JP2004228510A5 - - Google Patents
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- JP2004228510A5 JP2004228510A5 JP2003017686A JP2003017686A JP2004228510A5 JP 2004228510 A5 JP2004228510 A5 JP 2004228510A5 JP 2003017686 A JP2003017686 A JP 2003017686A JP 2003017686 A JP2003017686 A JP 2003017686A JP 2004228510 A5 JP2004228510 A5 JP 2004228510A5
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- JP
- Japan
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Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003017686A JP2004228510A (ja) | 2003-01-27 | 2003-01-27 | 半導体装置および半導体製造工程管理方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003017686A JP2004228510A (ja) | 2003-01-27 | 2003-01-27 | 半導体装置および半導体製造工程管理方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2004228510A JP2004228510A (ja) | 2004-08-12 |
JP2004228510A5 true JP2004228510A5 (ja) | 2006-07-06 |
Family
ID=32904780
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2003017686A Pending JP2004228510A (ja) | 2003-01-27 | 2003-01-27 | 半導体装置および半導体製造工程管理方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2004228510A (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4252056B2 (ja) | 2005-09-27 | 2009-04-08 | 富士通マイクロエレクトロニクス株式会社 | 半導体装置のコンタクト不良検査方法及びその検査方法が適用される半導体装置 |
KR101385752B1 (ko) * | 2008-10-24 | 2014-04-17 | 삼성전자주식회사 | 입출력 패드 영역과 중첩되는 공정 모니터링 패턴을 포함하는 반도체 소자 |
CN104425293B (zh) * | 2013-08-26 | 2017-05-17 | 中芯国际集成电路制造(上海)有限公司 | 一种监测sram通孔开路的测试结构及其形成方法 |
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2003
- 2003-01-27 JP JP2003017686A patent/JP2004228510A/ja active Pending