JP2004235521A - Process for producing sheet capacitor module - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a sheet capacitor module having no shift of pitch by solving a problem that the pin pitch of a contact part is shifted from the pin pitch of an IC due to shift when anode and cathode sheets are pasted. <P>SOLUTION: In the production process where a cathode sheet 3 provided with relief through holes 4, 6 and 9 not touching the connection pins of the IC, an insulating sheet 5 and an anode sheet 8 are laminated while aligning the through holes, and contact parts being connected with the connection pins are formed before a capacitor element is mounted, a sheet capacitor module in which shift of pitch is suppressed with respect to the connection pins of the IC can be provided stably even if the cathode sheet 3 and the anode sheet 8 are pasted while being shifted by forming the contact parts simultaneously by press, or the like, following to pasting. <P>COPYRIGHT: (C)2004,JPO&NCIPI

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a method for manufacturing a sheet-type capacitor module used for smoothing and noise absorption of high-speed ICs and processors, power supply backup, and the like.
[0002]
[Prior art]
2. Description of the Related Art In recent years, as personal computers and communication devices have been operated at higher speeds, there has been a demand for electronic components used in these devices to be smaller and have higher frequencies. Along with this, it is necessary to increase the capacity and lower the impedance of capacitors, which are one of the electronic components. There is a strong demand for electrolytic capacitors capable of realizing low ESR (equivalent series resistance), low ESL (equivalent series inductance), high ripple current resistance, and large capacity. In order to cope with the situation, in reality, a large number of small chip capacitors are arranged in the vicinity of the CPU at a position close to the CPU. Further, when the power supply capacity is reduced, the power can be supplied as a backup immediately. A compact one is desired.
[0003]
In addition, in order to bring the capacitor closer to the connection pins of the IC, the present inventors have proposed a sheet-type capacitor module configured to be mounted between the CPU and the IC socket in Japanese Patent Application No. 2002-315710. The sheet type capacitor module will be described below with reference to the drawings.
[0004]
FIG. 7 is an exploded perspective view showing the sheet-type capacitor module proposed in Japanese Patent Application No. 2002-315710 and its use, and FIG. 8 is an exploded perspective view showing the configuration of the sheet-type capacitor module. Reference numeral 1 denotes an IC represented by a CPU, and reference numeral 2 denotes a connection pin provided on the lower surface of the IC 1. In FIG. 1, an IC package for Pentium 4 (2.8 GHz "Pentium" is a registered trademark of Intel Corporation) is shown. This is an example using 478-pin FC-PGA2. 35 is an IC socket, 36 is a printed wiring board to which the IC socket 35 is soldered, and 37 is a sheet type capacitor module.
[0005]
8, reference numeral 40 denotes a conductive cathode sheet. The cathode sheet 40 has a through hole 41 through which the connection pin 2 of the IC 1 penetrates, and the connection pin 2 required for connection of the IC 1 penetrates. Only the through-hole 41 is provided with a contact portion 42 (black solid portion in the drawing) which is electrically connected to the connection pin 2, and further has a configuration in which the peripheral portion 43 is bent into a substantially L-shape and reinforced. Reference numeral 44 denotes an insulating sheet provided outside (the lower surface in the figure) side of the cathode sheet 40, and 45 denotes an insulating sheet made of a polymer material provided inside (the upper surface in the figure) side of the cathode sheet 40. An opening 46 is provided at the center of the insulating sheet 45.
[0006]
Reference numeral 47 denotes a conductive anode sheet. The anode sheet 47 is provided with a through hole 48 through which the connection pin 2 of the IC 1 penetrates, and a through hole 48 through which the connection pin 2 necessary for connection of the IC 1 penetrates. Only a contact portion 39 (black solid portion in the drawing) that is electrically connected to the connection pin 2 is formed, and an opening 49 is provided at the center. Reference numeral 50 denotes a sheet-like capacitor element, and reference numerals 51 and 52 denote an anode electrode section and a cathode electrode section provided on the capacitor element 50. Reference numeral 53 denotes an insulating sheet disposed on the upper surface of the anode sheet 47. The insulating sheet 53 has a through hole 38 through which the connection pin 2 of the IC 1 passes.
[0007]
In the sheet-type capacitor module 37 having such a configuration, the insulating sheet 45 and the conductive anode sheet 47 are laminated and joined to the inside of the conductive cathode sheet 40 having the insulating sheet 44 joined to the outside. Capacitor element 50 is disposed in overlapping openings 46 and 49 provided at the center of 47, and anode electrode part 51 of capacitor element 50 is provided on anode sheet 47, and cathode electrode part 52 is provided on cathode sheet 40. After being electrically connected to each other, the anode sheet 47 is sealed with an insulating sheet 53 so as to cover the anode sheet 47.
[0008]
In the conventional sheet-type capacitor module 37 configured as described above, the connection pins 2 of the IC 1 are attached to the IC socket 35 through the through holes 38 of the sheet-type capacitor module 37, and the contact pins 39, 42 are provided. As a result, the connection pin 2 of the IC 1 and the capacitor element 50 are connected at the root of the connection pin 2 so that the IC 1 and the sheet-type capacitor module 37 are electrically connected to each other. The ESL capacitor element 50 can be brought as close as possible to the IC 1, and the sheet-type capacitor module 37 with a simple configuration and a reduced thickness can be realized.
[0009]
As prior art document information related to the invention of this application, for example, Patent Document 1 is known.
[0010]
[Patent Document 1]
JP-A-60-130150
[Problems to be solved by the invention]
However, in the above-described conventional sheet-type capacitor module 37, when the cathode sheet 40 and the anode sheet 47 are bonded together with the insulating sheet 45, a structural displacement occurs, so that the contact portions 42 and the anode sheet 47 formed on the cathode sheet 40 are not provided. A pitch shift occurs in the formed contact portion 39. For this reason, if a pitch shift of 0.1 mm or more occurs with respect to the outer diameter of the connection pin 2 of the IC 1 of 0.3 mm, the connection between the connection pin 2 and the contact portions 39 and 42 of the sheet-type capacitor module 37 may not be completed. It will be difficult. Some CPUs such as Pentium 4 have components mounted on the connection pin side of the package, and it is necessary to form a recess to avoid this. In addition, there is a problem of the pitch of the contact portions 39 and 42 and the processing dimensional accuracy of the concave portion, and there is a problem that manufacturing is difficult.
[0012]
An object of the present invention is to solve the above-mentioned conventional problems, and an object of the present invention is to provide a method of manufacturing a sheet-type capacitor module in which a contact portion does not shift in pitch.
[0013]
[Means for Solving the Problems]
In order to solve the above problem, the invention according to claim 1 of the present invention requires a through hole into which a connection pin of an IC is fitted, and an electrical connection between the through hole and the connection pin of the IC. And a conductive cathode sheet provided with a wiring pattern including the contact portion, a conductive anode sheet formed in the same manner as the cathode sheet, and the above-described cathode sheet. An insulating sheet provided between the anode sheets, a capacitor element having a pair of electrode parts connected to the cathode sheet and the anode sheet, respectively, and at least a part of the outer surface was covered in a state where these were integrally laminated and joined. A manufacturing method for manufacturing a sheet-type capacitor module comprising an insulating exterior member, wherein first, a portion of the cathode sheet and the anode sheet that is not in contact with the connection pin is formed by measuring the outer diameter of the connection pin. Opening a large escape through hole, then sandwiching the insulation sheet with the escape hole opened to the part where all the connecting pins fit in a non-contact manner between the cathode sheet and the anode sheet, and the cathode sheet and the insulation sheet A method for manufacturing a sheet-type capacitor module, wherein after laminating in a state where the escape through holes provided in the anode sheet are aligned with each other, a contact portion to be connected to a connection pin is simultaneously formed integrally with the cathode sheet and the anode sheet. According to this method, even when the cathode sheet and the anode sheet are misaligned, by forming the contact sections simultaneously by pressing or the like after lamination, it is possible to form a contact section having no pitch misalignment. It has the effect of being able to.
[0014]
According to the second aspect of the present invention, before forming a contact portion to be connected to a connection pin on a cathode sheet and an anode sheet, at least a part excluding a release through hole and a portion forming a contact portion is pressed. The concave portion is formed by processing, and by this method, a stable concave shape can be formed even when the cathode sheet and the anode sheet are misaligned, and the contact portion is simultaneously formed by pressing or the like after the concave portion is formed. By forming them integrally, there is an operational effect that a contact portion without pitch shift can be formed.
[0015]
According to a third aspect of the present invention, a pair of electrode portions of a capacitor element is connected to the cathode sheet and the anode sheet after forming a contact portion to be connected to the connection pin on the cathode sheet and the anode sheet, respectively. The capacitor element is sealed with an insulating resin or an insulating sheet in a vacuum or an inert gas atmosphere. According to this method, oxidation of the capacitor element can be prevented by the vacuum or the inert gas. Therefore, there is an effect that the reliability of the sheet-type capacitor module is improved.
[0016]
The invention according to claim 4 of the present invention forms an insulating layer by printing a thermosetting or UV-curing insulating paint instead of the insulating sheet disposed between the cathode sheet and the anode sheet, The method in which the cathode sheet and the anode sheet are bonded by the insulating layer has the effect of eliminating the problem of slippage of the insulating sheet due to film expansion and contraction in roll production.
[0017]
The invention according to claim 5 of the present invention is that the insulating sheet is formed using a thermoreversible insulating sheet, and the cathode sheet and the anode sheet are heated to be thermally bonded to the insulating sheet, By this method, the insulating sheet can be kept at room temperature until immediately before the thermal bonding, so that the cathode / anode sheet can be thermally bonded while minimizing deformation due to heat. Is obtained.
[0018]
According to a sixth aspect of the present invention, the cathode sheet and the anode sheet are thermally bonded to the insulating sheet by ultrasonic waves instead of the thermal bonding by heating.
[0019]
According to a seventh aspect of the present invention, there is provided a contact portion provided in the cathode sheet and the anode sheet, wherein the diameter of the relief through hole provided in the cathode sheet and the anode sheet is larger than the diameter of the relief through hole provided in the insulating sheet. The diameter of the insulating sheet is made smaller than the diameter of the escape through hole provided in the insulating sheet. By this method, even if the cathode sheet, the anode sheet and the insulating sheet are misaligned, the non-contact escape through hole is provided. Is covered by an insulating layer to increase the insulating property, and the stability of the connection can be increased by releasing the insulating sheet of the contact portion.
[0020]
According to the invention of claim 8 of the present invention, an insulating sheet and a conductive anode sheet are additionally laminated to connect capacitor elements having different characteristics. This has the effect that a sheet-type capacitor module in which elements, battery elements, and capacitor elements having different characteristics constituted by elements, ceramics, functional polymers, films, and the like can be easily mounted.
[0021]
According to a ninth aspect of the present invention, an opening is provided in each of the central portions of the anode sheet and the insulating sheet, and the capacitor element is provided in the opening. Thus, a compact sheet-type capacitor module can be provided.
[0022]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings.
[0023]
FIGS. 1 (a) to 1 (c) show a manufacturing process diagram of an anode sheet, an insulating sheet and a cathode sheet, showing from a raw material to a pressing process in a manufacturing method of a sheet-type capacitor module according to an embodiment of the present invention. In FIG. 1C, reference numeral 3 denotes a cathode sheet, and the cathode sheet 3 is a 0.05 to 0.3 mm-thick spring material such as phosphor bronze or SUS, or a copper, iron, aluminum sheet, or First, an escape through-hole 4 that does not contact the connection pin 2 of the IC 1 is formed at a predetermined position of the cathode sheet 3 by press working, and is formed of a conductive sheet or the like obtained by laminating an elastic film and a metal foil.
[0024]
In FIG. 1B, reference numeral 5 denotes an insulating sheet. The insulating sheet 5 has a thickness of 0.01 to 0.3 mm, such as an insulating material such as PET, PP, or PC sheet, or a heat-resistant insulating sheet such as PI, PAI, or PEEK. A relief through hole 6 through which all the connecting pins 2 of the IC 1 penetrate in a predetermined position of the insulating sheet 5 in a non-contact manner, and an opening 7 in the center are formed by press working.
[0025]
In FIG. 1A, reference numeral 8 denotes an anode sheet. The anode sheet 8 is made of a spring material such as phosphor bronze or SUS having a thickness of 0.05 to 0.3 mm, or a copper, iron, aluminum sheet, or an elastic film. The anode sheet 8 is formed of a conductive sheet or the like, and is formed at a predetermined position of the anode sheet 8 with a through hole 9 not in contact with the connection pin 2 of the IC 1 and an opening 10 at a center portion by press working.
[0026]
2 (a) to 2 (c) are plan views and front views showing the steps from bonding of the processed cathode sheet 3, insulating sheet 5 and anode sheet 8 shown in FIG. It is a manufacturing process diagram shown in the figure and the bottom view. As shown in the figure, the processed cathode sheet 3 and anode sheet 8 are heated by the heater 11 to a temperature at which the insulating sheet 5 is melted, and between them. Laminating is performed by sandwiching the insulating sheet 5 serving as an insulating layer and pressing with a roll 12. Subsequently, in order to avoid protrusions of the IC 1 (in the case of Pentium 4, the electronic components mounted on the lower surface protrude), a concave portion 14 is formed in the center by a molding press 13 so that the cathode and anode wiring patterns are formed. Is produced.
[0027]
In addition, the shape pressability is improved by performing the molding press 13 while applying pressure to a temperature at which the insulating sheet 5 softens. Alternatively, the insulating sheet 5 may be sandwiched between the cathode sheet 3 and the anode sheet 8 and bonded by ultrasonic welding. Further, instead of the insulating sheet 5, the insulating layer may be formed by printing a thermosetting or UV-curing insulating paint.
[0028]
FIGS. 3A to 3C show a plan view and a front view of a process of forming a contact portion on the processed wiring laminate sheet 15 shown in FIG. 2 and mounting a capacitor element in the same manufacturing method. It is a manufacturing process diagram shown in a bottom view, and as shown in the figure, the connection pin 2 for the IC 1 is connected to the wiring laminate sheet 15 in which the cathode sheet 3 and the anode sheet 8 are laminated with the insulating sheet 5 interposed therebetween. The contact portion 17 (black solid portion in the figure) to be connected is formed by using a press machine 16, and by thus simultaneously punching holes in the cathode sheet 3 and the anode sheet 8 by one press, The pitch shift of each hole contacting with each connection pin 2 of the IC 1 is extremely small.
[0029]
Next, the conductive paste 18 of silver, carbon, copper, or the like is picked up by a tampon 19 and transferred to the bottom surface (cathode) of the concave portion 14 formed in the wiring laminate sheet 15 to apply the conductive paste 18. Subsequently, the cathode electrode portion 21 of the capacitor element 20 is brought into close contact with the conductive paste 18 applied to the bottom surface of the concave portion 14 so that the anode electrode portion 22 of the capacitor element 20 contacts the connection portion 23 of the anode sheet 8. The capacitor element 20 is arranged, and the conductive paste 18 is dried. Subsequently, the wiring laminate sheet 15 and the capacitor element 20 are electrically connected by connecting the anode electrode part 22 of the capacitor element 20 and the connection part 23 of the anode sheet 8 by welding means such as electric welding 24 or laser welding. It is intended to be.
[0030]
FIG. 4 is a plan view showing the shape of the hole constituting the contact portion 17. The hole is formed under the anode sheet 8 in which the escape through hole 9 is formed larger than the outer diameter of the connection pin 2 of the IC 1. The cathode sheet 3 having the insulating sheet 5 formed with the escape through hole 6 smaller than the escape through hole 9 and the elliptical hole 4 partially formed smaller than the outer diameter of the connection pin 2 is provided. The cathode contact part 25 and the anode contact part 26 are formed so that the elliptical hole 4 provided in the cathode sheet 3 has a part smaller than the outer diameter of the connection pin 2. A rectangular or star shape may be used.
[0031]
FIG. 5 is a cross-sectional view showing the configuration of the capacitor element 20. As shown in FIG. 5, thiophene or the like is formed on the outer surface of the anode electrode portion 22 made of aluminum foil having a dielectric oxide film formed on the surface. A sheet-type capacitor element 20 is formed by forming a solid electrolyte layer 27 made of a functional polymer, and further forming a cathode electrode portion 21 made of carbon, silver paste, or the like on the surface thereof. The capacitor element 20 is not particularly limited as long as it can be formed in a sheet shape, such as a tantalum capacitor element, a ceramic capacitor element, a wet electrolytic capacitor element, an electric double layer capacitor element, a sheet battery element, and the like.
[0032]
6 (a) and 6 (b) show, in the same manufacturing method, a step of attaching a cover sheet for protecting the capacitor element 20 mounted on the processed wiring laminate sheet 15 shown in FIG. FIGS. 4A and 4B are a manufacturing process diagram showing a process of cutting into pieces by a plan view and a front view. As shown in FIG. 4, the insulating laminate is provided with an escape through hole 28 through which the connection pin 2 of the IC 1 penetrates. The cover sheet 29 made of the above polymer material is stacked and carried into a vertically divided vacuum chamber 30 to be sealed, and the inside of the vacuum chamber 30 is evacuated by a vacuum pump 31 so that the inside is in a vacuum state. By pressing the cover sheet 29 against the wiring laminate sheet 15 using a hot press 32 to weld the capacitor element 20 in a sealed manner, and finally cutting it into individual pieces using a cutting press 33. It is obtained so as to generate more sheet-shaped capacitor module 34.
[0033]
In the above-described sheet-type capacitor module 34, the configuration has been described in which the insulating sheet 5 is provided only on the upper surface of the cathode sheet 3, but the insulating sheet may be welded or attached to the lower surface as necessary. It is.
[0034]
The insulating sheet 5 may be formed of an insulating paint such as epoxy, melamine, silicon, or polyurethane, an insulating material such as PET, PP, or PC sheet, or a heat-resistant insulating sheet such as PI, PAI, or PEEK. Further, the connection between the sheets may be made to have a bonding structure using an adhesive (or an adhesive). The exterior may be covered with resin molding, the surface may be covered with an insulating sheet, or a coating or an insulating paint may be printed with a coating material.
[0035]
【The invention's effect】
As described above, the method of manufacturing a sheet-type capacitor module according to the present invention comprises the steps of: laminating a cathode sheet, an insulating sheet, and an anode sheet having through holes that are not in contact with IC connection pins so that the through holes are aligned; By forming a contact portion connected to a pin for use and a manufacturing method of mounting a capacitor element, even if the cathode sheet and the cathode sheet are misaligned, the contact portion can be simultaneously formed after the lamination by pressing or the like. Accordingly, it is possible to stably provide a sheet-type capacitor module having a small pitch shift with respect to the connection pins of the IC.
[Brief description of the drawings]
FIG. 1 (a) is a manufacturing process diagram of an anode sheet showing from a raw material to a pressing process in a manufacturing method of a sheet-type capacitor module according to an embodiment of the present invention; (C) Manufacturing process diagram of the same cathode sheet [FIG. 2] (a) Manufacturing process showing in a plan view from bonding of a processed cathode sheet, an insulating sheet and an anode sheet to a concave portion forming process in the same manufacturing method. (B) Manufacturing process diagram shown in the front view (c) Manufacturing process diagram shown in the bottom view [FIG. 3] (a) Forming a contact portion on a processed wiring laminate sheet in the same manufacturing method FIG. 4B is a manufacturing process diagram showing the process of mounting the capacitor element in a plan view, FIG. 4B is a manufacturing process diagram shown in the front view, and FIG. 4C is a manufacturing process diagram shown in the bottom view. Plan view [Figure 5] Configuration of the capacitor element FIG. 6 (a) is a plan view showing a step of attaching a cover sheet for protecting a capacitor element mounted on a processed wiring laminate sheet in the same manufacturing method to a step of cutting it into final pieces; (B) Manufacturing process diagram shown in the front view. [FIG. 7] Conventional sheet-type capacitor module and exploded perspective view showing its use. [FIG. 8] Structure of the sheet-type capacitor module. Exploded perspective view shown [Description of reference numerals]
1 IC
2 Connection pin 3 Cathode sheet 4, 6, 9, 28 Escape through hole 5 Insulation sheet 7, 10 Opening 8 Anode sheet 11 Heater 12 Roll 13 Forming press 14 Depression 15 Wiring laminate sheet 16 Press machine 17 Contact part 18 Conductive Paste 19 Tampo 20 Capacitor element 21 Cathode electrode part 22 Anode electrode part 23 Connection part 24 Electric welding 25 Cathode contact part 26 Anode contact part 27 Solid electrolyte layer 29 Cover sheet 30 Vacuum tank 31 Vacuum pump 32 Hot press 33 Cutting press 34 Sheet type capacitor module

Claims (9)

A through-hole into which a connection pin of an IC fits, a contact portion formed in the through-hole which needs to be electrically connected to the connection pin of the IC in the through-hole, and a wiring pattern including the contact portion And a conductive anode sheet, a conductive anode sheet formed in the same manner as the cathode sheet, an insulating sheet provided between the cathode sheet and the anode sheet, and the cathode sheet and the anode sheet. A manufacturing method for manufacturing a sheet-type capacitor module comprising a capacitor element to which a pair of electrode portions are respectively connected, and an insulating exterior member covering at least a part of an outer surface in a state where these are integrally laminated and joined. First, a relief through hole larger than the outer diameter of the connection pin is opened in a portion of the cathode sheet and the anode sheet that is not in contact with the connection pin, and then all the connection pins are in non-contact. The insulating sheet having a through hole opened in the part to be fitted with is sandwiched between the cathode sheet and the anode sheet, and laminated with the escape through holes provided in the cathode sheet, the insulating sheet, and the anode sheet aligned with each other. After that, a contact portion connected to the connection pin is formed simultaneously and integrally on the cathode sheet and the anode sheet. 2. A concave portion is formed by press working on at least a part except for an escape through hole and a portion forming a contact portion before forming a contact portion connected to the connection pin on the cathode sheet and the anode sheet. 3. The method for manufacturing a sheet-type capacitor module according to item 1. After forming the contact portions connected to the connection pins on the cathode sheet and the anode sheet, a pair of electrode portions of the capacitor element are connected to the cathode sheet and the anode sheet, respectively, and then the capacitor element is placed in a vacuum or an inert gas atmosphere. 2. The method for manufacturing a sheet-type capacitor module according to claim 1, wherein the sealing is performed with an insulating resin or an insulating sheet. Instead of the insulating sheet disposed between the cathode sheet and the anode sheet, an insulating layer is formed by printing a thermosetting or UV-curing insulating paint, and the cathode sheet and the anode sheet are bonded by the insulating layer. The method for manufacturing a sheet-type capacitor module according to claim 1. The method for manufacturing a sheet-type capacitor module according to claim 1, wherein the insulating sheet is formed using a thermoreversible insulating sheet, and the cathode sheet and the anode sheet are heated to be thermally bonded to the insulating sheet. The method for manufacturing a sheet-type capacitor module according to claim 5, wherein the cathode sheet and the anode sheet are thermally bonded to the insulating sheet by ultrasonic waves instead of heat bonding by heating. The diameter of the relief through hole provided in the cathode sheet and the anode sheet is made larger than the diameter of the relief through hole provided in the insulating sheet, and the diameter of the contact part provided in the cathode sheet and the anode sheet is the diameter of the relief through hole provided in the insulation sheet. The method for manufacturing a sheet-type capacitor module according to claim 1, wherein the size of the sheet-type capacitor module is reduced. 2. The method for manufacturing a sheet-type capacitor module according to claim 1, wherein an insulating sheet and a conductive anode sheet are added and laminated to connect capacitor elements having different characteristics. 2. The method for manufacturing a sheet-type capacitor module according to claim 1, wherein an opening is provided in each of the central portions of the anode sheet and the insulating sheet, and the capacitor element is disposed in the opening.

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