JP2004264773A5 - - Google Patents
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- Publication number
- JP2004264773A5 JP2004264773A5 JP2003057401A JP2003057401A JP2004264773A5 JP 2004264773 A5 JP2004264773 A5 JP 2004264773A5 JP 2003057401 A JP2003057401 A JP 2003057401A JP 2003057401 A JP2003057401 A JP 2003057401A JP 2004264773 A5 JP2004264773 A5 JP 2004264773A5
- Authority
- JP
- Japan
- Prior art keywords
- ethylenically unsaturated
- compound
- resistance
- reacting
- photosensitive resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 150000001875 compounds Chemical class 0.000 description 4
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 239000003999 initiator Substances 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 150000007519 polyprotic acids Polymers 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003057401A JP2004264773A (ja) | 2003-03-04 | 2003-03-04 | 感光性樹脂組成物、その硬化物及びプリント配線板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003057401A JP2004264773A (ja) | 2003-03-04 | 2003-03-04 | 感光性樹脂組成物、その硬化物及びプリント配線板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2004264773A JP2004264773A (ja) | 2004-09-24 |
| JP2004264773A5 true JP2004264773A5 (enExample) | 2006-04-13 |
Family
ID=33120842
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2003057401A Pending JP2004264773A (ja) | 2003-03-04 | 2003-03-04 | 感光性樹脂組成物、その硬化物及びプリント配線板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2004264773A (enExample) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4705426B2 (ja) * | 2005-07-14 | 2011-06-22 | 互応化学工業株式会社 | プリント配線板製造用アルカリ現像型感光性レジストインキ組成物、その硬化物およびプリント配線板 |
| CN101107566B (zh) * | 2005-07-20 | 2012-08-29 | 凸版印刷株式会社 | 碱性显影型感光性着色组合物 |
| TWI476521B (zh) * | 2007-11-07 | 2015-03-11 | Taiyo Holdings Co Ltd | A photohardenable resin composition and a hardened pattern, and a printed circuit board |
| JP5058757B2 (ja) * | 2007-11-07 | 2012-10-24 | 太陽ホールディングス株式会社 | 光硬化性樹脂組成物及びその硬化物パターン、並びに該硬化物パターンを具備するプリント配線板 |
| JP5305972B2 (ja) * | 2009-02-20 | 2013-10-02 | 太陽ホールディングス株式会社 | 光硬化性熱硬化性樹脂組成物、ドライフィルム及びそれらの硬化物 |
| JP5236587B2 (ja) | 2009-07-15 | 2013-07-17 | 太陽ホールディングス株式会社 | 光硬化性樹脂組成物 |
| JP5385729B2 (ja) * | 2009-09-01 | 2014-01-08 | 昭和電工株式会社 | 感光性樹脂 |
| JP5403545B2 (ja) * | 2009-09-14 | 2014-01-29 | 太陽ホールディングス株式会社 | ソルダーレジスト組成物、そのドライフィルム及び硬化物並びにそれらを用いたプリント配線板 |
-
2003
- 2003-03-04 JP JP2003057401A patent/JP2004264773A/ja active Pending
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