JP2004281652A - Power controller - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a small-size and low-cost power controller by solving the problem that a device is enlarged as a whole. <P>SOLUTION: A heating component 4 is mounted vertically to a substrate 1, and an L-shaped heat radiator 5 so installed as to be in thermal contact with the heating component 4 is mounted on the substrate 1. An electronic component 2 is located in a space above the substrate 1 surrounded by the side face and the top face of the L-shaped heat radiator 5. All the components are stored in the main body 6 of a case and are sealed by a case cover 8. By this structure, the components can be arranged effectively and perfect heat dissipation is carried out, resulting in reducing the entire size of the power controller and remarkably reducing an occupation volume thereof. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a power control device such as an inverter or a switching power supply that drives a motor at a variable speed.
[0002]
[Prior art]
In recent years, with the progress of power electronics, power control devices have been used in various fields. For example, an inverter is used in a refrigerator or an air conditioner for the purpose of energy saving or the like, and induction heating is used in a rice cooker or the like.
[0003]
As a conventional power control device, there is a power control device in which heat radiation of the power element is particularly improved (for example, see Patent Document 1).
[0004]
Hereinafter, the conventional power control device will be described with reference to the drawings.
[0005]
FIG. 7 is a sectional view of a conventional power control device. As shown in FIG. 7, a power converter 101 is attached to a large radiator 102, and a first substrate 103 is fixed to the radiator 102 by a first spacer 104. The first substrate 103 is electrically connected to the power converter 101, and includes a smoothing capacitor 105, a voltage regulator 106 for generating a control power supply, and the like.
[0006]
Main control components such as a microcomputer (not shown) are mounted on the second substrate 107, and are fixed to the first substrate 103 by the second spacer 108. The cover 109 is attached so as to cover these circuits.
[0007]
The operation of the conventional power control device configured as described above will be described below.
[0008]
The heat from the power converter 101, which is a component that generates a large amount of heat, is transmitted to the radiator 102 to dissipate heat, thereby cooling the power converter 101.
[0009]
[Patent Document 1]
JP-A-9-283883
[Problems to be solved by the invention]
However, in the above-described conventional configuration, the heat generated by the power converter 101 is radiated by the radiator 102. However, since the power converter 101 is arranged in a plane, a large radiator 102 is required. There is a disadvantage that the space becomes large.
[0011]
An object of the present invention is to solve the conventional problem, and an object of the present invention is to provide a power control device that can be downsized by arranging a heat-generating component in a vertical direction and attaching the heat-generating component to an L-shaped radiator.
[0012]
In the above-described conventional configuration, the other heat-generating components require a small heat sink for heat radiation. The other heat radiating component here is, for example, a component of a power supply circuit for supplying power to a control circuit, and corresponds to, for example, a voltage regulator 106 for stabilizing a voltage. As described above, although a small heat sink is required, there is a drawback that the entire circuit is enlarged, the number of steps for assembly is increased, and the cost is high.
[0013]
Another object of the present invention is to provide a small-sized and low-cost power control device that uses a radiator of a main heat-generating component to effectively radiate quasi-heat-generating components, thereby omitting an auxiliary heat sink. It is.
[0014]
Further, in the above-described conventional configuration, even if the heat of the other heat-generating components is radiated, the heat is radiated in the cover 109, so that the internal temperature increases. In particular, the electrolytic capacitor 105 is susceptible to influence, and its life is generally affected such that as the temperature increases by 10 ° C., the life is reduced by half. Therefore, there is a disadvantage that an electrolytic capacitor having higher performance and higher cost is required to secure the life.
[0015]
It is another object of the present invention to provide a power control device capable of lowering the temperature of a component having a large temperature influence, improving reliability, and realizing miniaturization and cost reduction.
[0016]
[Means for Solving the Problems]
The invention according to claim 1 of the present invention provides a board on which components are mounted, a heating component vertically mounted on the board, and an L-shaped radiator attached so as to be in thermal contact with the heating component. A case main body including an electronic component disposed in a space surrounded by side and top surfaces of the L-shaped radiator, and a quasi-heat-generating component mounted on the substrate, and housing the substrate on which the component is mounted; It is provided with a case cover for hermetically closing the main body, and has an effect of downsizing because electronic components are arranged in the space of the L-shaped radiator.
[0017]
According to a second aspect of the present invention, in the first aspect of the invention, the electronic component includes an electrolytic capacitor, and the large-sized electrolytic capacitor maximizes the space of the L-shaped radiator. Since it can be used, there is an effect that the size can be further reduced.
[0018]
According to a third aspect of the present invention, in the first aspect of the present invention, the quasi-heating component is attached so as to be in thermal contact with the L-shaped radiator. Since heat is radiated from the heat-generating component by using a heat-radiator of the heat-generating component, a heat sink that assists the quasi-heat-generating component can be omitted, and it is possible to reduce the size and cost.
[0019]
The invention according to claim 4 is the invention according to any one of claims 1 to 3, wherein the case lid is a metal plate, and the space between the upper surface of the L-shaped radiator and the case lid is thermally. Since the heat generated by the L-shaped radiator is conducted to the case lid, the temperature rise inside the case can be suppressed.
[0020]
According to a fifth aspect of the present invention, in the fourth aspect of the present invention, a high heat conductive material is used to thermally contact between the upper surface of the L-shaped radiator and the case lid. It has the function of absorbing the unevenness of the contact surface due to the surface roughness of the container and the case lid and the assembling work, and the heat can be efficiently dissipated to the maximum extent.
[0021]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, embodiments of a power control device according to the present invention will be described with reference to the drawings.
[0022]
(Embodiment 1)
FIG. 1 is a sectional view of a power control device according to Embodiment 1 of the present invention.
[0023]
In FIG. 1, reference numeral 1 denotes a substrate on which a control circuit including an electronic component 2, a quasi-heating component 3, a microcomputer (not shown), and the like is mounted. Here, the quasi-heating component 3 refers to a voltage regulator or the like for stabilizing a control power supply.
[0024]
Reference numeral 4 denotes a heat-generating component, which is a power element that generally performs a main operation in a power control device, such as a MOSFET or an IGBT. A rectifying diode or the like is one of these components as the heat-generating component 4. The heat generating component 4 is mounted on the substrate 1 in a vertical direction.
[0025]
Reference numeral 5 denotes an L-shaped radiator, which is in sufficient thermal contact with the heat-generating component 4 on the side surface of the L-shape, and serves to diffuse and radiate the heat generated by the heat-generating component 4. The electronic component 2 is arranged in a space surrounded by the side and upper surfaces of the L-shaped radiator 5.
[0026]
Reference numeral 6 denotes a case main body, which fixes the substrate 1 on which the respective components are mounted by a spacer 7 and stores it inside. Reference numeral 8 denotes a case lid, which is attached to the opening of the case body to prevent intrusion of dust and the like.
[0027]
FIG. 2 is a circuit diagram of an example of the power control device according to the first embodiment of the present invention. Here, as an example of the power control device, an inverter that drives a motor at a variable speed will be described.
[0028]
In FIG. 2, reference numeral 9 denotes a commercial power supply, which is generally used at 100 V, 50 Hz or 60 Hz in the case of a general household in Japan.
[0029]
A converter 10 converts an AC voltage of the commercial power supply 9 into a DC voltage. Converter 10 performs a full-wave rectification of commercial power supply 9 by connecting four rectifier diodes 11a to 11d in a bridge. The electrolytic capacitor 12 is connected to the positive voltage output and the negative voltage output of the bridge-connected rectifier diodes 11a to 11d, and obtains a DC voltage by smoothing the full-wave rectified voltage.
[0030]
An inverter 13 converts a DC voltage output from the converter 10 into a three-phase AC having an arbitrary frequency and an arbitrary voltage by using the input as an input. Inverter 13 has IGBTs 14a to 14f connected in a three-phase bridge, and high-speed diodes 14g to 14l are connected in parallel to IGBTs 14a to 14f, respectively. The high-speed diodes 14g to 14l serve to flow a circulating current when the IGBTs 14a to 14f are turned off.
[0031]
Reference numeral 15 denotes a motor, which is driven by a three-phase AC output of the inverter 13. This motor 15 rotates at a rotation speed corresponding to the output frequency of the inverter 13.
[0032]
A control circuit 16 generates a waveform for driving the inverter 13 using a microcomputer or the like, detects an abnormal operation of the inverter 13 (a detection circuit is not shown), and performs a protection operation and the like.
[0033]
A power supply circuit 17 receives a DC output of the converter 10 as an input and outputs a power supply (for example, 5 V) for operating the control circuit 16. Here, the power supply circuit 17 uses a switching power supply, and includes a MOSFET 18a, a switching transformer 18b, a diode 18c, a capacitor 18d, a voltage regulator 18e, and the like.
[0034]
Here, a more detailed description will be added by comparing FIG. 2 with FIG.
[0035]
1 are the rectifier diodes 11a to 11d, the IGBTs 14a to 14f, and the high-speed diodes 14g to 14l in FIG. 2. Particularly, since the power for driving the motor 15 passes through the heat generating component 4, the loss is large and the heat is large. These heat generating components 4 are all mounted on the board 1 in the vertical direction.
[0036]
1 are the MOSFET 18a, the diode 18c, the voltage regulator 18e, and the like in FIG. 2, and the power is only the power for driving the control circuit 16. Therefore, the loss is not as large as the heat generating component 4. There is no such component, but if the heat is not radiated properly, the temperature rise is large and is mounted on the substrate 1.
[0037]
The electronic component 2 in FIG. 1 is a control circuit 16 including a microcomputer in FIG. 2, a drive circuit (not shown) for driving the IGBTs 14a to 14f, and the like. Is mounted on the substrate 1 in the space provided.
[0038]
The power control device configured as described above will be described in more detail.
[0039]
Since the heat-generating component 4 is an element that handles main electric power for performing power control, it has a very large loss and generates a large amount of heat. For example, when obtaining an output of 500 W, a loss of 25 W will occur even if the conversion efficiency is 95%.
[0040]
In order to effectively radiate the heat generated by such a large loss, it is necessary to use a large radiator. The heat generated by the heat generating component 4 is radiated by the L-shaped radiator 5 into the case.
[0041]
By doing so, the heat from the heat-generating component 4 is radiated, and the electronic component 2 can be arranged in a space surrounded by the side and top surfaces of the L-shaped radiator 5.
[0042]
As described above, the power control device of the present embodiment can radiate the heat generated from the heat-generating component 4 through the L-shaped radiator 5. In addition, the L-type radiator 5 has a large surface area effective for heat diffusion, can have a smaller mounting area on the substrate 1 than the block type, and can dispose the electronic component 2 in a space surrounded by the side surface and the upper surface. Remarkably improved.
[0043]
(Embodiment 2)
FIG. 3 is a sectional view of a power control device according to Embodiment 2 of the present invention.
[0044]
3, the same components as those in the first embodiment shown in FIG. 1 are denoted by the same reference numerals, and detailed description thereof will be omitted.
[0045]
In the present embodiment, the electronic component 2 in the first embodiment includes the electrolytic capacitor 12.
[0046]
By doing so, a large electrolytic capacitor 12 can be mounted in the space surrounded by the side and top surfaces of the L-shaped radiator 5. At this time, it is desirable that the spatial distance between the outer surface of the electrolytic capacitor 12 and the side and top surfaces of the L-shaped radiator 5 is 3 mm or more.
[0047]
As described above, the power control device according to the present embodiment includes the electrolytic capacitor 12 at the mounting position of the electronic component 2, so that the space and the space can be utilized to the maximum and the size can be significantly reduced. it can.
[0048]
(Embodiment 3)
FIG. 4 is a sectional view of a power control device according to Embodiment 2 of the present invention.
[0049]
4, the same components as those in the first and second embodiments shown in FIGS. 1 to 3 are denoted by the same reference numerals, and detailed description thereof is omitted.
[0050]
In this embodiment, the quasi-heat-generating component 3 in the first and second embodiments is attached to the L-shaped radiator 5 so as to be in thermal contact with the heat-generating component 4.
[0051]
By doing so, the heat generated from the quasi-heating component 3 is radiated using the L-shaped radiator 5.
[0052]
As described above, the power control apparatus according to the present embodiment uses the radiator of the main heat-generating component 4 to effectively radiate the heat of the quasi-heat-generating component 3. Not only can this be omitted and the cost can be reduced, but also other components can be arranged in the unnecessary space of the heat sink, and the size can be reduced.
[0053]
(Embodiment 4)
FIG. 5 is a sectional view of a power control device according to Embodiment 4 of the present invention.
[0054]
5, the same components as those in the first to third embodiments shown in FIGS. 1 to 4 are denoted by the same reference numerals, and detailed description thereof will be omitted.
[0055]
In the present embodiment, the case lid 8 in the first to third embodiments is a metal plate, and is attached so that the upper surface of the L-shaped radiator 5 and the case lid 8 are in thermal contact with each other.
[0056]
By doing so, the heat generated from the heat-generating component 4 or the quasi-heat-generating component 3 conducts heat from the L-shaped radiator 5 to the case lid 8 and is radiated outside the case.
[0057]
As described above, in the power control device of the present embodiment, the case lid 8 is made of a metal plate, and the upper surface of the L-shaped radiator 5 and the case lid 8 are in thermal contact with each other. Can sufficiently dissipate heat, and the size of the device can be reduced.
[0058]
In addition, since the temperature rise in the case can be reduced, the heat effect of components that are easily affected by temperature, particularly the electrolytic capacitor 12, can be reduced, and the life of the electrolytic capacitor 12 can be improved. Therefore, when the same life is sufficient, an inexpensive electrolytic capacitor 12 having a shorter life can be used.
[0059]
(Embodiment 5)
FIG. 6 is a sectional view of a power control device according to Embodiment 4 of the present invention.
[0060]
6, the same components as those of the fourth embodiment shown in FIG. 5 are denoted by the same reference numerals, and detailed description thereof will be omitted.
[0061]
In the present embodiment, the high thermal conductive material 18 is used for thermal contact between the upper surface of the L-shaped radiator 5 and the case lid 8 in the fourth embodiment.
[0062]
By doing so, the heat generated from the heat-generating component 4 or the quasi-heat-generating component 3 conducts heat from the L-shaped radiator 5 to the high thermal conductive material 18 and the case lid 8 and is radiated outside the case. Become.
[0063]
As described above, in the power control device of the present embodiment, since the high thermal conductive material 18 is inserted between the upper surface of the L-shaped radiator 5 and the case lid 8, the surface roughness of the L-shaped radiator 5 and the case lid 8 can be reduced. Non-uniformity of heat conduction due to assembly variations can be eliminated, and high-efficiency heat radiation can be performed, so that the size of the device can be further reduced.
[0064]
【The invention's effect】
As described above, according to the first aspect of the present invention, there is provided a board on which components are mounted, a heat generating component vertically mounted on the board, and an L-shaped heat radiator mounted so as to be in thermal contact with the heat generating component. Radiator, electronic components arranged in a space surrounded by the side and upper surfaces of the L-shaped radiator, and a quasi-heat-generating component mounted on the substrate, heat radiation of the heat-generating component by a very easy means. Therefore, there is an effect that the size can be reduced as compared with the related art.
[0065]
According to a second aspect of the present invention, in addition to the first aspect of the present invention, an electronic component includes an electrolytic capacitor, so that a large-sized component is provided in a space surrounded by the upper surface and side surfaces of the L-shaped radiator. Therefore, there is an effect that the mounting volume of the device can be reduced.
[0066]
According to a third aspect of the present invention, in addition to the first and second aspects of the present invention, the quasi-heating component is attached to the L-shaped radiator so as to be in thermal contact with the radiator. There is an effect that a heat sink for assisting heat radiation can be eliminated, and miniaturization and cost reduction can be achieved.
[0067]
According to a fourth aspect of the present invention, in addition to the first to third aspects of the present invention, the case lid is made of a metal plate so that the upper surface of the L-shaped radiator and the case lid are in thermal contact with each other. By mounting a high heat conductive material between one surface of the radiator and the case lid, the size of the radiator can be reduced and the size of the device can be reduced, and the temperature inside the case can be radiated to the outside. Therefore, the thermal effect on the electrolytic capacitor is very small, and the life is significantly extended. Therefore, there is an effect that an electrolytic capacitor having a short life can be used, and the cost can be reduced.
[0068]
According to a fifth aspect of the present invention, in addition to the fourth aspect, a high thermal conductive material is used to thermally contact between the upper surface of the L-shaped radiator and the case lid. In addition, it is possible to prevent a decrease in heat conduction due to variation in contact, and it is possible to more efficiently release heat.
[Brief description of the drawings]
FIG. 1 is a sectional view of a power control device according to a first embodiment of the present invention; FIG. 2 is a circuit diagram of an example of a power control device according to the first embodiment; FIG. 3 is a power control according to a second embodiment of the present invention; FIG. 4 is a cross-sectional view of a power control device according to a third embodiment of the present invention. FIG. 5 is a cross-sectional view of a power control device according to a fourth embodiment of the present invention. FIG. 7 is a cross-sectional view of a power control device according to a fifth embodiment.
DESCRIPTION OF SYMBOLS 1 Substrate 2 Electronic component 3 Semi-heating component 4 Heating component 5 L-shaped radiator 6 Case body 8 Case cover 12 Electrolytic capacitor 19 High thermal conductive material

Claims (5)

A board on which components are mounted, a heat-generating component vertically mounted on the board, an L-shaped radiator mounted so as to be in thermal contact with the heat-generating component, and surrounded by side and top surfaces of the L-shaped radiator An electronic component disposed in a separated space, and a quasi-heat-generating component mounted on the substrate, comprising: a case main body that houses the substrate on which the component is mounted; and a case cover that seals the case main body. Power control device characterized. The power control device according to claim 1, wherein an electrolytic capacitor is included in the electronic component. The power control device according to claim 1, wherein the quasi-heating component is attached so as to be in thermal contact with the L-shaped radiator. The power according to any one of claims 1 to 3, wherein the case lid is a metal plate, and is mounted so as to thermally contact between an upper surface of the L-shaped radiator and the case lid. Control device. The power control device according to claim 4, wherein a high heat conductive material is used to thermally contact between the upper surface of the L-shaped radiator and the case lid.

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