JP2004224972A5 - - Google Patents
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- JP2004224972A5 JP2004224972A5 JP2003016444A JP2003016444A JP2004224972A5 JP 2004224972 A5 JP2004224972 A5 JP 2004224972A5 JP 2003016444 A JP2003016444 A JP 2003016444A JP 2003016444 A JP2003016444 A JP 2003016444A JP 2004224972 A5 JP2004224972 A5 JP 2004224972A5
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- JP
- Japan
- Prior art keywords
- cured
- compositions
- minutes
- heated
- preparation
- Prior art date
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Description
（実験例：硬化塗膜作成）
組成物１〜８を厚さ０．８ｍｍのＳＰＣＣテストピース（日本テストパネル社製）に１００μｍのドクターブレードで塗布した。これを１２０℃に加熱してある送風乾燥機に入れ、１０分加熱硬化させた。
(Experimental example: Preparation of cured coating)
Compositions 1 to 8 were applied to a 0.8 mm-thick SPCC test piece (manufactured by Nippon Test Panel Co., Ltd.) using a 100 μm doctor blade. This was put into a blow dryer that was heated to 120 ° C., and was heated and cured for 10 minutes.
（実験例：硬化物作成）
組成物１〜８を内径５ｃｍ、深さ１．０ｃｍのＳＵＳ製型枠に入れ、１００℃で３０分加熱硬化させた。室温まで冷却したのち、型枠から外した。
(Experimental example: Preparation of cured product)
Compositions 1 to 8 were placed in a SUS mold having an inner diameter of 5 cm and a depth of 1.0 cm, and were cured by heating at 100 ° C. for 30 minutes. After cooling to room temperature, it was removed from the mold.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003016444A JP2004224972A (en) | 2003-01-24 | 2003-01-24 | Curable composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003016444A JP2004224972A (en) | 2003-01-24 | 2003-01-24 | Curable composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2004224972A JP2004224972A (en) | 2004-08-12 |
| JP2004224972A5 true JP2004224972A5 (en) | 2006-01-19 |
Family
ID=32903899
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2003016444A Pending JP2004224972A (en) | 2003-01-24 | 2003-01-24 | Curable composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2004224972A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4531338B2 (en) * | 2003-01-24 | 2010-08-25 | 電気化学工業株式会社 | Curable composition |
| JP2011233465A (en) * | 2010-04-30 | 2011-11-17 | Hitachi Chem Co Ltd | Resin composition for electric equipment insulation and electric equipment processed using the same |
-
2003
- 2003-01-24 JP JP2003016444A patent/JP2004224972A/en active Pending
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