JP2004229342A - Electrostatic chuck device - Google Patents

Electrostatic chuck device Download PDF

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Publication number
JP2004229342A
JP2004229342A JP2003010873A JP2003010873A JP2004229342A JP 2004229342 A JP2004229342 A JP 2004229342A JP 2003010873 A JP2003010873 A JP 2003010873A JP 2003010873 A JP2003010873 A JP 2003010873A JP 2004229342 A JP2004229342 A JP 2004229342A
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Japan
Prior art keywords
pair
shaped electrodes
comb
electrodes
electrostatic
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JP2003010873A
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Japanese (ja)
Inventor
Norio Onozato
紀夫 小野里
Masahiro Watanabe
正宏 渡邊
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Victor Company of Japan Ltd
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Victor Company of Japan Ltd
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Priority to JP2003010873A priority Critical patent/JP2004229342A/en
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Abstract

<P>PROBLEM TO BE SOLVED: To provide an electrostatic chuck device capable of further increasing an attracting force and retaining an object to be attracted in a flat electrostatic condition. <P>SOLUTION: This electrostatic chuck device includes a substrate 11 formed of an insulation body, a pair of comb teeth-shaped electrodes 12, 13 disposed so as to be separate and engaged from with each other on the substrate, and an attracting layer 14 formed so as to cover tops and gaps between the pair of comb teeth-shaped electrodes and so that its surface is flat. This electrostatic chuck device attracts the object 18 placed on the attracting layer to the attracting layer by directly applying a DC voltage between the pair of comb teeth-shaped electrodes, and generating an electrostatic field between the pair of comb teeth-shaped electrodes. An attracting layer 14A on the pair of comb teeth-shaped electrodes is formed of a first dielectric, and an attracting layer 14B between the pair of comb teeth-shaped electrodes is formed of a second dielectric, respectively, to make a relative dielectric constant of the first dielectric larger than that of the second dielectric. <P>COPYRIGHT: (C)2004,JPO&NCIPI

Description

【0001】
【発明の属する技術分野】
本発明は、被吸着物を静電力を利用して吸着する静電吸着装置に係り、特に被吸着物を吸着する大きな静電吸着力が得られる静電吸着装置に関するものである。
【0002】
【従来の技術】
近年、紙、OHPシート、プラスチックシート等の被吸着物を画鋲やマグネットを使用しないで静電吸着力によって被吸着物に傷を付けることなく保持する静電吸着装置を備えたプロッターやデジタイザーなどが製品化されている。
これらの静電吸着装置は、基板上に配置した一対の櫛歯状電極上に、シート状プラスチックを設置し、この一対の櫛歯状電極間に直流電圧を印加して、そのシート状プラスチック表面に紙等の被吸着物を載せて、それらを静電力により静電保持するものである(例えば、特許文献1参照。)。
従来例の静電吸着装置として特許文献1に記載の静電吸着装置について図と共に説明する。
【0003】
図5は従来例の静電吸着装置の断面図である。
図5に示されるように、この装置は、被吸着物55を吸着するプラスチックシートで形成された吸着層51と、前記吸着層51と熱圧着可能なポリ塩化ビニール(プラスチック)よりなる絶縁層52と、前記絶縁層52に間隔を置いて埋設された正電極となる導体53a,53c,53eと負電極となる導体53b,53d,53fとが互いに離間して噛み合うように配置された一対の櫛歯状電極を形成する複数個の導体53a〜53fと、これら2つの電極群間に直流高電圧を印加する直流電源54とより構成される。
吸着層51は、絶縁層52と複数個の導体53a〜53fの上に覆うようにして一定の比誘電率を有する誘電体、例えば硬質ポリ塩化ビニール(比誘電率は約5)等の樹脂で構成されている。
【0004】
この装置は、吸着層51の表面に被吸着物55を接触させると図示のように被吸着物55の各電極53a〜53fと対向する部分にそれぞれ静電誘導により電極の電荷と異極性の電荷が発生する。
従って、被吸着物55に生じた電荷と各電極53a〜53fの電荷との間に静電的吸引力が作用して被吸着物55を吸着層51の表面に吸着保持するものである。
【0005】
この装置は、導体53a〜53f及び絶縁層52を同種のプラスチックにより吸着層51に熱圧着して一体に形成したもので、各部の接着が極めて良好で形状変形がないので被吸着物55を吸着する性能を長期間にわたって安定に保持することが出来る。
しかし大きな保持力を必要とする被吸着物の場合は、このままの構成では対応に自ずと限界があり保持力を大きくすることは難しいものである。
【0006】
また、保持力改善の例としては、被吸着物の保持面に導電性を付与して保持面に掛かる電圧を小さくして、実効的に電極と吸着保持面間に掛かる電圧をより大きくして静電保持力を高め、吸着力を向上させるものがある(例えば、特許文献2参照。)。
しかし、このものを実施しても、カールや軽くしわのある紙やプラスチックシート等を平坦に吸着保持させることは出来なかった。
【0007】
【特許文献1】
実公昭54−41892号公報(第2頁,第1図)
【特許文献2】
特開平6−274114号公報(第5頁)
【0008】
【発明が解決しようとする課題】
よって、上記従来例は、紙やプラスチックシート等の被吸着物(被保持体)がカールしていたり、軽くシワがよっている場合に、静電保持が十分に出来ず、カールやシワを十分に補正して被吸着物を平坦に静電保持することが出来ないという問題があった。
そこで本発明は、かかる問題を解決するためになされたものであり、吸着力をより大きくして、被吸着物を平坦に静電保持することを可能にした静電吸着装置を提供することを目的とする。
【0009】
【課題を解決するための手段】
この課題を解決するために
請求項1に記載された発明は、
絶縁体からなる基板11と、前記基板11上に互いに離間して噛み合うように配置した一対の櫛歯状電極12,13と、前記一対の櫛歯状電極12,13上及び前記一対の櫛歯状電極12,13間を覆ってその表面が平坦になるように形成した吸着層14とを有し、
前記一対の櫛歯状電極間に直流電圧を印加して前記一対の櫛歯状電極12,13間に静電界を発生させて前記吸着層14上に載せた被吸着物18を前記吸着層14に吸着させる静電吸着装置において、
前記一対の櫛歯状電極12,13上の前記吸着層部分14Aを第1の誘電体により形成すると共に前記一対の櫛歯状電極12,13間の前記吸着層部分14Bを第2の誘電体によりそれぞれ形成して、
前記第1の誘電体の比誘電率を前記第2の誘電体の比誘電率より大きくしたことを特徴とする静電吸着装置を提供しようとするものである。
【0010】
【発明の実施の形態】
本発明の静電吸着装置の実施の形態につき、好ましい実施例により、以下に図と共に説明する。
<実施例>
図1は本発明の静電吸着装置の実施例の構成を示した斜視図であり、図2は図1のA‐A部分の断面図である。
【0011】
図1、図2に示されるように本発明の実施例の静電吸着装置10は、絶縁体からなる基板11、前記基板11上に互いに離間して噛み合うように配置した一対の櫛歯状電極12,13、前記一対の櫛歯状電極12,13上に形成した吸着層部分14A、前記一対の櫛歯状電極12,13間に形成した吸着層部分14Aより比誘電率が小さい吸着層部分14B、保護膜16、及び前記一対の櫛歯状電極12,13間に直流(DC)電圧を印加する直流電源17より構成されている。
【0012】
本発明の実施例は、導電材料で作られた一対の櫛歯状電極12,13間に直流(DC)電圧を印加することで前記一対の櫛歯状電極12,13上に静電界を発生させて前記吸着層14(吸着層部分14A及び14B)上に載せた被吸着物18を吸着するようにした静電吸着装置である。
【0013】
本実施例においては、これまで一種類の比誘電率の吸着層で構成していたものを、本実施例の静電吸着装置は前記一対の櫛歯状電極12,13上の吸着層部分14Aと前記一対の櫛歯状電極12,13間の前記吸着層部分14Bとに分け、前記吸着層部分14Aの比誘電率を前記吸着層部分14Bの比誘電率より大きくしたものである。
【0014】
次に、本実施例の各構成について、図1及び図2と共に説明する。
本実施例は、A4〜B5相当の紙、OHPシート、プラスチックシート等の被吸着物18の吸着を行うもので、絶縁体よりなる基板11としては、縦230mm、横320mm、厚さ5mmの大きさのガラス繊維入りエポキシ基板を使用する。
【0015】
一対の櫛歯状電極(正電極12,負電極13)は、図1に示されるように、前記基板11上に並行に複数の導体が配置され、複数の導体の各左端が一本置きに接続され、次に残りの複数の導体の右端が接続され、これらの左端が接続された複数の導体(正電極12)と右端が接続された複数の導体(負電極13)とを互いに離間して噛み合うように前記基板11上に配置される。
一対の櫛歯状電極12,13は、縦230mm、横320mm、厚さ75μmmの銅板をエッチングにより、銅導電材幅(電極幅)2mm、銅導電材幅間隔(電極間隔)5mmで等間隔に配設された複数の銅導電材を交互に接続して互いに対向して櫛歯状に噛み合うように基板11上に形成させる。なお、複数の銅導電材は、基板11に埋設させるようにしてもよい。
【0016】
前記基板11上に形成される吸着層14のうち厚さ0.2〜0.7mmの吸着層(高比誘電率体)14Aは、一対の櫛歯状電極12,13の上に形成され、その吸着層(高比誘電率体)部分14Aは、チタン酸バリウム(BaTiO)粉末が90パーセント混入された炭酸ポリエステル、ポリ塩化ビニル、アクリル、ポリカーボネート等の中から選択される比誘電率が30程度のものを、電極12,13部分を型抜きした厚さ0.2〜0.7mmのマスクを電極12,13の位置とマスクの電極12,13部分を型抜きした部分の位置とが一致するように配置し、そのマスク上よりスプレー等により電極12,13部分に塗布して形成されたものである。
【0017】
前記基板11上に形成される吸着層のうち厚さ0.2〜0.7mmの吸着層(低比誘電率体)部分14Bは、一対の櫛歯状電極12,13間に形成され、シリカ粉末が90パーセント混入された炭酸ポリエステル、ポリ塩化ビニル、アクリル、ポリカーボネート等の中から選択される、比誘電率が4〜5程度のものを、電極12,13がない部分を型抜きした厚さ0.2〜0.7mmのマスクを電極12,13がない部分の位置と、このマスクの電極12,13がない部分を型抜きした部分の位置とが一致するように配置し、そのマスク上よりスプレー等により電極12,13がない部分に塗布して形成されたものである。
【0018】
そのマスクを除去した後に、保護膜16が吸着層14Bと同じ材料のものをスプレー等により更に0.01〜0.1mm程度、吸着層14A及び吸着層14Bの上に塗布して表面の凸凹を平滑化して形成される。保護膜16は帯電防止剤を含めて形成される。
【0019】
直流電源17は一対の互いに離間して噛み合う櫛歯状電極(正電極12,負電極13)間に結合される。直流電源17は印加電圧が直流300〜3000Vで図示していない電源スイッチを、被吸着物18を吸着層14(吸着層部分14A及び14B)に保護膜16を介して保持する時にONし(電流10μA程度)、被吸着物18を取り外す時にOFFして使用されるようにしている。
以上で本実施例の静電吸着装置の各構成の説明を終了する。
【0020】
次に、既に上記実施例に適用した吸着力を大きくする方法(吸着層を一対の櫛歯状電極12,13表面の14Aの部分と前記一対の櫛歯状電極12,13間の前記吸着層部分14Bの部分とに分け、吸着層部分14Aの比誘電率を前記吸着層部分14Bの比誘電率より大きくする)について、図3、図4と共に更に説明する。
【0021】
(A)吸着力と電極上の吸着層の比誘電率と電極間の吸着層の比誘電率との関係について
図2に示したように、電極12,13上に吸着層部分14Aを、電極12,13間に吸着層部分14Bを配設した。
【0022】
吸着層部分14Aと吸着層部分14Bとを構成する材料について、その材料の比誘電率(吸着層部分14A,14Bの比誘電率をε1,ε2とする)を変えた場合の比誘電率と吸着力との関係を図3に示す。
【0023】
吸着層部分14A,14Bの比誘電率率ε1ε2が共に1の場合の被吸着物18に作用する吸着力を1として、吸着力は相対値として示した。吸着力は、厚さ0.1mmの紙を吸着層の上に間隔を空けてその吸着層に並行に両端を固定して配置し、その固定した紙の垂直方向のたわみ量の相対値で示し評価した。
【0024】
図3より、番号(2)〜(4)のデータを見ると、電極間の同じ比誘電率の吸着層部分14Bに対して、電極上の吸着層部分14Aは比誘電率を2.5,30,50と大きくするほど吸着力は1.25,2.23,2.25と大きくなっていくことが分かる。
同様に、番号(5)〜(6)、番号(7)〜(8)のデータからも、電極間の同じ比誘電率の吸着層部分14Bに対して、電極上の吸着層部分14Aは比誘電率を大きくするほど吸着力は大きくなっていくことが分かる。
これに対して、電極間の吸着層部分14Bと電極上の吸着層部分14Aとで比誘電率を同じ比誘電率とする場合の吸着力は、番号(1),(3),(7)で夫々1,1.25,1.33と示されるように電極上の吸着層部分14Aの比誘電率を電極間の吸着層部分14Bの比誘電率より大きくする場合と比較すると、いずれも小さいことが分かる。
【0025】
電極間の吸着層部分14Bの比誘電率に対して電極上の吸着層部分14Aの比誘電率の比を大きくするほど吸着力は大きくなっていくことが分かる。電極上の吸着層部分14Aの比誘電率は20以上程度で、電極間部の吸着層部分14Bの比誘電率は5以下程度(番号(6)の場合)にするのがよい。
【0026】
また、電極上の吸着層部分14Aの比誘電率が20未満では吸着力の向上が顕著には認められず、図3には示されていないが、100以上では、吸着層部分14Aを構成するベース、例えばエポキシ樹脂等に高比誘電率体(比誘電率100〜300程度)であるチタン酸バリウムの粉体を混錬、塗布して作製するが、比誘電率が100以上になると、チタン酸バリウム粉体の充填率を上げるために粘度が上がり、容易にシート状に塗布出来なくなる問題がおこる。
【0027】
(B)吸着力と電極幅Lと電極間隔Sとの関係について
図4に電極間隔Sに対して電極幅Lを変化させた場合の吸着力(相対値)の変化を示す。ここで、電極上の吸着層の比誘電率ε1は50、電極間部の吸着層の比誘電率ε2は5とした。
【0028】
電極間隔Sを3mmとして、電極幅Lを10〜1.5mmとしてS/L=0.3〜2と変化させると、それに対応して吸着力(相対値)は、18.1〜83と増大していく。
【0029】
具体的には、吸着層を上記高比誘電率と低比誘電率をなす2種類の誘電体で構成し、櫛歯状部の電極幅Lと電極間隔Sの比(S/L)をより大きくした(電極間隔幅Sに対して電極幅Lをより小さくした)構成の櫛歯状電極とすることにより、吸着力をさらに大きく出来ることが分かる。これより、単位長さ当りの端面部(電極断面の両端部)の出現回数を多くするのが被吸着物18の吸着力を大きくするのに有効であることが分かる。
【0030】
電極幅Lをより細く、電極間隔Sを放電しない範囲でより狭くするとよい。実施例は電極幅L=2mm、電極間隔S=5mmである。電極間隔Sを狭くすると、ある値から放電してしまうので、それらを勘案して3〜5mmで作製した。
【0031】
櫛歯状電極間には通常500V〜3KVの直流電圧を印加するので、電極間で放電が生じない間隔、すなわち3mm以上離して櫛歯状電極を設置するとよい。
【0032】
また、紙、OHPシート等の平面状の被吸着物18を吸着する場合、吸着層14Aの上には電荷が帯電しているので、そのまま電極がむき出しの状態では、手等を通して放電することがある。この放電を防止するために、低比誘電率体の保護膜16を吸着層部分14A14Bの上に形成した。
【0033】
この保護膜16は厚くなると吸着力を劣化させるので、0.2mm以下で吸着層より薄く、望ましくは0.1mm程度がよい。この厚さ0.1mmの保護膜16を設置することによる吸着力の低下は、電極上の比誘電率ε1=50、電極間の比誘電率ε2=5の場合、吸着力(相対値)は1.90となり、保護膜16がない場合の吸着力(相対値)2.06に対して8%程度小さくなる。
【0034】
本実施例の静電吸着装置は、吸着層部分14A,14Bの表面に被吸着物18を接触させると被吸着物18の各電極(正電極12、負電極13)と対向する部分に、それぞれ静電誘導により各電極12,13の電荷と異極性の電荷が発生する。
従って、被吸着物18に生じた電荷と各電極12,13の電荷との間に静電的吸引力が作用して被吸着物18を吸着層部分14A,14Bの表面に吸着保持するものである。
【0035】
電荷との間の静電的吸引力は、電極間の比誘電率より電極上の比誘電率の方を大きくしたので、電極上(電極端部)での電気力線の密度が大きくなり、電極上での静電保持力は従来よりも大きく出来、被吸着物の吸着力をより大きく出来るものである。
【0036】
【発明の効果】
以上に説明したように、本発明の静電吸着装置によると、絶縁体からなる基板と、前記基板上に互いに離間して噛み合うように配置した一対の櫛歯状電極と、前記一対の櫛歯状電極上及び前記一対の櫛歯状電極間を覆ってその表面が平坦になるように形成した吸着層とを有し、前記一対の櫛歯状電極間に直流電圧を印加して前記一対の櫛歯状電極間に静電界を発生させて前記吸着層上に載せた被吸着物を前記吸着層に吸着させる静電吸着装置において、前記一対の櫛歯状電極上の前記吸着層部分を第1の誘電体により形成すると共に前記一対の櫛歯状電極間の前記吸着層部分を第2の誘電体によりそれぞれ形成して、前記第1の誘電体の比誘電率を前記第2の誘電体の比誘電率より大きくしたので、吸着力がより大きくなり、被吸着物のカールやシワを十分に補正出来る静電保持力が得られる。
【図面の簡単な説明】
【図1】本発明の静電吸着装置の実施例の構成を示した斜視図である。
【図2】図1のA‐A部分の断面図である。
【図3】電極上の吸着層の比誘電率及び電極間の吸着層の比誘電率を変化させた場合の吸着力(相対値)を示した図である。
【図4】電極間隔と電極幅とを変化させた場合の吸着力(相対値)を示した図である。
【図5】従来例の静電吸着装置の断面図を示す。
【符号の説明】
10 静電吸着装置
11 基板
12 正電極
13 負電極
14 吸着層
14A 一対の櫛歯状電極12,13上に形成された吸着層部分(第1の誘電体)
14B 一対の櫛歯状電極12,13間に形成された吸着層部分(第1の誘電体より小さな比誘電率を有する第2の誘電体)
16 保護膜
17 直流電源
18 被吸着物
L 電極幅
S 電極間隔
ε1 吸着層14Aの比誘電率
ε2 吸着層14Bの比誘電率
[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to an electrostatic attraction device that adsorbs an object using electrostatic force, and more particularly to an electrostatic attraction device that obtains a large electrostatic attraction force to adsorb an object.
[0002]
[Prior art]
In recent years, plotters and digitizers equipped with an electrostatic attraction device that holds an object to be attracted such as paper, OHP sheet, plastic sheet, etc. without damaging the object by electrostatic attraction force without using a thumbtack or a magnet have been developed. It has been commercialized.
In these electrostatic chucks, a sheet-shaped plastic is placed on a pair of comb-shaped electrodes arranged on a substrate, and a DC voltage is applied between the pair of comb-shaped electrodes to apply a DC voltage to the surface of the sheet-shaped plastic. An object to be adsorbed such as paper is placed on a sheet and electrostatically held by electrostatic force (for example, see Patent Document 1).
An electrostatic attraction device described in Patent Document 1 will be described with reference to the drawings as a conventional electrostatic attraction device.
[0003]
FIG. 5 is a sectional view of a conventional electrostatic chuck.
As shown in FIG. 5, the apparatus includes an adsorbing layer 51 formed of a plastic sheet for adsorbing an object 55 to be adsorbed, and an insulating layer 52 made of polyvinyl chloride (plastic) that can be thermocompression-bonded to the adsorbing layer 51. And a pair of combs arranged such that conductors 53a, 53c, 53e serving as positive electrodes and conductors 53b, 53d, 53f serving as negative electrodes, which are embedded in the insulating layer 52 at intervals, are spaced apart from each other and mesh with each other. It is composed of a plurality of conductors 53a to 53f forming toothed electrodes and a DC power supply 54 for applying a high DC voltage between these two electrode groups.
The attraction layer 51 is made of a dielectric material having a specific dielectric constant such as a resin such as hard polyvinyl chloride (a relative dielectric constant is about 5) so as to cover the insulating layer 52 and the plurality of conductors 53a to 53f. It is configured.
[0004]
In this device, when the object 55 is brought into contact with the surface of the adsorption layer 51, as shown in the figure, the charges of the opposite polarity to the electrodes 53 a to 53 f are applied to the parts of the object 55 by electrostatic induction. Occurs.
Therefore, an electrostatic attraction force acts between the electric charge generated on the object 55 and the electric charge of each of the electrodes 53 a to 53 f, thereby adsorbing and holding the object 55 on the surface of the adsorption layer 51.
[0005]
In this apparatus, the conductors 53a to 53f and the insulating layer 52 are integrally formed by thermocompression bonding to the adsorption layer 51 using the same kind of plastic. Performance can be stably maintained over a long period of time.
However, in the case of an object to be adsorbed that requires a large holding force, it is difficult to increase the holding force because there is a limit in handling the structure as it is.
[0006]
Further, as an example of the improvement of the holding power, the voltage applied to the holding surface is reduced by imparting conductivity to the holding surface of the object to be suctioned, and the voltage applied between the electrode and the suction holding surface is effectively increased. There is one that increases the electrostatic holding force and improves the attraction force (for example, see Patent Document 2).
However, even when this method was implemented, it was not possible to flatly adsorb and hold a paper or a plastic sheet having curls or lightly wrinkles.
[0007]
[Patent Document 1]
Japanese Utility Model Publication No. 54-41892 (Page 2, FIG. 1)
[Patent Document 2]
JP-A-6-274114 (page 5)
[0008]
[Problems to be solved by the invention]
Therefore, in the above-mentioned conventional example, when the object to be adsorbed (the object to be held) such as paper or plastic sheet is curled or lightly wrinkled, the electrostatic holding cannot be performed sufficiently, and the curling or wrinkling is sufficiently prevented. There is a problem that the object cannot be electrostatically held flat by correction.
The present invention has been made in order to solve such a problem, and an object of the present invention is to provide an electrostatic attraction device that can increase an attraction force and hold an object to be electrostatically held flat. Aim.
[0009]
[Means for Solving the Problems]
To solve this problem, the invention described in claim 1 is:
A substrate 11 made of an insulator; a pair of comb-shaped electrodes 12 and 13 arranged on the substrate 11 so as to be spaced apart from each other; and a pair of comb-teeth electrodes 12 and 13 and a pair of comb-teeth An adsorption layer 14 formed so as to cover the space between the electrodes 12 and 13 so that the surface thereof is flat,
A DC voltage is applied between the pair of comb-shaped electrodes to generate an electrostatic field between the pair of comb-shaped electrodes 12 and 13, and the object 18 placed on the adsorption layer 14 is moved to the adsorption layer 14. In the electrostatic chucking device that sucks
The adsorbing layer portion 14A on the pair of comb-shaped electrodes 12, 13 is formed of a first dielectric, and the adsorbing layer portion 14B between the pair of comb-shaped electrodes 12, 13 is formed of a second dielectric. Respectively formed by
It is an object of the present invention to provide an electrostatic attraction device characterized in that the relative permittivity of the first dielectric is larger than the relative permittivity of the second dielectric.
[0010]
BEST MODE FOR CARRYING OUT THE INVENTION
An embodiment of the electrostatic attraction device of the present invention will be described below with reference to the drawings using a preferred embodiment.
<Example>
FIG. 1 is a perspective view showing the configuration of an embodiment of the electrostatic suction device of the present invention, and FIG. 2 is a cross-sectional view taken along the line AA in FIG.
[0011]
As shown in FIGS. 1 and 2, an electrostatic attraction device 10 according to an embodiment of the present invention includes a substrate 11 made of an insulator, and a pair of comb-shaped electrodes arranged on the substrate 11 so as to be separated from each other and engaged with each other. 12, 13; an adsorbing layer portion 14A formed on the pair of comb-shaped electrodes 12, 13; and an adsorbing layer portion having a lower relative dielectric constant than the adsorbing layer portion 14A formed between the pair of comb-shaped electrodes 12, 13. 14B, a protective film 16, and a DC power supply 17 for applying a direct current (DC) voltage between the pair of comb-shaped electrodes 12, 13.
[0012]
In the embodiment of the present invention, an electrostatic field is generated on the pair of comb-shaped electrodes 12, 13 by applying a direct current (DC) voltage between the pair of comb-shaped electrodes 12, 13 made of a conductive material. This is an electrostatic attraction device configured to adsorb the object 18 placed on the attraction layer 14 (attraction layer portions 14A and 14B).
[0013]
In the present embodiment, the electrostatic attraction device according to the present embodiment has been constituted by an adsorption layer having one kind of relative permittivity. However, the adsorption layer portion 14A on the pair of comb-shaped electrodes 12 and 13 is used. And the attraction layer portion 14B between the pair of comb-shaped electrodes 12 and 13, wherein the relative permittivity of the attraction layer portion 14A is larger than the relative permittivity of the attraction layer portion 14B.
[0014]
Next, each configuration of this embodiment will be described with reference to FIGS.
In this embodiment, an object 18 such as a paper, an OHP sheet, a plastic sheet or the like corresponding to A4 to B5 is adsorbed. The substrate 11 made of an insulator has a size of 230 mm in length, 320 mm in width, and 5 mm in thickness. Use an epoxy substrate containing glass fiber.
[0015]
As shown in FIG. 1, a pair of comb-shaped electrodes (positive electrode 12 and negative electrode 13) have a plurality of conductors arranged in parallel on the substrate 11, and the left ends of the plurality of conductors are alternately provided. Then, the right ends of the remaining plurality of conductors are connected, and the plurality of conductors (positive electrode 12) connected to their left ends and the plurality of conductors (negative electrode 13) connected to their right ends are separated from each other. It is arranged on the substrate 11 so as to be engaged with.
The pair of comb-shaped electrodes 12 and 13 are formed by etching a copper plate having a length of 230 mm, a width of 320 mm, and a thickness of 75 μm by a copper conductive material width (electrode width) of 2 mm and a copper conductive material width interval (electrode interval) of 5 mm at equal intervals. A plurality of copper conductive materials are alternately connected and formed on the substrate 11 so as to face each other and mesh with each other in a comb shape. Note that a plurality of copper conductive materials may be embedded in the substrate 11.
[0016]
An adsorption layer (high relative dielectric constant) 14A having a thickness of 0.2 to 0.7 mm among the adsorption layers 14 formed on the substrate 11 is formed on the pair of comb-shaped electrodes 12 and 13, The adsorbing layer (high relative dielectric constant) portion 14A has a relative dielectric constant of 30 selected from polyester carbonate, polyvinyl chloride, acrylic, polycarbonate or the like mixed with 90% of barium titanate (BaTiO 3 ) powder. In the case of a mask having a thickness of about 0.2 to 0.7 mm, the positions of the electrodes 12 and 13 match the positions of the masks where the electrodes 12 and 13 of the mask are cut. The electrodes 12 and 13 are formed by spraying or the like on the mask.
[0017]
An adsorbing layer (low dielectric constant) portion 14B having a thickness of 0.2 to 0.7 mm among the adsorbing layers formed on the substrate 11 is formed between a pair of comb-shaped electrodes 12 and 13 and formed of silica. 90% powder mixed carbonated polyester, polyvinyl chloride, acrylic, polycarbonate, etc., having a relative dielectric constant of about 4 to 5 A mask of 0.2 to 0.7 mm is arranged so that the position of the portion without the electrodes 12 and 13 and the position of the cut portion of the portion without the electrodes 12 and 13 of this mask coincide with each other. It is formed by spraying or the like on a portion having no electrodes 12 and 13.
[0018]
After removing the mask, the protective film 16 is further coated with a material of the same material as that of the adsorption layer 14B on the adsorption layer 14A and the adsorption layer 14B by about 0.01 to 0.1 mm by spraying or the like to remove irregularities on the surface. It is formed by smoothing. The protective film 16 is formed including an antistatic agent.
[0019]
The DC power supply 17 is coupled between a pair of spaced apart and interdigitated comb-shaped electrodes (positive electrode 12 and negative electrode 13). The DC power supply 17 turns on a power switch (not shown) with an applied voltage of 300 to 3000 V DC when the object 18 is held on the adsorption layer 14 (adsorption layer portions 14A and 14B) via the protective film 16 (current). (Approximately 10 μA), and is turned off when the object 18 is removed.
This is the end of the description of each component of the electrostatic chuck according to the present embodiment.
[0020]
Next, a method of increasing the attraction force already applied to the above-described embodiment (the attraction layer is formed between the pair of comb-shaped electrodes 12, 13 at the surface 14 A and the attraction layer between the pair of comb-shaped electrodes 12, 13). The relative dielectric constant of the adsorbing layer portion 14A, which is divided into the portion 14B and the relative dielectric constant of the adsorbing layer portion 14B, is further described with reference to FIGS.
[0021]
(A) Relationship between Adsorption Force, Relative Dielectric Constant of Adsorption Layer on Electrode and Relative Dielectric Constant of Adsorption Layer Between Electrodes As shown in FIG. An adsorbing layer portion 14B was provided between 12 and 13.
[0022]
The relative permittivity and the adsorption when the relative permittivity of the material constituting the adsorbing layer portion 14A and the adsorbing layer portion 14B is changed (the relative permittivity of the adsorbing layer portions 14A and 14B are ε1 and ε2). FIG. 3 shows the relationship with the force.
[0023]
When the relative permittivity ε1 and ε2 of the adsorption layer portions 14A and 14B are both 1, the adsorption force acting on the object 18 is 1 and the adsorption force is shown as a relative value. The suction force is indicated by the relative value of the vertical deflection of the fixed paper with a 0.1 mm thick paper placed on the suction layer at an interval and fixed at both ends in parallel with the suction layer. evaluated.
[0024]
Referring to the data of numbers (2) to (4) from FIG. 3, the adsorbed layer portion 14A on the electrode has a relative dielectric constant of 2.5, whereas the adsorbed layer portion 14A on the electrode has the same relative dielectric constant between the electrodes. It can be seen that the adsorption force increases as 1.25, 2.23, and 2.25 as it increases to 30,50.
Similarly, from the data of Nos. (5) to (6) and Nos. (7) to (8), the adsorbed layer portion 14A on the electrode has a specific ratio with respect to the adsorbed layer portion 14B having the same relative dielectric constant between the electrodes. It can be seen that as the dielectric constant increases, the attraction force increases.
On the other hand, when the relative dielectric constant of the attraction layer portion 14B between the electrodes and the attraction layer portion 14A on the electrodes are the same, the attraction force is represented by numbers (1), (3), and (7). As shown by 1, 1.25 and 1.33, respectively, when compared with the case where the relative dielectric constant of the adsorbing layer portion 14A on the electrode is larger than the relative dielectric constant of the adsorbing layer portion 14B between the electrodes, all are smaller. You can see that.
[0025]
It can be seen that as the ratio of the relative permittivity of the attraction layer portion 14A on the electrode to the relative permittivity of the attraction layer portion 14B between the electrodes increases, the attraction force increases. The relative permittivity of the attraction layer portion 14A on the electrode is preferably about 20 or more, and the relative permittivity of the attraction layer portion 14B between the electrodes is preferably about 5 or less (in the case of the number (6)).
[0026]
Further, when the relative permittivity of the adsorbing layer portion 14A on the electrode is less than 20, the remarkable improvement in the adsorbing power is not recognized, and it is not shown in FIG. 3, but when it is 100 or more, the adsorbing layer portion 14A is constituted. It is manufactured by kneading and applying a powder of barium titanate, which is a high dielectric constant substance (relative dielectric constant of about 100 to 300), to a base, for example, an epoxy resin or the like. In order to increase the filling rate of the barium acid powder, the viscosity increases, which causes a problem that the coating cannot be easily performed in a sheet shape.
[0027]
(B) Relationship Between Adsorption Force, Electrode Width L, and Electrode Interval S FIG. 4 shows a change in the adsorption force (relative value) when the electrode width L is changed with respect to the electrode interval S. Here, the relative permittivity ε1 of the adsorbing layer on the electrode was 50, and the relative permittivity ε2 of the adsorbing layer between the electrodes was 5.
[0028]
When the electrode interval S is 3 mm and the electrode width L is 10 to 1.5 mm and S / L is changed to 0.3 to 2, the attraction force (relative value) increases to 18.1 to 83 correspondingly. I will do it.
[0029]
Specifically, the adsorbing layer is composed of two kinds of dielectric materials having the above-mentioned high relative permittivity and low relative permittivity, and the ratio (S / L) of the electrode width L and the electrode interval S of the comb-tooth-like portion is more improved. It can be seen that the suction force can be further increased by using a comb-shaped electrode having a configuration in which the electrode width L is made smaller than the electrode interval width S. From this, it can be seen that increasing the number of appearances of the end faces (both ends of the electrode cross section) per unit length is effective in increasing the attraction force of the object 18 to be adsorbed.
[0030]
It is preferable that the electrode width L is narrower and the electrode interval S is narrower in a range where no discharge occurs. In the embodiment, the electrode width L is 2 mm and the electrode interval S is 5 mm. If the electrode interval S is reduced, the discharge starts at a certain value.
[0031]
Since a DC voltage of 500 V to 3 KV is usually applied between the comb-shaped electrodes, it is preferable to set the comb-shaped electrodes at an interval where no discharge occurs between the electrodes, that is, at a distance of 3 mm or more.
[0032]
Further, when a flat object 18 such as paper or an OHP sheet is adsorbed, the electric charge is charged on the adsorbing layer 14A. Therefore, when the electrode is bare, it is possible to discharge through a hand or the like. is there. In order to prevent this discharge, a protective film 16 of a low dielectric constant is formed on the adsorption layer portions 14A and 14B.
[0033]
When the thickness of the protective film 16 is increased, the attraction force is degraded. Therefore, the thickness of the protective film 16 is 0.2 mm or less, which is thinner than the attraction layer, preferably about 0.1 mm. The decrease in the adsorbing force due to the provision of the protective film 16 having a thickness of 0.1 mm is caused by the fact that the adsorbing force (relative value) is obtained when the relative permittivity ε1 = 50 on the electrodes and the relative permittivity ε2 = 5 between the electrodes. 1.90, which is about 8% smaller than the attraction force (relative value) of 2.06 when the protective film 16 is not provided.
[0034]
When the object 18 is brought into contact with the surfaces of the adsorbing layers 14A and 14B, the electrostatic attraction device of this embodiment is applied to the portions of the object 18 facing the electrodes (positive electrode 12 and negative electrode 13), respectively. Due to the electrostatic induction, charges having polarities different from those of the electrodes 12 and 13 are generated.
Therefore, an electrostatic attraction force acts between the electric charge generated on the object 18 and the electric charge of each of the electrodes 12 and 13, thereby adsorbing and holding the object 18 on the surfaces of the adsorption layer portions 14A and 14B. is there.
[0035]
Since the electrostatic attraction between the charge and the relative permittivity on the electrode is larger than the relative permittivity between the electrodes, the density of lines of electric force on the electrode (electrode end) increases, The electrostatic holding force on the electrode can be made larger than before, and the adsorbing force of the object to be adsorbed can be made larger.
[0036]
【The invention's effect】
As described above, according to the electrostatic suction device of the present invention, a substrate made of an insulator, a pair of comb-shaped electrodes arranged on the substrate so as to be separated from each other and mesh with each other, and the pair of comb-shaped electrodes An adsorption layer formed so as to cover the interdigital electrode and between the pair of comb-shaped electrodes so that the surface is flat, and apply a DC voltage between the pair of comb-shaped electrodes to In an electrostatic attraction device for generating an electrostatic field between the comb-shaped electrodes and adsorbing the adsorbed object placed on the adsorption layer to the adsorption layer, the adsorption layer portion on the pair of comb-shaped electrodes is A first dielectric, and a portion of the attraction layer between the pair of comb-teeth-shaped electrodes is formed of a second dielectric, and the relative permittivity of the first dielectric is adjusted by the second dielectric. Is higher than the relative dielectric constant of And electrostatic holding force can be sufficiently corrected the wrinkles can be obtained.
[Brief description of the drawings]
FIG. 1 is a perspective view showing a configuration of an embodiment of an electrostatic suction device of the present invention.
FIG. 2 is a sectional view taken along the line AA of FIG.
FIG. 3 is a diagram showing the attraction force (relative value) when the relative permittivity of the attraction layer on the electrode and the relative permittivity of the attraction layer between the electrodes are changed.
FIG. 4 is a diagram showing an attractive force (relative value) when an electrode interval and an electrode width are changed.
FIG. 5 is a sectional view of a conventional electrostatic attraction device.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 10 Electrostatic adsorption apparatus 11 Substrate 12 Positive electrode 13 Negative electrode 14 Adsorption layer 14A Adsorption layer part (1st dielectric material) formed on a pair of comb-shaped electrodes 12 and 13
14B Adsorption layer portion formed between the pair of comb-shaped electrodes 12 and 13 (second dielectric having a lower relative dielectric constant than the first dielectric)
Reference Signs List 16 Protective film 17 DC power supply 18 Adsorbed object L Electrode width S Electrode spacing ε1 Relative dielectric constant of adsorption layer 14A ε2 Relative dielectric constant of adsorption layer 14B

Claims (1)

絶縁体からなる基板と、前記基板上に互いに離間して噛み合うように配置した一対の櫛歯状電極と、前記一対の櫛歯状電極上及び前記一対の櫛歯状電極間を覆ってその表面が平坦になるように形成した吸着層とを有し、
前記一対の櫛歯状電極間に直流電圧を印加して前記一対の櫛歯状電極間に静電界を発生させて前記吸着層上に載せた被吸着物を前記吸着層に吸着させる静電吸着装置において、
前記一対の櫛歯状電極上の前記吸着層部分を第1の誘電体により形成すると共に前記一対の櫛歯状電極間の前記吸着層部分を第2の誘電体によりそれぞれ形成して、
前記第1の誘電体の比誘電率を前記第2の誘電体の比誘電率より大きくしたことを特徴とする静電吸着装置。
A substrate made of an insulator, a pair of comb-shaped electrodes disposed on the substrate so as to be spaced apart from each other and meshing with each other, and a surface covering the pair of comb-shaped electrodes and between the pair of comb-shaped electrodes Has an adsorption layer formed so as to be flat,
Electrostatic adsorption in which a direct current voltage is applied between the pair of comb-shaped electrodes to generate an electrostatic field between the pair of comb-shaped electrodes and the object to be adsorbed placed on the adsorption layer is adsorbed to the adsorption layer. In the device,
Forming the attraction layer portion on the pair of comb-shaped electrodes by a first dielectric and forming the attraction layer portion between the pair of comb-teeth electrodes by a second dielectric;
An electrostatic attraction device, wherein a relative dielectric constant of the first dielectric is larger than a relative dielectric constant of the second dielectric.
JP2003010873A 2003-01-20 2003-01-20 Electrostatic chuck device Pending JP2004229342A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008244149A (en) * 2007-03-27 2008-10-09 Taiheiyo Cement Corp Electrostatic chuck and manufacturing method thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008244149A (en) * 2007-03-27 2008-10-09 Taiheiyo Cement Corp Electrostatic chuck and manufacturing method thereof

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