JP2004269015A - Solder particle container - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a solder particle container which facilitates grounding of static electricity, has a simple structure, and can be mass-produced. <P>SOLUTION: The solder particle container is formed of a container body 1A having an opening, and a sheet-like cover member 1B for sealing the opening of the container body 1A. The container body 1A has a peripheral wall 3 extending upward from a rim of a bottom wall 2, and a flange 8 protruding from a rim at the tip of the peripheral wall 3 and extending along the rim of the peripheral edge. The cover member 1B has a tab portion 12 overhanging from the container body 1A at a necessary location of a peripheral portion thereof. Then both surfaces of each of the container body 1A and the cover member 1B have conductive layers applied thereto, and by welding the peripheral portion on one side of the cover member 1B to the flange 8, the opening is sealed. <P>COPYRIGHT: (C)2004,JPO&NCIPI

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a container for fine solder particles.
[0002]
[Prior art]
2. Description of the Related Art Conventionally, solder fine particles used for manufacturing a multifunctional electronic component or the like are extremely fine particles, and a certain amount of solder particles are contained in a container and distributed. As the container for fine solder particles, for example, a container as shown in FIG. 5 is used. This container for solder fine particles is a container body 101 having a bottomed cylindrical body and a male screw screwed on the outside upper side, and a shallow bottomed bottomed cylindrical body with a flange formed on the upper part. An inner lid 102 on which a filter is stretched and a hole is drilled, an oxygen absorber 103 that can be stored inside the inner lid, and a female screw that can be screwed with a male screw of the main body are screwed inside. The container body 101 is formed of an antistatic material.
[0003]
[Patent Document 1]
JP-A-11-112132
Further, fine solder particles are frequently used in various parts and the like, and containers for accommodating the fine particles are widely distributed. Therefore, high mass productivity has been conventionally required. However, in the case of the conventional container for fine solder particles, the outer lid is fixed to the container body by a screw action, so that it is necessary to cut off the screw, and it takes time and effort to manufacture and open the container.
[0005]
[Problems to be solved by the invention]
The present invention has been made in view of such a problem, and it is an object of the present invention to provide a solder fine-grain container that can easily ground static electricity and that can be mass-produced with a simple configuration. Subject.
[0006]
[Means for Solving the Problems]
The present invention is a container for fine solder particles, and is configured as follows to solve the above technical problem.
[0007]
That is, a container for solder fine grains including a container body having an opening, and a sheet-like lid member for sealing the opening of the container body, wherein the container body is upward from a peripheral edge of a bottom wall. A peripheral wall that extends, a flange that protrudes outward from the top peripheral edge of the peripheral wall and extends along the circumferential direction of the peripheral wall, wherein the lid member has a knob portion that protrudes from the container body at a required position on the outer peripheral position. In addition, conductive layers are provided on both surfaces of the container body and the lid member, and the opening is sealed by welding a peripheral edge of one side of the lid member to the flange.
[0008]
Conductive layers are provided on both surfaces of the container body and the lid member, and the lid member and the flange of the container body are welded, so that the container body and the lid member can be electrically connected. The conductive layer is a conductive film capable of easily causing the static electricity charged in the container to ground, and an antistatic film capable of reducing the surface resistivity of the container.
[0009]
The container body and the lid member are formed of, for example, a thermoplastic synthetic resin such as a polyolefin-based synthetic resin, a polyester-based synthetic resin, a polyamide-based synthetic resin, or a polyethylene-based synthetic resin, and a blend of these synthetic resins. It is desirable.
[0010]
In addition, the container for solder fine particles according to the present invention is provided with a flange protruding outward from the container body, and the flange and the lid member are bonded to each other to seal the opening of the container body. The opening at the upper edge of the main body can be made wider, so that the solder fine particles can be easily stored and taken out. The flange and the lid member can be bonded by heat welding, and there is no need to provide a separate member for bonding. Therefore, a simple configuration can be achieved, and economical efficiency and mass productivity are excellent.
[0011]
In addition, since the lid member is provided with a knob protruding from the container body at a required portion on the outer peripheral position, the container can be easily opened. Further, by grasping the knob portion with a finger at the time of opening the container, it is possible to reliably ground static electricity charged in the container.
[0012]
Desirably, one of the container body and the lid member has transparency. If either one has transparency, the contents can be checked while the lid member is sealed.
[0013]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
(Embodiment 1)
FIG. 1 is a perspective view of the solder fine-grain container according to the first embodiment, and FIG. 2 is a cross-sectional view of the knob portion of the lid member and the container body of the solder fine-grain container shown in FIG.
[0014]
The container main body 1A includes a bottom wall 2 having a substantially rectangular shape, and a peripheral wall 3 extending upward from a peripheral edge of the bottom wall 2. The container body 1 </ b> A defines a housing part 4 surrounded by the bottom wall 2 and the peripheral wall 3, and a top opening surrounded by the top peripheral edge of the peripheral wall 3. A large number of solder fine grains 11 are accommodated in the accommodation section 4.
[0015]
The container main body 1A is made of a polyolefin-based synthetic resin such as polyethylene or polypropylene, and the entire inner surface 6 and the entire outer surface 7 are covered with conductive coatings 9a and 9b. The conductive coatings 9a and 9b make it easy to ground the static electricity charged on the container body 1A, and have a resistivity of about 10 ⁶ to 10 ⁻⁸ (Ω · cm).
[0016]
The peripheral wall 3 defines a flange 8 extending in the circumferential direction from the top peripheral edge in parallel with the bottom wall 2. Both surfaces of the flange 8 are also covered with the conductive coatings 9a and 9b. The container for fine solder particles is provided with a lid member 1B fixed to the inner surface of the flange 8 and closing the top opening. The peripheral edge of the flange 8 and the peripheral edge of the lid member 1B are fixed, and for this fixing, hot melt adhesive or heat welding such as heat sealing or ultrasonic sealing can be used. Further, the lid member 1B is provided with a knob portion 12, and the knob portion 12 can be gripped and opened with a finger, thereby facilitating the opening operation.
[0017]
That is, in the container for solder fine particles according to the first embodiment, in the container body 1A and the lid member 1B, the conductive coatings 9a and 9c having a resistivity of about 10 ⁶ to 10 ⁻⁸ (Ω · cm) are provided. It becomes a conductor, and the inner peripheral surface 13 of the inner surface 13 of the lid member 1B and the inner surface 6 of the flange 8 of the container body 1A are electrically connected to each other through conductive coatings 9a and 9c which are coated on each other. Therefore, even if the inner surface 6 of the container for solder fine particles is charged by surface friction, for example, by gripping the knob portion 12 at the time of opening, static electricity is grounded via the conductive coating 9c on the inner surface 13 of the lid member 1B. Can be entangled. Further, since the outer surface 7 of the container body 1A and the outer surface 14 of the lid member 1B are also coated with the conductive coatings 9b and 9d, it is possible to ground static electricity charged on the container by touching the container for solder fine particles. it can.
[0018]
The conductive coatings 9a, 9b, 9c, 9d that cover the container body 1A or the lid member 1B may be any conductive materials capable of causing static electricity to ground. For example, a binder and a conductive filler may be used. And a polymer-type conductive paste formed from the above. As the binder, it is possible to use a thermoplastic synthetic resin such as an acrylic resin, a copolymerized polyester, a polyurethane, and a vinyl chloride-vinyl acetate copolymer. The binder makes the conductive filler adhere to the inner and outer surfaces 6, 7, 13, and 14 of the container body 1A and the lid member 1B, and at the same time, connects the conductive fillers in a chain to provide conductivity. It imparts physical and scientific stability to the functional coatings 9a, 9b, 9c, 9d. As the conductive filler, metals such as Ag, Al, Cu, Ni, Fe, and Pt, and carbon oxides such as carbon black, graphite, and tin oxide and indium oxide can be used.
[0019]
After molding the thermoplastic synthetic resin, the container main body 1A and the lid member 1B can form conductive coatings 9a, 9b, 9c, 9d on their inner and outer surfaces 6, 7, 13, and 14, respectively. At that time, a technique of a high-temperature plasma method or a vacuum evaporation method can be suitably used.
[0020]
However, it is also possible to form the synthetic resin sheet previously coated with the conductive coatings 9a, 9b, 9c, 9d using vacuum molding or the like to form the container body 1A and the lid member 1B. In order to coat the conductive coatings 9a, 9b, 9c, 9d on the synthetic resin sheet before being molded into the container body 1A and the lid member 1B, techniques such as a roll coating method, an extrusion method, a high-temperature plasma method, and a vacuum evaporation method are used. Can be used.
[0021]
In addition, although the container main body 1A and the lid member 1B of the container for solder fine particles according to the first embodiment are made of a polyolefin-based synthetic resin, an antistatic agent may be mixed into the polyolefin-based synthetic resin. Thereby, the surface specific resistance of the container body 1A can be reduced from about 10 ¹⁴ to 10 ¹⁷ (Ω / cm ² ) to about 10 ¹¹ to 10 ⁸ (Ω / cm ² ), and charging can be prevented. It is. As the antistatic agent, for example, a calcium salt of an imitalizolin-type amphoteric surfactant, a metal salt of an alanine-type amphoteric surfactant, and a metal salt of a diamine-type amphoteric surfactant can be used. In addition, a conductive filler that forms a conductive film can be used as an antistatic agent.
[0022]
Further, in the container for solder fine particles according to the first embodiment, the entire surface of the container body 1A and the lid member 1B may be subjected to a surface treatment with lauritol methyl ammonium chloride, which is a quaternary ammonium salt. By performing the surface treatment, it is possible to reduce charges generated by surface friction.
[0023]
(Embodiment 2)
FIG. 3 is a perspective view of the container for solder fine particles according to the second embodiment, and FIG. 4 is a cross-sectional view of the knob of the lid member and the container body of the container for solder fine particles shown in FIG. The container for fine solder particles according to the second embodiment has substantially the same configuration as the container for fine solder particles according to the first embodiment. However, unlike the first embodiment, the bottom wall and the lid member are substantially circular. The coating that covers both surfaces of the container body 2A and the lid member 2B is different.
[0024]
The container body 2A of the container for solder fine particles is composed of a bottom wall 2 having a substantially circular shape, and a peripheral wall 3 extending upward from a peripheral edge of the bottom wall 2. The inner surface 6 is coated with a conductive coating 10a and the outer surface 7 is coated with an antistatic coating 10b. A knob portion 12 is provided at a required position on a substantially circular cover member 2B for closing the top opening of the container body 1A, and both surfaces 13 and 14 of the cover member are covered with antistatic films 10c and 10d. The container body 1A and the lid member 1B are both made of a polyolefin-based synthetic resin.
[0025]
In this container for solder fine particles, the inner periphery of the inner surface 13 of the lid member 2B and the inner surface of the flange 8 of the container body 2B are electrically connected to each other through a conductive coating 10a and an antistatic coating 10c. Connected. Therefore, as in the first embodiment, even if the inner surface of the container is charged by surface friction, for example, by gripping the knob portion 12 at the time of opening, the inner surface 13 of the lid member 2B can be charged through the antistatic coating. Static electricity can be grounded.
[0026]
In order to form the conductive coating 10a on the inner surface 6 of the container body 2A, the same technology as in the first embodiment can be used. The antistatic coatings 10b, 10c, and 10d that cover the outer surface 7 of the container body 2A and both surfaces 13 and 14 of the lid member 2B are formed of a binder and an antistatic agent mixed therein. In order to form the antistatic film, the same method as in the case of forming the conductive film can be used.
[0027]
Examples of the antistatic agent include naphthalene sulfonate, 2-methylene carboxylic acid sulfoester, anionic antistatic agents such as water-soluble polysulfonamide, 1-octadecyl-5-methylbisguanide hydrochloride, dibutyl phosphate and the like. A cationic antistatic agent such as a salt comprising tetraethylenebentamine can be used. Further, as an antistatic agent, an anionic permanent antistatic agent such as a copolymer of styrene and styrene undecanoate, a copolymer of a fatty acid vinyl ester and maleic anhydride, a vinyl pyridine polymer, and a copolymer are used. Cationic permanent antistatic agents such as quaternized salts can also be used.
[0028]
Since the outer surface 7 of the container body 2A and both surfaces 13 and 14 of the lid member 2B are coated with an antistatic film, the surface specific resistance thereof is from about 10 ¹⁴ to 10 ¹⁷ (Ω / cm ² ) to about 10 ¹¹ . It can be reduced to 10 ⁸ (Ω / cm ² ) and charging can be suppressed.
[0029]
In the container for fine solder particles according to the first and second embodiments, the container body and the lid member, or the synthetic resin sheet before being formed into the container body and the lid member may be subjected to corona discharge treatment, chromium oxidation treatment, ultraviolet irradiation, or the like. By performing the surface oxidation treatment, the surfaces of the container body, the lid member, and the synthetic resin sheet can be made polar, and the adhesiveness of the conductive film or the antistatic film can be improved. In addition, the surface of the main body, lid member, and synthetic resin sheet are roughened by sandblasting or solvent treatment to increase the surface adhesion area and improve the adhesion of the conductive film and the antistatic film. Can be done.
[0030]
In addition, the main container and the lid member may be formed of two layers of thermoplastic synthetic resin, such as polyethylene / polypropylene and polyethylene / polyester, which overlap each other. In addition, it can be formed from kraft paper, high-quality paper, or continuous expanded polystyrene.
[0031]
【The invention's effect】
As described above, according to the present invention, even if the inside of the container for solder fine particles is charged, by touching the container, static electricity can be easily grounded from the container via the conductive layer coated on the container. . In addition, since the entire container has a simple configuration, it is easy to manufacture and mass productivity can be improved.
[0032]
In addition, since the lid member is provided with the knob portion, the container can be easily opened, and the inside of the container is charged via the conductive film or the antistatic film coated on the inner surface of the lid member and the container body. The grounded static electricity can be reliably caused.
[Brief description of the drawings]
FIG. 1 is a perspective view of a container for fine solder particles according to the first embodiment.
FIG. 2 is a sectional view of a knob portion of the container for fine solder particles according to the first embodiment.
FIG. 3 is a perspective view of a container for fine solder particles according to the second embodiment.
FIG. 4 is a cross-sectional view of a knob of the container for fine solder particles according to the second embodiment.
FIG. 5 shows a conventional container for fine solder particles.
[Explanation of symbols]
1A, 2A Container main body 1B, 2B Lid member 2 Bottom wall 3 Peripheral wall 4 Housing 6 Container main body inner surface 7 Container main body outer surface 8 Flanges 9a, 9b, 9c, 9d, 10a Conductive coatings 10b, 10c, 10d Antistatic coating 11 Solder fine particles 12 Knob 13 Inner surface of lid member 14 Outer surface of lid member 101 Container body 102 Inner lid 103 Oxygen absorber 104 Lid member

Claims (1)

A container for solder fine particles comprising a container body having an opening, and a sheet-shaped lid member for sealing the opening of the container body,
The container body has a peripheral wall extending upward from a peripheral edge of a bottom wall, and a flange extending outward from a peripheral edge of a top part of the peripheral wall and extending along a peripheral direction of the peripheral wall,
The lid member has a knob portion protruding from the container body at a required portion on the outer peripheral position,
Conductive layers are provided on both surfaces of the container body and the lid member,
A container for solder fine particles, wherein a peripheral portion on one side of the lid member is welded to the flange to seal the opening.

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