JP2004301668A - Measuring route generation method, apparatus and method for non-contact three-dimensional measurement - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To simplify the operation and to shorten the measuring time. <P>SOLUTION: In order to measure the flatness of the bump of an LSI package as a work, a CAD data figure 12' is displayed on a CRT, and a measuring route for continuously measuring the multitude of bumps using a laser probe is automatically generated on the basis of CAD data. The CAD data figure 12' is collated with the measuring route, only the signal regarding the part of the bumps is extracted from the detection signal obtained by controlling the laser probe according to the measuring route, and the flatness of the LSI package is obtained on the basis of the extraction result. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a non-contact three-dimensional measuring device, a non-contact three-dimensional measuring method, and a measurement route generating method suitable for measuring the properties of a work by measuring the displacement of a specific measurement element on the work with a non-contact displacement meter. About.
[0002]
[Prior art]
2. Description of the Related Art As an apparatus for measuring a work (object to be measured) in a non-contact manner, an image measurement apparatus that images a work with a CCD camera or the like and measures a contour shape of the work based on the work image is widely known. . When three-dimensional measurement including the height direction of the work is performed by the image measurement device, focus determination is performed based on the contrast of the image on the measurement surface, and the focus position is set as a position in the height direction. However, the focus determination method not only requires a long time for determination, but also has a problem that a measurement error is large. In particular, in the case of measuring the flatness of an LSI package or the like, it is difficult to perform measurement that meets the requirements using only an image measuring device.
[0003]
Therefore, an image measuring device equipped with an image pickup unit equipped with a non-contact displacement meter such as a laser probe together with a CCD camera for image measurement, and configured to measure a minute displacement of a work for which focusing determination is difficult by the non-contact displacement meter. For example, it is known from Patent Document 1. According to this, it is also possible to execute the measurement of a work that requires high accuracy in the height direction, such as the measurement of the flatness of an LSI package. Also, while observing the work image obtained by the CCD camera, measurement for defining a measurement route for measuring the height of a bump such as an LGA (Land Grid Array) or a BGA (Ball Grid Array) of an LSI package is performed. The tool (straight line tool, area tool, spiral tool, etc.) is set, and the non-contact displacement meter is driven along this measurement route, which enables high-speed, high-accuracy workpiece scanning measurement. Have been.
[0004]
[Patent Document 1]
JP-A-11-351841 (page 5, FIG. 1, FIG. 2, FIG. 7, FIGS. 12 to 18 and the like)
[0005]
[Problems to be solved by the invention]
However, in the apparatus disclosed in Patent Document 1, when arranging a measurement tool, an operator must look at a workpiece image and input the shape, size, measurement pitch, and the like of the tool, which makes the operation complicated. It was.
Further, Patent Document 1 discloses that a measurement pitch or the like is determined using design value data, but only a fixed value is input as the measurement pitch. For this reason, for example, in the case of bumps such as LGA and BGA of an LSI package, there is no problem as long as the bumps are arranged at a constant pitch. It is necessary to designate a new measurement range for a portion having a different arrangement pitch as a measurement range, and re-input the measurement pitch separately. Therefore, the measurement time cannot be reduced as expected.
The present invention has been made in view of this problem, and has as its object to provide a measurement route generation method, a non-contact three-dimensional measurement device, and a method that are easy to operate and that can reduce the measurement time. I do.
[0006]
[Means for Solving the Problems]
In order to achieve the above object, a measurement route generation method according to the present invention includes an imaging unit that images a work and outputs two-dimensional image information for image measurement and a distance between the measurement point and the measurement point on the work. A measurement route generating method for generating a measurement route when moving an imaging unit having a non-contact displacement meter that detects as a measurement along a specific measurement element to be measured on the workpiece in a measurement three-dimensional space, Extracting position information indicating the position of a specific measurement element of the work from the shape data of the work, and generating a measurement route for the non-contact displacement meter to follow the specific measurement element from the extracted position information. It is characterized in that.
[0007]
According to the present invention, position information indicating a position of a specific measurement element on the work is extracted from the shape data of the work, and a measurement route that follows the specific measurement element is generated from the extracted position information. . Therefore, it is not necessary to input a measurement pitch or the like, and the measurement route can be easily generated.
[0008]
In the present invention, the shape data of the work may be design data of the work. The shape data of the work is two-dimensional image information for image measurement obtained by imaging the work, and the position information recognizes image information of the specific measurement element from the two-dimensional image information. By doing so, it can be extracted.
[0009]
In order to achieve the above object, a non-contact three-dimensional measuring apparatus according to the present invention includes: an imaging unit that captures an image of a workpiece and outputs two-dimensional image information for image measurement; and a distance between a measurement point on the workpiece. An imaging unit including a non-contact displacement meter that detects the amount of displacement, an imaging unit driving unit that drives the imaging unit to an arbitrary position in a measurement three-dimensional space, and a specific shape on the work from the shape data of the work. Extracting a position information indicating the position of the measurement element, a measurement route generation unit that generates a measurement route from which the non-contact displacement meter follows the specific measurement element, and the non-contact displacement along the measurement route; A control unit that controls the imaging unit driving unit so that the meter moves, and extracts only the displacement amount of the specific measurement element portion from the detection signal of the non-contact displacement meter based on the position information. An extraction unit, characterized in that a quality data generating output means for generating and outputting the property data of the workpiece based on the displacement amount extracted by the extraction unit.
[0010]
According to the present invention, the measurement route generation unit extracts position information indicating the position of the specific measurement element on the work from the shape data of the work, and generates a measurement route for following the specific measurement element from the position information. You. The imaging unit driving unit is controlled by the control unit along this measurement route. Also, based on the position information, only the displacement of the specific measurement element portion is extracted by the extraction unit from the detection signals of the non-contact displacement meter. Then, based on the extracted displacement amount, the property data of the work is generated / output by the property data generation / output means. That is, even if a specific measurement element is arranged at an irregular pitch on the measurement route, position information of the specific measurement element is obtained, and only the displacement amount of the specific element portion is extracted by the extraction unit. . A measurement route is generated based on the shape data of the workpiece, and position information of a specific measurement element is also extracted. Therefore, whether the specific measurement element is formed at a constant pitch or an irregular pitch is determined. In addition, the measurement of a specific measurement element can be completed, and the measurement time can be reduced.
[0011]
In the present invention, the measurement route generation unit may be configured to generate the measurement route based on design data of the work. Further, in the present invention, it may be configured to include a coordinate system matching unit that matches a coordinate system of the work image with a coordinate system of the design data. Further, the measurement route generation unit may be configured to generate the measurement route using an image of the work captured by the imaging unit.
[0012]
In order to achieve the above object, the non-contact three-dimensional measurement method according to the present invention extracts position information indicating a position of a specific measurement element on the work from shape data of the work, and extracts the specific information from the position information. Generating a measurement route for measuring the measurement element; moving a non-contact displacement meter along the measurement route to measure the shape of the work including the specific measurement element; and Acquiring position information indicating the position of the specific measurement element along the basis of the shape data, and only the detection signal of the specific measurement element portion from the detection signal of the non-contact displacement meter to the position information. And extracting and outputting property data of the workpiece based on the extracted detection signal.
[0013]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings.
FIG. 1 is a perspective view showing an entire configuration of a non-contact three-dimensional measuring device according to an embodiment of the present invention. This apparatus includes a three-dimensional measuring machine 1 having a non-contact image measuring function and a non-contact displacement measuring function, and a computer system 2 for controlling the driving of the three-dimensional measuring machine 1 and executing necessary data processing. It is configured.
[0014]
The coordinate measuring machine 1 is configured as follows. That is, a measurement table 13 on which the work 12 is placed is mounted on the gantry 11, and the measurement table 13 is driven in the Y-axis direction by a Y-axis drive mechanism (not shown). Support arms 14 and 15 extending upward are fixed to the center of both sides of the gantry 11, and an X-axis guide 16 is fixed so as to connect both upper ends of the support arms 14 and 15. An imaging unit 17 is supported by the X-axis guide 16. The imaging unit 17 is driven along the X-axis guide 16 by an X-axis driving mechanism (not shown). The computer system 2 includes a computer 21 for performing measurement information processing and various controls, a keyboard 22, a joystick box 23 and a mouse 24 for inputting various instruction information, a CRT display 25 for displaying a measurement screen, an instruction screen, and a measurement result. And a printer 26 for printing out the measurement results.
[0015]
The inside of the imaging unit 17 is configured as shown in FIG. That is, the slider 31 is provided movably along the X-axis guide 16, and the Z-axis guide 32 is fixed to the slider 31 integrally. A support plate 33 is slidably provided in the Z-axis guide 32 in the Z-axis direction. The support plate 33 has a CCD camera 34 as an image pickup means for image measurement and a laser probe as a non-contact displacement meter. 35 are provided side by side. Thus, the CCD camera 34 and the laser probe 35 can be simultaneously moved in the X, Y, and Z axes while maintaining a fixed positional relationship. An illumination device 36 for illuminating the imaging range is added to the CCD camera 34. In the vicinity of the laser probe 35, a CCD camera 38 for imaging the periphery of the measurement position to confirm the measurement position of the laser probe 35 by the laser beam, and an illumination device 39 for illuminating the measurement position of the laser probe 35 Are provided. The laser probe 35 is supported by a vertical movement mechanism 40 for retracting the laser probe 35 when the imaging unit 17 moves, and a rotation mechanism 41 for adjusting the directionality of the laser beam to an optimal direction. .
[0016]
FIG. 3 is a diagram showing details of the laser probe 35. The light emitted from the semiconductor laser 51 passes through a beam splitter 52 and a quarter-wave plate 53, is converted into a parallel beam by a collimator lens 54, and is transmitted through mirrors 55 and 56 and an objective lens 57 to a measuring section of the work 12. To form a light spot. The light reflected from the measurement section of the work 12 is reflected by the beam splitter 52 along the reverse path of the mirrors 56 and 55, the collimator lens 54 and the quarter-wave plate 53, and is vertically split by the edge mirror 58. . The vertically split light is detected by the vertically split light receiving elements 59 and 60.
[0017]
The detection circuit 61 outputs a signal corresponding to the amount of deviation from the focal position of the objective lens 57 to the measurement surface 62 of the work 12 based on the output signals from the two-divided light receiving elements 59 and 60. The servo circuit 63 outputs a drive signal for driving the objective lens 57 to the drive mechanism 64 based on the detection output of the detection circuit 61. When the objective lens 57 moves up and down, the movable member 67 of the displacement detector 66 moves with respect to the fixed member 68. This movement amount is output as a displacement amount.
[0018]
FIG. 4 is a block diagram of the entire apparatus showing the configuration of the coordinate measuring machine 1 and the computer system 2 in more detail. In the coordinate measuring machine 1, image signals obtained by imaging the work 12 with the CCD camera 34 for image measurement and the CCD camera 38 for confirming the measurement position of the laser probe 35 are converted into A / D converters 71 and 72, respectively. Is converted into multi-valued image data by the selector, and one of them is selected by the selection circuit 73 and supplied to the computer 21. Illumination light necessary for imaging by the CCD cameras 34 and 38 is given by the illumination control units 74 and 75 controlling the illumination devices 36 and 39, respectively, under the control of the computer 21. The signal of the displacement amount obtained from the laser probe 35 is supplied to the computer 21 via the A / D converter 76. Then, the imaging unit 17 including these is driven in the XYZ-axis directions by the XYZ-axis driving unit 77 that operates based on the control of the computer 21. The position of the imaging unit 17 in the XYZ-axis direction is detected by the XYZ-axis encoder 78 and supplied to the computer 21.
[0019]
On the other hand, the computer 21 includes a CPU 81 serving as a control center, a multi-value image memory 82 connected to the CPU 81, a program storage unit 83, a work memory 84, interfaces 85, 86, 88, and a multi-value image memory. And a display control unit 87 for displaying the multi-valued image data stored in 82 on the CRT display 25. The CPU 81 switches the selection circuit 73 between the image measurement mode and the laser measurement mode. The multivalued image data for image measurement or the multivalued image data for laser measurement selected by the selection circuit 73 is stored in the multivalued image memory 82. The multivalued image data stored in the multivalued image memory 82 is displayed on the CRT display 25 by the display control operation of the display control unit 87.
[0020]
On the other hand, operator instruction information input from the keyboard 22, the joystick 23 and the mouse 24 is input to the CPU 81 via the interface 85. Further, the CPU 81 captures the displacement amount detected by the laser probe 35, the XYZ coordinate information from the XYZ axis encoder 78, and the like. The CPU 81 executes various processes such as stage movement by the XYZ-axis driving unit 77 and arithmetic processing of measured values, based on the input information, the instructions of the operator, and the programs stored in the program storage unit 83. The work memory 84 provides a work area for various processes of the CPU 81. The measured values are output to the printer 26 via the interface 86. The interface 88 is for converting CAD data of the work 12 provided from an external CAD system (not shown) into a predetermined format and inputting the converted data to the computer system 21.
[0021]
Next, in the non-contact three-dimensional measuring apparatus according to the present embodiment configured as described above, the laser probe 35 is moved along a measurement route passing through a large number of specific measurement elements (eg, bumps of an LSI package). Then, a scanning measurement mode for continuously measuring a large number of specific measurement elements will be described. Although various types of work 12 are conceivable, a case will be described here where the work 12 is an LSI package in which a number of bumps (LGA) having horizontal vertices are formed in the horizontal and vertical directions. .
[0022]
FIG. 5 is a flowchart showing the procedure for executing the scanning measurement mode by the laser probe 35.
First, the CCD camera 34 and the laser probe 35 are calibrated (S1). That is, as shown in FIG. 6, a jig 91 having two non-parallel linear components L1 and L2 is placed on the measurement stage 13. The CCD camera 34 and the laser probe 35 measure the straight lines L1 and L2 in the projection plane in the Z-axis direction, obtain the equations of these straight lines, and calculate the obtained equations. An offset between the coordinate axes of the probe 35 is obtained, and this offset value is used as position calibration data for the CCD camera 34 and the laser probe 35.
[0023]
After the calibration process is completed, the work 12 is placed on the measurement table 13 instead of the jig 91, and the work coordinate system is set on the work 12 (S2). The measurement result of the work 12 is calculated based on the work coordinate system. The setting of the work coordinate system is performed to define the positional relationship with the CAD data coordinate system expressing CAD data. It is necessary and sufficient to define the work coordinate system so that the positional relationship (offset, rotation) between them can be understood. However, in the present embodiment, for the sake of convenience in tolerance determination and generation of a measurement route, the two are assumed to be the same.
Similarly, it is necessary and sufficient for the workpiece coordinate system and the machine coordinate system to know the positional relationship between them, and it is not necessary to set both the offset and the rotation to 0, but at least only the rotation is 0 (that is, the coordinate axis directions match. ) Can simplify the driving of the CCD camera 34 and the like, and in this embodiment, the two are matched using a jig or the like. That is, if the workpiece coordinate system and the machine coordinate system match, if the measurement route is parallel to the X axis or the Y axis, the drive of the XY drive mechanism of the imaging unit 17 is also performed by the X axis drive mechanism or the Y axis drive. The mechanism can be driven alone, so that the drive along the measurement route can be performed quickly.
[0024]
The procedure for setting the work coordinate system will be described with reference to FIG. First, an image of the work 12 captured by the CCD camera 34 is displayed on the CRT 25 as shown in FIG. Then, of the bumps existing on the LSI package as the work 12, the bump B1 existing at the lower left end is designated by the mouse 24, and the coordinates (x1, y1, z1) of the center point P1 of the bump B1 (mechanical coordinates) (A value based on the system) is measured by the CCD camera 34 or the laser probe 35. The measured Z coordinate value z1 is reset to 0 by an automatic or manual reset operation.
[0025]
Next, as shown in FIG. 7B, a bump B2 existing at the other end of the linear bump row BL1 where the bump 1 is present is designated with the mouse 24, and the coordinates of the center point P2 of the bump 2 ( x2, y2, z2) (value based on the machine coordinate system) is measured by the CCD camera 34 or the laser probe 35.
Subsequently, as shown in FIG. 7C, the point P1 is designated again by the mouse 24, and a straight line connecting the points P1 and P2 is designated on the X axis, thereby completing the setting of the work coordinate system.
[0026]
Next, in order to make the work coordinate system coincide with the CAD data coordinate system, a CAD data graphic is displayed on the CRT 24 as shown in FIG. 8 and corresponds to the origin position (point P1) of the currently set work coordinate system. The pointer P of the mouse 24 is moved to the position P1 'on the CAD data graphic to be clicked, and the point P1' is designated by clicking the mouse 24.
Thereby, the work coordinate system is set to (−ΔX, −Y) based on the difference (ΔX, ΔY) between the coordinate value of the point P1 based on the work coordinate system and the coordinate value of the designated point P1 ′ based on the CAD data coordinate system. ΔY). That is, the work coordinate system is reset so as to match the CAD data coordinate system.
[0027]
Next, the process proceeds to a step of generating a measurement route. It is checked whether or not the already created measurement route is stored as a measurement route information file in the program storage unit 83 (S3). If not, a new measurement route is generated (S4) and the measurement is performed. It is stored as a route information file (S5). If stored, the measurement route information file is read from the program storage unit 83 (S6).
In generating the measurement route (S4), the CAD data is searched on a straight line 102 horizontal to a certain X axis (or Y axis), and the Y coordinate (or X coordinate) of the center position is determined by the Y coordinate (or X) of this straight line. The position information of the bump 101 within the allowable range centered on the (X coordinate) is extracted, and a route following the bump 101 is generated as a measurement route from the position information as the extraction result. In this way, a measurement route parallel to the X axis or the Y axis can be automatically generated. The allowable range here is determined in consideration of the diameter of the bump 101 and the like. The line as the measurement route may be generated in any shape, but is generated as a straight line along the X-axis and the Y-axis from the viewpoint of simplicity of calculation and speeding up of driving of the coordinate measuring machine 1. It is preferred to do so. The generated measurement route is stored in the program storage unit 83 as a measurement route information file for calibrating a part of the part program (S5). In this embodiment, the position information of the bump 101 is extracted based on the CAD data, and a measurement route is generated from the position information. Therefore, whether the bump 101 is arranged at a constant pitch or at an irregular pitch. However, a measurement route can be generated irrespective of.
[0028]
Next, the part program based on the created measurement route information file is activated to start measuring the work 12 (S7). In the part program, parameters such as a filter cutoff frequency for filtering a detection signal, a measurement speed, and a running / backward running distance are set in advance. The CPU 81 generates a drive signal for driving the XYZ drive unit 77, the vertical movement mechanism 40, and the rotation mechanism 41 based on the measurement route information stored in the measurement route information file and the parameters described above. The rotation mechanism 41 is for rotating the laser probe 35. This is because the displacement detection accuracy of the laser probe 35 has some directionality, so that it is necessary to control the laser probe 35 so as to face an optimal direction with respect to the measurement route.
[0029]
When performing the scanning measurement along the measurement route, if the size of the unevenness in the Z-axis direction of the work 12 is small, the XYZ drive system 77 is not driven in the Z direction, and the laser probe 35 is not driven in the Z direction. With the position fixed, only the objective lens 57 is driven, and the Z coordinate of the work 12 can be measured based on only the driving amount of the objective lens. When the size of the unevenness in the Z-axis direction of the work 12 is large, not only the objective lens 57 but also the XYZ drive unit 77 is driven together, and the drive amount of the objective lens 57 and the drive amount of the XYZ drive unit 77 are determined. The height of the work 12 in the Z-axis direction is measured. By driving the XYZ drive unit 77, the vertical movement mechanism 40, and the rotation mechanism 41, the laser probe 35 moves along the measurement route, and at predetermined intervals, the coordinate values in the Z direction together with the x and y axis coordinate values and the point sequence data ( 10), and this is stored in the work memory 84. When the work 12 is inclined, an average plane of the point sequence data 111 is obtained, the trend correction is performed on this plane, and the result is stored in the work memory 84.
[0030]
Next, bump position data along the measurement route information is acquired based on the CAD data (S8). Reference numeral 112 in FIG. 10 is a bump position signal that is created based on the CAD data and indicates the position of the bump along the measurement route, and indicates the position where the bump 112a exists. Using the bump position signal 112, the point sequence data 111 is filtered, and the high-frequency component is further filtered by a low-pass filter (not shown). As shown in FIG. Is obtained (S9). In this embodiment, as shown by a bold line in the signal 113 in FIG. 10, only data in a peripheral area within a predetermined distance from the center of the bump is extracted. By calculating the average of the heights of the extracted signals 113, the flatness (coplanarity) of the LSI package can be calculated as property data (S10). Since the point sequence data 111 is filtered by the bump position signal 112, the point sequence data 111 may include shape data of a portion other than the bumps along the measurement route. For this reason, in the present embodiment, it is not necessary to stop the laser probe 35 on each bump one by one for measurement, and the measurement time can be shortened.
[0031]
The embodiment of the present invention has been described above, but the present invention is not limited to this. For example, in the above-described embodiment, the work coordinate system is set so that the work coordinate system matches the CAD data. However, the work coordinate system does not always need to match the CAD data coordinate system, and the data indicating the correspondence is not necessarily required. (Offset and rotation amount) may be acquired, and coordinate conversion may be performed based on this data.
[0032]
In the above-described embodiment, the measurement route is generated based on the CAD data as the shape data of the work 12. However, instead of the CAD data, an image of the work captured by the CCD camera 34 is used. Is also good. That is, a work image captured by the CCD camera 34 is displayed, and an image of a specific measurement element such as a bump is extracted on the work image by a known method such as pattern matching. The measurement route may be generated based on the position of.
[0033]
In the above embodiment, the work 12 is assumed to be an LSI package having a large number of bumps (LGA, etc.). However, the work 12 of the present invention is not limited to this, and a large number of specific measurement elements may be used. The present invention can be similarly applied as long as it has. For example, as a work 12, a pin of a PGA (Pin Grid Array) having a large number of pins, a lens of a micro lens array, or the like is used as a specific measurement element, and a measurement route that follows such a pin or a lens is generated. It can also be measured by a program.
[0034]
【The invention's effect】
As described above, the measurement route generation method, the non-contact three-dimensional measurement device, and the non-contact three-dimensional measurement method according to the present invention have an effect that the operation is simple and the measurement time can be reduced.
[Brief description of the drawings]
FIG. 1 is a perspective view of a non-contact three-dimensional image measuring device according to an embodiment of the present invention.
FIG. 2 is a perspective view of the inside of an imaging unit in the apparatus shown in FIG.
FIG. 3 is a diagram showing a configuration of a laser probe in the apparatus shown in FIG.
FIG. 4 is an overall block diagram of the apparatus shown in FIG.
FIG. 5 shows a procedure of measurement by a laser probe 35 by the apparatus shown in FIG.
6 is a diagram for explaining a method of calibrating a CCD 34 and a laser probe 35 of the apparatus shown in FIG.
FIG. 7 is a diagram showing a procedure for setting a work coordinate system in the apparatus shown in FIG. 1;
FIG. 8 is a diagram showing a procedure for matching a work coordinate system with a CAD data coordinate system.
9 shows a method of determining a measurement route in the apparatus shown in FIG.
FIG. 10 is a diagram illustrating a method of extracting only a signal related to a bump from a detection signal of a laser probe 35 in the apparatus shown in FIG.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 ... Coordinate measuring machine, 2 ... Computer system, 11 ... Stand, 12 ... Work, 13 ... Measurement table, 14, 15 ... Support arm, 16 ... X-axis Guides, 17: imaging unit, 21: computer, 22: keyboard, 23: joystick box, 24: mouse, 25: CRT display, 26: printer, 34, 38 ... CCD camera, 35 ... Laser probe, 36, 39 ... Illumination device, 40 ... Vertical movement mechanism, 41 ... Rotation mechanism, 51 ... Semiconductor laser, 52 ... Beam splitter , 53 ... 1/4 wavelength plate, 54 ... collimating lens, 55, 56 ... mirror, 57 ... objective lens, 58 ... edge mirror, 59, 60 ... 2 split light receiving element , 6 DESCRIPTION OF SYMBOLS 1 ... Detection circuit, 63 ... Servo circuit, 64 ... Drive mechanism, 66 ... Displacement detector, 67 ... Movable member, 68 ... Fixed member, 71, 72 ... A / D converter, 73 selection circuit, 74, 75 illumination control unit, 76 A / D converter, 77 XYZ axis drive unit, 78 XYZ axis encoder, 81 ... CPU, 82 ... Multi-valued image memory, 83 ... Program storage unit, 84 ... Work memory, 85, 86, 88 ... Interface, 87 ... Display control unit, 101 ... -Bump figure, 102 ... line.

Claims (8)

An imaging unit including an imaging unit that captures an image of a workpiece and outputs two-dimensional image information for image measurement and a non-contact displacement meter that detects a distance between the measurement point on the workpiece as a displacement amount, A measurement route generation method for generating a measurement route when moving along a specific measurement element to be measured on the workpiece in a space,
Extracting position information indicating the position of a specific measurement element of the work from the shape data of the work,
A method for generating a measurement route, wherein the non-contact displacement meter generates a measurement route for following the specific measurement element from the extracted position information. The method according to claim 1, wherein the shape data of the work is design data of the work. The shape data of the work is two-dimensional image information for image measurement obtained by imaging the work,
The method according to claim 1, wherein the position information is extracted by recognizing image information of the specific measurement element from the two-dimensional image information. An imaging unit including a non-contact displacement meter that detects a distance between a measurement point on the workpiece and an imaging unit that captures a workpiece and outputs two-dimensional image information for image measurement,
An imaging unit driving unit that drives the imaging unit to an arbitrary position in the measurement three-dimensional space,
A measurement route generating unit configured to extract position information indicating a position of a specific measurement element on the work from the shape data of the work, and to generate a measurement route for the non-contact displacement meter to follow the specific measurement element from the position information. When,
A control unit that controls the imaging unit drive unit so that the non-contact displacement meter moves along the measurement route,
An extraction unit that extracts only the displacement amount of the part of the specific measurement element from the detection signal of the non-contact displacement meter based on the position information,
A non-contact three-dimensional measuring apparatus, comprising: a property data generation / output unit configured to generate and output property data of the work based on the displacement amount extracted by the extraction unit. The non-contact three-dimensional measurement apparatus according to claim 4, wherein the measurement route generation unit generates the measurement route based on design data of the work. The non-contact three-dimensional measurement apparatus according to claim 5, further comprising a coordinate system matching unit that matches a work coordinate system indicating the position of the work with a coordinate system of the design data. The non-contact three-dimensional measurement apparatus according to claim 4, wherein the measurement route generation unit generates the measurement route using an image of the work captured by the imaging unit. Extracting position information indicating the position of a specific measurement element on the work from the shape data of the work, and generating a measurement route for measuring the specific measurement element from the position information;
Moving the non-contact displacement meter along the measurement route to measure the shape of the work including the specific measurement element,
Acquiring position information indicating the position of the specific measurement element along the measurement route based on the shape data;
Extracting only the detection signal of the part of the specific measurement element from the detection signal of the non-contact displacement meter based on the position information,
Generating and outputting property data of the workpiece based on the extracted detection signal.

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