JP2004291245A - Method for manufacturing matrix of mold for molding optical element, matrix, mold for molding optical element and coating apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing the matrix of a mold for molding an optical element, capable of removing the clogging with a resist and capable of applying a coating agent while well keeping the flatness of a base material, the matrix, a mold for molding the optical element and a coating apparatus. <P>SOLUTION: Since a circular linear groove 43 is provided to a spin coater chuck 40 in order to suck and hold the base material 10, the film thickness irregularity of a resist L can be suppressed and, even if the resist L flows in the linear groove 43, the resist L can be easily removed and labor at the time of production can be reduced. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a method for manufacturing a master for an optical element molding die, a master, an optical element molding die, and a coating apparatus.
[0002]
[Prior art]
2. Description of the Related Art In recent years, in the field of an optical pickup device that is rapidly developing, extremely high-precision optical elements such as objective lenses are used. When a material such as plastic or glass is molded into such an optical element using a mold, a product having a uniform shape can be rapidly manufactured. It is suitable for mass production of. Here, the mold is a consumable item, and is also expected to be damaged due to an unexpected situation. Therefore, in order to mold a high-precision optical element, it is necessary to exchange the mold regularly or irregularly. It can be said that. Therefore, it can be said that a mold for molding an optical element (also referred to as a mold for molding an optical element) needs to be prepared with a certain degree of accuracy in advance to a certain extent.
[0003]
Here, when a mold is manufactured by cutting using a single crystal diamond tool or the like, it can be said that it is troublesome and it is difficult to cut out a mold of exactly the same shape. There is a problem that the shape of the product may vary and the cost may increase.
[0004]
In particular, a certain type of optical element used in an optical pickup device is provided with a fine diffraction zone having a blazed cross section concentrically with the optical axis of an optical surface in order to improve aberration characteristics. . When the concentric grooves corresponding to such diffraction zones are formed on the optical surface transfer surface of the mold, there is a problem that the cutting process takes time and effort. When the optical element molding die is formed of super steel or the like, in order to obtain a desired optical surface transfer surface shape with high accuracy, it is necessary to perform cutting with a diamond tool or the like.
[0005]
In response to such a problem, for example, there has been an attempt to manufacture a mold by growing electroforming or the like through a chemical reaction on a mother mold having a mother optical surface corresponding to the optical surface of an optical element. With such a method of manufacturing a mold by electroforming, for example, only one master mold having an aspherical surface with a ring corresponding to the diffraction ring of the optical element formed with high precision is prepared, and there is little dimensional variation. An optical element molding die can be relatively easily transferred and formed.
[0006]
According to such a method, for example, in order to form a ring corresponding to the diffraction ring, a resist is applied as a coating agent to the surface of the matrix, electronic drawing is performed, development is performed, and electroforming is performed. An optical element molding die can be obtained. Here, in order to form a highly accurate diffraction zone on the surface of the optical element, it is necessary to suppress the thickness variation of the resist to a narrow range. In particular, when molding a high-precision optical element, a higher-precision mold for molding an optical element is required, and therefore, the precision requirement for a master mold for molding such a mold becomes extremely high.
[0007]
As a method of suppressing the thickness variation, for example, there is a spin coating process used in the semiconductor manufacturing field. In the spin coating process, a substrate is sucked and held by a spin chuck, a resist is dropped at the center of rotation while rotating the substrate, and the resist is spread using centrifugal force to control the film thickness to be constant. The shape of a spin chuck used for such a spin coating process is described in, for example, Patent Documents 1 and 2 below.
[Patent Document 1]
JP-A-10-15097
[Patent Document 2]
JP-A-9-63946
[0008]
[Problems to be solved by the invention]
In the above-mentioned Patent Documents 1 and 2, a plurality of perforations radially arranged from the rotation center are formed on the upper surface of the spin chuck, and the perforations are connected by lateral holes extending radially in the spin chuck. And is connected to a negative pressure pump. Therefore, when the substrate is disposed on the upper surface of the spin chuck and the negative pressure pump is operated, the substrate is sucked and held in the perforated holes having the negative pressure. Here, if the flatness of the upper surface of the spin chuck is high, the base material follows the upper surface of the spin chuck and is maintained at a high flatness, so that a variation in the film thickness during spin coating can be suppressed.
[0009]
However, when the resist dropped on the base material travels along its surface to reach the spin chuck and is sucked into the perforations, the solidified resist clogs the perforations and impairs the adsorption action, resulting in a locally flat surface. Degree may decrease. Furthermore, even if it is attempted to remove the solidified resist or to push out the resist in the perforation from the upper surface side of the spin chuck with a needle-shaped member, the resist merely enters the back and the clogging is not solved. There is a problem.
[0010]
Then, the present inventors considered changing the groove shape of the spin chuck. FIG. 8A is a top view of the spin chuck considered by the present inventors, and FIG. 8B is a cross-sectional view of the spin chuck cut along line BB in the axial direction. 8, a substantially disk-shaped spin chuck 1 has a perforation 1a formed in the center and a cross groove 1b formed on the upper surface and centered on the perforation 1a. According to such a spin chuck 1, even if the resist solidifies after flowing into the cross groove 1b, it can be removed by scraping along the groove, and even if the perforation 1a is clogged, the needle-like shape can be obtained. It is possible to push it downward by poke with a member or the like.
[0011]
However, when the present inventors actually performed spin coating using the spin chuck 1 that can easily remove the clogging of the resist, it was found that the following problems were encountered. FIG. 9 is a diagram showing the results of a test performed by the present inventors. The thickness of a film obtained by dropping a resist on a 0.5 mm quartz plate held by suction on a spin chuck 1 is represented by the rotation center. Is measured at a position of 3 mm from, and the measured values are plotted. As is clear from FIG. 9, a region having a large thickness in the vertical and horizontal directions with respect to the rotation center is formed. This is considered to be because the quartz plate could not maintain the flatness due to the presence of the cross groove 1b, and the film thickness varied because a large amount of the resist adhered to the bent portion. In the semiconductor manufacturing field, the thickness variation as shown in FIG. 9 may be an acceptable value, but when manufacturing a highly accurate optical element molding die, such a thickness variation is extremely low. It is not acceptable.
[0012]
The present invention has been made in view of such problems of the related art, and is an optical element that can remove clogging of a resist and can coat a coating agent while maintaining good flatness of a substrate. It is an object of the present invention to provide a method for manufacturing a mother die of a molding die, a mother die, an optical element molding die, and a coating device.
[0013]
[Means for Solving the Problems]
A coating apparatus according to a first aspect of the present invention is a method for manufacturing a mother mold of an optical element molding die, the method comprising a step of forming a linear groove on a holding portion having a center of rotation and having a linear groove surrounding the center of rotation. A mounting step of mounting a base material covering the groove, a suction step of suctioning the base material to the holding section through the linear groove by a negative pressure, and a step of rotating the holding section and setting a base on the holding section. A spin coating step of applying a coating material to a material, a drawing step of drawing a predetermined pattern on an area corresponding to the inside of the linear groove on the base material coated with the coating material, and a developing process And a developing step of developing a predetermined pattern formed on the base material, so that even if the coating agent flows into the linear groove and solidifies, the coating agent can be easily removed along the linear groove. A shape in which the linear groove surrounds the center of rotation. Since Tsu, thickness variation is suppressed in the circumferential direction by suppressing deterioration of the flatness of the substrate, it is possible to perform highly accurate coating. Further, by drawing a predetermined pattern on an area corresponding to the inside of the linear groove, it is possible to suppress deterioration of flatness of at least a range where the predetermined pattern is drawn, and to apply a coating material having a uniform film thickness. By coating, a highly accurate matrix can be obtained.
[0014]
Furthermore, it is preferable that the method further includes a step of baking the base material coated with a coating agent after the spin coating step.
[0015]
It is preferable that the method further includes, after the developing step, a step of performing dry etching on the base material on which the predetermined pattern has been developed in order to cure the coating material.
[0016]
Further, it is preferable that the drawing in the drawing step is drawing by an electron beam.
[0017]
Preferably, the predetermined pattern has a diffraction ring shape.
[0018]
Further, the base material placed on the holding part is preferably a flat plate, but may have a three-dimensional shape corresponding to an optical element such as a lens.
[0019]
Also, an electroforming step of forming an electroformed member on the base material having the predetermined pattern by an electroforming process, and in the formed electroformed member, a region other than a region corresponding to the inside of the linear groove is cut. And thereby forming a mold for molding an optical element.
[0020]
Further, it is preferable that the linear groove has a circular shape, since the deterioration of the flatness of the substrate can be further suppressed. However, the present invention is not limited to this, and the groove may have a polygonal shape or a spiral shape.
[0021]
Preferably, the linear groove is connected to a negative pressure supply unit.
[0022]
A high-precision mother die is formed by the above-described method for manufacturing a master for an optical element molding die.
[0023]
A high-precision optical element molding die is formed by using the above-described master.
[0024]
A high-precision optical element is molded using the above-described optical element molding die.
[0025]
The coating apparatus according to the second aspect of the present invention is a coating apparatus for holding and rotating a substrate while applying a coating agent to the substrate, wherein the coating apparatus has a single linear groove having a rotation center and surrounding the rotation center. Formed on the surface, a holding portion for holding the substrate, a rotation driving portion for rotating the holding portion, and a negative pressure generated in the linear groove communicating with the single linear groove. A negative pressure supply unit for adsorbing and holding the base material on the holding unit, and a supply unit for supplying a coating agent on the base material held by the holding unit, so that the linear groove Even if the coating agent flows in and solidifies, it can be easily removed along the linear groove, and the linear groove has a shape surrounding the center of rotation, thereby suppressing the deterioration of the flatness of the base material. This suppresses variations in film thickness in the circumferential direction, enabling highly accurate coating. It is. Further, by drawing a predetermined pattern on an area corresponding to the inside of the linear groove, it is possible to suppress deterioration of flatness of at least a range where the predetermined pattern is drawn, and to apply a coating material having a uniform film thickness. By coating, a highly accurate matrix can be obtained.
[0026]
Further, the linear groove is preferably circular.
[0027]
Further, it is preferable to have a plurality of communication holes communicating with the linear groove and the negative pressure supply unit.
[0028]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, embodiments of the present invention will be specifically described with reference to the drawings. FIG. 1 is a functional block diagram illustrating a schematic configuration of the entire coating apparatus according to the present embodiment.
[0029]
As shown in FIG. 1, the coating apparatus 30 of the present embodiment includes a spin coater chuck 40 that is a holding unit that holds the base material 10 on which a coating material, for example, a resist is applied, while rotating about a rotation axis A. The coating agent, which is a coating agent supply unit that supplies the resist by continuously flowing the resist (L shown in FIG. 1) as the coating agent from above at the position of the rotation center axis A with respect to the base material 10 Coating means 31, viscosity control means 32 for controlling the viscosity of the resist, coating amount control means 33 for adjusting and controlling the amount of resist supplied by the coating material applying means 31, and allowing the resist to flow continuously A coating agent supply time control means 34 for controlling the supply time of the resist at the time of rotation, and a motor 35 which is a rotation drive unit for rotating the spin coater chuck 40 in the θ direction about the rotation center axis A. A rotation control means 36 for controlling the number of rotations of the spin coater chuck 40 by controlling the motor 35, and a correlation between a predetermined amount of resist and the number of rotations, for example, so that the thickness of the applied resist is substantially uniform. The storage means 37 stores various control condition information such as a correlation table and various environmental condition conditions such as condition information taking into account temperature control conditions, and a spin coater chuck 40 for adsorbing and holding the substrate 10. It has a negative pressure pump 38 which is a negative pressure source for generating a negative pressure, and control means 39 for controlling these.
[0030]
The coating apparatus 30 is linked with the above-described control means 39 in order to control the ambient environment condition, for example, the temperature condition, which is one of the control conditions for resist coating at the time of resist coating, so that the film thickness becomes substantially uniform. It is preferable to provide an atmosphere temperature control unit that does not perform the control. Atmospheric temperature control conditions at this time are preferably set and controlled at, for example, 22 to 24 ° C, and during baking, at 100 to 200 ° C.
[0031]
The base material 10 is formed in a disk shape using a material suitable for forming a matrix for manufacturing a mold such as an optical element such as a parallel plate, for example, a resin material such as polyimide or n-type silicon.
[0032]
FIG. 2 is a perspective view of the spin coater chuck 40. 1 and 2, the spin coater chuck 40 has an integral shape such as a disk 42 connected to the upper end of a cylindrical shaft 41, and the upper surface of the disk 42, which is a flat surface, has a rotation axis A as a center. A circular linear groove 43 is formed. The bottoms of the circular linear grooves 43 are connected at a total of four locations by two (only one is shown in FIGS. 1 and 2) horizontal holes 44 extending radially and orthogonal to each other. The intersection of the pair of horizontal holes 44 communicates with a vertical hole 45 that passes through the shaft 41 coaxially with the rotation axis A.
[0033]
The shaft 41 of the spin coater chuck 40 is a rotation shaft of a motor 35, and receives a predetermined magnetic force from the motor 35 to rotate at an arbitrary rotation speed. The vertical hole 45 opened at the lower end of the shaft 41 is connected to a pipe 46 via a relatively rotatable connector, and the pipe 46 is connected to a negative pressure pump 38 as a negative pressure supply unit.
[0034]
The operation of the present embodiment will be described. After the substrate 10 is placed on the spin coater chuck 40, the negative pressure pump 38 is driven to form a line through the pipe 46, the vertical hole 45, and the horizontal hole 44. Since the inside of the groove 43 is sucked, the substrate 10 is sucked and held by the spin coater chuck 40 while maintaining the flatness. After that, by driving the motor 35, the spin coater chuck 40 and the substrate 10 rotate integrally.
[0035]
At this time, the control means 39 controls the viscosity based on the number of rotations by the motor 35 and the amount of resist applied. Further, based on the supply time controlled by the coating material supply time control means 34, the number of rotations of the spin coater chuck 40 is controlled via the rotation number control means 36 in accordance with the supply of the coating material by the coating material applying means 31. Can be.
[0036]
3 and 4 show the results of tests performed by the present inventors. FIG. 3 is a graph obtained by actually measuring the thickness of a film obtained by dropping a resist on a 0.5 mm quartz plate sucked and held by a spin chuck 40 at a position 3 mm from the center of rotation, and plotting such measured values. And the same test result as FIG. 9 is shown. The spin coater chuck used in this test had an outer diameter of the upper surface of φ30 mm, an outer diameter of the circumferential groove of φ16 mm, and a groove width of 1.5 mm. According to FIG. 3, the film thickness variation can be reduced as is apparent from comparison with FIG.
[0037]
FIG. 4 is a diagram illustrating a film thickness distribution obtained when a groove is provided at a distance of 7 to 8 mm from the center in the above-described test. According to the test results shown in FIG. 4, it is sufficient to provide a fine structure such as a diffraction ring zone in a range of 4 mm from the center in order to keep the thickness variation within 4 μm.
[0038]
According to the coating apparatus 30 of the present embodiment, since the spin coater chuck 40 is provided with the circular linear groove 43 for holding the substrate 10 by suction, the thickness variation of the resist L is suppressed as described above. In addition, even if the resist L flows into the linear groove 43, the removal can be easily performed, and the labor at the time of manufacturing can be reduced.
[0039]
Hereinafter, a method for manufacturing the optical element molding die according to the present embodiment will be specifically described with reference to the drawings. FIG. 5 is a flowchart showing the steps constituting the method of manufacturing a matrix according to the present embodiment. FIG. 6 is a cross-sectional view showing a base material (a material of a matrix) to be processed in the main steps shown in FIG. In the matrix manufactured according to the present embodiment, an annular zone corresponding to the diffraction annular zone of the optical element which is a parallel plate is formed on the optical surface of the matrix.
[0040]
First, in step S101 of FIG. 5, the thin disk-shaped base material 10 is set on the spin coater chuck 40 (mounting step), and the base material 10 is sucked and held using the negative pressure in the linear groove 43 ( In step S102, spinning is performed while rotating the spin coater chuck 40 and flowing down the resist L onto the base material 10 sucked and held therein, thereby forming a film of the resist L (rotation coating step, FIG. 6 (a)).
[0041]
Thereafter, in step S103, the substrate 10 is removed from the spin coater chuck 40, and in step S104, a baking process is performed at an ambient temperature of 180 ° C. for 20 minutes (baking step) to stabilize the film of the resist L. Further, in step S105, an electron beam drawing process is performed on the resist L on the mother optical surface 10a of the base material 10 by using an electron beam drawing device described in detail later (drawing step, see FIG. 6B). By setting the range to be drawn by the electron beam within the region C (region corresponding to the inside of the linear groove) surrounded by the linear groove 43 of the spin coater chuck 40, the coating film (resist layer) having a uniform film thickness is formed. In this case, accurate drawing can be performed, and a highly accurate pattern shape can be obtained.
[0042]
After the electron beam writing process, in Step S106, the developing process and the rinsing process are sequentially performed by immersing the base material 10 in a developing solution and a rinsing solution (see FIG. 6C) to remove unnecessary resist. Thus, an annular resist L is obtained (development step). Here, if the irradiation time of the electron beam B at the same point is lengthened, the amount of removal of the resist increases accordingly. By adjusting the position and the irradiation time (dose amount), the blaze shape as shown in FIG. The resist L can be left so as to form an annular zone.
[0043]
Further, in step S107, the surface of the mother optical surface 10a of the base material 10 is carved through dry etching (a step of performing dry etching) by a plasma shower, and the blazed annular zone 10b (illustrated exaggeratedly in reality). ) Is formed (see FIG. 6D). Thereafter, in step S108, the base material 10 whose surface has been subjected to the activation treatment is immersed in a nickel sulfamate bath, and an electric current is caused to flow between the electrode member 11 and the external electrode 12, thereby growing the electroforming 20 (electroforming). Casting step, see FIG. 6 (e)). In the course of its growth, the electroforming 20 forms an optical surface transfer surface 20a accurately corresponding to the mother optical surface 10a and an orbicular transfer surface 20b accurately corresponding to the orbicular zone 10b.
[0044]
Then, in step S109, the electroforming 20 is cut (cut) into a predetermined shape, and in step S110, the electroforming 20 is removed from the mold and subjected to appropriate machining so as to be incorporated into an optical element manufacturing apparatus. An element molding die can be obtained (step of forming an optical element molding die).
[0045]
An electron beam writing apparatus used for electron beam writing according to the present embodiment will be described. FIG. 7 is an explanatory diagram showing the overall configuration of the electron beam writing apparatus of the present example.
[0046]
As shown in FIG. 7, the electron beam writing apparatus 401 forms a high-resolution electron beam probe with a large current and scans the substrate 10 to be written at a high speed. An electron gun 412, which is an electron beam generating means for forming and irradiating the target with a beam by generating an electron beam, a slit 414 for passing the electron beam from the electron gun 412, and an electron beam for passing through the slit 414 An electron lens 416 for controlling the focal position with respect to the base material 10, an aperture 418 arranged on a path from which the electron beam is emitted, and an aperture 418 for forming a desired electron beam shape through an opening; A deflector 420 that controls the scanning position and the like on the substrate 10 as a target by deflecting, and a correction coil 422 that corrects the deflection are provided. Nde is configured. These components are disposed in the lens barrel 410 and are kept in a vacuum state when emitting an electron beam.
[0047]
Further, the electron beam writing apparatus 401 includes an XYZ stage 430 that is a mounting table for mounting the substrate 10 on which an image is to be written, and a transport for transporting the substrate 10 to a mounting position on the XYZ stage 430. Loader 440, a measuring device 480 for measuring a reference point on the surface of the substrate 10 on the XYZ stage 430, and a stage driving unit 450 for driving the XYZ stage 430. A loader driving device 460 for driving the loader 440, a vacuum exhaust device 470 for exhausting the interior of the lens barrel 410 and the housing 411 including the XYZ stage 430 to a vacuum, and observing the substrate 10 And a control circuit 492 which is a control means for controlling these.
[0048]
The electronic lens 416 is controlled by generating a plurality of electronic lenses by the current values of the coils 417a, 417b, and 417c that are separately installed at a plurality of locations along the height direction. The focal position of the electron beam is controlled.
[0049]
The measuring device 480 includes a first laser length measuring device 482 that measures the base material 10 by irradiating the base material 10 with a laser, and a laser beam (first laser light emitted by the first laser length measuring device 482). (A first irradiation light) reflects the base material 10 and receives the reflected light, and a second laser length measurement device irradiates from a different irradiation angle from the first laser length measuring device 482. Device 486, and a second light receiving unit 488 that reflects the laser light (second irradiation light) emitted by the second laser length measuring device 486 on the base material 10 and receives the reflected light. It is composed of
[0050]
The stage driving means 450 includes an X direction driving mechanism 452 for driving the XYZ stage 430 in the X direction, a Y direction driving mechanism 454 for driving the XYZ stage 430 in the Y direction, and a Z direction driving mechanism for driving the XYZ stage 430 in the Z direction. A mechanism 456 and a θ-direction drive mechanism 458 for driving the XYZ stage 430 in the θ-direction are included. Thereby, the XYZ stage 430 can be operated three-dimensionally and alignment can be performed.
[0051]
Although not shown, the control circuit 492 includes an electron gun power supply unit for supplying power to the electron gun 412, an electron gun control unit for adjusting and controlling current, voltage, and the like in the electron gun power supply unit, and an electronic lens 416 ( A lens power supply for operating each of the plurality of electronic lenses), and a lens controller for adjusting and controlling each current corresponding to each electronic lens in the lens power supply.
[0052]
Further, the control circuit 492 includes a coil control unit for controlling the correction coil 422, a forming / deflecting unit for deflecting in the forming direction by the deflector 420, and a sub-control unit for deflecting in the sub-scanning direction by the deflector 420. A deflecting unit, a main deflecting unit for deflecting in the main scanning direction by the deflector 420, an electric field control circuit serving as electric field control means for controlling an electric field of the electron beam, a drawing pattern, and the like are generated on the substrate 10. Pattern generation circuit, various laser control systems, a stage control circuit for controlling the stage driving means 450, a loader control circuit for controlling the loader driving device 460, a measurement information input section for inputting measurement information, A memory as storage means for storing information and a plurality of other information, a program memory storing a control program for performing various controls, and a control including each unit It is configured to include a control unit, which is formed by a CPU for example controls the these units.
[0053]
In the electron beam writing apparatus 401 having the above-described configuration, when the substrate 10 transported by the loader 440 is placed on the XYZ stage 430, the vacuum exhaust device 470 causes the air in the lens barrel 410 and the housing 411 to escape. After exhausting gas and dust, an electron beam is emitted from the electron gun 412.
[0054]
The electron beam emitted from the electron gun 412 is deflected by the deflector 420 via the electron lens 416, and the deflected electron beam B (hereinafter, only the deflection-controlled electron beam after passing through the electron lens 416 is referred to as " The electron beam B is sometimes referred to as “electron beam B”), and the drawing is performed by irradiating the surface of the substrate 10 on the XYZ stage 430, for example, a drawing position on a curved surface (curved surface).
[0055]
At this time, the drawing position (at least the height position among the drawing positions) on the base material 10 or the position of a reference point, which will be described later, is measured by the measuring device 480, and the control circuit 492 determines the position based on the measurement result. The current values flowing through the coils 417a, 417b, 417c, etc. of the electron lens 416 are adjusted and controlled to control the position of the depth of focus of the electron beam B, that is, the focus position, so that the focus position becomes the drawing position. Is controlled.
[0056]
Alternatively, based on the measurement result, the control circuit 492 controls the stage driving unit 450 to move the XYZ stage 430 so that the focal position of the electron beam B becomes the drawing position.
[0057]
Further, in this example, control may be performed by either one of the control of the electron beam and the control of the XYZ stage 430, or both may be performed.
[0058]
Next, the base material 10 is irradiated with the first light beam S1 from the direction intersecting the electron beam by the first laser length measuring device 482 of the measuring device 480, and the first light beam transmitted through the base material 10 The first light intensity distribution is detected by the light reception in S1.
[0059]
At this time, since the first light beam S1 is reflected at the bottom of the substrate 10, the (height) position on the flat portion of the substrate 10 is measured and calculated based on the first intensity distribution. Will be. The height position of the substrate 10 is set as a drawing position, for example, and the focal position of the electron beam is adjusted to perform drawing.
[0060]
When the base optical surface 10a of the base material 10 has a three-dimensional shape, the position on the base optical surface 10a may not be known even if the (height) position of the bottom surface is obtained. is there. Therefore, in such a case, the base material 10 is irradiated with the second light beam S2 from the direction substantially orthogonal to the electron beam different from the first light beam S1 by the second laser length measuring device 486. The second light intensity distribution is detected by the second light beam S2 transmitted through the base material 10 being received by the second light receiving unit 488. Based on this, the position of the mother optical surface 10a is determined. It is possible to perform appropriate electron beam writing according to the measured and calculated electron beam having a small depth of focus.
[0061]
As described above, the present invention has been described with reference to the embodiments and the examples. However, the present invention should not be construed as being limited to the above-described embodiments, and may be appropriately modified and improved (combinations of the embodiments may be used). Of course) is possible.
[0062]
【The invention's effect】
According to the present invention, it is possible to remove clogging of the resist, and a method of manufacturing a mold of an optical element molding mold capable of coating a coating agent while maintaining good flatness of a substrate, a mold, An optical element molding die and a coating device can be provided.
[Brief description of the drawings]
FIG. 1 is a functional block diagram illustrating a schematic configuration of an entire coating apparatus according to an embodiment.
FIG. 2 is a perspective view of a spin coater chuck 40.
FIG. 3 is a diagram in which the thickness of a film obtained by dropping a resist on a 0.5 mm quartz plate sucked and held by a spin chuck 40 is measured at a position 3 mm from a rotation center, and the measured values are plotted. It is.
FIG. 4 is a view showing a film thickness distribution when a groove is provided at a distance of 7 to 8 mm from the center.
FIG. 5 is a flowchart showing steps constituting a method of manufacturing a matrix according to the present embodiment.
FIG. 6 is a cross-sectional view showing a base material (a material of a matrix) to be processed in the main steps shown in FIG.
FIG. 7 is an explanatory diagram illustrating an example of a configuration of an electron beam writing apparatus.
FIG. 8A is a top view of a spin chuck considered by the present inventors, and FIG. 8B is a cross-sectional view of the spin chuck cut along a line BB in an axial direction. FIG.
FIG. 9 is a diagram in which the thickness of a film obtained by dropping a resist on a 0.5 mm quartz plate sucked and held by a spin chuck 1 is actually measured at a position 3 mm from a rotation center, and the measured values are plotted. It is.
[Explanation of symbols]
10 Substrate
20 Electroforming
30 Coating device
40 Spin coater chuck
401 electron beam lithography system
L resist

Claims (15)

A method of manufacturing a master of an optical element molding die,
A mounting step of mounting a substrate covering the linear groove on a holding portion having a rotation center and having a linear groove surrounding the rotation center formed on the surface,
An adsorption step of adsorbing the substrate by the negative pressure through the linear groove to the holding unit,
Rotating and applying the coating agent to the substrate on the holding unit while rotating the holding unit,
A drawing step of drawing a predetermined pattern on an area corresponding to the inside of the linear groove, on the substrate on which the coating agent is applied,
A developing step of developing a predetermined pattern formed on the base material by a developing process. The method of claim 1, further comprising baking the base material coated with a coating agent after the spin coating step. The optical element molding method according to claim 1, further comprising, after the developing step, a step of performing dry etching on the base material on which the predetermined pattern has been developed to further cure a coating material. How to make a mold. 4. The method according to claim 1, wherein the drawing in the drawing step is drawing by an electron beam. 5. The method according to claim 1, wherein the predetermined pattern is a diffraction ring shape. The method according to any one of claims 1 to 5, wherein the base material placed on the holding unit is a flat plate. An electroforming step of forming an electroformed member on the substrate having the predetermined pattern by an electroforming process,
2. The step of forming an optical element molding die by cutting a region other than an area corresponding to the inside of the linear groove in the formed electroformed member. 7. A method for producing a master mold for an optical element molding die according to any one of claims 6 to 6. 8. The method according to claim 1, wherein the linear groove has a circular shape. 9. The method according to claim 1, wherein the linear groove is connected to a negative pressure supply unit. A mother die manufactured by the method for manufacturing a mother die for an optical element molding die according to claim 1. An optical element molding die formed using the mother die according to claim 10. An optical element formed by the optical element molding die according to claim 11. In a coating device for applying a coating agent to the substrate while rotating while holding the substrate by suction,
A single linear groove having a rotation center and surrounding the rotation center is formed on the surface, a holding portion for holding the base material,
A rotation drive unit that rotates the holding unit,
A negative pressure supply unit that communicates with the single linear groove and suction-holds the base material to the holding unit by a negative pressure generated in the linear groove;
A supply unit for supplying a coating material onto the base material held by the holding unit. The coating device according to claim 13, wherein the linear groove has a circular shape. The coating apparatus according to claim 13, further comprising a plurality of communication holes that communicate with the linear groove and the negative pressure supply unit.

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