JP2004255866A - Liquid injection printing head - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a liquid injection printing head, which hardly causes undershoot of sealing resin when sealing resin is coated, without bringing a dummy lead into contact with a printing device substrate. <P>SOLUTION: The printing head has a dummy lead 17 which is provided in adjacent to a lead electrode 13 on the inside of an opening 12 so as to protrude lower than the lead electrode 13 and is not electrically connected to an electrode pad 7. <P>COPYRIGHT: (C)2004,JPO&NCIPI

Description

  The present invention relates to a liquid jet recording head that performs recording on a recording medium by discharging recording liquid as droplets.

  A flexible film wiring board (wiring film) in a liquid jet recording head such as an ink jet recording head has its electrical connection portion covered with a sealant. FIG. 9 is a schematic diagram of an electrical connection portion of a flexible film wiring board of a conventional ink jet recording head.

  In FIG. 9, reference numerals 1a and 1b each include a plurality of ejection energy generating elements (not shown) for imparting ejection energy to the recording liquid and a plurality of ejection ports 6 for ejecting the recording liquid, and depending on the pressure generated by the ejection energy. A recording element substrate for discharging a recording liquid. Reference numeral 8 denotes a support member to which a plurality of recording element substrates 1a and 1b are bonded and fixed in parallel. Reference numeral 11 is electrically mounted on the recording element substrates 1a and 1b, and a plurality of wirings (not shown) for transmitting electrical signals from the recording apparatus main body (not shown) to the recording element substrates 1a and 1b. A flexible film wiring board (wiring film) having a wiring protective layer (resist) for protecting wiring. Reference numeral 9 denotes a support plate that is bonded and fixed to the support member 8 and holds and fixes the flexible film wiring board 11. Reference numeral 18 denotes a portion around the plurality of recording element substrates 1a and 1b and a part of the electrical connection portion between the plurality of recording element substrates 1a and 1b and the flexible film wiring substrate 11 through the corrosion by the recording liquid and the recording liquid. It is the 1st sealing resin applied in order to protect from a short circuit. Reference numeral 19 protects an electrical connection portion between the plurality of electrode pads 7 provided on the plurality of recording element substrates 1 and the plurality of lead electrodes 13 provided on the flexible film wiring substrate 11 from an external force such as wiping. Therefore, it is a second sealing resin (indicated by a broken line) to be coated.

Further, in Japanese Patent Application Laid-Open No. 10-44441, dummy leads having the same shape as the lead electrodes or resin receiving parts made of the same material as the lead electrodes are arranged at the four corners of the opening of the flexible film wiring board (wiring film) 11. An ink jet head is described. By narrowing the gap between the inner peripheral part of the opening of the flexible film wiring board (wiring film) and the recording element board by such a dummy lead or resin receiving part, the second sealing resin falls into this gap. It is described that the electrical connection portion between the electrode pad provided on the recording element substrate and the lead electrode provided on the flexible film wiring substrate is sufficiently sealed by the second sealing resin. .
Japanese Patent Laid-Open No. 10-44441

  However, even in the configuration described in Japanese Patent Laid-Open No. 10-44441, when there are a plurality of recording element substrates 1 in one opening (device hole) of the flexible film wiring substrate, for example, The space beyond the arrangement pitch of the lead electrodes is vacated between the lead electrodes connected to the electrode pads located on the outermost sides of the recording element substrate 1 to be printed. In such a case, as shown in FIG. 10, the first sealing resin 18 and the second sealing resin may fall downward due to this space. In this case, the electrical connection portion between the electrode pad provided on the recording element substrate and the lead electrode provided on the flexible film wiring substrate cannot be sufficiently sealed, and the second sealing resin cracks. It is also considered that the lead electrode is exposed due to the occurrence of 27 or the like. Furthermore, when applying the area | region where the 1st sealing resin 18 has fallen largely with the 2nd sealing resin, surrounding air was included and the bubble 28 was included. In this case, when the second sealing resin is heat-cured, the bubbles 28 may expand, and the second sealing resin 19 may be ruptured to expose the lead electrode 13.

  Further, in the gap between the flexible film wiring substrate and the recording element substrate between the lead electrodes connected to the electrode pads located at the outermost positions of the adjacent recording element substrates 1, it is described in JP-A-10-44441 described above. If a dummy lead with the same shape as the lead electrode is provided, the dummy lead may contact the recording element substrate and cause a short circuit, or the dummy lead may be mistaken for a lead wiring and connected to the electrode pad. There was also a risk.

  Therefore, the present invention can reliably make electrical connection between the electrode pads provided on the recording element substrate and the lead electrodes provided on the flexible film wiring substrate without the dummy leads contacting the recording element substrate. It is an object of the present invention to provide a liquid jet recording head in which a drop of the sealing resin that occurs when the sealing resin is applied is unlikely to occur.

  In order to solve the above-described problems, a liquid jet recording head according to the present invention applies a recording element substrate having a recording liquid discharge port and a discharge energy generating element for generating discharge energy, and an electric signal to the discharge energy generating element. And a flexible film wiring board connected to the recording element substrate and having an opening for exposing the recording element substrate to the outside and a plurality of lead electrodes projecting inside the opening, and provided on the recording element substrate A plurality of electrode pads electrically connected to the lead electrodes for electrically connecting the recording element substrate and the flexible film wiring substrate; and at least one of a lead electrode group comprising the plurality of lead electrodes Provided adjacent to the lead electrode group, and provided to extend shorter than the lead electrode inside the opening The is characterized in that it has, and dummy leads are not electrically connected to the electrode pad.

  As described above, according to the present invention, the electrical connection between the electrode pad provided on the recording element substrate and the lead electrode provided on the flexible film wiring substrate can be ensured without the dummy lead contacting the recording element substrate. By being able to do so, it is possible to provide a liquid jet recording head in which the sealing resin is less likely to drop when the sealing resin is applied.

  Hereinafter, embodiments according to the present invention will be described with reference to the drawings.

  FIG. 1 is a schematic view of the liquid jet recording head according to the first embodiment of the present invention as viewed from above.

  In the present embodiment, a plurality of recording element substrates are arranged on the support member 8. In this description, two recording element substrates are used. However, it is obvious that the present invention can be suitably applied even when the number of recording element substrates is more than that.

  In FIG. 1, reference numeral 6 denotes a plurality of ejection energy generating elements (not shown) for imparting ejection energy to the recording liquid and a plurality of ejection ports for ejecting the recording liquid. Reference numeral 1 denotes a recording element substrate that discharges a recording liquid by pressure generated by discharge energy. Reference numeral 8 denotes a support member to which a plurality of recording element substrates 1 are bonded and fixed. Reference numeral 11 denotes a flexible film wiring board which is electrically mounted on the recording element substrate 1 and has a plurality of wirings for transmitting an electric signal from the recording apparatus main body to the recording element substrate. Reference numeral 9 denotes a support plate that is bonded and fixed to the support member 8 and holds and fixes the flexible film wiring board 11. 18 is applied to protect a part of the electrical connection portion between the plurality of recording element substrates 1 and the plurality of recording element substrates 1 and the flexible film wiring substrate 11 from corrosion and short-circuit by the recording liquid, Furthermore, the first sealing resin is also applied to the outer periphery of the flexible film wiring board 11 in order to protect the wiring of the flexible film wiring board 11 from corrosion caused by the recording liquid. Reference numeral 19 denotes an electrical connection portion between a plurality of electrode pads (not shown) provided on the plurality of recording element substrates 1 and a plurality of lead electrodes 13 provided on the flexible film wiring substrate 11 from an external force such as wiping. It is a second sealing resin that covers these for protection. The first sealing resin 18 and the second sealing resin 19 are made of a low-viscosity material so that the first sealing resin 18 can be efficiently wrapped around the recording element substrate 1 in accordance with each application. The second sealing resin 19 is selected from a material that is highly thixotropic to reliably cover the plurality of lead electrodes 13 and that is extremely hard after curing so as to withstand external forces such as wiping. Yes.

  As a feature of the present embodiment, a plurality of lead electrodes 13 are provided at a desired arrangement pitch in openings (device holes) 12 provided so that the recording element substrate 1 is exposed on the flexible film wiring substrate 11. . Further, when a plurality of recording element substrates 1 are arranged on the support member 8, a plurality of lead electrodes that are arranged adjacent to each other, or that protrude from the flexible film wiring substrate 11 into the device holes 12 and are arranged at a predetermined arrangement pitch. Dummy leads 17 are additionally arranged at a pitch substantially the same as the arrangement pitch of the lead electrodes in an area where there is no 13 (in other words, an area where there is no lead electrode at a larger interval than the predetermined arrangement pitch of the lead electrodes). As a result, the leads 13 and 17 are all arranged at a desired arrangement pitch in the space from one end of one side of the device hole 12 to the other end.

  Note that the dummy lead 17 includes a plurality of lead electrodes 13 as a lead electrode group including a plurality of lead electrodes 13 and is provided adjacent to at least one lead electrode group.

  In FIG. 1, the second sealing resin 19 completely covers the region including the electrical connection portion between the electrode pad of the recording element substrate 1 and the lead electrode 13 of the flexible film wiring substrate 11 and the dummy lead 17. It has been applied. As shown in FIG. 2, with this configuration, the first sealing resin 18 applied to the outer periphery of the recording element substrate 1 is cornered below the lead electrode 13 and the dummy lead 17 by capillary action. Further, the gap between the adjacent lead electrodes is raised to the height of the lead electrode 13 and the dummy lead 17 by surface tension. At this time, the first sealing resin 18 is held in a shape that falls downward so that the center of the arrangement pitch becomes the lowest point due to its own weight within the arrangement pitch between the adjacent lead electrodes 13. The first sealing resin 18 and the second sealing resin 19 applied thereon are in close contact with each other. Here, the amount of drop of the first sealing resin 18 is determined by the viscosity of the resin and the arrangement pitch of the lead electrodes, and therefore, the arrangement pitch of the various lead leads from the end to the end of the opening 12 in general. There is no problem if the pitch is maintained or if the pitch is narrower.

  However, when the interval between the lead electrodes is wide as shown in FIG. 10, the amount of the first sealing resin 18 dropped increases. In particular, since the second sealing resin 19 has high thixotropy, if there is an abrupt drop portion 29, the shape cannot be followed and cracks are likely to occur. As described above, the arrangement pitch composed of the plurality of lead electrodes 13 and the dummy leads 17 is such that the amount of the first sealing resin 18 falling does not exceed a desired amount because the adjacent lead electrodes 13 do not short-circuit each other. It is preferable to set within a range of a short interval. In this embodiment, the effect which this invention show | played was able to be acquired by setting so that the space | interval between lead electrodes may be in the range of 40 micrometers or more and 100 micrometers or less.

  Thus, in this embodiment, since the lead electrodes 13 and the dummy leads 17 are arranged at a substantially uniform pitch, the amount of sagging between the first sealing resin 18 and each lead electrode 13 is small. The phenomenon that the second sealing resin 19 that is almost uniformized and applied so as to trace it is held by the lead electrode 13 and the dummy lead 17 and is greatly depressed is generated. Without this, it becomes possible to apply a desired sealing region in a uniform shape.

  In addition, although the arrangement pitch of the leads 13 and 17 is arranged at substantially equal intervals, the arrangement pitch of the leads 13 and 17 is not limited within the range in which the second sealing resin does not collapse as described above. It does not depart from the gist of the present invention to be equal. However, if the arrangement pitch of the lead electrodes 13 is P, the distance between the lead electrodes 13 and the dummy leads 17 is preferably 0.75P ≦ P ≦ 1.25P. These findings concerning the arrangement intervals of the leads apply to both the second and third embodiments described later.

  Further, in the present embodiment, since the dummy lead 17 having a length shorter than that of the lead electrode 13 is provided, the dummy lead 17 contacts the recording element substrate 1 and is short-circuited, or the dummy lead 17 is connected to the lead wiring 13. It can be prevented that the connection with the electrode pad 7 is mistaken.

  Thus, the length of the dummy lead 17 has such a difference that it can be reliably distinguished from the normal lead electrode 13, and the first sealing resin and the second sealing resin 19 are as described above. It is important to have a length that does not cause depression. That is, it is preferable that the length of the dummy lead 17 is set to the longest length that does not contact the end face of the recording element substrate 1 in accordance with the bonding accuracy of the flexible film wiring substrate 11. As a result of repeated studies, the present inventor determined the dummy lead as a ratio capable of maintaining the bonding performance of the lead electrode 13 and also maintaining the coating performance of the first sealing resin and the second sealing resin 19. It has been found that the best result can be obtained by setting the length of 17 to about 40% to 60% of the length of the lead electrode 13. However, the difference from the normal lead electrode 13 which is the object of the present invention is surely performed, and the first sealing resin and the second sealing resin 19 are not depressed. As a matter of course, even if the length of the dummy lead 17 is out of the above range, it does not depart from the gist of the present invention. In the present embodiment, the length of the lead electrode 13 is 560 μm, and the length of the dummy lead 17 is 250 μm.

  Note that the dummy lead 17 includes a plurality of lead electrodes 13 as a lead electrode group including a plurality of lead electrodes 13 and is provided adjacent to at least one lead electrode group.

  In addition, the lead electrode and the dummy lead can be cost dyne by being manufactured in the same manufacturing process in the manufacturing process of the flexible film wiring board.

  FIG. 3 is a schematic view of the liquid jet recording head according to the second embodiment of the present invention as viewed from above.

  This embodiment is the same as the first embodiment except that the arrangement of the electrode pads is not uniform on one recording element substrate.

  As shown in FIG. 3, the flexible film wiring substrate 11 used in the liquid jet recording head of this embodiment has a plurality of lead electrodes 13 divided into a plurality of lead electrode groups in one recording element substrate. The distance between the leads including the lead electrode 13 is substantially equal where the gap between the adjacent lead electrode groups is a gap greater than the arrangement pitch where the lead electrodes 13 are arranged as described above. A required number of dummy leads are arranged as described above. However, if the arrangement pitch of the lead electrodes 13 is P, the distance between the lead electrodes 13 and the dummy leads 17 is preferably 0.75P ≦ P ≦ 1.25P.

  Note that the dummy lead 17 includes a plurality of lead electrodes 13 as a lead electrode group including a plurality of lead electrodes 13 and is provided adjacent to at least one lead electrode group. With such a configuration, it is possible to obtain the same effect as in the first embodiment.

  The basic configuration of the recording head is described in the description of FIG.

  FIG. 4 is a schematic view of a liquid jet recording head according to a third embodiment of the present invention as viewed from above.

  In this embodiment, by adjusting the width of the dummy leads 17 instead of the number thereof, a space larger than a desired arrangement pitch is not generated, and the others are the same as in the above-described embodiment.

  As shown in FIG. 4, the flexible film wiring board 11 used in the liquid jet recording head of the present invention has a distance between each lead including the lead electrode in a gap space equal to or larger than the arrangement pitch in which the lead electrodes 13 are arranged. It is possible to obtain the same effect by arranging the wide dummy leads 17 adjusted so as to be substantially equal to each other.

  The gap space (gap) formed by the arrangement pitch with the adjacent lead electrode 13 or dummy lead 17 prevents short-circuiting between adjacent leads, and the first sealing resin 18 and the second sealing. It may be set so as to satisfy that the stop resin 19 is not depressed. Actually, although depending on the bonding method employed, the first sealing resin 18 and the second sealing resin 18 are set by setting the gap between the adjacent leads within a range that does not cause a short circuit between adjacent terminals. The stop resin 19 may not be depressed, and a gap between the leads that may cause the second sealing resin 19 to be depressed is unavoidable due to the configuration of the liquid jet recording head. As a method for dealing with the second sealing resin 19 so as not to be depressed, the dummy lead 17 may be adjusted by appropriately increasing the width thereof. As a result of repeated studies, the inventor of the present invention has a gap of about 40 μm to 100 μm as a gap that can prevent the adjacent sealing and also the depression of the first sealing resin 18 and the second sealing resin 19. It has been found that doing the best results. However, if it is possible to prevent the adjacent short circuit that is the object of the present invention and also prevent the second sealing resin 19 from being depressed, the gap is naturally outside the above range. However, it does not depart from the gist of the present invention. However, if the arrangement pitch of the lead electrodes 13 is P, the distance between the lead electrodes 13 and the dummy leads 17 is preferably 0.75P ≦ P ≦ 1.25P.

  Note that the dummy lead 17 includes a plurality of lead electrodes 13 as a lead electrode group including a plurality of lead electrodes 13 and is provided adjacent to at least one lead electrode group.

  In particular, the advantage of this embodiment over the above-described embodiments is that the holding ability of the sealing resin is excellent so that the second sealing resin 19 is not depressed. The basic configuration of the recording head is described in the description of FIG.

  Next, a liquid jet recording head equipped with an embodiment according to the present invention will be described with reference to FIGS. 5 is an external perspective view, FIG. 6 is an AA cross-sectional view in FIG. 5, and FIG. 7 is a BB cross-sectional view in FIG.

  As shown in FIG. 5, the liquid jet recording head according to the present invention includes a plurality of recording element substrates having different shapes and sizes (in this description, two examples will be described for convenience) 1a, 1b, a support member 8, and a flexible member. It is comprised with the member containing the film wiring board 11. FIG. Each of the recording element substrates 1a and 1b includes a plurality of ejection openings 6 for ejecting the recording liquid onto the ejection opening plate 5 on the surface side in two rows corresponding to the ejection energy generating elements (for example, electrothermal conversion elements) 4. The recording liquid supply port 3 is formed in the center of the back side of the back surface. The recording liquid supply port 3 penetrates the recording liquid and has a length substantially equal to the length of the ejection ports 6 in the arrangement direction. A plurality of electrode pads 7 electrically connected to the plurality of ejection energy generating elements 4 are provided at both ends of the recording element substrate 1 (1a, 1b). Each electrode pad 7 is provided with a stud bump 14 using a commonly used gold wire. In addition, solder bumps and plating bumps other than stud bumps may be used. These recording element substrates 1a and 1b are disposed so that the back surfaces thereof are close to the support member 8, and are bonded and fixed at predetermined positions with high accuracy of several μm to several tens of μm. In the present description, only a few discharge ports 6 and electrodes 7 are shown by way of example, but in actual products, there are several tens to several hundreds.

  The flexible film wiring board 11 is provided with two openings 12a and 12b so as to expose the two recording element substrates 1a and 1b, respectively, and the two recording element substrates 1a and 1b are electrically mounted. For this purpose, the same number of electrode leads 13 as the number of electrodes 7 are provided around the openings 12a and 12b. The electrode leads 13 are electrically connected to the electrode pads 7 of each recording element substrate 1. The electrode pads 7 of the element substrate 1 are electrically connected via stud bumps 14. In this connection, an arbitrary load and ultrasonic vibration are applied for a predetermined time while the electrode connection portion is heated to 150 ° C. to 200 ° C., and the gold bumps on the electrode pad 7 and the flexible film wiring substrate 11 are provided with gold plating. This is done by causing an intermetallic bond between the contact surfaces with the electrode leads. In this example, single point bonding as described above was used, but other connection methods include gang bonding in which all connections are connected together using a thermocompression bonding unit, reflow method in which solder bumps are melted, Any method such as wire bonding for connecting both electrodes with a wire or an ACF connection method may be used.

  In the liquid jet recording head according to the present invention, the flexible film wiring board 11 is formed so as to completely cover the supporting plate 9 and protrudes in a predetermined amount in a hook shape, and is adhesively fixed on the supporting plate 9. In order to protect the outer periphery of the film wiring board 11 from corrosion by the recording liquid, it is not necessary to apply the first sealing resin 18 so as to protrude toward the discharge port surface. Therefore, the 1st sealing resin 18 should just be apply | coated to the back surface of the flexible film wiring board 11 which protruded from the support plate 9 along the outer peripheral side surface of the support plate 9. In the present invention, if the first sealing resin 18 has a low viscosity and is applied in a predetermined amount to a predetermined position, then it is preferable to use a material that naturally spreads along the outer periphery of the flexible film wiring board 11 by capillary force. A good coating state could be obtained. As the first sealing resin 18, for example, NR200C, which is a thermosetting silicone-modified epoxy resin manufactured by Nippon Rec Co., Ltd., is optimal.

  And the recessed part formed by the opening part 12 of the flexible film wiring board 11, the opening part 10 of the support plate 9, and the recording element board | substrate 1, and the electrical connection part of the some recording element board | substrate 1 and the flexible film wiring board 11 A first thermosetting sealing resin 18 is applied to protect a part of the surface (around the stud bump and the lower part of the electrode lead). The first thermosetting sealing resin 18 is covered and protected with a thermosetting sealing agent having elasticity even after curing, such as NR200C, which is a thermosetting silicone-modified epoxy resin manufactured by Nippon Lec Co., Ltd. . Further, the second thermosetting sealing resin 19 is disposed on the upper part of the electrical connection portion between the plurality of recording element substrates 1 and the flexible film wiring substrate 11 (the region including the electrode lead and the discharge port plate from the flexible film wiring substrate). The coating is protected by. As the second thermosetting sealing resin 19, for example, a thermosetting sealing having a very hard hardness after curing, such as CV5420D, which is a thermosetting epoxy resin manufactured by Matsushita Electric Works, Ltd. and having mechanical strength. Protect the coating with a stopper. And after apply | coating these some thermosetting sealing resin, it cures simultaneously, and several different thermosetting sealing agents are hardened simultaneously. In each of the embodiments described above, curing was performed by curing at 100 ° C. for 1 hour, and then curing at 150 ° C. for 3 hours. The curing condition may be determined for each device in consideration of the heat damage of the device used.

  Thereafter, a second wiring board 16 provided with an external input pad 15 for providing an electrical signal such as recording information to the flexible film wiring board 11 from the recording apparatus main body side to the liquid jet recording head is electrically connected. Of course, the flexible film wiring board 11 and the second wiring board 16 may be integrated on the same board. Then, the flexible film wiring substrate 11 is bent and stuck along the outer shape of the member for storing ink, whereby the liquid jet recording head shown in FIG. 1 described above can be manufactured.

  5 to 8 are explanatory views for explaining a suitable head cartridge and recording head to which the above-described embodiments are implemented or applied. Hereinafter, each component will be described with reference to these drawings.

  The recording head according to each of the above-described embodiments is a component constituting the recording head cartridge 100, as can be seen from the perspective view of FIG. The recording head cartridge 100 includes a recording element unit 101 including a recording head, and a tank that detachably holds ink tanks for storing various color inks such as black ink, cyan ink, magenta ink, and yellow-in. A holder 102 and an ink supply unit 103 that supplies ink from these ink tanks to the recording head are configured. The recording head cartridge 100 is detachably mounted on a carriage or the like with electrical connection to the ink jet recording apparatus main body, and is used for ink jet recording on a recording medium or the like.

  As described above, according to each of the above-described embodiments, in the arrangement of the plurality of lead electrodes provided in the device hole of the flexible film wiring board, no empty space is generated over a desired arrangement pitch. In addition, by providing a dummy lead having a shorter length than the lead electrode between a plurality of lead electrode groups consisting of a plurality of lead electrodes, the dummy lead may contact the recording element substrate to cause a short, Can be prevented or suppressed from being mistaken as a lead electrode and being connected to an electrode pad provided on the recording element substrate. In addition, dummy leads are provided between the lead electrode groups so as not to create a blank space over a desired arrangement pitch in the arrangement of the plurality of lead electrodes provided in the device hole of the flexible film wiring board. As a result, it is possible to suppress the drop amount of the first sealing resin filled in the gap between the adjacent lead electrodes. Therefore, the electrode pad and the lead electrode are traced over the first sealing resin. By preventing or suppressing the drop of the second sealing resin that occurs when applying the second sealing resin for protecting the electrical connection portion from external force such as wiping, the second sealing resin When cured, it is possible to obtain a stable shape from end to end of a desired application region and reliably cover the electrical connection portion, and to provide a highly reliable liquid jet recording head. Now it is.

  Furthermore, since a plurality of lead electrodes and a plurality of dummy leads of the flexible film wiring board can be formed in the same manufacturing process, efficient production can be achieved without causing an increase in cost.

1 is a schematic diagram illustrating a liquid jet recording head according to a first embodiment of the invention. It is a schematic diagram which shows the cross section of the part relevant to this invention of FIG. FIG. 5 is a schematic diagram illustrating a liquid jet recording head according to a second embodiment of the invention. FIG. 6 is a schematic diagram illustrating a liquid jet recording head according to a third embodiment of the invention. It is a perspective view which shows the recording element unit in which the flexible film wiring board based on this invention was integrated. It is AA sectional drawing in FIG. It is BB sectional drawing in FIG. 1 is a perspective view showing a recording head according to the present invention. FIG. 10 is a schematic diagram showing a portion related to the present invention in a conventional recording head. FIG. 10 is a schematic diagram illustrating a cross section of a portion where the lead electrodes of FIG. 9 are arranged.

Explanation of symbols

1, 1a, 1b Recording element substrate 3 Recording liquid supply port 4 Discharge energy generating element (electrothermal conversion element)
5 Discharge port plate 6 Discharge port 7 Electrode pad 8 Support member 9 Support plate 10 Support plate opening 11 Flexible film wiring substrate 12 Flexible film wiring substrate opening (device hole)
13 Lead Electrode 14 Stud Bump 15 External Input Pad 16 Second Wiring Board 17 Dummy Lead 18 First Sealing Resin 19 Second Sealing Resin 26 Recording Liquid Supply Member

Claims (11)

A recording element substrate having a recording liquid discharge port and a discharge energy generating element for generating discharge energy;
A flexible film connected to the recording element substrate for applying an electrical signal to the ejection energy generating element, and having an opening for exposing the recording element substrate to the outside and a plurality of lead electrodes projecting inside the opening A wiring board;
A plurality of electrode pads provided on the recording element substrate and electrically connected to the lead electrode to electrically connect the recording element substrate and the flexible film wiring board;
A dummy lead which is provided adjacent to the lead electrode and which is provided to extend shorter than the lead electrode inside the opening, and is not electrically connected to the electrode pad;
A liquid jet recording head characterized by comprising:   The liquid jet recording head according to claim 1, wherein the dummy lead is provided on the flexible film wiring board.   The liquid jet recording according to claim 1, wherein the lead electrode and the electrode pad are sealed with a sealing resin so as to cover the electrical connection portion between the lead electrode and the electrode pad and the dummy lead. Dod.   4. The liquid jet recording head according to claim 1, wherein the dummy leads are provided in the vicinity of both end portions of the array of the lead electrodes.   5. The liquid according to claim 1, wherein the dummy lead is provided in the lead electrode group where an arrangement pitch between adjacent lead electrodes is more than another arrangement pitch. 6. Jet recording head.   6. The liquid jet recording head according to claim 1, wherein the dummy leads are arranged at a pitch similar to a pitch at which the lead electrodes are arranged.   7. A plurality of the recording element substrates are provided for one of the openings, and the dummy leads are provided in the vicinity of adjacent end portions of the plurality of recording element substrates. The liquid jet recording head according to any one of the above.   A plurality of the dummy leads are arranged between the adjacent lead electrode groups so that there is no gap more than a desired distance between the plurality of lead electrodes. Item 8. The liquid jet recording head according to any one of Items 1 to 7.   9. The interval between the lead electrodes and the dummy leads is in a range of 0.75P ≦ P ≦ 1.25P, where P is an arrangement pitch of the plurality of lead electrodes. 2. A liquid jet recording head according to 1.   10. The structure according to claim 1, wherein the dummy lead has a width wider than the width of the lead electrode so that a predetermined gap or more is not left between the plurality of lead electrodes. 11. A liquid jet recording head according to claim 1. The liquid jet recording head according to claim 1, wherein the lead electrode and the dummy lead are manufactured in the same manufacturing process.

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