JP2004264773A5 - - Google Patents

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Publication number
JP2004264773A5
JP2004264773A5 JP2003057401A JP2003057401A JP2004264773A5 JP 2004264773 A5 JP2004264773 A5 JP 2004264773A5 JP 2003057401 A JP2003057401 A JP 2003057401A JP 2003057401 A JP2003057401 A JP 2003057401A JP 2004264773 A5 JP2004264773 A5 JP 2004264773A5
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JP
Japan
Prior art keywords
ethylenically unsaturated
compound
resistance
reacting
photosensitive resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2003057401A
Other languages
English (en)
Japanese (ja)
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JP2004264773A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2003057401A priority Critical patent/JP2004264773A/ja
Priority claimed from JP2003057401A external-priority patent/JP2004264773A/ja
Publication of JP2004264773A publication Critical patent/JP2004264773A/ja
Publication of JP2004264773A5 publication Critical patent/JP2004264773A5/ja
Pending legal-status Critical Current

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JP2003057401A 2003-03-04 2003-03-04 感光性樹脂組成物、その硬化物及びプリント配線板 Pending JP2004264773A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2003057401A JP2004264773A (ja) 2003-03-04 2003-03-04 感光性樹脂組成物、その硬化物及びプリント配線板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003057401A JP2004264773A (ja) 2003-03-04 2003-03-04 感光性樹脂組成物、その硬化物及びプリント配線板

Publications (2)

Publication Number Publication Date
JP2004264773A JP2004264773A (ja) 2004-09-24
JP2004264773A5 true JP2004264773A5 (enrdf_load_stackoverflow) 2006-04-13

Family

ID=33120842

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003057401A Pending JP2004264773A (ja) 2003-03-04 2003-03-04 感光性樹脂組成物、その硬化物及びプリント配線板

Country Status (1)

Country Link
JP (1) JP2004264773A (enrdf_load_stackoverflow)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4705426B2 (ja) * 2005-07-14 2011-06-22 互応化学工業株式会社 プリント配線板製造用アルカリ現像型感光性レジストインキ組成物、その硬化物およびプリント配線板
CN101107566B (zh) * 2005-07-20 2012-08-29 凸版印刷株式会社 碱性显影型感光性着色组合物
TWI476521B (zh) * 2007-11-07 2015-03-11 Taiyo Holdings Co Ltd A photohardenable resin composition and a hardened pattern, and a printed circuit board
JP5058757B2 (ja) * 2007-11-07 2012-10-24 太陽ホールディングス株式会社 光硬化性樹脂組成物及びその硬化物パターン、並びに該硬化物パターンを具備するプリント配線板
JP5305972B2 (ja) * 2009-02-20 2013-10-02 太陽ホールディングス株式会社 光硬化性熱硬化性樹脂組成物、ドライフィルム及びそれらの硬化物
JP5236587B2 (ja) 2009-07-15 2013-07-17 太陽ホールディングス株式会社 光硬化性樹脂組成物
JP5385729B2 (ja) * 2009-09-01 2014-01-08 昭和電工株式会社 感光性樹脂
JP5403545B2 (ja) * 2009-09-14 2014-01-29 太陽ホールディングス株式会社 ソルダーレジスト組成物、そのドライフィルム及び硬化物並びにそれらを用いたプリント配線板

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