JP2004312570A - Solid-state imaging apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To prevent an adhesive from being spread onto a circuit board when adhering circuit components to the circuit board by using the adhesive. <P>SOLUTION: An imaging device is mounted on one side of the circuit board 1 and the circuit components 8, 9 for processing an electric signal from the imaging device are adhered to the other side by the adhesive. An adhesive flowing-out preventing means 11 is provided between an end face 1a of the circuit board 1 and a peripheral part of the circuit components 8, 9 on the other side of the circuit board 1. The flowing-out preventing means 11 is formed by providing a groove 11a at a prescribed interval d from the end face 1a of the circuit board 1, or formed by forming a resist to the other side of the circuit board and forming a narrow width part in parallel with the end face at the prescribed interval d from the end face to be a board exposed part without the resist. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a solid-state imaging device that is mounted on a portable device such as a mobile phone or a notebook personal computer, and that performs imaging using an imaging device.
[0002]
[Prior art]
As an example of the prior art, an optical device disclosed in Patent Document 1 below has an image sensor mounted on a circuit board, and an electric signal from the image sensor is provided on a surface of the circuit board opposite to the image sensor mount surface. Is disposed. The imaging element and the circuit element are adhered by an adhesive (for example, underfill).
[0003]
Further, in a camera for a portable device described in Patent Document 2 below, a connection terminal portion is formed on an end face of a circuit board, and an image pickup device is wire-bonded to the connection terminal portion using a wire, and the other connection terminal portion is used. Electrical circuit.
[0004]
[Patent Document 1]
JP-A-11-340448 [Patent Document 2]
JP-A-2002-374438
[Problems to be solved by the invention]
In the above-mentioned Patent Document 1, there is a problem that the adhesive for circuit element bonding flows out to reach, for example, a mounting position of another portable device member, and the other member cannot be mounted. Further, in the above-mentioned Patent Document 2, the optical filter is coated with an adhesive on the outer peripheral portion of the upper surface and is bonded to the holder, and the holder is also bonded to the circuit board with the adhesive. When a large amount of adhesive is applied, the adhesive flows along the inner wall of the holder, spreads on the circuit board, reaches the end face, and electrically connects the connection terminal portion formed on the end face to another electric circuit. There is a problem that connection becomes impossible. In particular, miniaturization has recently been required, and it has been desired to reduce the size of the circuit board as much as possible.
[0006]
Therefore, the present invention prevents the adhesive from flowing out and spreading on the circuit board, and enables downsizing.
[0007]
[Means for Solving the Problems]
The solid-state imaging device according to the present invention includes, on a circuit board, an imaging element, a circuit element that processes an electric signal from the imaging element, and a holder that surrounds the imaging element, which are mounted via an adhesive. Is characterized in that a means for preventing the adhesive from flowing out is provided between an end face of the circuit board and at least an outer peripheral portion of one of the holder and the circuit element. With this configuration, when the imaging element, the holder, and the circuit element are bonded to the circuit board using the adhesive, even if the adhesive flows out from the outer peripheral portion toward the end surface of the circuit board, the flow-out preventing means is provided. And does not spread on the circuit board.
[0008]
The outflow prevention means is preferably a groove provided on the circuit board at a predetermined interval from at least one of the holder and the circuit element. In addition, the outflow prevention means may be formed by forming a resist on the circuit board, and leaving a predetermined width from the end face and a narrow portion parallel to the end face as a substrate exposed portion where no resist is provided. Is preferred. In any case, since the production is easy, the production cost does not increase.
[0009]
BEST MODE FOR CARRYING OUT THE INVENTION
An embodiment of the present invention will be described with reference to the drawings.
[0010]
As shown in FIG. 1, an image sensor 2 and a holder 3 are mounted on one surface (upper surface) of the circuit board 1 so as to surround the image sensor 2.
[0011]
The lower side of the holder 3 that contacts the circuit board 1 is a square portion 3a, and the holder 3 is bonded to the upper surface of the circuit board 1 at the lower end surface of the square portion 3a using an adhesive. The imaging element 2 is fitted and held in a rectangular recess 3b provided on the lower end side of the rectangular portion 3a. On the upper surface of the image sensor 2, a light receiving section 2a is provided. An opening 3c serving as a light passage is provided above the light receiving portion 2a. A concave portion 3d for disposing an optical filter 4 such as an infrared cut filter is provided on a lower surface of a peripheral portion of the opening 3c, and the optical filter 4 is bonded to the concave portion 3d with an adhesive (not shown). At an upper portion of the holder 3, a cylindrical portion 3e concentric with the opening 3c is provided. A female screw portion 3f is formed on the inner peripheral surface of the cylindrical portion 3e.
[0012]
The lens holder 5 is located above the holder 3. An opening 5a for introducing light is provided on the upper surface of the lens holder 5, and a cylindrical portion 5b is provided so as to protrude downward. On the outer peripheral surface of the cylindrical portion 5b, a male screw portion 5c screwed with the female screw portion 3f is provided. A lens 6 is fixed in a cylindrical portion 5b by a lens retainer 7. The male screw part 5c of the lens holder 5 to which the lens 6 is fixed and the female screw part 3f of the holder 3 are screwed together to connect the lens holder 5 to the holder 3.
[0013]
When the lens holder 5 is connected to the holder 3, the opening 5a, the lens 6, the opening 3c, the optical filter 4, and the light receiving unit 2a are set such that their centers coincide with the optical axis. . Then, by adjusting the screwing amount between the male screw portion 5c and the female screw portion 3f, the distance between the lens 6 and the light receiving portion 2a can be finely adjusted in the optical axis direction, so-called focusing can be performed. .
[0014]
When bonding the holder 3 to which the image pickup device 2 is fitted and held to the circuit board 1, the image pickup device 2 is connected to the circuit board 1 by, for example, a flip-chip method and bonded by an adhesive (not shown). An adhesive (not shown) is applied to the lower end surface and adheres to the circuit board 1.
[0015]
On the other surface (lower surface) of the circuit board 1, as shown in FIGS. 2 and 3, a circuit element 8 such as a DSP for processing a signal from the image sensor 2 and a circuit element 9 such as a resistor and a capacitor are arranged. And bonded by an adhesive 10. On the circuit element bonding surface of the circuit board 1, a means 11 for preventing the adhesive 10 from flowing out is provided in parallel with the end surface 1a at a slight distance d from the end surface 1a. The interval d is set to an interval necessary as a flow-out prohibition area, and a mounting portion of another portable device member (not shown) and a connection portion with another electric circuit are formed.
[0016]
The means 11 for preventing the adhesive from flowing out is formed by providing a groove 11a in the circuit board 1 as in the example shown in FIG. When the circuit element 8 is adhered to the circuit board 1 using the adhesive 10 by the groove 11 a, the adhesive 10 wraps around from the bottom surface of the circuit element 8 to the outer peripheral portion and flows out to the end face 1 a of the circuit board 1. However, when the adhesive 10 flows into the groove 11a, the adhesive 10 is divided and diffused in the groove 11a, and is prevented from flowing over the groove 11a to the end face 1a. The same applies when the circuit element 9 is bonded, and the adhesive 10 is prevented from flowing out to the end surface 1a of the circuit board 1.
[0017]
Similarly, a groove (not shown) is formed in the circuit board 1 at a position separated from the outer peripheral portion of the holder 3 by a predetermined distance, and an adhesive for adhering the imaging element 2, the holder 3, and the optical filter 4 has an end face. 1a can be prevented.
[0018]
Since the groove 11a and the groove (not shown) are formed between the circuit elements 8, 9 and the holder 3 and the end surface 1a, the adhesive 10 for bonding the circuit elements 8, 9 and the imaging element 2 are formed. The adhesive (not shown) for bonding the holder 3 and the optical filter 4 can be prevented from spreading on the circuit board 1 and reaching the end surface 1a. Therefore, these adhesives reach a mounting position of another portable device member or a connection portion with another electric circuit, so that other members cannot be mounted, or an electric connection between the circuit board 1 and another electric circuit. Can be prevented from being disabled.
[0019]
FIG. 4 shows another example of the means 11 for preventing the adhesive from flowing out. In many cases, a resist is formed on the circuit element bonding surface of the circuit board 1. Therefore, when forming the resist, the resist 12a is formed on the surface between the end face 1a of the circuit board 1 and the interval d, and the resist 12b is formed on the surface where the circuit elements 8 and 9 are bonded. A gap is provided between the resists 12a and 12b. This gap is set to have substantially the same width as the above-mentioned groove 11a, thereby forming the substrate exposed portion 11b. Since the substrate exposed portion 11b is a groove which is lowered by the thickness of the resist, the adhesive 10 flows from the bottom surface of the circuit element 8 to the outer peripheral portion and flows out to the end surface 1a of the circuit substrate 1 in the same manner as the groove 11a. However, when the adhesive 10 flows into the groove of the substrate exposed portion 11b, the adhesive 10 is divided and diffused in the groove, and the adhesive 10 is prevented from flowing over the substrate exposed portion 11b and flowing out to the end face 1a. Is done. The same applies when the circuit element 9 is bonded, and the adhesive 10 is prevented from flowing out to the end surface 1a of the circuit board 1.
[0020]
Similarly, the circuit board 1 is provided with a substrate exposed portion (not shown) at a location separated by a predetermined distance from the outer peripheral portion of the holder 3, and an adhesive for adhering the imaging element 2, the holder 3 and the optical filter 4. Can be prevented from flowing to the end face 1a.
[0021]
As described above, since the substrate exposure portion 11b and the substrate exposure portion (not shown) are formed between the circuit elements 8, 9 and the holder 3 and the end surface 1a, the adhesive 10 for bonding the circuit elements 8, 9 is formed. In addition, it is possible to prevent an unillustrated adhesive for bonding the imaging element 2, the holder 3, and the optical filter 4 from spreading on the circuit board 1 and reaching the end face 1a. Therefore, these adhesives reach a mounting position of another portable device member or a connection portion with another electric circuit, so that other members cannot be mounted, or an electric connection between the circuit board 1 and another electric circuit. Can be prevented from being disabled.
[0022]
Further, since these exposed portions of the substrate on which the resist is not formed can be formed simultaneously with the formation of the resist in the manufacturing process of the circuit board 1, the grooves shown in the above-described embodiment after the manufacture of the circuit board 1 are different from those of the above-described embodiment. Can be omitted, and the manufacturing process is not complicated.
[0023]
In the present invention, the circuit elements 8 and 9 are arranged on the surface opposite to the surface on which the imaging device 2 and the holder 3 are formed, but they may be arranged on the same surface.
[0024]
Further, in the present invention, the flow-out prevention means 11 is a concave portion such as the groove 11a and the substrate exposed portion 11b, but the flow-out prevention means 11 is not limited to this and can be appropriately changed. For example, the flow-out preventing means 11 may be a convex.
[0025]
In addition, although the outflow prevention means 11 is formed on the opposite end face of the circuit board 1 according to the illustrated example, it is not limited to this, and may be provided along all four end faces of the circuit board. Alternatively, it may be provided along three end faces.
[0026]
【The invention's effect】
In the solid-state imaging device of the present invention, the means for preventing the adhesive from flowing out is provided between the end face of the circuit board and at least the outer peripheral portion of the holder and the circuit element. Thus, when the adhesive is bonded to the circuit board, the adhesive can be prevented from spreading on the circuit board. Further, by providing the flow-out preventing means, the circuit board can be set to a necessary minimum area, and downsizing can be achieved.
[Brief description of the drawings]
FIG. 1 is a sectional view showing an embodiment of the present invention.
FIG. 2 is a bottom view of FIG.
FIG. 3 is a sectional view taken along the line AA of FIG. 2;
FIG. 4 is a sectional view showing another example along the line AA in FIG. 2;
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Circuit board 1a End surface 2 Image sensor 2a Light receiving part 3 Holder 8, 9 Circuit element 11 Outflow prevention means 11a Groove 11b Substrate exposed part

Claims (3)

On the circuit board, an image sensor and a circuit element that processes an electric signal from the image sensor and a holder that surrounds the image sensor are mounted via an adhesive,
The solid-state imaging device according to claim 1, wherein the circuit board is provided with a means for preventing the adhesive from flowing out between an end surface of the circuit board and at least an outer peripheral portion of one of the holder and the circuit element. 2. The solid-state imaging device according to claim 1, wherein the flow-out prevention unit is a groove provided at a predetermined distance from at least one of the holder and the circuit element. 2. The device according to claim 1, wherein the flow-out preventing means forms a resist on the circuit board, and sets a narrow portion parallel to the end face at a predetermined interval from the end face to a substrate exposed portion where no resist is provided. A solid-state imaging device characterized by the following.

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