JP2004235636A - 可撓性を有する電気的接続を用いたasicモジュール上の集積化vcsel - Google Patents
可撓性を有する電気的接続を用いたasicモジュール上の集積化vcsel Download PDFInfo
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- 239000000758 substrate Substances 0.000 claims abstract description 50
- 230000003287 optical effect Effects 0.000 claims abstract description 19
- 238000000034 method Methods 0.000 claims description 11
- 239000000919 ceramic Substances 0.000 abstract description 5
- 239000013307 optical fiber Substances 0.000 abstract description 5
- 238000012536 packaging technology Methods 0.000 abstract 1
- 238000003491 array Methods 0.000 description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000011368 organic material Substances 0.000 description 3
- 239000005022 packaging material Substances 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
- H01L27/10—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration
- H01L27/118—Masterslice integrated circuits
- H01L27/11898—Input and output buffer/driver structures
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/43—Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73253—Bump and layer connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1515—Shape
- H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/15165—Monolayer substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1517—Multilayer substrate
- H01L2924/15172—Fan-out arrangement of the internal vias
- H01L2924/15174—Fan-out arrangement of the internal vias in different layers of the multilayer substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1517—Multilayer substrate
- H01L2924/15192—Resurf arrangement of the internal vias
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Semiconductor Lasers (AREA)
- Optical Couplings Of Light Guides (AREA)
- Light Receiving Elements (AREA)
Abstract
【解決手段】少なくとも1つの特定用途向け集積回路(ASIC)504及び複数の垂直共振器型面発光レーザ(VCSEL)アレイモジュール520を含む回路モジュールが、標準的なセラミック又は有機マルチチップモジュール(MCM)パッケージ基板500を使用して形成され、その結果として小さなフットプリントを有する高密度の素子が得られる。電子的な素子とVCSELアレイモジュールとの間の配線は、標準的な集積回路パッケージング技術及び可撓性コネクタ518を使用して達成される。VCSELアレイから光ファイバケーブルへの光学的な接続は、工業規格による光コネクタをパッケージ上に集積化させることにより実施することが可能である。光学的な受信器及び送受信モジュールもまた回路モジュールに組み込むことが可能である。
【選択図】図5
Description
502 ヒートスプレッダ
504 ASIC
506 キャビティ
508 ASIC信号ポート
510 MCMパッド
512 ASIC信号線
514 VCSEL信号線
516 VCSEL信号ポート
518 フレキシブル回路基板
520 VCSELアレイ
Claims (6)
- 回路モジュールであって、
モジュール基板(500)と、
該基板(500)に取り付けられたASIC(504)と、
前記基板(500)に取り付けられ、及び前記ASIC(504)に電気的に接続された、少なくとも1つの可撓性コネクタ(518)と、
該少なくとも1つの可撓性コネクタ(518)に取り付けられ、及び該少なくとも1つの可撓性コネクタ(518)を介して前記ASIC(504)に電気的に接続された、複数のVCSELアレイモジュール(520)と
を含む、回路モジュール。 - 回路モジュールであって、
モジュール基板(500)と、
該基板(500)に取り付けられたASIC(504)と、
前記基板(500)に取り付けられ、及び前記ASIC(504)に電気的に接続された、少なくとも1つの可撓性コネクタ(518)と、
該少なくとも1つの可撓性コネクタ(518)に取り付けられ、及び該少なくとも1つの可撓性コネクタ(518)を介して前記ASIC(504)に電気的に接続された、複数の光受信モジュール(520)と
を含む、回路モジュール。 - 回路モジュールであって、
モジュール基板(500)と、
該基板(500)に取り付けられたASIC(504)と、
前記基板(500)に取り付けられ、及び前記ASIC(504)に電気的に接続された、少なくとも1つの可撓性コネクタ(518)と、
該少なくとも1つの可撓性コネクタ(518)に取り付けられ、及び該少なくとも1つの可撓性コネクタ(518)を介して前記ASIC(504)に電気的に接続された、複数のVCSEL送受信モジュール(520)と
を含む、回路モジュール。 - 回路モジュールを構成するための方法であって、
a)モジュール基板を配設し(800)、
b)該基板にASICを取り付け(802)、
c)複数のVCSELアレイモジュールを少なくとも1つの可撓性コネクタに取り付け(806)、
d)該少なくとも1つの可撓性コネクタを前記基板に取り付け(808)、
e)該少なくとも1つの可撓性コネクタを介して前記ASICを前記VCSELアレイモジュールに電気的に接続する(808)、
という各ステップを含む、回路モジュールを構成するための方法。 - 回路モジュールを構成するための方法であって、
a)モジュール基板を配設し(800)、
b)該基板にASICを取り付け(802)、
c)複数の光受信モジュールを少なくとも1つの可撓性コネクタに取り付け(818)、
d)該少なくとも1つの可撓性コネクタを前記基板に取り付け(820)、
e)該少なくとも1つの可撓性コネクタを介して前記ASICを前記光受信モジュールに電気的に接続する(814)、
という各ステップを含む、回路モジュールを構成するための方法。 - 回路モジュールを構成するための方法であって、
a)モジュール基板を配設し(800)、
b)該基板にASICを取り付け(802)、
c)複数のVCSEL送受信モジュールを少なくとも1つの可撓性コネクタに取り付け(812)、
d)該少なくとも1つの可撓性コネクタを前記基板に取り付け(814)、
e)該少なくとも1つの可撓性コネクタを介して前記ASICを前記VCSEL送受信モジュールに電気的に接続する(814)、
という各ステップを含む、回路モジュールを構成するための方法。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/355,663 US6922496B2 (en) | 2003-01-31 | 2003-01-31 | Integrated VCSELs on ASIC module using flexible electrical connections |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2004235636A true JP2004235636A (ja) | 2004-08-19 |
Family
ID=32770585
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2004017927A Pending JP2004235636A (ja) | 2003-01-31 | 2004-01-27 | 可撓性を有する電気的接続を用いたasicモジュール上の集積化vcsel |
Country Status (2)
Country | Link |
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US (1) | US6922496B2 (ja) |
JP (1) | JP2004235636A (ja) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6975514B2 (en) * | 2003-01-31 | 2005-12-13 | Hewlett-Packard Development Company, L.P. | Integrated VCSELs on traditional VLSI packaging |
US7135704B2 (en) * | 2003-08-14 | 2006-11-14 | Lockhead Martin Corporation | VCSEL settling fixture |
US7545159B2 (en) * | 2006-06-01 | 2009-06-09 | Rika Denshi America, Inc. | Electrical test probes with a contact element, methods of making and using the same |
US8576885B2 (en) * | 2012-02-09 | 2013-11-05 | Princeton Optronics, Inc. | Optical pump for high power laser |
US9829655B2 (en) | 2012-01-12 | 2017-11-28 | Te Connectivity Corporation | Communication connector having an alignment mechanism |
US9304274B2 (en) | 2012-07-09 | 2016-04-05 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Metal strain relief device for use in an optical communications system, an optical fiber cable that employs the strain relief device, and a method |
US8911158B2 (en) | 2012-07-09 | 2014-12-16 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Z-pluggable optical communications module, an optical communications system, and a method |
US8950954B2 (en) | 2012-07-31 | 2015-02-10 | Avago Technologies General Ip ( Singapore) Pte. Ltd. | Side-edge mountable parallel optical communications module, an optical communications system that incorporates the module, and a method |
US9038883B2 (en) | 2013-09-11 | 2015-05-26 | Princeton Optronics Inc. | VCSEL packaging |
WO2017069771A1 (en) * | 2015-10-23 | 2017-04-27 | Hewlett-Packard Enterprise | Printed circuit board for receiving a switch chip and transceiver modules |
US11336376B1 (en) * | 2021-01-29 | 2022-05-17 | Alibaba Group Holding Limited | Flexible switch solution based on co-packaged optics |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5978401A (en) | 1995-10-25 | 1999-11-02 | Honeywell Inc. | Monolithic vertical cavity surface emitting laser and resonant cavity photodetector transceiver |
CA2272751A1 (en) * | 1996-12-31 | 1998-07-09 | Honeywell Inc. | Flexible optic connector assembly |
US6392296B1 (en) | 1998-08-31 | 2002-05-21 | Micron Technology, Inc. | Silicon interposer with optical connections |
US6635861B1 (en) * | 1998-10-22 | 2003-10-21 | Wavefront Research, Inc. | Relaxed tolerance optical interconnect system having a GRIN rod lens |
US6527456B1 (en) | 1999-10-13 | 2003-03-04 | Teraconnect, Inc. | Cluster integration approach to optical transceiver arrays and fiber bundles |
US6334784B1 (en) | 2000-08-07 | 2002-01-01 | Teradyne, Inc. | Z-axis pressure mount connector fixture |
TW564009U (en) | 2001-02-13 | 2003-11-21 | Foxconn Prec Components Co Ltd | Locking device for heat sink |
-
2003
- 2003-01-31 US US10/355,663 patent/US6922496B2/en not_active Expired - Lifetime
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2004
- 2004-01-27 JP JP2004017927A patent/JP2004235636A/ja active Pending
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US6922496B2 (en) | 2005-07-26 |
US20040150092A1 (en) | 2004-08-05 |
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