirror finishing tool for machining workpieces of complex shapes other than surface grinding machines is widely spread.
[0021]
The invention according to claim 5 is the mirror finish device according to any one of claims 1 to 4, wherein the grinding means is applied to a CMP (Chemical Mechanical Polishing) device. Since the mirror finishing device minimizes or eliminates the use amount of the polishing slurry, the polishing slurry, the polishing slurry supply mechanism, and the waste liquid treatment function are also minimized or unnecessary. Therefore, both equipment costs and operation costs can be saved, and the burden on the environment due to waste liquid treatment can be reduced.
[0022]
The invention according to claim 6 is the mirror finishing device according to any one of claims 1 to 5, wherein an oxide material is used as the grinding means. As the material of the oxide, for example, fumed silica, precipitated silica, colloidal silica, fused silica, condensed silica, synthetic silica, silica gel, artificial quartz, the above-mentioned grinding means using at least one kind of porous silica, a mirror surface It is suitable as the grinding means which does not lower the finishing efficiency. Also, the abrasive grains are preferably spherical.
[0023]
Here, combinations of the oxide abrasive grains (right) optimal for the work (left) using various materials are exemplified below.
(A) Quartz: Fe3O4
(B) Si: BaCo3  , CaCO3
(C) Si3N4  : Cr2O3
(D) Fe2O3  : Fe3O4
(E) AlO3  : SiO2  , Fe2O3  , Fe3O4
(F) Si3N4  : CaCO3  , MgO, SiO2  , Fe2O3  , Fe3O4
(G) Glass: CeO2
(H) SiC: Cr2O3  , Al2O3
(I) AlN: Cr2O3
(Nu) ZrO2  : SiO2  , CeO2
[0024]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
FIG. 1 is a schematic cross-sectional view of a mirror finishing device according to an embodiment of the present invention, and a block diagram illustrating a control unit 40. In FIG. 1, for example, a work piece 10 obtained by slicing a cylinder of silicon single crystal into a thin disk shape, rough-grinding and finish-grinding is placed on a rotary table 20, held by vacuum suction, and moved in the direction of arrow J every minute. It rotates at about 10 to 150 rotations.
[0025]
Attached to a grindstone holder (hereinafter, also simply referred to as a “holder”) 32 that is supported by a rotation axis Z2 of a spindle head that is disposed in parallel with the rotation axis Z1 of the turntable 20 at a position separated by a length of the rotation radius. The mechanochemical grindstone (hereinafter, also simply referred to as “grindstone”) 30 is brought into sufficient surface contact with the work 10 on the rotary table 20 so that the mechanochemical grindstone 30 passes through the center of the work 10. It is arranged in a positional relationship so as to cover partly.
[0026]
Then, while the mechanochemical grindstone 30 is rotated in the direction of the arrow K by the motor M on a part of the grinding surface 11 of the rotating work 10, the lower grindstone surface 31 slidably contacts a part thereof, and The entire surface 11 to be ground is ground.
[0027]
Also, in order to appropriately bring the surface 11 to be ground into sliding contact with the grindstone surface 31, and so that the work 10 is intermittently placed, sucked, held, and released on the rotary table 20 in accordance with the progress of the grinding process. At least one of the turntable 20 and the mechanochemical grindstone 30 fixed to the lower end surface of the spindle of the spindle head has an elevating mechanism (not shown) that can move up and down in the axial direction.
[0028]
That is, the distance between the table surface and the grindstone surface 31 of the rotary table 20 is greatly widened, and the work 10 is set between the table surface and the grindstone surface 31 so that the work 10 is inserted. Grinding with gentle pressing force. The rotation of each of the turntable 20 and the mechanochemical grindstone 30 is appropriately controlled.
[0029]
Further, a humidity sensor 9 composed of a dry / wet reaction element exhibiting an electric resistance corresponding to the humidity of the mechanochemical grindstone 30 is fitted on the inner periphery of the mechanochemical grindstone 30, and inputs humidity information to the control means 40. The humidity management unit 42 is configured to operate properly. In addition to the humidity management means 42, the control means 40 measures the power consumption of the drive motor for rotating the mechanochemical grindstone 30, and monitors the drive motor power consumption P. When the monitored power consumption fluctuates, the The situation is compared with the control information stored in the memory 44 to act on the control target setting means 41 to appropriately select the air or the mist 21 from the humidity management means 42 for at least one of the grindstone surface 31 or the ground surface 11. And spray.
[0030]
Note that the humidity sensor 9 is a constituent element for the purpose of clearly explaining the control purpose of the humidity management unit 42. Even when the humidity sensor 9 is not actually used, the driving motor power consumption meter which is a sliding load monitoring unit is used. The humidity management unit 42 can be appropriately operated based on P and the determination result of the stability determination unit 43.
[0031]
FIG. 2 is an index graph showing the state of the mechanochemical grindstone 30 in the control means of the mirror finisher shown in FIG. 1, and FIG. 2 (a) shows the correlation between the humidity (horizontal axis) and the power consumption of the drive motor, FIG. 3B is a graph showing a correlation between humidity and grinding quality. 2, the horizontal axis indicates the humidity of the mechanochemical grindstone 30 (see FIG. 1), and the vertical axis indicates that the operating state of the mirror finishing device changes in response to the change in humidity. The grinding quality and efficiency of grinding can be numerically displayed by, for example, the degree of occurrence of scratches and the cutting speed, but the grinding quality and efficiency are used as indices rather than strictly measured values.
[0032]
The state of the mechanochemical grindstone 30 at each of the indexes 1 to 8 shown in FIG. The index 1 indicates that the mechanochemical grindstone 30 is completely dried and stable when its humidity is, for example, about 0% (since it is not air, it is not a humidity in% display in weather observation and the like, but a mere reference and not shown). It shows the grinding quality and efficiency that can be obtained.
[0033]
Then, the control target setting unit 41 (see FIG. 1) is urged to humidify, and the mist 21 is sprayed from the humidity management unit 42 on at least one of the grindstone surface 31 and the ground surface 11. Then, the state shown by the indices 7 to 8 changes, and the humidity at which the mechanochemical grindstone 30 is completely immersed in water is, for example, about 100% (not shown), and the chemical action of the mechanochemical grindstone 30 is water. And reduce the grinding efficiency to an impractical level.
[0034]
The dry-type mechanochemical mirror-finish whetstone, which is the premise of the present invention, minimizes the wetting of the silica itself due to the water absorption of the PVA resin surrounding the silica of the mechanochemical whetstone 30 based on PVA (polyvinyl alcohol) resin. It is said that it is possible to maintain a high mechanochemical effect, and in general, the mechanochemical grindstone 30 is used after being dried. It was found that the highest level of grinding quality and grinding efficiency indicated by index 7 could be obtained.
[0035]
However, if the humidity of the mechanochemical grindstone 30 is increased beyond the index 2, the situation rapidly deteriorates from the index 3 and falls into an unpractical region indicated by the indexes 4 and 5. In the indices 4 and 5, the balance of the water absorption of the PVA resin surrounding the silica of the mechanochemical grindstone 30 is broken, so that the PVA resin becomes brittle and easily broken, and the silica particles cannot be retained and are separated from the mechanochemical grindstone 30. Since the work 10 is scratched, it becomes impractical.
[0036]
At this time, the drive motor power consumption W shown in FIG. 2 (a) exhibits an unstable fluctuation 45 in the range of Δ1 and Δ2 around W. The cause of the fluctuation 45 is that the PVA resin that holds the silica of the mechanochemical grindstone 30 collapses, the sliding friction resistance between the ground surface 11 of the work 10 and the grindstone surface 31 becomes unstable, and the grindstone holder becomes unstable. This is because the drive motor power consumption W also changes in accordance with the change in the load for rotating the motor 32. Regarding this unstable and impractical state, let the humidity relating to the index 3 be α, and let the humidity relating to the index 6 be β, and let the humidity of the areas α to β be referred to as critical area humidity for convenience of explanation.
[0037]
Then, when the humidity of the mechanochemical grindstone 30 is further increased from the index 5, the situation rapidly recovers from the index 5 to the index 6. The index 7 shows a situation in which the grinding quality and efficiency are maximized at the "humidity slightly exceeding the critical state" described in claim 2. Further, if the mechanochemical grindstone 30 is wet with a high humidity exceeding the index 7, the area falls into a low-efficiency and impractical area along the downward slope shown in the indexes 7 to 8. Conversely, even if the mechanochemical grindstone 30 is gradually wetted from the state of the index 8 where it is completely wet, the situation changes in the order indicated by the indexes 8 to 1.
[0038]
From the above results, the control target 40 automatically controls the humidity management unit 42 so that the control target setting unit 41 (FIG. 1) sets the target of the humidity X that achieves the condition of the index 7 that maximizes the grinding quality and efficiency. Control. This will be specifically described with reference to FIGS.
[0039]
The critical area humidity α to β is a so-called dangerous area, and it is necessary to detect and avoid it quickly. Therefore, the mechanochemical grindstone 30 as a grinding means is rotated by the drive motor M via the grindstone holder 32. A driving motor power consumption meter P as a sliding load monitoring means for monitoring a sliding load, and a stability as a critical detection means for detecting a state in which the sliding load monitored by the sliding load monitoring means fluctuates unstablely. The determination result of the determination means 43 is used.
[0040]
The above-mentioned sliding load monitoring means and criticality detecting means can grasp the correlation shown in the graph of FIG. The experimental data of the situation in which the fluctuations 45 between the heights, the humidity X, α to β of the mechanochemical grinding wheel 30 and the grinding quality and efficiency change from index 1 to index 8 are organized into a “reproducible causal relationship” and stored in memory. 44.
[0041]
The control means 40 is mainly constituted by a microcomputer, in which an arithmetic program stored in a memory 44 stores the above-mentioned experimental data, the control target setting means 41, the stability determination means 43, and each output value of the humidity sensor 9. And the humidity management unit 42 is automatically controlled so as to realize the target humidity X set by the control target setting unit 41.
[0042]
For example, if the control means 40 determines that the condition of the index 1 is present, the mist 21 is blown out to both the ground surface 11 and the grindstone surface 31 of the work 10 by the humidity management means 42 to humidify and drive motor consumption. The critical humidity X is realized by promptly passing the critical region humidities α to β while confirming the fluctuation 45 by the wattmeter P. The control target X is “humidity slightly exceeding the critical state” described in claim 2, and a specific example of the “control target setting means that sets an optimal state adjacent to the critical state as a setting target” described in claim 3 is described below. It shows the effect.
[0043]
The control in the direction indicating the status change in the order of the indexes 1 to 7 is for convenience of explanation, and it is practically impossible to control in the direction indicating the status change in the order of the indexes 8 to 7 in practice. It is convenient because it does not pass through a critical region humidity α to β. In this case, the control means 40 compares and examines the output value of the humidity sensor 9 with the above-mentioned experimental data, and the humidity control means 42 makes the humidity control means 42 dry at least one of the ground surface 11 and the grindstone surface 31 of the work 10. The air 21 is blown out to achieve the target humidity X.
[0044]
The power consumption of the drive motor power consumption meter P is constantly monitored even during the normal operation, and when the power consumption fluctuates, the state including the determination result of the stability determination means 43 is stored in the control information stored in the memory 44. By acting on the control target setting means 41 and appropriately selecting and blowing air or mist 21 from the humidity management means 42 to at least one of the grindstone surface 31 and the ground surface 11, the target humidity is controlled. Keep X.
[0045]
FIG. 3 is a schematic cross-sectional view and a block diagram of a mirror finishing apparatus in which the present invention is applied to a CMP apparatus. In the mirror finisher shown in FIG. 3, the positional relationship between the rotary table 20 and the grindstone holder 32 shown in FIG. 1 is turned upside down, and the rotary table 20a holding the work 10 is disposed above and the urethane pad 30a containing silica is disposed on the upper surface. The configured grinding wheel holder 32a is located below.
[0046]
In the case of the mirror finishing device shown in FIG. 3, the output value of the humidity sensor 9a is input to the control target setting means 41, and is compared with the target value. The target humidity is achieved by appropriately selecting and spraying air or mist 21 on at least one surface of 31a.
[0047]
The well-known silica-containing urethane pad 30a uses a polishing slurry (hereinafter, also simply referred to as "slurry") as a lubricating abrasive in which silica particles are mixed in a paste-like aqueous solution between the grindstone surface 31a and the surface 11 to be ground. While lubricating, maintain high grinding quality and grinding efficiency of mirror finish.
[0048]
However, since the slurry is expensive and has a burden on the environment during waste treatment, it is desirable to reduce the amount of use as much as possible. However, as a lubricating abrasive instead of this slurry, the inventor of the present application has set the grinding wheel surface 31a of the silica-containing urethane pad 30a. By controlling the humidity to a certain degree by the humidity control means 42 and appropriately controlling the humidity, the silica particles separated from the grindstone surface 31a by a small amount are mixed with the applied water to form a paste-like lubricating abrasive. Therefore, equivalent grinding quality and efficiency can be obtained without adding the expensive slurry.
[0049]
4 is a schematic cross-sectional view of a ground surface of a silica-containing urethane pad used in the CMP apparatus shown in FIG. 3, wherein FIG. 4A is an enlarged cross-sectional view in a dry state, and FIG. 4 is an enlarged view of a portion F shown in FIG.
[0050]
As shown in FIG. 4A, the silica-containing urethane pad 30a is configured based on a PVA resin 34 in which silica particles 33 are mixed as abrasive grains, and the PVA resin 34 has a porous structure including the pores 22. The bubbles 22 can contain a certain amount of moisture like a sponge.
[0051]
As shown in FIG. 4B, in order to maintain the quality and efficiency of the mirror finish, the slurry is used in combination with a lubricant, but the boundary between the outer peripheral surface of the silica particles 33 and the PVA resin 34 and the pores 22 are formed. It is estimated that the state where the water film 23 remains thin on the inner wall surface is one of the conditions for obtaining the highest grinding quality and efficiency shown in FIG.
[0052]
For example, in order to maximize the mechanochemical phenomenon (i.e., the chemical reaction of the minute unit induced by the applied mechanical energy) that occurs in the h between the soft abrasive grains and the workpiece even in the case of a dry-type mirror finishing device. In addition to maintaining a very small amount of moisture or moderate humidity effectively, the surface roughness due to cohesive wear can be prevented by a lubrication effect close to that of the slurry during mirror finishing.
[0053]
In addition, as shown in FIG. 4B, the amount of water that oozes out from the vicinity of the grinding contact point 35 of the water film 23 to the surface 11 to be ground of the work 10 is limited to a very small cross section of the water film 23. In the case of using water as the washing cooling medium or the above-mentioned slurry mainly composed of water, harm of water wetting can be avoided. Since the mirror finishing device minimizes or eliminates the use amount of the polishing slurry, the polishing slurry, the polishing slurry supply mechanism, and the waste liquid treatment function are also minimized or unnecessary. Therefore, both equipment costs and operation costs can be saved, and the burden on the environment due to waste liquid treatment can be reduced.
[0054]
Therefore, according to the present invention, it is possible to achieve both a mirror finish and a work that is resistant to water wetting. For example, a mirror-finished surface of sodium chloride, which is cut from a single crystal of sodium chloride, which is a water-soluble material, to form an infrared prism, or a mirror-finished surface of a workpiece made of a substance that generates a toxic gas by chemically reacting with water , Etc., against the property that dislikes water wetting, etc., without using the slurry mainly composed of water, with a lubricating effect close to that slurry, preventing surface roughness due to cohesive wear, maximizing grinding quality and efficiency Thus, it is possible to achieve both of obtaining the mirror surface and finishing the mirror surface with a property of being resistant to water wetting. In this case, the control target setting unit 41 shown in FIG. 1 is set to be slightly dry, and the humidity management unit 42 blows the slightly dried air 21.
[0055]
Regarding the above-mentioned sodium chloride, more specifically, since ordinary anhydride crystals are colorless and equiaxed hexahedrons and transmit infrared rays well, large single crystals are used for prisms of infrared spectrometers.
Unpurified sodium chloride is unusable because it contains magnesium and calcium salts and shows deliquescence, but pure sodium chloride does not have deliquescence and is water-soluble. In consideration of the above, the method can be put into practical use by polishing and devising so as not to get wet with water.
[0056]
In addition, for example, it is generally called “grinding” for a semiconductor wafer and “polishing” for lenses, prisms and jewelry, but “grinding” of the grinding means of the present invention. Means a process using a tool in which abrasive grains are fixed by a binder, and "polishing" is used in the same meaning as long as it is a process corresponding to the process.
Therefore, the mirror finishing device of the present invention is also suitable for polishing jewelry such as sapphire. However, description of the mechanism design is omitted.
[0057]
The grindstone is not limited to a donut (annular) shape, and a disc surface may be used as a grindstone surface. The mechanochemical grindstones 30 and 30a and the turntable 20 may be located in any of the upper and lower directions. .
[0058]
In addition, the water absorption of PVA surrounding the silica of the mechanochemical grindstone 30 can minimize the wetting of the silica itself and maintain a high mechanochemical effect. It is not necessary to limit to silica in order to exhibit the mechanochemical effect. Further, as the material of the "oxide" used for the abrasive grains of the grinding means, for example, at least one of fumed silica, precipitated silica, colloidal silica, fused silica, condensed silica, combustion synthetic silica, silica gel, artificial quartz, and porous silica The grinding means using a type is suitable as the grinding means which does not reduce the efficiency of mirror finishing. Also, the abrasive grains are preferably spherical.
[0059]
The cleaning and cooling medium is not a mist of pure water, but may be a mist mixed with oil or other liquid, pure water or other liquid may be applied as it is, and the grinding stone is not limited to a cup-shaped one. Alternatively, the entire lower surface of the disk may be a grindstone surface.
Further, in the embodiment, water is applied from the outer peripheral side of the annular (cup-shaped) grindstone, but water may be applied from the inner peripheral side of the annular grindstone.
[0060]
Further, the grinding means is not limited to a surface grinder using a rotary grindstone or the like, but is applied to a mirror finishing device using at least one of a grindstone, an abrasive pad, a polishing tape, and a polishing sheet. The use of the grinding means as a polishing tool is widespread.
[0061]
These are abrasive grains formed on the surface of a platen (platen) that moves in an eccentric small circle (orbital), instead of a surface grinding machine that combines a rotating whetstone that moves in a single rotation and a work holder that sucks a work. A method of using a work holder with a work sucked down on the ground surface of the pad, or a polishing tape of a belt conveyor type, a partial contact scanning process with an annular semi-fixed hard pad of a rotary scanning type, a cylindrical pad that rotates, Alternatively, the present invention is applied to a mirror finishing device using any tool (pad) of a polishing sheet.
[0062]
A precision mechanical device that is applied to a mirror finishing device using any of the tools (pads) described above, and that appropriately rotates, rotates, revolves, swings, or reciprocates (linearly) a rotating grindstone or a work. The devices having the configurations described in Japanese Patent Application Laid-Open No. 2001-71242, JP-A-2001-246557, JP-A-2001-32256, JP-A-2001-358106, JP-A-3-104536, and JP-A-4-141336 can be realized by designing by those skilled in the art. Further illustration and explanation are omitted because they are considered.
[0063]
Note that the present invention can be variously modified within the scope of the technical idea, and various embodiments other than the above-described embodiment are conceivable. In these, as described in claim 1, in a mirror finishing device provided with a grinding means accompanied by a chemical action, a humidity for managing the humidity of at least one of the ground surface of the grinding means and the surface to be ground of the work. Naturally, all the cases belonging to the present invention belong to the present invention.
[0064]
【The invention's effect】
As described above, according to the first aspect of the present invention, the grinding means having a chemical action makes the ground surface brittle at a critical region humidity between the dry state and the wet state, and Since a scratch is generated on the ground surface and there is a critical state that is considered to be unsuitable for practical use, the humidity management unit sets the ground surface of the grinding unit and at least one of the surfaces to be ground of the work to the optimum humidity. If maintained, the critical state can be avoided.
[0065]
Further, since the humidity slightly exceeding the critical region humidity is in an optimum state for maximizing the operation efficiency and the production quality of the mirror finishing device, if the humidity management means sets and maintains the optimum humidity, You can achieve your goals.
[0066]
According to the invention according to claim 2, a causal relationship between the sliding load monitoring result of the sliding load monitoring means and the optimum state is grasped in advance by an experiment, and the control means dries the sliding load slightly more than the critical region humidity. By setting and maintaining the set humidity, the optimum state can be stably and easily maintained.
[0067]
According to the invention according to claim 3, it is determined whether or not the critical state has been reached, based on the determination result of the stability determining means for determining whether the power consumption is stable or unstable by using the fluctuation characteristics of the driving load. Can be determined.
[0068]
Therefore, the optimum state can be easily maintained by setting and maintaining a state in which the humidity is slightly dried from the critical area humidity by the control means that is grasped in advance through experiments and is based on empirical rules.
[0069]
According to the invention according to claim 4, the use as a mirror finishing tool for machining a work having a complicated shape other than the surface grinder is widespread.
[0070]
According to the fifth aspect of the present invention, the amount of the polishing slurry used is minimized or unnecessary, so that the polishing slurry, the polishing slurry supply mechanism, and the waste liquid treatment function are also minimized or unnecessary. Therefore, both equipment costs and operation costs can be saved, and the burden on the environment due to waste liquid treatment can be reduced.
[0071]
According to the invention of claim 6, as the oxide material, for example, at least one of fumed silica, precipitated silica, colloidal silica, fused silica, condensed silica, synthetic silica, silica gel, artificial quartz, and porous silica Is suitable as the grinding means which does not reduce the efficiency of mirror finishing.
[0072]
Then, various combinations of oxide abrasive grains (right) optimal for the work (left) using various materials can be selected.
(A) Quartz: Fe3O4
(B) Si: BaCo3  , CaCO3
(C) Si3N4  : Cr2O3
(D) Fe2O3  : Fe3O4
(E) AlO3  : SiO2  , Fe2O3  , Fe3O4
(F) Si3N4  : CaCO3  , MgO, SiO2  , Fe2O3  , Fe3O4
(G) Glass: CeO2
(H) SiC: Cr2O3  , Al2O3
(I) AlN: Cr2O3
(Nu) ZrO2  : SiO2  , CeO2
[Brief description of the drawings]
FIG. 1 is a schematic cross-sectional view of a mirror finishing device according to an embodiment of the present invention, and a block diagram illustrating a control unit.
FIG. 2 is an index graph showing a state of a mechanochemical grinding wheel in a control means of the mirror surface finishing device shown in FIG. 1, wherein FIG. 2 (a) shows a correlation between humidity and drive motor power consumption, and FIG. 2 (b). Is a graph showing the correlation between humidity and grinding quality.
FIG. 3 is a schematic cross-sectional view and a block diagram of a mirror finishing apparatus in which the present invention is applied to a CMP apparatus.
4 is a schematic cross-sectional view of a ground surface of a silica-containing urethane pad used in the CMP apparatus shown in FIG. 3, wherein FIG. 4A is an enlarged cross-sectional view in a dry state, and FIG. It is an enlarged view of F part shown to a).
[Explanation of symbols]
1-8 Index indicating the status of mechanochemical grinding wheels
9,9a Humidity sensor
10 Work
11 Surface to be ground
20,20a Rotary table
21 Air or mist
22 pores
23 Water film
30, 30a Mechanochemical whetstone
31, 31a Whetstone surface
32, 32a Whetstone holder
33 silica particles
34 PVA resin
35 Grinding contacts of silica particles
40 control means
41 Control target setting means
42 Humidity control means
43 Stability determination means
44 memory
45 turbulence
P wattmeter
W Drive motor power consumption
Z1, Z2 rotation axis
α, β Critical region humidity
Δ1, Δ2 Range under turbulence

Claims (6)

化学的作用を伴う研削手段を備えた鏡面仕上げ装置において、
前記研削手段の研削面と、ワークの被研削面の少なくとも何れか一面の湿度を管理する湿度管理手段を備えたことを特徴とする鏡面仕上げ装置。
In a mirror finishing device provided with a grinding means with a chemical action,
A mirror finishing device comprising: a humidity control unit that controls humidity of at least one of a ground surface of the grinding unit and a ground surface of a workpiece.
前記湿度管理手段として、
前記研削手段の摺動負荷を監視する摺動負荷監視手段と、
前記摺動負荷監視手段により監視する摺動負荷が不安定に乱高下する状態を検出する臨界検出手段と、
前記臨界検出手段が検出する臨界状態に隣り合わせた最適状態であって前記臨界状態を僅かに超えた湿度に設定し維持する制御手段と、を備えたことを特徴とする請求項1に記載の鏡面仕上げ装置。
As the humidity management means,
Sliding load monitoring means for monitoring the sliding load of the grinding means,
Criticality detection means for detecting a state in which the sliding load monitored by the sliding load monitoring means is unstable and fluctuates,
The mirror surface according to claim 1, further comprising control means for setting and maintaining the humidity in an optimum state adjacent to the critical state detected by the criticality detecting means and slightly exceeding the critical state. Finishing equipment.
前記摺動負荷監視手段として、
回転砥石を駆動する駆動モータの消費電力を計測する駆動モータ消費電力計と、
前記消費電力が安定か不安定かを判別する安定度判別手段と、
前記制御手段として、前記安定度判別手段の判別結果が不安定となることにより前記臨界状態とし、当該臨界状態に隣り合わせた最適状態を設定目標にする制御目標設定手段と、を備えたこと特徴とする請求項1または請求項2に記載の鏡面仕上げ装置。
As the sliding load monitoring means,
A drive motor power meter that measures the power consumption of the drive motor that drives the rotating grindstone,
Stability determining means for determining whether the power consumption is stable or unstable;
A control target setting unit that sets the critical state when the determination result of the stability determination unit becomes unstable, and sets an optimal state adjacent to the critical state as a setting target, as the control unit; The mirror finishing device according to claim 1 or 2, wherein
前記研削手段として、砥石、砥粒パット、研磨テープ、研磨シートの少なくとも一種類を用いたことを特徴とする請求項1ないし請求項3のいずれか1項に記載の鏡面仕上げ装置。The mirror finishing device according to any one of claims 1 to 3, wherein at least one kind of a grindstone, an abrasive pad, a polishing tape, and a polishing sheet is used as the grinding means. 前記研削手段を、CMP装置に適用したことを特徴とする請求項1ないし請求項4のいずれか1項に記載の鏡面仕上げ装置である。The mirror finishing device according to any one of claims 1 to 4, wherein the grinding means is applied to a CMP device. 前記研削手段として、酸化物の材料を用いたことを特徴とする請求項1ないし請求項5のいずれか1項に記載の鏡面仕上げ装置。The mirror finishing device according to any one of claims 1 to 5, wherein an oxide material is used as the grinding means.
JP2003129814A 2003-05-08 2003-05-08 Mirror finishing device Expired - Fee Related JP4189265B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2003129814A JP4189265B2 (en) 2003-05-08 2003-05-08 Mirror finishing device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003129814A JP4189265B2 (en) 2003-05-08 2003-05-08 Mirror finishing device

Publications (2)

Publication Number Publication Date
JP2004330362A true JP2004330362A (en) 2004-11-25
JP4189265B2 JP4189265B2 (en) 2008-12-03

Family

ID=33505511

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003129814A Expired - Fee Related JP4189265B2 (en) 2003-05-08 2003-05-08 Mirror finishing device

Country Status (1)

Country Link
JP (1) JP4189265B2 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007054950A (en) * 2005-08-25 2007-03-08 Freiberger Compound Materials Gmbh Method and device for wire sawing and slurry for wire sawing
JP2010139032A (en) * 2008-12-15 2010-06-24 Ntn Corp Machine component, rolling element for rolling bearing, bearing ring, and method for super-finishing the same
JP2011189502A (en) * 2010-03-11 2011-09-29 Lg Chem Ltd Device and method for monitoring polishing state of glass pane
CN110253426A (en) * 2019-06-26 2019-09-20 长江存储科技有限责任公司 Grinding head and chemical mechanical polishing device

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102152190B (en) * 2011-01-26 2013-07-31 金华久隆机械有限公司 Full-automatic ornament grinding and polishing machine

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007054950A (en) * 2005-08-25 2007-03-08 Freiberger Compound Materials Gmbh Method and device for wire sawing and slurry for wire sawing
JP2010139032A (en) * 2008-12-15 2010-06-24 Ntn Corp Machine component, rolling element for rolling bearing, bearing ring, and method for super-finishing the same
US8690450B2 (en) 2008-12-15 2014-04-08 Ntn Corporation Machine component and super-finishing method therefor
JP2011189502A (en) * 2010-03-11 2011-09-29 Lg Chem Ltd Device and method for monitoring polishing state of glass pane
US9028294B2 (en) 2010-03-11 2015-05-12 Lg Chem, Ltd. Apparatus and method for monitoring glass plate polishing state
TWI508819B (en) * 2010-03-11 2015-11-21 Lg Chemical Ltd Apparatus and method for monitoring glass plate polishing state
CN110253426A (en) * 2019-06-26 2019-09-20 长江存储科技有限责任公司 Grinding head and chemical mechanical polishing device

Also Published As

Publication number Publication date
JP4189265B2 (en) 2008-12-03

Similar Documents

Publication Publication Date Title
US6679769B2 (en) Polishing pad having an advantageous micro-texture and methods relating thereto
JP4838614B2 (en) Semiconductor substrate planarization apparatus and planarization method
KR101704811B1 (en) Method of processing synthetic quartz glass substrate for semiconductor
JP4224517B2 (en) Polishing method for disk-shaped substrate
JP2008093735A (en) Machining device
KR20000017219A (en) Semiconductor equipment fabrication method and working apparatus
JP2008310404A (en) Polishing device
JP4153857B2 (en) Mirror finishing device
TW202026102A (en) Polishing device
JP4189265B2 (en) Mirror finishing device
KR20160138099A (en) Method for polishing gan single crystal material
JP6517108B2 (en) CMP polisher
JP2008068338A (en) Polisher, polishing method and manufacturing method of semiconductor device
CN108081118A (en) The processing method of chip
KR20150065722A (en) Elastic grindstone dressing method
JP2008018502A (en) Substrate polishing device, substrate polishing method, and substrate treating device
JP6887016B2 (en) Gettering layer forming apparatus, gettering layer forming method and computer storage medium
JPH10315131A (en) Polishing method of semiconductor wafer and device therefor
JP2016046326A (en) Method for manufacturing structure for mold manufacturing, and method for manufacturing mold
JP2016198830A (en) Dry polishing device
JP6979608B2 (en) Grinding device and grinding method
JP2010017808A (en) Polisher and polishing method
JP4090186B2 (en) Polishing method and polishing apparatus
JP2019096911A (en) Laser processing system
JP2019071476A (en) Laser optical unit

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20060302

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20080314

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20080401

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20080528

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20080624

RD13 Notification of appointment of power of sub attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7433

Effective date: 20080701

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A821

Effective date: 20080704

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20080808

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20080902

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20080912

R150 Certificate of patent or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20110919

Year of fee payment: 3

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20110919

Year of fee payment: 3

S533 Written request for registration of change of name

Free format text: JAPANESE INTERMEDIATE CODE: R313533

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20110919

Year of fee payment: 3

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20110919

Year of fee payment: 3

S531 Written request for registration of change of domicile

Free format text: JAPANESE INTERMEDIATE CODE: R313531

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20110919

Year of fee payment: 3

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120919

Year of fee payment: 4

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130919

Year of fee payment: 5

LAPS Cancellation because of no payment of annual fees