JP2004272164A - Pattern forming apparatus and method for forming pattern - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a pattern forming apparatus which can prevent misalignment of a pattern position from a pattern in the preceding step, and to provide a method for forming a pattern. <P>SOLUTION: The pattern forming apparatus 100 carries out steps of: scanning a base material 303 with a CCD camera 302 to acquire the image data or the like of the pattern in the preceding step (step 502); and subjecting the image data to image processing to acquire the measurement data relating to the position of the pattern in the preceding step (step 503). The pattern forming apparatus 100 carries out steps of: calculating the drawing data relating to the drawing position of the new pattern based on the measurement data (step 504); layering a transfer sheet 306 on the base material 303 (step 506); and scanning the substrate 303 by an irradiation head 301 to irradiate the transfer sheet 306 with a laser beam 307 based on the drawing data so as to transfer and draw the transfer layer onto the base material 303 (step 507). <P>COPYRIGHT: (C)2004,JPO&NCIPI

Description

【０１０６】
本発明の実施の形態において形成したディスプレイパターンにおいて、２００ｍｍ幅のディスプレイサイズに対して、ＴＦＴパターンとカラーフィルタパターンの位置ずれは、最大でも５μｍに抑えられた。
【０１０７】
一方、従来の技術であるフォトマスクを用いたフォトリソ法により形成したディスプレイパターンにおいて、２００ｍｍ幅のディスプレイサイズ対して、ＴＦＴパターンとカラーフィルタパターンの位置ずれは、最大５０μｍとなった。
【０１０８】
すなわち、本発明の実施の形態によれば、高精度のパターン形成が可能であり、フォトマスクを介しての露光等、従来技術と比較して、位置ずれが約９０％軽減されるという極めて顕著な効果が得られた。
【０１０９】
以上、添付図面を参照しながら、本発明にかかるパターン形成装置、パターン形成方法等の好適な実施形態について説明したが、本発明はかかる例に限定されない。当業者であれば、本願で開示した技術的思想の範疇内において、各種の変更例または修正例に想到し得ることは明らかであり、それらについても当然に本発明の技術的範囲に属するものと了解される。
【０１１０】
【発明の効果】
以上、詳細に説明したように本発明によれば、前工程パターンとの位置ずれ防止を可能とするパターン形成装置、パターン形成方法等を提供することができる。
【図面の簡単な説明】
【図１】パターン形成装置１００の概略構成図
【図２】第１層目パターンの形成における、パターン形成装置１００の動作を示すフローチャート
【図３】前工程パターンの位置測定における、パターン形成装置１００の動作の概略を示す図
【図４】新たなパターンの描画における、パターン形成装置１００の動作の概略を示す図
【図５】新たなパターン形成における、パターン形成装置１００の動作を示すフローチャート
【図６】前工程パターンの形成後の基材６０１を示す図
【図７】新たなパターンの形成時の基材７０１を示す図
【図８】パターン形成装置１００の照射部１０３（描画装置）の一態様を示す図
【図９】ライトバルブから発信されるレーザビームのビーム配列を示す図
【図１０】レーザビーム照射時の基材等を示す図
【図１１】レーザビーム照射後の基材等を示す図
【図１２】カラーフィルタの製造工程を示すフローチャート
【図１３】ＣＯＡ（カラーフィルタ・オン・アレイ）の製造工程を示すフローチャート
【符号の説明】
１００………パターン形成装置
１０１………制御部
１０２………測定部
１０３………照射部
１０４………支持部
３０１………照射ヘッド
３０２………ＣＣＤカメラ
３０３………基材
３０４………吸引機構
３０５………ステージ
３０６………転写シート
３０７………レーザビーム
６０１、７０１………基材
６０２………アライメントマーク
６０３………前工程パターン
６０４………画素間ピッチ（前工程パターン）
７０３………新たなパターン
７０４………画素間ピッチ（新たなパターン）
８０４………ライトバルブ
８０６………照射ヘッド[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a pattern forming apparatus and a pattern forming method for forming a pattern such as a color filter, a BM (black matrix), and a TFT (Thin Film Transistor) in a liquid crystal display. More specifically, the present invention relates to a pattern forming apparatus, a pattern forming method, and the like that enable highly accurate pattern alignment.
[0002]
[Prior art]
2. Description of the Related Art Conventionally, as a method of forming a pattern such as a liquid crystal display on a plastic substrate, there are various methods such as a photolithography method, a printing method, an electrodeposition method, an ink jet method, and a transfer method. Among them, a photolithography method manufactured using a photomask is widely used at present (for example, see Patent Document 1).
Also, a method of forming a color filter pattern on a plastic substrate by a printing method has been proposed (for example, see [Patent Document 2]).
[0003]
As a method of forming a color filter by a drawing method, a laser transfer method has been proposed for forming a colored layer on a substrate of a color filter such as a liquid crystal display (for example, see Patent Documents 3 and 4). ).
In the laser transfer method, a hot-melt type colorant is applied to a film-like base material in advance, and the colorant is melted by applying a laser beam to the transfer film in a state where the transfer film and the color filter substrate are overlapped. Is a method of transferring a colorant to a substrate in a desired pattern.
[0004]
As a laser irradiation device, a system in which a single laser beam is scanned by a polygon mirror has been devised (for example, see [Patent Document 5]).
Further, when a plurality of laser beams are formed, a method in which a plurality of laser beams are guided from a plurality of laser light sources by a plurality of optical fibers and irradiates a plurality of locations through a condenser lens has been devised (for example, see [Patent Document 6]). .
[0005]
The manufacturing process of a color filter and a COA (color filter on array) will be described with reference to FIGS.
A case where a glass substrate is used as a base material and a photosensitive substance (sensitive material) is used as a coloring layer will be described.
[0006]
FIG. 12 is a flowchart showing a process of manufacturing a color filter.
The BM is formed on the substrate through processes such as cleaning, Cr film formation, positive resist coating, pre-baking, exposure, development, etching, resist peeling, and cleaning (Step 1201).
Next, a colored layer is formed on the substrate through processes such as application of a colored photosensitive material, pre-baking, exposure, development, post-baking, and washing. The formation of the colored layer is repeated for three colors (Red, Green, Blue) (Step 1202).
[0007]
Next, a transparent electrode film is formed on the substrate through processes such as ITO (Indium-Tin Oxide, transparent electrode) film formation and cleaning (step 1203).
Next, a column spacer is formed on the substrate by forming a spacer (glass beads, plastic beads, etc.) by photolithography (step 1204).
A color filter is manufactured through the above process, and a TFT color liquid crystal display is manufactured by bonding the color filter and the TFT array.
[0008]
FIG. 13 is a flowchart showing a process of manufacturing a COA (color filter on array).
COA (color filter on array) forms a color filter on a TFT array substrate.
[0009]
Forming a TFT array on a substrate (Step 1301), forming a colored layer (Step 1302), forming a BM (Step 1303), forming a transparent electrode film (Step 1304), forming a column spacer (Step 1305), etc. Through the process, COA is produced.
The formation of the colored layer, the formation of the BM, the formation of the transparent electrode film, the formation of the column spacer, and the like go through the same process as the above-described color filter.
[0010]
[Patent Document 1]
JP 2000-284303 A
[Patent Document 2]
JP 2001-228468 A
[Patent Document 3]
JP-A-10-206625
[Patent Document 4]
JP-A-7-104113
[Patent Document 5]
Japanese Patent Publication No. 5-61613
[Patent Document 6]
JP-A-11-160530
[0011]
[Problems to be solved by the invention]
However, in the conventional manufacturing method, when a pattern is formed on a substrate, such as a plastic substrate, which is likely to undergo dimensional changes, rather than a glass substrate, deformation, expansion, contraction, and dimensional changes of the substrate due to the effects of heat, operating stress, and the like. And the like, and when forming a laminated pattern on a substrate, there is a problem that a positional deviation from a pattern in a previous process occurs, which causes display failure of a display panel and the like.
[0012]
The present invention has been made in view of the above problems, and an object of the present invention is to provide a pattern forming apparatus, a pattern forming method, and the like that can prevent a positional deviation from a pattern in a previous process.
[0013]
[Means for Solving the Problems]
According to a first aspect of the present invention, there is provided a pattern forming apparatus for forming a pattern by irradiating a beam, which measures a position of a pre-process pattern on a substrate and holds the position as measurement data. Means, drawing data calculation means for calculating drawing data on a drawing position of a new pattern based on the measurement data, and irradiation means for performing the beam irradiation based on the drawing data. It is a pattern forming apparatus.
[0014]
In the first invention, the pattern forming apparatus measures the position of the pre-process pattern on the base material, holds the measured position as measurement data, calculates drawing data relating to a drawing position of a new pattern based on the measurement data, and Beam irradiation is performed based on the data.
[0015]
The pre-process pattern is a TFT pattern, a BM pattern, a color filter pattern, or the like.
The new pattern is a BM pattern, a color filter pattern, or the like.
[0016]
When measuring the position of the pre-process pattern, the pattern forming apparatus captures an image of the pre-process pattern with an image sensor such as a CCD (CHARGE COUPLED DEVICE) camera and obtains measurement data by performing image processing on the image. Is also good.
[0017]
In addition, the pattern forming apparatus may include a supply unit that feeds out the base material, a support unit that supports the base material, a collection unit that collects the base material after pattern formation, and the like.
When the substrate is a flexible substrate such as a plastic substrate, the supply unit, the recovery unit, and the like can employ winding, a roll, and the like.
[0018]
In the first aspect, the pattern forming apparatus measures the dimension of the pre-process pattern when forming a new pattern, even when the dimension of the pre-process pattern changes due to expansion, contraction, deformation, or the like of the base material. Thus, the drawing dimension can be corrected, so that the positional deviation between the previous process pattern and the new pattern can be prevented.
In particular, when the substrate is a flexible substrate such as a plastic substrate, the above-described effects are remarkable.
[0019]
A second invention is a pattern forming apparatus that forms a pattern by performing beam irradiation, comprising: a measuring unit that measures a position of a pre-process pattern on a base material and retains the position as measurement data, based on the measurement data. A drawing data calculation unit that calculates drawing data related to a drawing position of a new pattern, and an irradiation unit that performs exposure by performing the beam irradiation based on the drawing data for a photosensitive material stacked on the base material. And a developing means for developing the photosensitive material after exposure.
[0020]
In the second invention, the pattern forming apparatus uses a photosensitive substance as a transfer layer laminated on the base material.
The pattern forming apparatus stacks a transfer sheet having a photosensitive material on a base material, irradiates the photosensitive material with a laser beam based on drawing data, and develops the exposed photosensitive material. Thus, a new pattern is formed.
[0021]
A third invention is a pattern forming apparatus that forms a pattern by performing beam irradiation, comprising: a measuring unit that measures a position of a pre-process pattern on a base material and holds the position as measurement data; Data calculating means for calculating drawing data relating to a writing position of a new pattern, and irradiating means for applying energy to the hot-melt material laminated on the substrate by performing the beam irradiation based on the drawing data And a pattern forming apparatus comprising:
[0022]
In the third invention, the pattern forming apparatus uses a hot-melt substance as the transfer layer laminated on the base material.
The pattern forming apparatus stacks a transfer sheet having a hot melt material on a base material, irradiates a laser beam to the hot melt material based on drawing data, and gives thermal energy through a photothermal conversion material or the like. A new pattern is formed by transfer.
[0023]
A fourth invention is a pattern forming method for forming a pattern by irradiating a beam, comprising: a measuring step of measuring a position of a pre-process pattern on a base material and holding the position as measurement data; A drawing data calculation step of calculating drawing data relating to a drawing position of a new pattern, and an irradiation step of performing the beam irradiation based on the drawing data.
[0024]
A fourth invention is an invention relating to a pattern forming method in the pattern forming apparatus of the first invention.
[0025]
A fifth invention is a pattern forming method for forming a pattern by performing beam irradiation, comprising: a measuring step of measuring a position of a pre-process pattern on a base material and holding the position as measurement data; A drawing data calculation step of calculating drawing data related to a drawing position of a new pattern, and an irradiation step of performing exposure by performing the beam irradiation based on the drawing data for a photosensitive material laminated on the base material. And a developing step of developing the photosensitive material after exposure.
[0026]
A fifth invention is an invention relating to a pattern forming method in the pattern forming apparatus of the second invention.
[0027]
A sixth invention is a pattern forming method for forming a pattern by performing beam irradiation, comprising: a measurement step of measuring a position of a pre-process pattern on a base material and holding the position as measurement data; Data calculating step of calculating drawing data relating to a writing position of a new pattern by applying the beam irradiation based on the drawing data to a hot melt material laminated on the base material and applying energy. And a pattern forming method.
[0028]
A sixth invention is an invention relating to a pattern forming method in the pattern forming apparatus of the third invention.
[0029]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, preferred embodiments of a pattern forming apparatus and the like according to the present invention will be described in detail with reference to the accompanying drawings. In the following description and the accompanying drawings, components having substantially the same functional configuration will be denoted by the same reference numerals, and redundant description will be omitted.
[0030]
First, the configuration of a pattern forming apparatus 100 according to an embodiment of the present invention will be described with reference to FIG.
FIG. 1 is a schematic configuration diagram of a pattern forming apparatus 100 according to the present embodiment.
[0031]
The pattern forming apparatus 100 includes a control unit 101, a measurement unit 102, an irradiation unit 103, a support unit 104, a supply unit 105, a collection unit 106, a bus 107, and the like.
The pattern forming apparatus 100 forms a new pattern by stacking a transfer sheet on a base material and irradiating a laser beam to transfer the transfer layer onto the base material.
[0032]
When the transfer layer is a photosensitive material, the pattern forming apparatus stacks a transfer sheet having the photosensitive material on a base material, and irradiates the photosensitive material with a laser beam based on drawing data to expose the photosensitive material. A new pattern is formed by developing the exposed photosensitive material.
[0033]
When the transfer layer is a heat-fusible material, the pattern forming apparatus stacks a transfer sheet having the heat-fusible material on a base material, irradiates a laser beam to the heat-fusible material based on drawing data, A new pattern is formed by transferring by applying heat energy through the above.
[0034]
The control unit 101 includes a CPU, a ROM, a RAM, a hard disk, and the like, and drives and controls each device connected via the bus 107 according to a program stored or introduced in the ROM, the RAM, the hard disk, or the like.
Each program code is read as needed by the control unit 101, transferred to the RAM, read by the CPU, and executed as various means.
[0035]
The control unit 101 creates drawing data for drawing a new pattern (such as a color filter pattern) based on measurement data related to the position of the pre-process pattern (TFT, BM, etc.) measured by the measuring unit 102. Further, the control unit 101 can obtain measurement data by performing image processing on image data and the like acquired by the measurement unit 102.
[0036]
The measurement unit 102 measures the position of the pre-process pattern, the substrate length, and the like, and acquires measurement data. The measurement unit 102 is, for example, an image sensor such as a CCD (CHARGE COUPLED DEVICE) camera. The measurement unit 102 acquires measurement data from image data such as a pattern and an alignment mark in a previous process.
The measuring unit 102 is not limited to an image sensor such as a CCD camera, but may be a light reflection type sensor as long as it measures the position of the pre-process pattern, the substrate length, and the like.
[0037]
The measurement data is data relating to the position of the pre-process pattern, the substrate length, and the like. The data on the position of the pre-process pattern is, for example, a pixel position, a pitch between pixels, and the like. The data on the substrate length is, for example, the distance between the alignment marks attached to the substrate. The measurement data may be obtained by performing image processing on image data in the control unit 101.
[0038]
When the measuring unit 102 includes an encoder (not shown) and the like, the sensor such as a CCD camera is moved by encoder control of a driving source such as a motor. The position of the pattern, the length of the substrate, and the like can be measured.
When a scale (not shown) or the like is provided, the measuring unit 102 can measure the position and the movement amount by acquiring an image of the scale with a CCD camera or the like and processing the image.
Further, instead of an image sensor such as a CCD camera, a light reflection type sensor such as a laser sensor can be used.
[0039]
The irradiation unit 103 is a drawing apparatus that draws a pattern image by irradiating a laser beam or the like. The irradiating unit 103 has a light source and an irradiating head, and irradiates a transfer sheet laminated on a base material with a laser beam based on the drawing data created by the control unit 101.
The support section 104 has a stage for supporting and arranging a base material, a transfer sheet, and the like.
[0040]
Both the irradiation head of the irradiation unit 103 and the stage of the support unit 104 may be arbitrarily movable two-dimensionally (XY axis directions, θ rotation direction, etc.), or the irradiation head may arbitrarily move on the stage relatively. You may make it movable. For example, with respect to the XY two-axis directions, the irradiation head may be movable only in the Y direction, and the stage may be movable only in the X direction.
[0041]
The supply unit 105 is a roll that supplies a base material to the stage, or a winding.
The collecting unit 106 is a roll or a winding for collecting the base material from the stage.
The transfer step is performed a plurality of times (for example, in the case of forming a colored layer, three times of Red, Blue, and Green). A supply unit and a recovery unit may be provided for each step, or a supply unit may be provided between steps. Alternatively, a plurality of steps may be performed continuously without providing a recovery unit.
[0042]
Next, the operation of the pattern forming apparatus 100 will be described with reference to FIGS.
[0043]
The operation of the pattern forming apparatus 100 in forming the first layer pattern will be described with reference to FIG.
FIG. 2 is a flowchart illustrating the operation of the pattern forming apparatus 100 in forming the first layer pattern.
[0044]
The pattern forming apparatus 100 mounts a substrate on a stage (Step 201).
The pattern forming apparatus 100 forms a first layer pattern on the base material (Step 202). When manufacturing a color filter to be bonded to a TFT array, the first layer is a BM pattern, and when manufacturing a COA, the first layer is a TFT pattern.
[0045]
The pattern forming apparatus 100 makes an alignment mark on the base material (Step 203).
The alignment mark is formed outside the pattern region on the base material, and is attached to, for example, four corners of the base material (see the alignment mark 602 in FIG. 6).
[0046]
Through the above process, the pattern forming apparatus 100 also forms an alignment mark when forming the first layer pattern.
[0047]
The operation of the pattern forming apparatus 100 in forming a new pattern (position measurement of a pre-process pattern, drawing of a new pattern) will be described with reference to FIGS.
[0048]
FIG. 3 is a diagram schematically illustrating the operation of the pattern forming apparatus 100 in the position measurement of the pre-process pattern.
FIG. 4 is a diagram schematically illustrating an operation of the pattern forming apparatus 100 in drawing a new pattern.
[0049]
FIG. 5 is a flowchart showing the operation of the pattern forming apparatus 100 in forming a new pattern.
[0050]
The pattern forming apparatus 100 mounts the substrate 303 on which the pattern of the previous process is formed on the stage 305 (Step 501). In the pattern forming apparatus 100, the substrate may be mounted on the stage via the suction mechanism 304 or the like. Further, the base material may be positioned based on the alignment mark.
[0051]
The pattern forming apparatus 100 scans the substrate 303 with the CCD camera 302 to acquire image data of the pre-process pattern (step 502).
The pattern forming apparatus 100 performs image processing on the acquired image data, and acquires measurement data on the position of the pre-process pattern (Step 503).
[0052]
Through the processes of steps 501 to 503, the pattern forming apparatus 100 measures the position of the pre-process pattern.
[0053]
The pattern forming apparatus 100 calculates drawing data related to a drawing position of a new pattern based on the measurement data (Step 504).
The pattern forming apparatus 100 evacuates the CCD camera 302 (step 505), and stacks the transfer sheet 306 on the substrate 303 (step 506).
[0054]
The pattern forming apparatus 100 scans the base 303 with the irradiation head 301, irradiates the transfer sheet 306 with the laser beam 307 based on the drawing data, and transfers and draws the transfer layer on the base 303 (step). 507).
[0055]
Through the processes of steps 504 to 507, the pattern forming apparatus 100 forms a new pattern.
[0056]
FIG. 6 is a diagram illustrating the base material 601 after the formation of the pre-process pattern (TFT pattern, BM pattern, etc.) 603.
FIG. 7 is a diagram illustrating the substrate 701 when a new pattern (color filter pattern or the like) 703 is formed.
[0057]
As shown in FIG. 6, the pattern forming apparatus 100 acquires image data of a pre-process pattern 603 formed on a base material 601 by a CCD camera, performs image processing, and processes the pre-process pattern such as a pixel pitch 604. Obtain measurement data related to the position.
[0058]
As shown in FIGS. 6 and 7, when the design dimension of the pixel pitch 604 in the pre-process pattern 603 is (a) and the measurement dimension is (a + Δa), the pattern forming apparatus 100 The drawing dimension of the pitch 704 is set to (p = a + Δa), and the base 701 is scanned by the irradiation head 702 to draw a new pattern 703.
[0059]
The scanning by the irradiation head 702 may be performed by moving the stage in the stage moving direction 705 (X direction) and moving the irradiation head in the head moving direction 706 (Y direction).
[0060]
As described above, even when the dimension of the pre-process pattern changes due to expansion and contraction or deformation of the base material, the drawing dimension is corrected by actually measuring the dimension of the pre-process pattern when forming a new pattern. Therefore, it is possible to prevent the displacement between the previous process pattern and the new pattern. As a result, display defects and the like of the display panel can be reduced, and the yield can be improved.
In particular, when the substrate is a flexible substrate such as a plastic substrate, the above-described effects are remarkable.
[0061]
In the above description, the pattern forming apparatus measures the pixel pitch in the position measurement of the pre-process pattern. However, a reference position (for example, FIG. 6: a reference point 605, a reference line 606, etc.) is provided, and these reference positions are set. The distance between the pixel and each pixel may be measured.
Further, the pattern forming apparatus may measure not only the XY biaxial directions but also other directions.
Further, the pattern forming apparatus may measure the same base material along two or more parallel scanning lines. In this case, the pattern forming apparatus can correct the drawing data also regarding distortion in the pattern area.
[0062]
Note that a pattern forming apparatus that performs each step of forming a pre-process pattern, measuring the position of the pre-process pattern, and drawing a new pattern may be integrally configured, or may be configured as a different pattern forming apparatus that can operate independently. You may make it.
[0063]
Next, transfer and drawing of a transfer layer by laser beam irradiation will be described with reference to FIGS.
[0064]
FIG. 8 is a diagram illustrating one embodiment of the irradiation unit 103 (drawing apparatus) of the pattern forming apparatus 100.
FIG. 9 is a diagram showing a beam arrangement of laser beams emitted from the light valve.
FIG. 10 is a diagram illustrating a base material and the like at the time of laser beam irradiation.
FIG. 11 is a diagram illustrating a substrate and the like after laser beam irradiation.
[0065]
The irradiation unit 103 (laser transfer device) shown in FIG. 8 includes a laser light source 801, an optical lens 802, a half mirror 803, a light valve 804, an optical lens 805, an irradiation head 806, and the like.
[0066]
The laser beam emitted from the laser light source 801 is corrected to an optimum beam shape through an optical lens 802, passes through a half mirror 803, and is irradiated on a light valve 804.
[0067]
The light valve 804 is, for example, a diffractive light valve having a DMD (digital micromirror device). The DMD includes a plurality of micromirrors arranged two-dimensionally.
[0068]
The light valve 804 performs electrical control for each bulb to change the angle of the bulb reflector. The laser beam specularly reflected by the light valve 804 is transmitted again to the optical lens 805 via the half mirror 803, and is pattern-irradiated as a laser beam 807 from the irradiation head 806 to the transfer sheet 808 laminated on the base material 809.
[0069]
As shown in FIG. 9, in the light valve 804, a two-dimensional beam array 810 is formed. The pattern forming apparatus can increase or decrease the irradiation energy by controlling the number of beams used in the head scan direction 811.
For example, in the region 812, the number of used beams is 1 (the number of beam transmitting pixels is 1), and in the region 813, the number of used beams is 2 (the number of beam transmitting pixels is 2).
[0070]
As shown in FIG. 10, the laser beam 807 is emitted from the irradiation head 806 from the side of the transfer sheet substrate 814 on the back surface of the transfer sheet 808. The transfer sheet 808 includes a transfer sheet substrate 814, a light-to-heat conversion layer 815, a transfer layer 816, and the like. The transfer sheet 808 and the base material 809 are held in close contact with each other by suction through suction holes provided in the stage. Adhesion can be improved by performing suction using vacuum adhesion means.
[0071]
The laser beam 807 is applied to the photothermal conversion layer 815 via the transfer sheet base material 814 to convert light energy into heat energy, and the transfer layer 816 is transferred onto the base material 809 by the heat energy.
As shown in FIG. 11, the transfer layer 817 (after the transfer) is transferred to the base material 809 at the portion irradiated with the laser beam 807.
[0072]
As described above, the pattern forming apparatus brings the thermal transfer layer of the laser thermal transfer recording material into contact with the surface of the image receiving side substrate and irradiates a laser beam to transfer an image onto the image receiving side substrate.
The pattern forming apparatus performs, for example, scanning exposure with a beam spot in which a semiconductor laser beam oscillating near-infrared light of 680 to 1100 nm is collected to a diameter of 5 to 100 μm.
[0073]
Further, the energy to be given can be changed by changing the amount of laser light or the irradiation area.
Further, a pattern image may be formed by irradiating laser light from the transfer sheet side, or a pattern image may be formed by irradiating laser light from the image receiving substrate side.
[0074]
When an image is formed by irradiating laser light from the transfer sheet side, the laser light is irradiated to the photothermal conversion layer via the transfer sheet base material. In this case, in order to improve the heat conversion efficiency of the laser light in the light-to-heat conversion layer, the transfer sheet base material preferably does not contain a laser light absorbing material.
[0075]
On the other hand, when an image is formed by irradiating the laser light from the image receiving substrate side, the laser light is applied to the transfer layer and the photothermal conversion layer of the transfer sheet via the image receiving substrate. In this case, in order to improve the heat conversion efficiency of the laser light in the light-to-heat conversion layer, it is preferable that the image receiving substrate and the transfer layer do not contain a laser light absorbing material.
[0076]
The drawing apparatus has various radiation beams such as an electron beam, a laser, X-rays, ions, and UV, and there are two types of various beams, a photon mode and a heat mode.
The photon mode is a system in which a photosensitive resist (photosensitive substance) is exposed and reacted by beam irradiation, and a pattern is formed by a developing process.
The heat mode is a method in which a pattern is directly transferred by thermal fusion transfer, ablation, sublimation transfer, trimming, or the like by beam irradiation.
[0077]
In the case of the photon mode, a pattern can be formed with low irradiation energy, and in the case of the heat mode, a high irradiation energy is required, but the pattern can be formed without going through a developing step.
In any of the photon mode and the heat mode, drawing can be performed directly without using a photomask. Therefore, drawing can be performed while correcting dimensions such as a pattern pitch.
[0078]
In the case of laser light, there are a beam scan type, a light valve type and the like. The light valve type includes a diffraction type and a linear type. The drawing apparatus in the heat mode using the diffractive light valve has been described above with reference to FIG.
[0079]
Light valves include a diffraction type and a linear type. With respect to a diffractive light valve, there is a method in which thousands of thin reflectors (ribbons) arranged in a horizontal direction are moved by an electric force, and a light beam is modulated using diffraction caused by the ribbon (for example, See JP-A-2002-139702 (Dainippon Screen).) Further, there is a digital micromirror device (DMD manufactured by Texas Instruments) in which micromirrors are two-dimensionally arranged.
As for the linear light valve, there is a method of changing the polarization state of light by applying a voltage to an electrode made of PLZT (lead lanthanum zirconate titanate), and performing ON / OFF control of a laser beam for each valve. There is also a light valve using a liquid crystal shutter.
[0080]
Next, the transfer sheet substrate, light-to-heat conversion layer, and transfer layer of the transfer sheet will be described. (Transfer sheet substrate)
The transfer sheet substrate is not particularly limited, but when irradiating a laser beam from the transfer sheet substrate side, a material having high transparency is preferable.
[0081]
The transfer sheet base material is, for example, polyester such as polyethylene terephthalate, polypropylene, cellophane, polycarbonate, cellulose acetate, triacetyl cellulose, polyethylene, polyvinyl chloride, polystyrene, nylon, polyimide, polyethylene sulfide (PES), polyethylene naphthalate (PEN) ), Plastics having relatively high heat resistance, such as polyvinylidene chloride, polyvinyl alcohol, fluororesin, chlorinated rubber, and ionomer; papers such as condenser paper and paraffin paper; and nonwoven fabrics. Further, these may be combined.
The thickness of the transfer sheet substrate can be appropriately changed in consideration of strength and thermal conductivity, but the thickness is 2 to 180 μm, preferably 50 to 125 μm.
[0082]
(Light-to-heat conversion layer)
The light-to-heat conversion layer is provided on the transfer sheet substrate, and is a layer that converts light energy of the emitted laser light into heat energy.
The light-to-heat conversion layer is mainly composed of a binder resin of a resin composition crosslinked with a near-infrared absorbing material.
[0083]
Near-infrared absorbing material is a substance that absorbs light and efficiently converts it to heat.For example, when a semiconductor laser is used as a light source, carbon black, graphite, titanium black, iron oxide, composite metal oxide, phthalocyanine dye Squarium dyes, nitroso compounds and metal complex salts thereof, polymethine dyes, thiol nickel salts, triarylmethane dyes, immonium dyes, naphthoquinone dyes, and anthracene dyes.
When carbon black, which is a particle material among the above, is used as the near-infrared absorbing material, it is possible to realize appropriate foil holding and high sensitivity of printing.
[0084]
Further, the binder resin of the light-to-heat conversion layer is a crosslinked resin composition or the like, for example, a monomer or oligomer having an unsaturated bond, an electron beam cured product or a UV cured product, or a thermoplastic resin having a reactive group in the resin. Examples include a cured product of a resin and a polyisocyanate.
[0085]
As the thermoplastic resin having a reactive group in the above resin, known resins can be used, for example, a polyester resin, a polyacrylate resin, a polyvinyl acetate resin, a polyurethane resin, a styrene acrylate resin, Polyacrylate resins, polyacrylamide resins, polyamide resins, polyether resins, polystyrene resins, polyethylene resins, polypropylene resins, polyolefin resins, vinyl resins such as polyvinyl chloride resins and polyvinyl alcohol resins, cellulose Resins, cellulose resins such as hydroxyethyl cellulose resins and cellulose acetate resins, polyvinyl acetal resins such as polyvinyl acetoacetal resins and polyvinyl butyral resins, silicone-modified resins, and long-chain alkyl-modified resins.
[0086]
The method for curing the binder resin is not particularly limited, such as heating and irradiation with ionizing radiation. Conventionally, various isocyanate curing agents are known. Among them, an adduct of an aromatic isocyanate is preferably used, and Takenate (registered trademark) (manufactured by Takeda Pharmaceutical Co., Ltd.), Burnock ( (Registered trademark) (manufactured by Dainippon Ink and Chemicals, Inc.), Coronate (registered trademark) (manufactured by Nippon Polyurethane Industry Co., Ltd.), Duranate (registered trademark) (manufactured by Asahi Kasei Kogyo Co., Ltd.), Dismodule (manufactured by Bayer), etc. Can be used.
[0087]
The addition amount of the polyisocyanate is suitably in the range of 5 to 200 parts by weight based on 100 parts by weight of the binder resin constituting the light-to-heat conversion layer. The ratio of -NCO / -OH is preferably in the range of about 0.6 to 2.0.
If the amount of the polyisocyanate is small, the crosslink density becomes low and the heat resistance becomes insufficient. On the other hand, when the added amount of the polyisocyanate is large, the shrinkage of the formed coating film cannot be controlled, the curing time is prolonged, and unreacted -NCO groups remain in the light-to-heat conversion layer and react with moisture in the atmosphere. In some cases, such troubles may occur.
[0088]
Further, as the crosslinked resin composition, an electron beam cured product or a UV cured product of a monomer or oligomer having an unsaturated bond can be used. The light-to-heat conversion layer is mainly composed of at least a near-infrared absorbing material and a curable binder, and can be used as a cured product by electron beam or UV by appropriately adding a non-curable binder and a photopolymerization initiator.
As the curable binder, a compound having at least one polymerizable carbon-carbon unsaturated bond can be used.
[0089]
The content of such a curable binder is preferably in the range of 20 to 80% by weight based on the total solid content of the light-to-heat conversion layer. Among the non-curable binders, polymethyl methacrylate resin, polyethyl methacrylate resin, polymethyl methacrylate resin and polymethacrylic acid are used from the viewpoint of compatibility with the curable binder used together and yellowing against heat. It is preferable to use a copolymer of an ethyl resin, a phenoxy resin, an epoxy resin, a polycarbonate resin, a polystyrene resin, cellulose acetate propionate, cellulose acetate butyrate, ethyl hydroxyethyl cellulose, cellulose triacetate, and the like.
[0090]
Particularly preferably, polymethyl methacrylate resin, polyethyl methacrylate resin, copolymer of polymethyl methacrylate resin and polyethyl methacrylate resin, phenoxy resin, epoxy resin, and modified products thereof can be used. .
Further, the content of such a non-curable binder is preferably in the range of 5 to 50% by weight based on the total solid content of the light-to-heat conversion layer.
[0091]
Further, the photopolymerization initiator can be used alone or in combination of two or more to increase the photocuring reaction rate.
The addition amount of the photopolymerization initiator is preferably in the range of 0.1 to 10% by weight based on the total solid content of the photothermal conversion layer. When the amount of the photopolymerization initiator is less than 0.1% by weight, it is extremely difficult to exhibit the effect as the photopolymerization initiator regardless of the type of the photopolymerization initiator used. On the other hand, if the content exceeds 10% by weight, the reaction rate of photopolymerization becomes extremely high, but tackiness remains unpreferably.
[0092]
By using the binder resin, which is the above crosslinked resin composition, the heat resistance of the light-to-heat conversion layer is high, it does not soften even at the time of high output of laser light, the peelability with the thermal transfer ink layer is good, and the sensitivity is high. A thermal transfer recording material is obtained.
[0093]
The formation of the light-to-heat conversion layer is performed by adding a near-infrared absorbing material and a binder resin as described above, and optionally an additive, and further mixing and adjusting a solvent component such as water and an organic solvent as necessary. The conversion layer forming coating liquid is applied and dried by a conventionally known method such as gravure direct coat, gravure reverse coat, die coat, microgravure coat, slide coat, slit reverse coat, curtain coat, knife coat, air coat, roll coat and the like. can do.
[0094]
The thickness of the light-to-heat conversion layer is preferably from 0.1 to 5 μm when dried, and the content of the near-infrared absorbing material in the light-to-heat conversion layer is usually such that the absorbance at the wavelength of the light source used for image recording is from 0.3 to 3. It can be determined to be zero. Generally, the absorbance should be about 0.4 to 1.5.
[0095]
(Transfer layer)
The transfer layer is mainly composed of a coloring material and a binder resin, and is transferred to the image receiving substrate side by heating at the time of printing so that the adhesive force with the image receiving substrate becomes stronger than the adhesive force with the photothermal conversion layer side.
Examples of the coloring material include pigments such as inorganic pigments and organic pigments, and dyes.
[0096]
Examples of the inorganic pigment include titanium dioxide, carbon black, zinc oxide, Prussian blue, cadmium sulfide, iron oxide, and chromates of lead, zinc, barium, and calcium. Examples of the organic pigment include azo-based, thioindigo-based, anthraquinone-based, anthranthrone-based, and triphenedioxazine-based pigments, vat dye pigments, phthalocyanine pigments (eg, copper phthalocyanine) and derivatives thereof, and quinacridone pigments.
[0097]
Examples of organic dyes include acid dyes, direct dyes, disperse dyes, oil-soluble dyes, metal-containing oil-soluble dyes, and sublimable dyes (thermal sublimable dyes). As the sublimable dye, a conventionally known sublimable dye can be used. Examples of the sublimable dye include a cyan dye, a magenta dye, and a yellow dye. The sublimable dye contained in the thermal transfer ink layer may be any one of a yellow dye, a magenta dye and a cyan dye or a mixture thereof as long as the image to be formed is a single color.
[0098]
The above-mentioned coloring material is preferably a material having good properties as a recording material, for example, a material having a sufficient coloring density and not discoloring by light, heat, temperature or the like. In addition, carbon black, an organic pigment, an inorganic pigment, or an appropriate dye can be selected and used from various dyes according to a required color tone. The content of the coloring material in the transfer layer is not particularly limited, but is usually in the range of 5 to 70% by weight, preferably 10 to 60% by weight.
[0099]
The binder of the transfer layer is preferably composed mainly of a resin, and specific examples of the resin include an acrylic resin, a cellulose resin, a melamine resin, a polyester resin, a polyamide resin, a polyolefin resin, and an acrylic resin. Thermoplastic elastomers such as resin, styrene resin, polyamide, ethylene-vinyl acetate copolymer, vinyl chloride-vinyl acetate copolymer, and styrene-butadiene rubber are exemplified. Particularly, those having a relatively low softening point conventionally used as a heat-sensitive adhesive, for example, a softening point of 50 to 150 ° C are preferable.
[0100]
In addition, if necessary, a wax component can be mixed and used to such an extent that heat resistance and the like are not impaired. Examples of the wax include microcrystalline wax, carnauba wax, and paraffin wax. Furthermore, various types such as Fischer-Tropsch wax, various low molecular weight polyethylenes, wood wax, beeswax, spermaceti, Ibota wax, wool wax, shellac wax, candelilla wax, petrolactam, polyester wax, partially modified wax, fatty acid ester, fatty acid amide, etc. Wax. Among them, those having a melting point of 50 to 85 ° C. are particularly preferable. If the temperature is lower than 50 ° C., there arises a problem in storage stability.
[0101]
The transfer layer is formed by adding a colorant component and a binder component as described above, and if necessary, various additives such as a dispersant and an antistatic agent, and further adding water, an organic solvent and the like as necessary. A coating solution for forming a thermal transfer ink layer formed by mixing and adjusting a solvent component is coated with a conventionally known hot melt coat, hot lacquer coat, gravure direct coat, gravure reverse coat, die coat, microgravure coat, slide coat, slit reverse coat, curtain coat. A thickness of 0.05 to 5 μm, preferably 0.2 to 1.5 μm is provided in a dry state by a method such as knife coating, air coating, roll coating or the like. When the thickness of the dried coating film is less than 0.05 μm, a uniform ink layer cannot be obtained due to the problem of film forming properties, which causes a reduction in the abrasion of printed matter. On the other hand, when the thickness exceeds 5 μm, high energy is required at the time of print transfer, resulting in insufficient printing sensitivity.
[0102]
(Image receiving substrate)
As the image receiving substrate, a film having transparency and heat resistance is suitably used. Specific examples of such a film include polyethylene terephthalate, polycarbonate, polyethylene sulfide (PES), polyimide, polyethylene naphthalate (PEN), polyvinyl chloride, polyether sulfone, polyamide imide, polyamide, and aromatic polyamide. Among them, polyethylene terephthalate, polycarbonate, polyether sulfone, and thin film glass are preferably used.
[0103]
Next, a comparison between a display pattern formed in the embodiment of the present invention and a display pattern formed by a conventional technique will be described.
[0104]
Using a 100 μm-thick polyethylene terephthalate (PET) film (Lumilar (registered trademark) T-60, manufactured by Toray Industries, Inc.) as a transfer sheet substrate, a coating solution having the following composition was applied to one surface of the transfer sheet substrate. Coating and drying were performed by a reverse roll coater, and a light-to-heat conversion layer and a transfer layer were laminated in this order. The coating amount is 0.8 μm for the light-to-heat conversion layer and 1.2 μm for the thermal transfer ink layer. However, the light-to-heat conversion layer was dried and cured at 120 ° C. for 3 minutes.
[0105]

[0106]
In the display pattern formed in the embodiment of the present invention, the displacement between the TFT pattern and the color filter pattern was suppressed to 5 μm at the maximum for a display size of 200 mm width.
[0107]
On the other hand, in a display pattern formed by a photolithography method using a photomask, which is a conventional technique, the maximum displacement between the TFT pattern and the color filter pattern was 50 μm for a display size of 200 mm width.
[0108]
That is, according to the embodiment of the present invention, it is possible to form a pattern with high precision, and it is extremely remarkable that misalignment is reduced by about 90% as compared with the related art such as exposure through a photomask. Effect was obtained.
[0109]
As described above, the preferred embodiments of the pattern forming apparatus, the pattern forming method, and the like according to the present invention have been described with reference to the accompanying drawings, but the present invention is not limited to such examples. It will be apparent to those skilled in the art that various changes or modifications can be made within the scope of the technical idea disclosed in the present application, and these naturally belong to the technical scope of the present invention. I understand.
[0110]
【The invention's effect】
As described above in detail, according to the present invention, it is possible to provide a pattern forming apparatus, a pattern forming method, and the like that can prevent a positional deviation from a pre-process pattern.
[Brief description of the drawings]
FIG. 1 is a schematic configuration diagram of a pattern forming apparatus 100.
FIG. 2 is a flowchart showing the operation of the pattern forming apparatus 100 in forming a first layer pattern.
FIG. 3 is a diagram schematically illustrating the operation of a pattern forming apparatus 100 in position measurement of a pre-process pattern.
FIG. 4 is a diagram schematically showing the operation of the pattern forming apparatus 100 in drawing a new pattern.
FIG. 5 is a flowchart showing the operation of the pattern forming apparatus 100 in forming a new pattern.
FIG. 6 is a view showing a base material 601 after a pre-process pattern is formed.
FIG. 7 is a view showing a base material 701 when a new pattern is formed.
FIG. 8 is a diagram showing one mode of an irradiation unit 103 (drawing apparatus) of the pattern forming apparatus 100.
FIG. 9 is a diagram showing a beam arrangement of laser beams emitted from a light valve.
FIG. 10 is a diagram showing a base material and the like at the time of laser beam irradiation.
FIG. 11 is a diagram showing a base material and the like after laser beam irradiation.
FIG. 12 is a flowchart showing a manufacturing process of a color filter.
FIG. 13 is a flowchart showing a manufacturing process of a COA (color filter on array).
[Explanation of symbols]
100 pattern forming apparatus
101 Control unit
102 Measurement part
103 irradiating unit
104 Support part
301 irradiation head
302 ... CCD camera
303 ............ Base material
304 ... Suction mechanism
305 ……… Stage
306 ... Transfer sheet
307 ... Laser beam
601, 701 ..... substrate
602 ...... Alignment mark
603: Pre-process pattern
604: Pixel pitch (pre-process pattern)
703 ……… New pattern
704: Pixel pitch (new pattern)
804 Light bulb
806 Irradiation head

Claims (14)

A pattern forming apparatus that forms a pattern by performing beam irradiation,
Measuring means for measuring the position of the pre-process pattern on the base material and holding it as measurement data,
A drawing data calculation unit that calculates drawing data related to a drawing position of a new pattern based on the measurement data;
Irradiation means for performing the beam irradiation based on the drawing data,
A pattern forming apparatus comprising: A pattern forming apparatus that forms a pattern by performing beam irradiation,
Measuring means for measuring the position of the pre-process pattern on the base material and holding it as measurement data,
A drawing data calculation unit that calculates drawing data related to a drawing position of a new pattern based on the measurement data;
Irradiation means for exposing the photosensitive material to be laminated on the base material by performing the beam irradiation based on the drawing data,
Developing means for developing the photosensitive material after exposure,
A pattern forming apparatus comprising: A pattern forming apparatus that forms a pattern by performing beam irradiation,
Measuring means for measuring the position of the pre-process pattern on the base material and holding it as measurement data,
A drawing data calculation unit that calculates drawing data related to a drawing position of a new pattern based on the measurement data;
Irradiating means for applying energy by performing the beam irradiation based on the drawing data, for a hot melt material laminated on the base material,
A pattern forming apparatus comprising: 4. The pattern forming apparatus according to claim 1, wherein the measurement unit captures an image of the pre-process pattern and acquires the measurement data based on the image. 5. 4. The pattern forming apparatus according to claim 1, wherein the pre-process pattern includes at least one of a TFT pattern and a black matrix pattern. 4. The apparatus according to claim 1, further comprising a supply unit that feeds out the base material, a support unit that supports the base material, and a collection unit that collects the base material after pattern formation. 5. A pattern forming apparatus according to any one of the above. The pattern forming apparatus according to any one of claims 1 to 3, wherein the new pattern includes a color filter pattern. A pattern forming method for forming a pattern by performing beam irradiation,
A measurement step of measuring the position of the pre-process pattern on the base material and holding it as measurement data,
A drawing data calculation step of calculating drawing data for a drawing position of a new pattern based on the measurement data;
An irradiation step of performing the beam irradiation based on the drawing data;
A pattern forming method, comprising: A pattern forming method for forming a pattern by performing beam irradiation,
A measurement step of measuring the position of the pre-process pattern on the base material and holding it as measurement data,
A drawing data calculation step of calculating drawing data for a drawing position of a new pattern based on the measurement data;
An irradiation step of exposing and performing the beam irradiation based on the drawing data, for a photosensitive material laminated on the base material,
A developing step of developing the photosensitive material after exposure,
A pattern forming method, comprising: A pattern forming method for forming a pattern by performing beam irradiation,
A measurement step of measuring the position of the pre-process pattern on the base material and holding it as measurement data,
A drawing data calculation step of calculating drawing data for a drawing position of a new pattern based on the measurement data;
An irradiation step of applying energy by performing the beam irradiation based on the drawing data, for a heat-melted substance laminated on the base material,
A pattern forming method, comprising: The pattern forming method according to any one of claims 8 to 10, wherein in the measuring step, an image of the pre-process pattern is captured, and the measurement data is obtained based on the image. 11. The pattern forming method according to claim 8, wherein the pre-process pattern includes at least one of a TFT pattern and a black matrix. 11. The method according to claim 8, further comprising: a supply step of feeding the base material, a support step of supporting the base material, and a collection step of collecting the base material after pattern formation. Or a pattern forming method. The pattern forming method according to any one of claims 8 to 10, wherein the new pattern includes a color filter pattern.

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