JP2004224408A - Package for electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To prevent an electronic component 3 placed in a component storage recess 2 from protruding on the surface of a base material laminae 1 by the swell of the bottom 2a of the recess as to an electronic component package comprising the cardboard base material laminae 1 having in a line form a plurality of recesses 2 formed by pressing a pressing mold for denting a surface 1a and a cover film 4 separably adhered covering the recesses on the surface of the laminae. <P>SOLUTION: A back face recess 5 having a bottom area larger than the storage recess is formed by a pressing mold pressed on an area corresponding to the component storage recess on the back face 1b of the base material laminae 1. <P>COPYRIGHT: (C)2004,JPO&NCIPI

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a cardboard base plate having a component accommodating recess for accommodating an electronic component such as a chip-type resistor, and a cover film adhered to a surface of the substrate plate so as to cover the component accommodating recess. And a package comprising:
[0002]
[Prior art]
Conventionally, as shown in FIGS. 1 and 2, a cardboard base plate 1 is formed into a tape shape in one of such packages, and a press die is pressed into the surface 1a of the base plate 1. The component receiving recesses 2 formed by recessing are provided in a row at appropriate intervals along the longitudinal direction, and at least one of the electronic components 3 such as a chip type resistor is provided in each component receiving recess 2. There is a configuration in which a cover film 4 is removably adhered to the surface 1a of the base plate 1 after the components are loaded so as to cover the component receiving recesses 2 (for example, Patent Document 1 and the like). See).
[0003]
[Patent Document 1]
JP-A-11-227870
[Problems to be solved by the invention]
In the package having this configuration, as described above, a part receiving recess 2 is formed by partially depressing a part of the surface 1 a of the cardboard base plate 1 by pressing the press die 10. As a result, the bottom portion 2a of the component housing recess 2 is formed by crushing a cardboard having a thickness T to a small thickness T1 and deforming it.
[0005]
For this reason, the bottom portion 2a in the component receiving recess 2 is formed by crushing and deforming the paper fiber, so that the elastic restoring stress remaining in the paper fiber causes the two-dot chain line 2a in FIG. As shown by ′, the tendency to restore to the swelled state in the middle, that is, the spring back to the original shape, and the springback to be restored to the swelled state in the middle, It becomes larger in proportion to the lapse of time since the receiving recess 2 was formed by pressing the press die.
[0006]
Due to the springback generated in the bottom portion 2a, the electronic component 3 put in each component accommodating recess 2 in the base plate 1 is removed from the component accommodating recess 2 when the electronic component 3 is taken out from the component accommodating recess 2. When the cover film 4 on the surface 1a is peeled off, the bottom portion 2a bulges in a middle height, as shown by a two-dot chain line in FIG. In this case, the tip of the tape-shaped base plate 1 is loaded into an automatic mounting device that automatically supplies each electronic component 3 on the base plate 1 to a printed circuit board or the like. When, for example, the electronic components 3 of the base plate 1 that are protruding from the surface 1a of the base plate 1 fall out of the component housing recess 2 and disappear. There is a problem that often occurs.
[0007]
Meanwhile, the depth dimension H1 of each of the component receiving recesses 2 in the base plate 1 is set to a size having a margin to the height dimension H0 of the electronic component 3 to be inserted therein, while the base plate 1 1, the thickness T is set to the sum of the depth H1 of the component housing recess 2 and the thickness T1 of the bottom portion 2a. In this case, in the conventional package, the thickness dimension T1 of the bottom portion 2a is set to a value that minimizes springback in the bottom portion 2a as much as possible or almost eliminates springback. By setting, the thickness dimension T in the base body 1 is determined by the depth dimension H1 in the component accommodating recess 2 formed in the base body 1 and, consequently, the height dimension H0 in the electronic component 3 for packaging. That is, as the base plate 1, every time the height H0 of the electronic component 3 for packaging is changed, the base plate 1 having a thickness T adapted to the height H0 is prepared. In other words, in other words, when the height dimension H0 of the electronic component 3 for packaging is changed, the base body 1 in the package must be changed to a thickness T corresponding thereto. There.
[0008]
Therefore, in the automatic loading device for loading the electronic component 3 into each of the component receiving recesses 2 in the base body 1 and the automatic mounting device described above, every time the size of the electronic component changes, the electronic component is eventually replaced. Each time the thickness dimension T of the base plate 1 to be packaged is changed, it has to be adjusted and set to correspond to the thickness dimension T, which requires a lot of trouble and time. Moreover, since the base plates having different thicknesses by the number of sizes in the electronic component 3 are required, there is a problem that the cost is significantly increased.
[0009]
An object of the present invention is to provide a package that solves these problems.
[0010]
[Means for Solving the Problems]
In order to achieve this technical object, claim 1 of the present invention provides
`` A cardboard base plate provided with a plurality of component receiving recesses formed by pressing a press die into the surface to form a recess, and the component receiving recesses are provided on the surface of the base plate. In a package for electronic parts comprising a cover film that is peelably adhered so as to close,
A back surface recess having a larger bottom area than the bottom surface of the component housing recess is formed in a portion corresponding to each of the component housing recesses on the back surface of the base plate by pressing a press die. "
It is characterized by:
[0011]
Claim 2 of the present invention
"In the description of the first aspect, each of the back surface recesses is formed in a groove shape that is continuous in the row direction of each of the component housing recesses."
It is characterized by:
[0012]
Furthermore, claim 3 of the present invention
"In the first or second aspect, the depth of the back surface recess is shallow when the depth in the component housing recess is deep, and is deep when the depth in the component housing recess is shallow."
It is characterized by:
[0013]
[Action and Effect of the Invention]
As described above, in a portion corresponding to each of the component receiving recesses on the back surface of the base plate, the rear surface recess having a bottom area larger than the bottom area in the component receiving recess is recessed by pressing a press die. By forming, the spring back does not occur on the whole of the bottom portion of each component accommodating recess, or until the spring back hardly occurs, it is crushed almost completely by the formation of the back surface recess. Since the electronic component can be deformed, the electronic component placed in the component receiving recess is projected from the surface of the base plate, and thus the electronic component in the component receiving recess is automatically mounted by the automatic mounting device. This has the effect of reliably reducing spilling and disappearing.
[0014]
Further, by forming the backside recess into a continuous groove shape for a plurality of component housing recesses as described in claim 2, processing for forming the backside recess is easier. There are advantages that can be done.
[0015]
And, as described in claim 3, by making the depth of the back surface recess shallow when the depth in the component housing recess is deep, and deep when the depth in the component housing recess is shallow, A plurality of types of electronic components having different sizes can be accommodated in a base plate having the same thickness dimension. In other words, it is necessary to change the thickness dimension of the base plate according to the size of the electronic component. In addition, since multiple types of electronic components of different sizes can be packaged using a base plate with the same thickness, the cost required for packaging can be significantly reduced, and the same applies to electronic components of multiple sizes. Since a base plate having a thickness is used, in the automatic loading device and the automatic mounting device for the electronic component on the base plate, it is greatly reduced to adjust and set the thickness according to the thickness of the base plate. It has the effect that the kill.
[0016]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
[0017]
3 to 7 show the first embodiment. In this figure, reference numeral 1 denotes a tape-shaped base plate made of cardboard as shown in FIG. 1, and a surface 1a of the base plate 1 is formed by pressing a press die into a recess. The component accommodating recesses 2 are provided in a row at appropriate intervals along the longitudinal direction.
[0018]
In this case, the component receiving recess 2 is rectangular in plan view, and the depth H1, the length L1, and the width W1 of the rectangular shape from the surface 1a of the base plate 1 are the same as those of the component receiving recess. The height of the height H0, the length L0, and the width W0 of the electronic component 3 placed in the place 2 is appropriately increased so as to have some margin.
[0019]
In the tape-shaped base plate 1, feed holes 6 are formed at one end edge in the longitudinal direction at appropriate intervals along the longitudinal direction.
[0020]
Then, in each of the positions corresponding to the respective component accommodating recesses 2 on the back surface 1 b of the substrate plate 1, the back surface recesses 5 are provided similarly to the case of the component accommodating recesses 2. A depression is formed by pressing a press die into the mold.
[0021]
In this case, when each of the component housing recesses 2 is rectangular in plan view, the back surface recess 5 is made larger than the component housing recess 2 and rectangular, and each of the component housing recesses 2 is viewed in plan. When it is round, the back recess 5 is formed into a round shape having a diameter larger than that of the component housing recess 2, so that the bottom area of the back recess 5 is reduced to the bottom of the component housing recess 2. Make it larger than the area.
[0022]
After the electronic components 3 are loaded one by one into the respective component accommodating recesses 2 on the surface 1a of the base plate 1 thus configured, the cover film 4 is releasably adhered.
[0023]
As described above, the back surface recess 5 having a larger bottom area than the bottom area of the component housing recess 2 is pressed at a position corresponding to each of the component housing recesses 2 on the back surface 1 b of the base plate 1. By forming the recesses by pressing the mold, the whole of the bottom portion 2a of each of the component receiving recesses 2 is set in a state where no springback occurs or the springback hardly occurs in the entire bottom portion 2a. By forming the back surface recess 5 up to the thickness dimension T1, it is possible to sufficiently crush and deform almost completely, so that the bottom portion 2a of each of the component housing recesses 2 has a middle height due to springback. Swelling can be reliably reduced.
[0024]
The base plate 1 having the above-described configuration is manufactured by a method described below.
[0025]
That is, before cutting the base plate 1 from the cardboard into a tape shape. Alternatively, after cutting into a tape shape, as shown in FIG. 6, it is placed upside down on the upper surface of the support base plate 7, and in this state, the press die 8 is pressed against the back surface 1 b of the base plate 1. By pressing, the back surface recess 5 having a predetermined depth S is formed.
[0026]
Next, the base plate 1 is turned upside down as shown in FIG. 7, and the projection 9 a provided on the upper surface of the support base plate 9 fits into the back surface recess 5. In this state, the pressing die 10 is pressed into the surface 1a of the base plate 1 to form the component receiving recess 2 having a predetermined depth H1.
[0027]
Another method is to first press the press die 10 into the front surface 1a of the base plate 1 while supporting the back surface of the base plate 1 with a support base plate, thereby forming the component housing recess 2 having a predetermined depth H1. Then, the base plate 1 is turned upside down, and the front surface 1a and the bottom portion 2a of each component accommodating recess 2 are supported by another support table. By pressing the press die 8, the back surface recess 5 having a predetermined depth S is formed.
[0028]
Still another method is to press the pressing die 10 into the front surface 1a of the base plate 1 to form the recess 2 for accommodating the component, and at the same time, press the die 10 into the back surface 1b of the base plate 1. 8 is pressed to form the back surface recess 5. That is, the component housing recess 2 on the front surface 1a and the back surface recess 5 on the back surface 1b are simultaneously formed.
[0029]
By the way, as in the second embodiment shown in FIG. 8, the back surface recesses 5 on the back surface 1b of the base plate 1 are arranged in the row direction of the component accommodation recesses 2 on the front surface 1a of the base plate 1. In the form of a continuous groove.
[0030]
With this configuration, the groove-shaped back surface recess 5 can be continuously formed by pressing a pressing die which is a rotating roller, so that the recess of the back surface recess 5 is formed by the second step. This can be easily performed at a higher speed than in the case of the first embodiment.
[0031]
Next, FIG. 9 shows a third embodiment.
[0032]
In the third embodiment, as shown in FIG. 9A, when the electronic component 3 to be packaged is an electronic component having a size as large as its height H0 ', the electronic component 3 is accordingly The depth dimension of the component housing recess 2 provided on the front surface 1a of the base plate 1 is increased from H1 to H1 ', while the depth dimension of the back recess 5 provided on the back surface 1b of the base plate 1 is changed from S to S ', The bottom portion 2a of the component accommodating recess 2 has a predetermined thickness T1, that is, no springback or almost no springback occurs in the entire bottom portion 2a. The thickness T1 in the state is set.
[0033]
Further, as shown in FIG. 9 (B), when the electronic component 3 for packaging is an electronic component having a size as small as the height H0 ″, the surface 1a of the base plate 1 is accordingly adjusted. In the above-described component housing, the depth dimension of the component housing recess 2 provided in the base plate 1 is reduced from H1 to H1 ″, while the depth dimension of the back surface recess 5 provided in the back surface 1b of the base plate 1 is increased from S to S ″. A configuration in which the bottom portion 2a of the recess 2 has a predetermined thickness T1, that is, a thickness T1 in which springback does not occur on the entire bottom portion 2a or hardly occurs. It is to be.
[0034]
Thus, a plurality of types of electronic components having different sizes can be packaged using the base plate 1 having the same thickness dimension T. In other words, it is not necessary to change the thickness dimension T of the base plate 1 according to the size of the electronic component. Parts can be packaged.
[Brief description of the drawings]
FIG. 1 is a perspective view showing a package.
FIG. 2 is an enlarged sectional view taken along line II-II of FIG.
FIG. 3 is an enlarged cross-sectional view according to the first embodiment.
FIG. 4 is a sectional view taken along line IV-IV of FIG. 3;
FIG. 5 is a perspective view illustrating a back surface of the base plate according to the first embodiment.
FIG. 6 is an enlarged cross-sectional view showing a state in which a back surface recess is formed in the base plate according to the first embodiment.
FIG. 7 is an enlarged cross-sectional view illustrating a state in which a component housing recess is formed in the base plate according to the first embodiment.
FIG. 8 is a perspective view showing a back surface of a base plate according to the second embodiment.
FIG. 9 is an enlarged sectional view of the third embodiment.
[Explanation of symbols]
REFERENCE SIGNS LIST 1 base plate 1a front surface of base plate 1b back surface of base plate 2 component housing recess 2a bottom portion of component housing recess 3 electronic component 4 cover film 5 back recess 6 feed hole

Claims (3)

A cardboard base plate provided with a plurality of component receiving recesses formed by pressing a surface into a depression by pressing a press die, and closing the component receiving recesses on the surface of the base plate. In a package for electronic parts comprising a cover film adhered releasably as described above,
On the back surface of the base plate, at a portion corresponding to each of the component housing recesses, a back surface recess having a bottom area larger than the bottom area of the component housing recess is formed by pressing a press die. A package for electronic components, characterized by the following. 2. The electronic component package according to claim 1, wherein each of the back surface recesses has a groove shape that is continuous in a row direction of each of the component housing recesses. 3. The method according to claim 1, wherein the depth of the back surface recess is small when the depth in the component housing recess is deep, and is large when the depth in the component housing recess is small. Packaging for electronic components.

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