JP2004235664A - Polishing apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a polishing apparatus, which complies with the blocking of the apparatus, and is excellent in productivity, expandability, maintenance property, and adaptability to users. <P>SOLUTION: The polishing apparatus, which polishes a wafer, wherein the polishing apparatus comprises a load/unload block 5, which loads a cassette housing the wafer 1, a polishing block 7, which polishes the wafer 1, a cleaning block 8, which cleans the wafer 1, a robot 15, which transfers the wafer 1 and a control block 9, which stores a relative position between the cassette of the load/unload block 5 and the robot 15 and a relative position between the cleaning block 8 and the robot 15 by teaching, each block is independently disposed and the layouts can be changed. <P>COPYRIGHT: (C)2004,JPO&NCIPI

Description

  The present invention relates to a polishing apparatus, and more particularly to a polishing apparatus for polishing a polishing target such as a semiconductor wafer flat and mirror-like.

In recent years, as the degree of integration of semiconductor devices has increased, circuit wiring has become finer, and the distance between wirings has become smaller. In particular, in the case of optical lithography of 0.5 μm or less, the depth of focus becomes shallow, so that the image plane of the stepper needs to be flat.
Therefore, it is necessary to planarize the surface of the semiconductor wafer. As one of the planarization methods, polishing is performed by a polishing apparatus.

Conventionally, this type of polishing equipment can be roughly divided into a load / unload function for transferring a cassette containing wafers, a transfer function for moving wafers, a polishing function for polishing wafers, and recently cleaning a polished wafer. The apparatus is provided with a cleaning function for controlling the operation of the apparatus and a control function for controlling the operation of the apparatus, and the apparatus is configured by individually assembling a number of devices and members for attaching the devices in order to perform these functions.
In addition, drivers and control valves necessary for operation and control of the equipment are housed in a control panel together with a computer for controlling the entire apparatus.

Conventional polishing apparatuses have the following problems.
(1) Since there are many types of semiconductor wafers to be processed, and polishing process conditions differ depending on the type of wafer, the configuration of equipment to be used is also different, it is difficult to standardize the equipment, and the standardization reduces the cost and shortens the delivery time. Could not hope.
(→ Productivity of equipment manufacturing)
(2) The generation of semiconductor wafers changes rapidly, and the function of the apparatus needs to be advanced. However, the modification of the apparatus is not easy, and the cost of updating the apparatus is large.
(→ extensibility)
(3) Since the polishing apparatus is usually installed in a clean room, the disassembly of the apparatus in repair and the generation of dust when replacing parts must be suppressed as much as possible, but there is a limit in the assembly configuration of the apparatus.
(→ Maintenance)
(4) Since the layout such as the size of the device, the position of loading / unloading the wafer cassette, and the position of the operation panel is fixed, access to the device is inconvenient depending on the location of use. (→ User compatibility)

As one of means for avoiding such a problem, it is conceivable to block each device function. However, as in the past, a driver for driving a motor, a control valve for driving the driver, an air cylinder and a process valve, and an interface for converting control signals to the driver and the control valve are concentrated in one control panel. When storing
(1) If a space inside the panel is secured for an arbitrary number of blocks, the control panel becomes very large, so that the control panel is individually adapted to the number of blocks and cannot be standardized.
(2) If the checking operation is to be performed in an assembled state in block units, a test stand equipped with various control devices is required, which is difficult to implement.
(3) If the specifications of motors, cylinders, and other devices are changed in order to enhance the functions in the middle of the process or at the request of the user, a significant change in the shape of the related drivers, control valves, and interfaces will cause an increase in the size of the control panel. It is necessary to change the layout and wiring of the equipment, and the cost for the remodeling and the impact on the delivery time are increased.

  SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and has as its object to provide a polishing apparatus which is suitable for blocking the apparatus and has excellent productivity, expandability, maintainability, and user responsiveness.

  In order to achieve the above object, the present invention provides a polishing apparatus for polishing a wafer, wherein the polishing apparatus includes a loading / unloading block for loading a cassette containing a wafer, a polishing block for polishing a wafer, and a wafer. A cleaning block for cleaning, a robot for transferring a wafer, and a control block for storing the relative position of the cassette and the robot of the load / unload block and the relative position of the cleaning block and the robot by teaching, The blocks are arranged independently of each other, and the layout can be changed.

A control device is provided in each of the blocks.
The robot is disposed in a transport block.
Each of the blocks is independently arranged on a base.

  Another embodiment of the present invention is a polishing apparatus for polishing a wafer, wherein the polishing apparatus includes a load / unload block for mounting a cassette containing a wafer, a polishing block for polishing the wafer, and a cleaning for cleaning the wafer. A block, a robot for transferring a wafer, and a control block for storing, by teaching, a relative position of the cassette of the load / unload block and the robot and a relative position of the cleaning block and the robot by teaching. The robot is characterized by being arranged independently on a base.

  The present invention provides a function-based block other than a control block, that is, a load / unload block for transferring a cassette containing wafers, a transport block for moving a wafer, a polishing block for polishing a wafer, and a polishing block after polishing. In a cleaning block for cleaning a wafer, a driver for driving a motor, an electric terminal block for supplying electricity to the driver, a control valve for driving an air cylinder and a process valve, and an air supply kit for supplying air to the control valve. An interface for converting a control signal to a driver and a control valve, and a communication terminal block for receiving the control signal, a power supply unit and an electric terminal block for supplying electricity to each block in the control block, and a computer for issuing a control command Terminal block that sends control signals and accepts external power supply A power supply terminal block A, and a control panel for commanding the operation.

Further, the driver, the electric terminal block, the control valve, the air supply kit, the interface, and the communication terminal block may be attached to one chassis for each block, and the chassis may be detachable from the block.
Further, a tray may be provided on the block so as to cover the chassis, and a water leak sensor may be mounted in the tray.

It also controls the operation of the equipment, including a load / unload block for transferring a cassette containing wafers, a transport block for moving wafers, a polishing block for polishing wafers, and a cleaning block for cleaning wafers after polishing. In a polishing apparatus including control blocks, a control device may be provided for each of the functional blocks.
Further, the load / unload block, the transport block, the polishing block, and the cleaning block may be provided with an interface for converting a control signal and a communication terminal block for receiving the control signal.
Further, the control block may include a computer for issuing a control command and a communication terminal block for sending a control signal.

According to the present invention having a configuration in which a control device is provided for each of the functional blocks described above, the control panel can be standardized, and at the same time, a preliminary operation check can be performed in block units, thereby reducing costs, shortening delivery times, and improving reliability. The productivity is expected to be improved, and the productivity of device manufacturing is improved.
Further, when the function of the device needs to be enhanced in the future, the modification of the control panel is not required, so that the cost of the change is low and the device has expandability.

Furthermore, since the control unit can be pulled out to the outside in block units, repair is easy and maintainability is good. The control is also protected against process chemicals because it is protected by the upper pan.
Also, when the layout is changed according to the user's request, the layout can be changed only by changing the routing of the power cable and the communication cable.

  According to the present invention, since the control device is provided for each function-based block, it is possible to perform a preliminary operation check for each block, and the control panel can be commonly used, so that standardization can be performed, thereby reducing costs and shortening delivery times. As a result, it is possible to increase the productivity of manufacturing the device and to achieve an excellent effect that the reliability can be further improved.

  Further, when it is necessary to upgrade the functions of the device in the future, it is not necessary to modify the control panel, so that the cost for the change is low and the device has expandability. In addition, when the layout is changed according to the user's request, the layout can be changed simply by changing the layout of the power cable and the communication cable.

ADVANTAGE OF THE INVENTION According to this invention, it is possible to pull out a control part outside for a block unit and to perform repair, and the maintenance property is good.
According to the present invention, since the control unit is protected by the upper pan, the control unit is also safe for the process liquid.

Hereinafter, embodiments of a polishing apparatus according to the present invention will be described with reference to the drawings.
FIG. 1 is an external view of a polishing apparatus according to the present invention. A transfer port 3 is provided in an apparatus main body A. After a cassette 2 containing unpolished wafers 1 is inserted into the cassette transfer port 3, an operation panel is provided. When the switch 4 is turned on, the wafers 1 in the cassette 2 are automatically extracted one by one, polished, washed, returned to the original cassette 2, and stored. After the polishing of all the wafers 1 is completed, the cassette 2 is taken out and sent to the next step.

  FIG. 2 shows the inside of the apparatus main body A, which includes a load / unload block 5 for transferring a cassette containing the wafer 1, a transport block 6 for moving the wafer 1, and a polishing block for polishing the wafer 1. 7, a cleaning block 8 for cleaning the polished wafer 1 and a control block 9 for controlling each of these blocks are independently arranged on a common base 10.

  The load / unload block 5 includes a stage 11 on which the cassette 2 is placed, and a sensing sensor 12 that measures the number of stored wafers 1a to z and the positions of the storage shelves 13a to 13z (mapping of wafers). The information is stored in the computer 14 in the control block 9.

  The transfer block 6 has a robot 15 movably mounted on a rail 6a, and the fingers 16 transfer the wafer 1a between the blocks. The robot 15 functions as a unit, and a plurality of robots 15 can be installed on the rail 6a.

The polishing block 7 has a rotary table 18 and a top ring 17 facing the rotary table 18. A polishing cloth is attached to the surface of the rotary table 18, and a device for supplying a polishing liquid on the polishing cloth surface is provided. Have been.
The cleaning block 8 includes a cleaning tank 19 for performing cleaning with pure water and a drying tank 20, and these tanks 19 and 20 are units constituting the cleaning block 8.

  Each of the load / unload block 5, the transport block 6, the polishing block 7, and the cleaning block 8 includes a driver for driving a motor, an electric terminal block for supplying electricity to the driver, and an air terminal. A control valve for driving the cylinder and the process valve, an air supply kit for supplying air to the control valve, an interface for converting a control signal to a driver and the control valve, and a communication terminal block for receiving the control signal are provided. .

  Such a unitized structure will be described with reference to FIG. 3 using the cleaning block 8 as an example. In this figure, the chassis 21 containing the control device of the cleaning block 8 has been pulled out. Slide bars 22 are provided on both sides of the chassis 21 so as to engage with rails 23 on the inner surface of the block and slide. When the handle 24 is pulled, the chassis 21 is pulled out. The chassis 21 has a stopper 25 for preventing the chassis 21 from falling off. The cables and pipes of the chassis 21 are of a flexible type, and a test operation can be performed while being connected to the cleaning block 8.

  The chassis 21 includes a driver 26 for sending a driving current to a motor of the cleaning brush, an electric terminal block 27 for supplying electricity to the driver 26, an air cylinder for moving the cleaning brush onto the wafer, and cleaning pure water. A control valve 28 for driving a valve for sending air, an air supply kit 29 for supplying air to the control valve 28, an interface 30 for sending a control signal to the driver 27 and the control valve 28, and a communication terminal block 31 for receiving the control signal are attached. ing.

  A receiving tray 32 is provided on the upper part of the storage section of the chassis 21. In the event that water is leaked from the washing section, the receiving tray 32 receives the water and prevents pure water from being applied to the electric equipment of the chassis 21. . A leak sensor 33 is affixed to the inner surface of the tray 32, and when a leak occurs, an alarm is issued, and the accumulated pure water is discharged by a drain pipe 34 connected to a drain pipe of the device. .

  Thus, a driver for driving a motor, an electric terminal block for supplying electricity to the driver, a control valve for driving an air cylinder and a process valve, an air supply kit for supplying air to the control valve, a driver and a control valve The same applies to the load / unload block 5, the transport block 6, and the polishing block 7 in that an interface for converting a control signal to the control signal and a communication terminal block for receiving the control signal are provided.

  On the other hand, as shown in FIG. 4, the control block 9 includes a power supply unit 35 for supplying electricity to the respective blocks 5, 6, 7, and 8, an electric terminal block 36, a computer 14 for issuing control commands, A communication terminal block 37 for sending out power, a power supply terminal block 38 for receiving a supply of electricity from the outside, and an operation panel 4 for instructing operation.

The operation of the polishing apparatus of the present invention thus configured will be described.
The cassette 2 inserted from the transfer port 3 in FIG. 1 is placed on the stage 11 of the load / unload block 5, and the number of stored wafers 1a to z and the positions of storage shelves 13a to z are measured by the sensing sensor 12. (Wafer mapping), and the information is stored in the computer 14 in the control block 9. When the mapping is completed, the fingers 16 of the robot 15 mounted on the transport block 6 take out the wafer 1a from the shelf 13a of the cassette 2.

  The relative position between the robot 15 and the cassette 2 is stored in the computer 14 in advance by teaching after each block is arranged. That is, the operation and the position setting of the robot 15 are performed according to a command from the computer 14, and the structure between the load / unload block 5 where the cassette 2 is placed and the transport block 6 where the robot 15 is mounted is set. It is not dictated by the constrained dimensions obtained by the constraint.

  The wafer 1 a taken out of the cassette 2 is mounted on the top ring 17 of the polishing block 7 by the robot 15 and polished on the turntable 18. A polishing cloth is stuck on the surface of the turntable 18 and is polished in a state where the abrasive liquid flows down.

The polished wafer 1a is transferred to the cleaning block 8 by the robot 15, and is mounted in the cleaning tank 19 in the block. When the cleaning is completed, the wafer 1a is mounted on a drying tank 20 in the block and drained, and thereafter is taken out of the cleaning block 8 by the robot 15 and returned to the storage shelf 13a of the cassette 2. The relative positions of the robot 15 and the cleaning block are stored in the computer 14 in advance, as described above.
In this manner, polishing of one wafer 1a is completed, the remaining wafers 1b to 1z are polished, and the cassette is replaced when all the wafers have been processed.

The process conditions for optimally polishing the wafer 1 include, in addition to the rotation speed and pressing force of the top ring 17 corresponding to the film to be polished on the surface of the wafer 1, the rotation speed of the turntable 18, and the type of cloth material on the surface. There are types of polishing liquids, and these are appropriately set and selected depending on the type of film on the wafer surface. Here, the chemical properties of the polishing liquid differ greatly depending on the type. For example, when the film of the wafer is SiO ₂ , the polishing liquid is nearly neutral, but when the film is a metal, the polishing liquid is acidic or alkaline. Therefore, a special material having corrosion resistance is used as a material of a polishing-related member that comes into contact with the abrasive liquid. Further, the mechanism of the cleaning device also differs depending on the film of the wafer in the post-process cleaning.

  Under these conditions, the present apparatus can completely standardize the three blocks of the loading / unloading block 5, the transport block 6, and the control block 9, and is stocked in blocks. Since some parts of the polishing block 7 and the cleaning block 8 are different depending on the type of the wafer 1, the polishing block 7 and the cleaning block 8 are assembled in a semi-finished product, and the parts are optionally stocked. Therefore, when manufacturing an apparatus suitable for use conditions, a unitized block may be assembled, and the amount of stock itself is small. As a result, the productivity of device manufacturing is high.

FIG. 1 is a perspective view showing the appearance of a polishing apparatus according to an embodiment of the present invention. 1A is a perspective view showing the inside of a polishing apparatus according to one embodiment of the present invention, and FIG. 1B is a view showing the configuration of a cassette. 1 is a perspective view showing a cleaning block of a polishing apparatus according to one embodiment of the present invention. FIG. 2 is a perspective view showing a control block of the polishing apparatus according to the embodiment of the present invention.

Explanation of reference numerals

1 Wafer 4 Operation Panel 5 Load / Unload Block 6 Transport Block 7 Polishing Block 8 Cleaning Block 9 Control Block 14 Computer 21 Chassis 26 Driver 27 Electric Terminal Block 28 Control Valve 29 Air Supply Kit 30 Interface 31 Communication Terminal Block 32 Receiving Plate 33 Leakage Water Sensor 35 Power supply unit 36 Electric terminal block 37 Communication terminal block 38 Power supply terminal block

Claims (5)

A polishing apparatus for polishing a wafer,
The polishing apparatus comprises:
A loading / unloading block for loading a cassette containing wafers,
A polishing block for polishing the wafer,
A cleaning block for cleaning the wafer;
A robot for transferring wafers,
A control block for storing the relative position of the cassette of the load / unload block and the robot and the relative position of the cleaning block and the robot by teaching,
The polishing apparatus according to claim 1, wherein the blocks are arranged independently of each other, and the layout can be changed.   The polishing apparatus according to claim 1, wherein a control device is provided in each of the blocks.   The polishing apparatus according to claim 1, wherein the robot is disposed in a transport block.   The polishing apparatus according to claim 1, wherein each of the blocks is independently arranged on a base. A polishing apparatus for polishing a wafer,
The polishing apparatus comprises:
A loading / unloading block for loading a cassette containing wafers,
A polishing block for polishing the wafer,
A cleaning block for cleaning the wafer;
A robot for transferring wafers,
A control block for storing the relative position of the cassette of the load / unload block and the robot and the relative position of the cleaning block and the robot by teaching,
The polishing apparatus, wherein each of the blocks and the robot are independently disposed on a base.

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