JP2004268072A - Releasing agent applying device and releasing agent applying method for molding die - Google Patents

Releasing agent applying device and releasing agent applying method for molding die Download PDF

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Publication number
JP2004268072A
JP2004268072A JP2003059986A JP2003059986A JP2004268072A JP 2004268072 A JP2004268072 A JP 2004268072A JP 2003059986 A JP2003059986 A JP 2003059986A JP 2003059986 A JP2003059986 A JP 2003059986A JP 2004268072 A JP2004268072 A JP 2004268072A
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molding
mold
release agent
die
polarity
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JP2003059986A
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Japanese (ja)
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Koji Toda
耕二 戸田
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Yamaha Fine Technologies Co Ltd
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Yamaha Fine Technologies Co Ltd
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Priority to JP2003059986A priority Critical patent/JP2004268072A/en
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  • Molds, Cores, And Manufacturing Methods Thereof (AREA)
  • Casting Devices For Molds (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a releasing agent applying device and a releasing agent applying method for a molding die, wherein the joining state of a molding die is excellently maintained and the molding agent is not used wastefully. <P>SOLUTION: An injection molding apparatus 10 is provided with a molding die that has a recessed part for molding, which consists of a recess 13b and a protrusion 14b, on joining-surfaces 13a, 14a of a fixed die 13 and a movable die 14, which are openable and closable, and that forms a molding of a prescribed shape by filling the recessed part for molding with a molten material. A releasing agent applying device 20 is provided in the injection molding apparatus 10, The releasing agent applying device 20 is composed of: an electric charge source 25 positively electrifying the fixed die 13 and the movable die 14 and negatively electrifying a releasing agent 23; insulation film parts 15a, 15b arranged on the areas of the fixed die 13 and the movable die 14, which exclude the recessed part for molding; and the like. Further, the releasing agent applying device 20 is provided with a spray head 24 removing the positive electrification of the insulation film parts 15a, 15b by jetting anions to the fixed die 13 and the movable die 14 that are positively electrified by a charging source 25. <P>COPYRIGHT: (C)2004,JPO&NCIPI

Description

【0001】
【発明の属する技術分野】
本発明は、成形金型の成形用凹部に離型剤を塗布するための成形金型の離型剤塗布装置および離型剤塗布方法に関する。
【0002】
【従来の技術】
従来から、例えば、ダイカスト等の成形金型を用いた鋳造においては、鋳造後の成形品を成形金型から取り出しやすくするために、離型剤が用いられている。この離型剤は、鋳造により成形された各成形品を成形金型から取り出すたびに成形金型を構成する固定型と移動型との接合面に形成された成形用凹部に塗布される。この離型剤塗布の際に、成形金型における塗布の不要な部分に離型剤が塗布されたり、突部に隠れた塗布の必要な部分に離型剤が届かず塗布されなかったりすることがある。このため、このようなことを防止するために、成形金型をプラスに帯電させるとともに、離型剤をマイナスに帯電させて互いに引き付けさせることにより離型剤を成形金型に塗布することが行われている(例えば、特許文献1参照)。
【0003】
【特許文献1】
特開平6−182519号公報
【0004】
【発明が解決しようとする課題】
しかしながら、従来の離型剤塗布方法では、成形金型の接合面における成形用凹部の凹部形成面だけに離型剤を塗布することが難しく、接合面の他の部分や接合面以外の部分にも離型剤が塗布されてしまうことがある。このため、成形金型の接合面に離型剤が堆積して固定型と移動型との接合性が悪化するという問題や離型剤のむだが多くなるという問題が生じている。
【0005】
【発明の概要】
本発明は、上記問題に対処するためになされたもので、その目的は、塗布が必要な成形用凹部のみに離型剤を塗布できるようにすることにより成形金型の良好な接合状態を維持でき、かつ離型剤のむだがなくなる成形金型の離型剤塗布装置および離型剤塗布方法を提供することである。
【0006】
上記の目的を達成するため、本発明に係る成形金型の離型剤塗布装置の構成上の特徴は、開閉可能な成形金型を構成する固定型と移動型との接合面に成形用凹部を設け、成形用凹部の凹部形成面に離型剤を塗布して成形用凹部内に溶融材料を充填することにより所定の形状の成形品に成形する成形金型の離型剤塗布装置であって、固定型と移動型とを一方の極性に帯電させるとともに、離型剤を他方の極性に帯電させる帯電装置と、固定型と移動型とにおける成形用凹部を除く所定部分に設けられた絶縁皮膜部と、帯電装置によって一方の極性に帯電された固定型と移動型とに他方の極性のイオンを供給して絶縁被膜部を非帯電状態または他の極性の帯電状態にするイオン供給装置とを備えたことにある。
【0007】
前記のように構成した本発明の成形金型の離型剤塗布装置では、固定型と移動型とにおける成形用凹部を除く所定部分に絶縁皮膜部を設けて、その部分各金型の内部と外部との間を電気的に絶縁している。したがって、帯電装置によって、固定型と移動型とを一方の極性に帯電した場合、成形用凹部の凹部形成面はその極性に帯電した状態になり、それ以外の絶縁被膜部が設けられた部分は電気的に絶縁された状態になる。
【0008】
そして、イオン供給装置が供給する他方の極性のイオンによって絶縁被膜部が非帯電または他の極性の帯電状態となり、より確実に離型剤は成形用凹部の凹部形成面のみに均一状態で塗布される。このため、帯電装置によって他方の極性に帯電された離型剤を成形用凹部に向って吹き付けると、離型剤は成形用凹部の凹部形成面のみに引き付けられ均一状態で塗布される。この結果、成形用凹部のみにむだのない良好な離型剤層が形成される。
【0009】
また、本発明に係る成形金型の離型剤塗布装置の他の構成上の特徴は、絶縁皮膜部が設けられた所定部分が固定型と移動型との接合面における成形用凹部を除いた部分であることにある。これによると、成形金型における成形用凹部以外の部分の中で、離型剤が塗布されやすく、また塗布されると問題が生じやすい接合面にだけ絶縁被膜部が設けられるため、絶縁皮膜部を最小、かつ効果的に設けることができる。
【0010】
本発明に係る成形金型の離型剤塗布方法の構成上の特徴は、接合面に成形用凹部が設けられ、成形用凹部を除く所定部分に絶縁皮膜部が設けられた固定型と移動型とを一方の極性に帯電させる帯電工程と、帯電工程によって一方の極性に帯電された固定型と移動型とに他方の極性のイオンを噴射して絶縁皮膜部を非帯電状態または他方の極性の帯電状態にするイオン噴射工程と、固定型と移動型との接合面における成形用凹部に他方の極性に帯電した離型剤を塗布する離型剤塗布工程とを備えたことにある。
【0011】
本発明に係る成形金型の離型剤塗布方法では、帯電工程において、固定型と移動型とを一方の極性に帯電し、その固定型と移動型とに、イオン噴射工程において他方の極性のイオンを噴射することによって、絶縁皮膜部を非帯電状態または他方の極性の帯電状態にするようにしている。この場合、成形用凹部の凹部形成面に他方の極性のイオンが噴射されても凹部形成面はすぐに一方の極性に帯電された状態になる。したがって、固定型と移動型との接合面における成形用凹部に他方の極性に帯電した離型剤を吹き付けると、離型剤は絶縁被膜部を避けて成形用凹部の凹部形成面のみに塗布される。この結果、成形用凹部のみにむだのない良好な離型剤層が形成される。
【0012】
【発明の実施の形態】
以下、本発明の一実施形態を図面を用いて説明する。図1は、本発明にかかる成形金型の離型剤塗布装置20を備えた射出成形装置10の主要部の概略構成図を示している。この射出成形装置10は、固定プレート11と固定プレート11に対向して進退可能に設置された移動プレート12とを備えている。そして、固定プレート11には固定型13が取り付けられ、移動プレート12には移動型14が取り付けられている。固定型13と移動型14との接合面13a,14aにおける中央部には、組み付けられることにより本発明の成形用凹部を構成する凹部13bと突部14bとがそれぞれ形成されている。この固定型13と移動型14とで本発明の成形金型が構成される。
【0013】
固定型13の表面における凹部13bを除く部分および移動型14の表面における突部14bを除く部分には、それぞれアルミナ等からなる帯電防止用の絶縁被膜部15a,15bが形成されている。また、固定型13の中央には図示の左右に貫通するランナー13cが形成され、このランナー13cが固定プレート11の中央部に設けられた鋳込口11aに連通している。このため、固定型13と移動型14とを閉じた状態で鋳込口11a側に溶融材料を供給しプランジャー(図示せず)によって溶融材料をランナー13c側に鋳込むことにより、溶融材料は成形用凹部内に圧入されて所定の形状に成形される。
【0014】
また、固定型13と移動型14との接合面13a,14aの上方には、離型剤タンク21からポンプ22の駆動によって供給されてくる離型剤23を成形用凹部に吹き付けるためのスプレーヘッド24が設けられている。このスプレーヘッド24は、昇降装置(図示せず)の駆動によって上下移動が可能になっており、固定型13と移動型14とが閉じている場合には、上方に退避し、固定型13と移動型14とが開くと下降して凹部13bと突部14bとの表面に離型剤23を塗布する。
【0015】
また、固定型13と移動型14との内部には、それぞれ本発明の帯電装置を構成する荷電電源25のプラス端子25aが配線26a,26bを介して接続され、スプレーヘッド24には、荷電電源25のマイナス端子25bが配線27を介して接続されている。なお、荷電電源25のマイナス端子25bとスプレーヘッド24とは、本発明のイオン供給装置としての機能も有する。
【0016】
離型剤タンク21、スプレーヘッド24、荷電電源25、各配線26a,26b,27および固定型13と移動型14とにそれぞれ設けられた絶縁被膜部15a,15bとで離型剤塗布装置20が構成される。また、この射出成形装置10は、CPU、ROM,RAMおよび各種の回路等で構成された制御装置(図示せず)を備えており、射出成形装置10を構成する各装置は、この制御装置によってその作動を制御される。
【0017】
以上のように構成された離型剤塗布装置20を備えた射出成形装置10を用いて、成形品を射出成形する場合は、まず、荷電電源25によって、固定型13と移動型14とが、図2に示すように(図2では移動型14のみを図示している。また、以下の説明のために添付した図面には、移動型14側部分のみを図示している。)プラスに帯電される。この場合、絶縁被膜部15a,15bは、帯電されていない状態か、または、図3(a)に示すように、固定型13または移動型14と接する部分がマイナスに帯電し、空間に向って開放された部分がプラスに帯電した状態になる。
【0018】
そして、型開きした状態の固定型13と移動型14との間に、スプレーヘッド24が下降していき、図3(b)に示すように凹部13bと突部14bとにマイナスイオンを噴射する。これによって、絶縁被膜部15a,15bのプラスの帯電は打ち消され、図3(c)に示すように非帯電の状態になるか、または、図3(d)に示すようにマイナスの帯電状態になる。なお、凹部13bと突部14bとの表面部は荷電電源25によってプラスに帯電された状態に維持される。
【0019】
この状態になったときに、ポンプ22が作動して離型剤タンク21内の離型剤23をスプレーヘッド24に供給し、スプレーヘッド24はその離型剤23を霧状にして凹部13bと突部14bとの表面に吹き付ける。この際、離型剤23はスプレーヘッド24内でマイナスに帯電されてスプレーヘッド24から噴射される。この結果、マイナスに帯電された離型剤23はプラスに帯電された凹部13bと突部14bとに吸引されるようにして均一な状態で塗布される。
【0020】
また、凹部13bと突部14bとの周囲に形成された絶縁被膜部15a,15bには非帯電またはマイナスに帯電した部分しかないため、離型剤23は吸引されないようになるか、反発されてこの部分には塗布されない。したがって、成形用凹部だけに、離型剤23の層が形成される。また、この離型剤23の層は均一な一定厚みに形成される。
【0021】
つぎに、スプレーヘッド24は上昇して固定型13と移動型14との間から退避し、移動型14が固定型13側に移動して型を閉じる。そして、成形用凹部内に、溶融材料が鋳込まれて成形用凹部内で固化する。この固化は、固定型13および移動型14の型温度が溶融材料の凝固温度より低く、溶融材料の熱を奪うこととなることによって行われる。
【0022】
そして、材料の固化が終了すると、移動型14が固定型13から離れる方向に移動して型が開き、成形品の取り出しが行われる。この取り出しは、取り出し装置(図示せず)によって行われる。この際、離型剤23の作用により、成形品はスムーズに固定型13と移動型14から離れるため、欠けたり破壊したりすることがない。成形品の取り出しが終了すると、再度、スプレーヘッド24が下降して、前述した操作が繰り返される。この操作を繰り返し行うことにより大量の成形品の成形が行われる。
【0023】
このように、本実施形態では、固定型13と移動型14とにおける凹部13bと突部14bとを除く部分に絶縁皮膜部15a,15bを設けている。そして、固定型13と移動型14とをプラスに帯電させるとともに、接合面13a,14aにおける絶縁皮膜部15a,15bの部分にマイナスイオンを噴射するようにしている。その状態で、マイナスに帯電した離型剤23を凹部13bと突部14bとに塗布するようにしている。
【0024】
したがって、荷電電源25によって絶縁被膜部15a,15bがプラスに帯電されてもスプレーヘッド24から噴射されるマイナスイオンによって接合面13a,14aにおける絶縁被膜部15a,15bの部分のプラス帯電は除去され、離型剤23は凹部13bと突部14bとの表面部のみに均一状態で塗布される。このため、成形された成形品の固定型13と移動型14からの離型性がよくなり良好な成形品を得ることができる。
【0025】
なお、前述した実施形態では、離型剤23を塗布する前の絶縁皮膜部15a,15bにマイナスイオンを噴射するようにしているが、絶縁被膜部15a,15bが帯電防止効果の大きなものであれば、このマイナスイオンの噴射をせずに、そのまま離型剤23を塗布することもできる。この場合、固定型13と移動型14における凹部13bと突部14bとを除く部分の各型の内部と外部との間は、絶縁皮膜部15a,15bによって電気的に絶縁された状態になっている。
【0026】
したがって、固定型13と移動型14とがプラスに帯電された場合、凹部13bと突部14bとの表面部はプラスに帯電した状態になり、絶縁被膜部15a,15bが設けられた部分は電気的に絶縁された状態になる。このため、マイナスに帯電された離型剤23を凹部13bと突部14bとに向って吹き付けると、離型剤23は凹部13bと突部14bとの表面部のみに均一状態で塗布される。この結果、成形用凹部を構成する凹部13bと突部14bとのみにむだのない良好な離型剤23の層が形成される。
【0027】
さらに、本実施形態においては、固定型13と移動型14とにおける凹部13bと突部14bとを除くすべての部分に絶縁被膜部15a,15bを形成しているが、この絶縁被膜部15a,15bは、接合面13a,14aにおける凹部13bと突部14b以外の部分にだけ設けるようにしてもよい。接合面13a,14aは、離型剤23が塗布されやすい位置にある面であり、かつこの面に離型剤23が堆積すると、固定型13と移動型14との型締め時の接合性が悪くなるという問題が発生する。
【0028】
このため、接合面13a,14aにおける凹部13bと突部14b以外の部分だけに絶縁被膜部15a,15bを形成しても、接合性悪化の問題発生の防止や良好な離型剤層形成は可能になる。また、これによって、絶縁被膜部15a,15bは最小量で済むようになるため、コストの低減や製造の手間の減少が可能になる。
【0029】
また、本実施形態では、固定型13と移動型14とをプラスに帯電させ、これにマイナスイオンを噴射するとともに、離型剤23をマイナスに帯電させているが、これらの極性は、それぞれ逆の極性としてもよい。さらに、マイナスイオンは、噴射することに限られず、塗布してもよいし、他の形態で供給するようにしてもよい。また、各型13,14と離型剤23の帯電についても、その方法は実施形態の手法に限られるものでなく、各型13,14と離型剤23とを異なる極性に帯電させることができるものであればよい。
【図面の簡単な説明】
【図1】本発明の一実施形態による離型剤塗布装置を備えた射出成形装置を示す概略構成図である。
【図2】移動型の帯電状態を示す断面図である。
【図3】移動型の帯電状態を示す断面図であり、(a)は接合面および絶縁皮膜部の表面がプラスに帯電した状態、(b)は(a)に示した接合面および絶縁皮膜部の表面にマイナスイオンを噴射した状態、(c)は絶縁皮膜部の表面のプラス帯電が除去され非帯電になった状態、(d)は絶縁皮膜部の表面がマイナスに帯電した状態をそれぞれ示している。
【符号の説明】
10…射出成形装置、13…固定型、13a,14a…接合面、13b…凹部、14…移動型、14b…突部、15a,15b…絶縁皮膜部、20…離型剤塗布装置、24…スプレーヘッド、25…荷電電源、25a…プラス端子、25b…マイナス端子。
[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a mold release agent application device and a mold release agent application method for applying a release agent to a molding recess of a molding die.
[0002]
[Prior art]
2. Description of the Related Art Conventionally, for example, in casting using a molding die such as die casting, a release agent has been used in order to facilitate removal of a molded product from the molding die. The release agent is applied to the molding recess formed on the joint surface between the fixed mold and the movable mold that constitute the molding die each time each molded product formed by casting is removed from the molding die. When applying the release agent, the release agent is applied to portions of the molding die that do not need to be applied, or the release agent does not reach the portions that need to be applied hidden behind the protrusions and is not applied. There is. For this reason, in order to prevent such a situation, the mold is positively charged, and the mold release agent is applied to the mold by charging the mold release agent negatively and attracting each other. (For example, see Patent Document 1).
[0003]
[Patent Document 1]
JP-A-6-182519
[Problems to be solved by the invention]
However, in the conventional release agent application method, it is difficult to apply the release agent only to the concave forming surface of the molding concave portion on the joining surface of the molding die, and it is difficult to apply the releasing agent to other portions of the joining surface and portions other than the joining surface. Also, a release agent may be applied. For this reason, there has been a problem that the release agent is deposited on the joining surface of the molding die to deteriorate the bondability between the fixed die and the movable die, and that the release agent is wasted.
[0005]
Summary of the Invention
The present invention has been made in order to address the above-described problem, and an object thereof is to maintain a good joining state of a molding die by allowing a release agent to be applied only to a concave portion for molding that requires application. It is an object of the present invention to provide a mold releasing agent applying apparatus and a method of applying a releasing agent to a molding die, which is possible and eliminates waste of the releasing agent.
[0006]
In order to achieve the above-mentioned object, a configurational feature of the mold releasing agent application device for a molding die according to the present invention is that a molding concave portion is formed on a joint surface between a fixed die and a movable die that constitute a mold that can be opened and closed. A mold release agent coating device for applying a mold release agent to a concave portion forming surface of the molding concave portion and filling the molding concave portion with a molten material to form a molded product having a predetermined shape. A charging device for charging the fixed mold and the movable mold to one polarity and charging the release agent to the other polarity, and an insulating device provided at a predetermined portion of the fixed mold and the movable mold except for a molding recess. A film portion, an ion supply device for supplying ions of the other polarity to the fixed type and the movable type charged to one polarity by the charging device to set the insulating film portion to a non-charged state or a charged state of another polarity; and That you have.
[0007]
In the mold release agent coating device of the present invention having the above-described configuration, an insulating film portion is provided in a predetermined portion of the fixed die and the movable die except for the concave portion for molding, and the inside of each of the molds is provided. It is electrically insulated from the outside. Therefore, when the fixed device and the movable mold are charged to one polarity by the charging device, the concave portion forming surface of the molding concave portion is charged to that polarity, and the other portions provided with the insulating coating portion are provided. Becomes electrically insulated.
[0008]
Then, the insulating coating portion is uncharged or charged to another polarity by the ions of the other polarity supplied by the ion supply device, and the release agent is more reliably applied in a uniform state only to the concave portion forming surface of the molding concave portion. You. For this reason, when the release agent charged to the other polarity by the charging device is sprayed toward the concave portion for molding, the release agent is attracted only to the concave portion forming surface of the concave portion for molding and is applied in a uniform state. As a result, a good release agent layer without waste is formed only in the molding concave portions.
[0009]
Further, another structural feature of the mold releasing agent coating device of the molding die according to the present invention is that a predetermined portion provided with an insulating film portion is formed by removing a molding concave portion at a joint surface between a fixed die and a movable die. Is to be part. According to this, in the portion other than the molding concave portion of the molding die, the release coating agent is easily applied, and since the insulation coating portion is provided only on the joint surface where problems are likely to occur when applied, the insulating coating portion is provided. Can be provided minimally and effectively.
[0010]
The constitutional features of the method for applying a release agent of a molding die according to the present invention include a fixed mold and a movable mold in which a molding concave portion is provided on a joining surface and an insulating film portion is provided in a predetermined portion excluding the molding concave portion. And a fixed type and a movable type charged to one polarity by the charging process, and the other polarity ions are ejected to the insulating film portion in the non-charged state or the other polarity. In other words, the method includes an ion spraying step of making the charged state, and a release agent applying step of applying a release agent charged to the other polarity to the molding concave portion on the joint surface between the fixed mold and the movable mold.
[0011]
In the mold release agent applying method of the molding die according to the present invention, in the charging step, the fixed mold and the movable mold are charged to one polarity, and the fixed mold and the movable mold have the other polarity in the ion injection step. By injecting ions, the insulating film portion is set to a non-charged state or a charged state of the other polarity. In this case, even if ions of the other polarity are jetted to the concave forming surface of the molding concave, the concave forming surface is immediately charged to one polarity. Therefore, when a mold release agent charged to the other polarity is sprayed on the molding concave portion on the joint surface between the fixed mold and the movable mold, the mold releasing agent is applied only to the concave portion forming surface of the molding concave portion avoiding the insulating coating portion. You. As a result, a good release agent layer without waste is formed only in the molding concave portions.
[0012]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, an embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a schematic configuration diagram of a main part of an injection molding apparatus 10 including a mold release agent applying apparatus 20 for a molding die according to the present invention. The injection molding apparatus 10 includes a fixed plate 11 and a movable plate 12 that is provided so as to be capable of moving forward and backward facing the fixed plate 11. A fixed mold 13 is attached to the fixed plate 11, and a movable mold 14 is attached to the movable plate 12. A concave portion 13b and a protrusion 14b which are assembled to form the concave portion for molding of the present invention are formed at the center of the joint surfaces 13a, 14a of the fixed die 13 and the movable die 14, respectively. The fixed die 13 and the movable die 14 constitute a molding die of the present invention.
[0013]
Antistatic insulating coating portions 15a and 15b made of alumina or the like are formed on portions of the surface of the fixed die 13 other than the concave portions 13b and portions of the surface of the movable die 14 except for the protrusions 14b, respectively. A runner 13c is formed at the center of the fixed mold 13 so as to penetrate left and right as shown in the figure. The runner 13c communicates with a casting port 11a provided at the center of the fixed plate 11. Therefore, the molten material is supplied to the casting port 11a side with the fixed mold 13 and the movable mold 14 closed, and the molten material is cast to the runner 13c side by a plunger (not shown). It is press-fitted into the molding recess and molded into a predetermined shape.
[0014]
Further, a spray head for spraying the release agent 23 supplied from the release agent tank 21 by driving the pump 22 onto the molding recess is provided above the joining surfaces 13a and 14a between the fixed die 13 and the movable die 14. 24 are provided. The spray head 24 can be moved up and down by driving a lifting device (not shown). When the fixed mold 13 and the movable mold 14 are closed, the spray head 24 is retracted upward, and the When the movable mold 14 is opened, the movable mold 14 is lowered and the release agent 23 is applied to the surfaces of the concave portion 13b and the protrusion 14b.
[0015]
A positive terminal 25a of a charging power supply 25 constituting the charging device of the present invention is connected to the interior of the fixed mold 13 and the movable mold 14 via wirings 26a and 26b, respectively. The 25 negative terminals 25 b are connected via the wiring 27. The negative terminal 25b of the charging power supply 25 and the spray head 24 also have a function as the ion supply device of the present invention.
[0016]
The release agent applying device 20 is constituted by the release agent tank 21, the spray head 24, the charging power supply 25, the wirings 26a, 26b, 27, and the insulating coating portions 15a, 15b provided on the fixed mold 13 and the movable mold 14, respectively. Be composed. Further, the injection molding apparatus 10 includes a control device (not shown) including a CPU, a ROM, a RAM, and various circuits, and each device constituting the injection molding device 10 is controlled by the control device. Its operation is controlled.
[0017]
When an injection-molded product is injection-molded using the injection molding device 10 including the release agent coating device 20 configured as described above, first, the fixed die 13 and the movable die 14 are charged by the charging power supply 25. As shown in FIG. 2 (only the movable mold 14 is shown in FIG. 2. In the drawings attached for the following description, only the movable mold 14 side portion is shown). Is done. In this case, the insulating coating portions 15a and 15b are not charged or, as shown in FIG. 3A, the portion in contact with the fixed mold 13 or the movable mold 14 is negatively charged, and faces toward the space. The opened portion becomes a positively charged state.
[0018]
Then, the spray head 24 descends between the fixed mold 13 and the movable mold 14 in the opened state, and injects negative ions into the recess 13b and the protrusion 14b as shown in FIG. 3B. . As a result, the positive charge of the insulating coating portions 15a and 15b is cancelled, and becomes a non-charged state as shown in FIG. 3 (c) or a negative charge state as shown in FIG. 3 (d). Become. The surfaces of the recess 13b and the protrusion 14b are maintained in a positively charged state by the charging power supply 25.
[0019]
When this state is reached, the pump 22 operates to supply the release agent 23 in the release agent tank 21 to the spray head 24, and the spray head 24 makes the release agent 23 into a mist and forms the recess 13b. It is sprayed on the surface of the projection 14b. At this time, the release agent 23 is negatively charged in the spray head 24 and is ejected from the spray head 24. As a result, the negatively charged release agent 23 is applied in a uniform state so as to be sucked into the positively charged concave portions 13b and the protruding portions 14b.
[0020]
Further, since the insulating coating portions 15a and 15b formed around the concave portion 13b and the protruding portion 14b have only non-charged or negatively charged portions, the release agent 23 is not sucked or repelled. It is not applied to this part. Therefore, a layer of the release agent 23 is formed only in the concave portion for molding. The layer of the release agent 23 is formed to have a uniform and uniform thickness.
[0021]
Next, the spray head 24 moves up and retreats from between the fixed mold 13 and the movable mold 14, and the movable mold 14 moves to the fixed mold 13 side to close the mold. Then, the molten material is cast into the molding recess and solidified in the molding recess. This solidification is performed when the mold temperature of the fixed mold 13 and the movable mold 14 is lower than the solidification temperature of the molten material, thereby removing heat from the molten material.
[0022]
When the solidification of the material is completed, the movable mold 14 moves in a direction away from the fixed mold 13 to open the mold, and the molded product is taken out. This removal is performed by a removal device (not shown). At this time, the molded product is smoothly separated from the fixed mold 13 and the movable mold 14 by the action of the mold release agent 23, so that the molded article is not chipped or broken. When the removal of the molded product is completed, the spray head 24 is lowered again, and the above-described operation is repeated. By repeating this operation, molding of a large number of molded articles is performed.
[0023]
As described above, in the present embodiment, the insulating coating portions 15a and 15b are provided in portions of the fixed die 13 and the movable die 14 except for the concave portion 13b and the protrusion 14b. The fixed mold 13 and the movable mold 14 are positively charged, and negative ions are jetted to the insulating film portions 15a and 15b on the joint surfaces 13a and 14a. In this state, the negatively charged release agent 23 is applied to the recess 13b and the protrusion 14b.
[0024]
Therefore, even if the insulating coating portions 15a and 15b are positively charged by the charging power supply 25, the positive charge of the portions of the insulating coating portions 15a and 15b on the joining surfaces 13a and 14a is removed by the negative ions ejected from the spray head 24, The release agent 23 is applied in a uniform state only to the surface of the recess 13b and the protrusion 14b. Therefore, the releasability of the molded article from the fixed mold 13 and the movable mold 14 is improved, and a good molded article can be obtained.
[0025]
In the above-described embodiment, the negative ions are jetted to the insulating coating portions 15a and 15b before the release agent 23 is applied. However, the insulating coating portions 15a and 15b may have a large antistatic effect. For example, the release agent 23 can be applied as it is without performing the injection of the negative ions. In this case, between the inside and the outside of each of the fixed mold 13 and the movable mold 14 except for the concave portion 13b and the protrusion 14b are electrically insulated by the insulating coating portions 15a and 15b. I have.
[0026]
Therefore, when the fixed mold 13 and the movable mold 14 are positively charged, the surface portions of the concave portion 13b and the protrusion 14b are positively charged, and the portions provided with the insulating coating portions 15a and 15b are electrically charged. Insulated state is obtained. Therefore, when the negatively charged release agent 23 is sprayed toward the concave portion 13b and the protrusion 14b, the release agent 23 is uniformly applied to only the surface of the concave portion 13b and the protrusion 14b. As a result, a good layer of the release agent 23 without waste is formed only in the concave portions 13b and the protrusions 14b constituting the concave portions for molding.
[0027]
Further, in the present embodiment, the insulating coating portions 15a and 15b are formed in all portions of the fixed die 13 and the movable die 14 except for the concave portion 13b and the protruding portion 14b, but the insulating coating portions 15a and 15b are formed. May be provided only in portions other than the concave portion 13b and the protruding portion 14b in the joint surfaces 13a and 14a. The joining surfaces 13a and 14a are surfaces at positions where the mold release agent 23 is easily applied, and when the mold release agent 23 is deposited on this surface, the jointability between the fixed mold 13 and the movable mold 14 at the time of mold clamping is improved. The problem of getting worse occurs.
[0028]
For this reason, even if the insulating coating portions 15a and 15b are formed only on the joining surfaces 13a and 14a other than the recessed portions 13b and the protruding portions 14b, it is possible to prevent the problem of the deterioration of the joining property and to form a good release agent layer. become. In addition, this allows the insulating coating portions 15a and 15b to have a minimum amount, so that cost can be reduced and manufacturing effort can be reduced.
[0029]
Further, in the present embodiment, the fixed mold 13 and the movable mold 14 are positively charged, negative ions are ejected to the fixed mold 13 and the movable mold 14, and the release agent 23 is negatively charged. May be used. Further, the negative ions are not limited to being sprayed, but may be applied or supplied in another form. The method for charging the molds 13 and 14 and the release agent 23 is not limited to the method of the embodiment, and the molds 13 and 14 and the release agent 23 may be charged to different polarities. Anything that can be done is acceptable.
[Brief description of the drawings]
FIG. 1 is a schematic configuration diagram illustrating an injection molding apparatus including a release agent applying apparatus according to an embodiment of the present invention.
FIG. 2 is a cross-sectional view illustrating a movable charging state.
FIGS. 3A and 3B are cross-sectional views showing a movable charging state, in which FIG. 3A is a state in which a bonding surface and a surface of an insulating film portion are positively charged, and FIG. 3B is a bonding surface and an insulating film shown in FIG. (C) shows the state where the positive charge on the surface of the insulating film is removed and becomes uncharged, and (d) shows the state where the surface of the insulating film is negatively charged. Is shown.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 10 ... Injection molding apparatus, 13 ... Fixed type, 13a, 14a ... Joining surface, 13b ... Concave part, 14 ... Moving type, 14b ... Protrusion, 15a, 15b ... Insulating film part, 20 ... Release agent coating device, 24 ... Spray head, 25: charging power supply, 25a: plus terminal, 25b: minus terminal.

Claims (3)

開閉可能な成形金型を構成する固定型と移動型との接合面に成形用凹部を設け、前記成形用凹部の凹部形成面に離型剤を塗布して前記成形用凹部内に溶融材料を充填することにより所定の形状の成形品に成形する成形金型の離型剤塗布装置であって、
前記固定型と前記移動型とを一方の極性に帯電させるとともに、前記離型剤を他方の極性に帯電させる帯電装置と、
前記固定型と前記移動型とにおける前記成形用凹部を除く所定部分に設けられた絶縁皮膜部と、
前記帯電装置によって一方の極性に帯電された固定型と移動型とに他方の極性のイオンを供給して前記絶縁被膜部を非帯電状態または他の極性の帯電状態にするイオン供給装置と
を備えたことを特徴とする成形金型の離型剤塗布装置。
A molding recess is provided on a joint surface between a fixed mold and a movable mold that constitute a mold that can be opened and closed, and a mold release agent is applied to a recess forming surface of the molding recess to apply a molten material in the molding recess. A mold release agent coating device for a molding die for molding into a molded product of a predetermined shape by filling,
A charging device that charges the fixed type and the movable type to one polarity, and charges the release agent to the other polarity,
An insulating film portion provided at a predetermined portion of the fixed die and the movable die except for the molding concave portion,
An ion supply device that supplies ions of the other polarity to the fixed type and the movable type charged to one polarity by the charging device to put the insulating coating portion in an uncharged state or a charged state of another polarity. A mold release agent coating device for a molding die.
前記絶縁皮膜部が設けられた所定部分が前記固定型と前記移動型との接合面における前記成形用凹部を除いた部分である請求項1に記載の成形金型の離型剤塗布装置。2. The mold release agent coating device according to claim 1, wherein the predetermined portion provided with the insulating coating portion is a portion excluding the molding concave portion on a joining surface between the fixed die and the movable die. 3. 接合面に成形用凹部が設けられ、前記成形用凹部を除く所定部分に絶縁皮膜部が設けられた固定型と移動型とを一方の極性に帯電させる帯電工程と、
前記帯電工程によって一方の極性に帯電された固定型と移動型とに他方の極性のイオンを噴射して前記絶縁皮膜部を非帯電状態または他方の極性の帯電状態にするイオン噴射工程と、
前記固定型と前記移動型との接合面における前記成形用凹部に他方の極性に帯電した離型剤を塗布する離型剤塗布工程と
を備えたことを特徴とする成形金型の離型剤塗布方法。
A charging step of charging the fixed mold and the movable mold, each having a molding concave portion provided on the joining surface, and a fixed mold provided with an insulating film portion at a predetermined portion excluding the molding concave portion, to one polarity,
An ion injection step of injecting ions of the other polarity to the fixed type and the movable type charged to one polarity by the charging step to set the insulating film portion to a non-charged state or a charged state of the other polarity,
A mold release agent applying step of applying a mold release agent charged to the other polarity to the molding concave portion on the joint surface between the fixed mold and the movable mold. Coating method.
JP2003059986A 2003-03-06 2003-03-06 Releasing agent applying device and releasing agent applying method for molding die Pending JP2004268072A (en)

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008062456A (en) * 2006-09-06 2008-03-21 Kojima Press Co Ltd Structure for mounting mold on mounting plate
CN100584485C (en) * 2005-12-26 2010-01-27 东芝机械株式会社 Parting compound injection method and device in the die casting machine
CN108311659A (en) * 2017-01-17 2018-07-24 上海胜僖汽车配件有限公司 A kind of die casting equipment of energy-saving inner cavity deep hole spraying
CN113165223A (en) * 2018-11-23 2021-07-23 巴斯夫涂料有限公司 Automated method for injection molding of coated parts
CN116871491A (en) * 2023-09-06 2023-10-13 宁波吉烨汽配模具有限公司 Die casting die shedder

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100584485C (en) * 2005-12-26 2010-01-27 东芝机械株式会社 Parting compound injection method and device in the die casting machine
JP2008062456A (en) * 2006-09-06 2008-03-21 Kojima Press Co Ltd Structure for mounting mold on mounting plate
CN108311659A (en) * 2017-01-17 2018-07-24 上海胜僖汽车配件有限公司 A kind of die casting equipment of energy-saving inner cavity deep hole spraying
CN113165223A (en) * 2018-11-23 2021-07-23 巴斯夫涂料有限公司 Automated method for injection molding of coated parts
CN113165223B (en) * 2018-11-23 2024-03-05 巴斯夫涂料有限公司 Automated method for injection molding of coated parts
CN116871491A (en) * 2023-09-06 2023-10-13 宁波吉烨汽配模具有限公司 Die casting die shedder
CN116871491B (en) * 2023-09-06 2023-12-19 宁波吉烨汽配模具有限公司 Die casting die shedder

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