JP2004221254A - Apparatus and method of pasting substrates - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To easily and accurately set a cell gap when pasting substrates together. <P>SOLUTION: The pasting apparatus comprises a substrate pushing means 22 for pushing the outside surface 42a of a first substrate 42, and a second surface plate 32 for holding a second substrate 44. The substrate pushing means 22 comprises a gas pressure adjustment space 24 which is airtightly made to push the first substrate 42 by the gas pressure, a gas supply and discharge hole 26 for supplying and exhausting gas to control the gas pressure of the gas pressure adjustment space 24, a gas pressure adjustment means 52 connected to the gas supply and discharge hole 26, and a pressure distribution member 10. <P>COPYRIGHT: (C)2004,JPO&NCIPI

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a device and method for bonding display panel substrates.
[0002]
[Prior art]
A liquid crystal display panel and an organic EL display panel are generally manufactured by laminating two substrates. Hereinafter, a conventional substrate bonding process will be described with reference to FIG.
[0003]
FIG. 4 is a schematic diagram of a main part for describing a conventional substrate bonding step and a bonding apparatus. As shown in FIG. 4, the first substrate 110 is held by a first platen 142 having an X-axis driving mechanism 132. Similarly, the second substrate 112 provided with the sealing material is held by a second surface plate 144 having a Y-axis driving mechanism 134. While observing the alignment marks provided on the first substrate 110 and the second substrate 112, the X axis, the Y axis, and the θ axis are adjusted by the θ table 162 located further below the second surface plate 144. That is, the second substrate 112 is rotated in the horizontal plane by the rotation drive mechanism 136 to perform alignment with the first substrate. Thereafter, the first platen 142 or the second platen 144 can be actuated in the direction of arrow A by pressing the substrate as a result by means of the platen up and down lifting means 138 and the pressure cylinder 160. Laminating. At this time, if the distance between the two substrates (hereinafter, also simply referred to as a cell gap) is not constant between, for example, the periphery of the cell and the center of the cell, uneven display occurs on the completed display panel. . Therefore, in order to maintain high and constant display panel display quality, it is necessary to appropriately maintain the cell gap in the manufacturing process. This technique is called cell gap control (CELL GAP CONTROL). The X-axis driving mechanism 132, the Y-axis driving mechanism 134, the rotation driving mechanism 136, the vertical lifting / lowering means 138, and the substrate pressing mechanism using the pressing cylinder 160 have been conventionally known since there are various mechanisms. Therefore, those skilled in the art can easily configure these mechanisms, and a detailed description thereof will be omitted.
[0004]
For example, in the bonding process in the production of a liquid crystal display panel using a glass substrate or the like, a spacer fiber made of glass fiber or the like is mixed into the sealing material itself, and at the same time, resin, silica, etc. The cell gap maintaining means such as spacer particles is sprayed. In some cases, a cell gap holding unit is provided in the display cell region by a structure such as a resist. However, a negative effect such as a decrease in contrast due to the spacer occurs. Therefore, in order to improve the display quality, a so-called spacerless liquid crystal display that performs precise cell gap control without disposing spacer particles inside the cell has been desired.
[0005]
In addition, in organic EL panels and the like whose demand has been increasing in recent years, it is not possible to arrange spacer particles inside the display cell region.
[0006]
In the substrate pressing step of such a display panel bonding step, the center of the area corresponding to the display cell area of the substrate located particularly on the upper surface side is a downwardly convex direction, particularly because the presence of the sealing material causes resistance. In some cases. Due to the occurrence of the bending, uniformity of the cell gap cannot be obtained. Therefore, at present, precise cell gap control is not realized by the conventional bonding apparatus and bonding method.
[0007]
At the time of filing the present application, there is no prior art document known by the applicant and the inventor concerning the technical idea of the present application.
[0008]
[Problems to be solved by the invention]
The present invention has been made in view of the above-mentioned conventional problems, and an object of the present invention is to reduce the deflection of a substrate caused by a sealing material, particularly in a display cell region, in a bonding step of the substrates. It is an object of the present invention to provide a substrate bonding apparatus and a substrate bonding method that can set a cell gap easily and with high accuracy while preventing the occurrence.
[0009]
[Means for Solving the Problems]
According to a preferred configuration example of the substrate bonding apparatus of the present invention, the substrate bonding apparatus preferably has the following configuration.
[0010]
That is, the bonding apparatus includes a substrate pressing unit that presses the outer surface of the first substrate, and a second surface plate that holds the second substrate. The substrate pressing means includes a gas pressure adjusting space that is hermetically defined for pressing the first substrate by gas pressure, and a gas pressure adjusting space for adjusting the gas pressure of the gas pressure adjusting space. It includes a supply / exhaust hole and gas pressure adjusting means connected to the supply / exhaust hole.
[0011]
In addition, the bonding apparatus of the present invention may be configured such that the outer surface of the first substrate is substantially in close contact with the outer surface so that the outer surface of the first substrate can be pressed with uneven pressure for preventing the substrate from bending. A pressure dispersing member for converting a uniform gas pressure generated in the pressure adjusting space into a non-uniform pressure and transmitting the converted pressure to an outer surface.
[0012]
Thus, in the bonding step, the pressing force applied to the first substrate can be optimized by the pressing force dispersing member so that the partial region of the substrate defining the display cell does not bend.
[0013]
The pressing force dispersing member is formed of a material having elasticity, and the pressing force dispersing member corresponds to at least a region of the pressure receiving surface receiving the gas pressure and the outer surface of the first substrate surrounded by the sealing material. It has one or more pressing force distribution regions that are substantially in close contact with the entire surface of the partial region (hereinafter, simply referred to as the partial region), and a pressing bottom surface.
[0014]
With such a configuration, it is possible to cope with a substrate for so-called multi-panning.
[0015]
The shape of the pressing force dispersion region is preferably a cone having a vertex located immediately above the center of the partial region. The side surface of the cone is a pressure receiving surface, and the bottom surface of the cone is a pressing bottom surface.
[0016]
The shape of the pressing force distribution region is preferably a convex body having a curved line formed by connecting a vertex located immediately above the center of the partial region and each point making a round on the periphery of the edge of the pressing force distribution region. . At this time, the curved surface of the convex body formed by a curve is defined as a pressure receiving surface, and the bottom surface of the convex body is defined as a pressing bottom surface.
[0017]
The pressing force dispersing member is preferably a solid member.
[0018]
With such a configuration, the pressing force can be gradually increased in the direction from the center of the partial region on the outer surface of the first substrate to the side defining the partial region. When a pressing force is uniformly applied to the outer surface of the substrate, it is possible to prevent bending of the lower side of the first substrate, that is, the direction of the second substrate, which is caused by the presence of the sealing material as a resistance.
[0019]
According to another configuration example of the bonding apparatus of the present invention, a first surface plate and an inner surface of the first substrate among the outer surfaces of the first substrate provided on the first surface plate. A substrate pressing means for contacting and pressing an area corresponding directly above the sealing material provided on the side, an airtight substrate pressing space defined so as to be surrounded by the substrate pressing means, and a substrate pressing space. A gas supply / exhaust hole provided in the first platen so that gas can be supplied and exhausted, a gas pressure adjusting means connected to the gas supply / exhaust hole, and a second substrate holding the second substrate. Including the surface plate.
[0020]
With such a configuration, on the outer surface of the first substrate, a pressing force applied to a region directly above the sealing material and a first pressure corresponding to the display cell region surrounded by the region directly above the sealing material. Since the pressing force applied to the partial region on the outer surface of the substrate can be different in pressing force, the bonding step can be performed while preventing the substrate from bending due to the resistance of the sealing material. Can be. In addition, since the gas pressure in the substrate pressing (suction) space can be set to a negative pressure in the partial region corresponding to the display cell region, for example, from the outer surface of the first substrate, the display cell region is opposed to the display cell region. Even when the first substrate bends in the direction, the bonding can be performed while removing the warp.
[0021]
At this time, the substrate pressing means is preferably formed of a tubular member having elasticity and having a hollow portion.
[0022]
With such a configuration, it is possible to efficiently press the region corresponding to the outer surface of the first substrate immediately above the sealing material, and at the same time, to define the substrate pressing (suction) space.
[0023]
According to the substrate bonding method of the present invention, the following steps are included.
[0024]
(1) a step of facing the inner surfaces of the first substrate and the second substrate via a sealant for defining a display cell region; (2) a display surrounded by the sealant of the first substrate In the partial area on the outer surface corresponding to the cell area, the pressing force gradually increases from the center of the partial area toward the edge of the partial area, and the pressing force of the area substantially directly above the sealing material is increased. It includes a step of determining a predetermined cell gap by applying a pressing force so that the pressure is maximized, and (3) a step of curing the sealing material.
[0025]
At this time, in the step (2), the first pressing force uniformly applied to the entire outer surface of the first substrate is applied from at least the center of the partial region by using a pressing force dispersing member closely contacting the entire surface of the partial region. A second pressing force converted so that the pressing force gradually increases toward the edge direction of the partial region and the pressing force of the region substantially directly above the sealing material is maximized is applied. Thus, it is preferable to set a predetermined cell gap.
[0026]
This first pressing force is preferably a pressing force composed of gas pressure.
[0027]
By performing the bonding step in this manner, a display panel having a uniform cell gap without bending in the display cell region can be efficiently manufactured.
[0028]
According to another example of the method of bonding substrates according to the present invention, the method includes the following steps.
[0029]
(1) a step of facing the inner surfaces of the first substrate and the second substrate via a sealant for defining a display cell region; (2) a display surrounded by the sealant of the first substrate A step of determining a predetermined cell gap by applying a pressing force such that the pressing force applied to the partial region on the outer surface corresponding to the cell region is different from the pressing force in a region substantially immediately above the sealing material; and (3) A step of curing the sealing material is included.
[0030]
At this time, in the step (2), a suction force for removing bending of the first substrate is added to a partial region on the outer surface corresponding to the display cell region surrounded by the sealant of the first substrate, and A step of applying a pressing force to a region substantially directly above the sealing material to determine a predetermined cell gap may be adopted.
[0031]
At this time, in the step (2), a step of determining a predetermined cell gap by applying a pressing force to a region substantially directly above the sealing material is provided along the region directly above the sealing material. It is also preferable to use a tubular member having a hollow portion and supply gas to the hollow portion.
[0032]
By doing so, the bonding step can be performed with a simpler process while preventing the display cell region from bending.
[0033]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the drawings, the shapes, sizes, and arrangements of the components are only schematically shown to the extent that the present invention can be understood, and the present invention is not particularly limited thereby. In addition, it is to be understood that the same constituent components are denoted by the same reference numerals in the drawings used in the following description, and the overlapping description may be omitted.
[0034]
In practicing the present invention, the X-axis drive mechanism, the Y-axis drive mechanism, the rotary drive mechanism, the up-and-down elevating means, and the seal material hardening means already described with reference to FIG. Since the configuration and functions are well known in the art and are not the gist of the present invention, detailed description thereof will be omitted.
[0035]
In the following description of embodiments, the present invention will be described with respect to an example of bonding substrates used as a liquid crystal display panel and an organic EL display panel. In the case of an organic EL display panel, it is assumed that an organic EL layer is formed in advance on one of the substrates to be bonded. In the case of a liquid crystal display panel, a description will be given mainly of an example of a “dropping liquid crystal injection” step of injecting a liquid crystal medium into a cell region before bonding the display panel.
[0036]
As is well known, a large number of display cells are arranged in a matrix on the first and second substrates. However, in the embodiment described below, an example in which one display cell is formed on one substrate (two opposing substrates) will be taken as a representative in order to avoid complication of the drawing. are doing. In the drawings, other components such as electrodes and other transistors necessary for display are not shown because they are not directly necessary for the description of the present invention.
[0037]
With reference to FIGS. 1A and 1B, a description will be given of a configuration example of a pressing force dispersing member suitable for applying to the bonding apparatus and the bonding method of the present invention.
[0038]
FIG. 1A is a schematic plan view of the pressing force dispersing member 10 as viewed from above. FIG. 1B is a cross-sectional view schematically showing a cross-section of the cross section taken along the broken line II shown in FIG.
[0039]
By dispersing the uniform pressing force applied to the outer surface of the substrate to be bonded, the pressing force dispersing member 10 converts the pressing force applied particularly in the vertical direction of the outer surface to the non-uniform transmission, and particularly transmits the pressing force. It is a sheet-shaped member having one or more three-dimensional irregularities for preventing the substrate from bending due to the sealing material.
[0040]
The pressing force dispersing member 10 includes a pressure receiving surface 10a and a pressing bottom surface 10b, and has a plurality of pressing force dispersing regions 12. As described above, the display panel is formed by simultaneously forming a plurality of display panels in a matrix on one substrate (two opposing substrates) and singulating the display panel after completion of the manufacturing process. Therefore, the pressing force distribution areas 12 are arranged in a matrix in accordance with the pattern of the substrate provided for forming a plurality of panels. FIG. 1A shows an example in which they are arranged in a 2 × 2 matrix. However, the present invention is not limited to this, and the present invention is also applicable to a case where one or an arbitrary plurality of display panels are manufactured from, for example, one (two opposing substrates). That is, the pressing force dispersion regions 12 can be arranged in a matrix of n × m (n and m are each one or more positive numbers independent of each other). The intervals between the pressing force dispersing members 12 are preferably arranged at regular intervals in consideration of the size of the substrate, the size of the panel, the margin required for the singulation process, and the like.
[0041]
The pressing force dispersing region 12 of the pressing force dispersing member 10 has a partial area (hereinafter simply referred to as a partial area) on an outer surface of a first substrate (not shown; see FIG. 2) corresponding to a display cell area of a display panel to be manufactured. (Referred to as a region) is preferably formed in a conical shape surrounded by a vertex 15 and an edge 12 located immediately above the center. The side surface of the cone is a pressure receiving surface 10a, and the bottom surface of the cone is a pressing bottom surface 10b.
[0042]
The cone shape of the pressing force dispersion region 12 may be configured to include, for example, the number of vertices equal to the number of sides defining the display cell region and one or more surfaces passing through the side. . In this example, an example is shown in which the display cell area is square. In this example, the pressing force distribution region 12 includes four surfaces 13 of an equilateral triangle, that is, a ridge line 14 passing through a side and a vertex 15 (the ridge line here is as shown in FIG. 1B). (The same applies to the following.) Also has a shape of a linear so-called pyramid-shaped quadrangular pyramid.
[0043]
The shape of the surface 13 of the pressing force distribution region 12 is not limited to this, and may be formed as a curved surface in order to obtain a necessary pressing force. The shape of the pressing force dispersion region 12 is a convex body having a curved line formed by connecting a vertex 15 located immediately above the center of the partial region and each point making a round on the periphery of the edge 12 a of the pressing force dispersion region 12. It is better to do. At this time, the curved surface of the convex body formed by a curve is defined as a pressure receiving surface, and the bottom surface of the convex body is defined as a pressing bottom surface.
[0044]
The magnitude of the pressing force converted by the pressing force dispersion member is determined by the angle at which the surface 13 intersects the outer surface of the substrate to be pressed and the thickness (height) of a certain coordinate on the surface of the pressing force distribution area 12. Depends on the relationship. Specifically, as the angle and the thickness increase, the pressing force applied to the outer surface of the substrate decreases. Therefore, the curvature of the surface 13 can be appropriately set as appropriate in consideration of the necessary pressing force at a certain point (coordinate) on the outer surface of the substrate and the angle and thickness of the surface of the pressing force distribution region 12.
[0045]
The pressing force dispersing member 10 is preferably formed of a material that can be in close contact with the outer surface of the substrate and press it. Preferably, it is made of an elastic material. For example, the pressing force dispersing member 10 having desired elasticity can be formed as, for example, a sheet-like member by applying a solid material such as rubber or resin, or a foamable material. Further, the pressing force dispersing member 10 is preferably formed as a solid member.
[0046]
With such a configuration, the pressing force is gradually increased from the center of the partial area on the outer surface of the substrate toward the side (edge) defining the partial area, and the pressing force applied to the outer surface of the substrate is increased. Can be distributed and optimized non-uniformly, so that when a pressing force is applied uniformly to the outer surface of the substrate using, for example, a gas pressure, the first material generated as a resistance is caused by the presence of the sealing material. Of the lower side of the substrate, that is, bending in the direction of the second substrate.
[0047]
(First Embodiment)
With reference to FIGS. 2A and 2B, a description will be given of a bonding apparatus and a bonding method according to a first embodiment of the present invention.
[0048]
FIG. 2 is a diagram for explaining the first embodiment of the present invention. FIG. 2A is a schematic plan view of a main part of a substrate bonding apparatus (hereinafter, simply referred to as a bonding apparatus) as viewed from above from above. FIG. 2B is a schematic cross-sectional view illustrating a cross-section of the cross section taken along the broken line II shown in FIG.
[0049]
The bonding apparatus according to the first embodiment mainly includes a first base 22 serving as a substrate pressing unit, a second base 32 opposed thereto, and a sealing material hardening unit (not shown). I have. The first platen (hereinafter, also referred to as a substrate pressing means) 22 includes a gas pressure adjusting space 24 air-tightly defined by a box-shaped body for pressing the first substrate 42 by gas pressure, and a gas pressure adjusting space 24. A box-shaped body in which a supply / exhaust hole 26 for supplying and exhausting gas for adjusting the gas pressure in the pressure adjustment space 24 and a gas pressure adjusting unit 52 connected to the supply / exhaust hole 26 constitute the substrate pressing unit 22. Is formed on the upper surface side. The positions of the supply / exhaust holes 26 and the gas pressure adjusting means 52 can be appropriately set as appropriate as long as the gas pressure adjusting space 24 can be set to a desired gas pressure. As the gas pressure adjusting means 52, a conventionally known, for example, vacuum pump or the like can be used.
[0050]
The substrate pressing means 22 applies a uniform gas pressure generated in the gas pressure adjusting space 24 in close contact with the outer surface 42a so that the outer surface 42a of the first substrate 42 can be pressed with an uneven pressure. A pressing force dispersing member 10 for converting the pressure into an uneven pressure and transmitting the converted pressure to the outer side surface 42a is provided. The pressing force dispersing member 10 has already been described with reference to FIG.
[0051]
The pressing force dispersing member 10 is provided on the substrate pressing means 22 such that the pressure receiving surface 10 a in which the pressing force dispersing region 12 is formed is exposed in the gas pressure adjusting space 24.
[0052]
FIG. 2B illustrates an example in which the edge of the pressing force dispersing member 10 is connected to the substrate pressing means 22, but the pressure receiving surface 10 a of the pressing force dispersing member 10 is The configuration is not limited to such a configuration as long as the gas pressure generated on the pressing force dispersing member 10 can be transmitted to the pressing bottom surface 10b side. For example, the pressing force dispersing member 10 is disposed as an independent sheet-shaped member on the outer surface 42a of the first substrate 42, and all structures including the second platen 32 shown in FIG. It is good also as a structure stored in the box inside.
[0053]
As described above, the pressing force applied to the first substrate 42 by the pressing force dispersing member 10 is optimized so that the partial region 42b of the substrate defining the display cell region 48 is not bent in the bonding step. can do.
[0054]
Next, a bonding method using the bonding apparatus according to the first embodiment will be described mainly with reference to FIG.
[0055]
The first substrate 42 has a second surface mounted on the second platen 32 with a sealing material 46 interposed therebetween so as to define a region to be a display cell on the lower surface side, that is, a display cell region 48. Is disposed so as to face the substrate 44.
[0056]
In the space between the first substrate 42 and the second substrate 44, a flexible sealing material 46 before curing for separating the display cell region 48 is provided in advance so as to form the display cell region 48. . The sealing material 46 is disposed so that the display cell region 48 is formed by continuous walls without interruption.
[0057]
Here, as the first substrate 42 and the second substrate 44, for example, a glass substrate, a plastic substrate, an epoxy resin substrate, or the like according to a desired display can be applied, but the invention is not limited thereto.
[0058]
Further, as the sealing material 46, it is preferable to use a conventionally used ultraviolet curing type and / or thermosetting type sealing material containing glass fiber fibers as a spacer material.
[0059]
The pressing bottom surface 10 b of the pressing force dispersing member 10 provided on the substrate pressing means 22 is disposed so as to substantially adhere to the outer surface 42 a of the first substrate 42. At this time, the center C of the partial region 42b of the outer side surface 42a is located immediately below the vertex 15 of the pressing force distribution region 12 of the pressing force distribution member 10, and the partial region 42b is coincident with the pressing force distribution region 12. Adjust the placement position. In this example, the ridge line 14 of the pressing force dispersion region 12 does not straddle in the region immediately above the sealing material 46. However, in order to obtain a desired pressing force, the region directly above the sealing material 46 is formed. , The ridge line 14 may straddle or intersect.
[0060]
This step is performed by using a conventionally known X-axis operation mechanism, Y-axis operation mechanism, rotation operation mechanism, and / or a CCD camera (not shown).
[0061]
Next, for example, when manufacturing a liquid crystal display cell, a liquid crystal medium is injected by a liquid crystal injection device (not shown) before the first and second substrates 42 and 44 are bonded.
[0062]
Next, a gas such as air or an inert gas is sent into the gas pressure adjusting space 24 by the gas supply / exhaust hole 26 and the gas pressure adjusting means 52 connected thereto to increase the gas pressure in the space 24. This gas pressure is transmitted to the pressure receiving surface 10a of the pressing force distribution member 10 as a uniform pressing force. The transmitted pressing force is dispersed by the pressing force distribution region 12 and gradually increases from the central portion C toward the edge of the first substrate with respect to the outer surface 42 a of the first substrate 42. .
[0063]
By the pressing force unevenly applied in the gradation form, the bonding can be performed while preventing the first substrate 42 from being bent particularly due to the presence of the sealing material 46.
[0064]
Therefore, a panel having an accurate cell gap d can be efficiently manufactured by a simple process.
[0065]
Thereafter, the sealing material 46 is cured by irradiating ultraviolet rays, heating or cooling. The hardening of the sealing material 46 is performed in a conventional manner by irradiating ultraviolet rays in the case of an ultraviolet-curable sealing material, heating or cooling in the case of a heat- or cooling-curing sealing material, and performing two or more types of sealing materials. When it is necessary to combine the methods, the necessary means and steps may be combined.
[0066]
(Second embodiment)
With reference to FIGS. 3A and 3B, a bonding apparatus and a bonding method according to a second embodiment of the present invention will be described. Note that steps other than the bonding are the same as those in the first embodiment, and a detailed description thereof will be omitted.
[0067]
FIG. 3 is a diagram for explaining a second embodiment of the present invention. FIG. 3A is a schematic plan view of the main part of the substrate bonding apparatus, as viewed from above. FIG. 3B is a schematic cross-sectional view showing a cross-section of the cross section taken along the broken line II shown in FIG.
[0068]
The bonding apparatus according to the second embodiment of the present invention includes a first surface plate 62 and a first surface of an outer surface of a first substrate provided on a lower surface side of the first surface plate 62. And a substrate pressing means 64 for contacting and pressing a region of the outer surface 42a corresponding to a position directly above the sealing material 46 provided on the inner surface 42c of the substrate 42. The substrate pressing means 64 has a shape that matches the contour of the sealing material 46 provided between the first substrate 42 and the second substrate 44. The substrate pressing means 64 is configured to contact the outer side surface 42a to define an airtight substrate pressing space 68. In the figure, the structure is such that an airtight substrate pressing space 68 is defined between the first surface plate 62 and the outer side surface 42a by being surrounded by a square wall shape.
[0069]
The substrate pressing means 64 can be constituted by a mechanical operating mechanism such as a servomotor or a hydraulic cylinder. In this case, an airtight holding member such as a rubber packing for forming the substrate pressing space 68 is combined. Alternatively, an airtight substrate pressing space may be separately formed.
[0070]
The substrate pressing means 64 is preferably made of a tubular member having elasticity and having a hollow portion and made of a material such as rubber. Then, by filling the hollow portion with a gas such as air or an inert gas, it is possible to press a region immediately above the seal material 46 on the outer side surface 42a and simultaneously define the substrate pressing space 68.
[0071]
The bonding apparatus according to the second embodiment includes a supply / exhaust hole 66 provided in the first platen 62 so as to supply / exhaust gas to / from the substrate pressing space 68, and a supply / exhaust hole. It includes a gas pressure adjusting means 72 connected to 66 and a second platen 32 for holding the second substrate 44.
[0072]
The gas pressure adjusting means 72 used in this embodiment not only supplies gas such as air and inert gas to the substrate pressing space 68 but also pulls the first substrate 42 to a negative pressure by exhaustion. It is preferable that a suction force can be applied to the outer side surface 42a.
[0073]
The air supply / exhaust holes 66 and the second platen 32 are the same as those already described in the first embodiment, so that detailed description thereof will be omitted.
[0074]
With such a configuration, the pressing force applied to the area corresponding to the area directly above the sealing material 46 on the outer surface 42a of the first substrate 42 and the display cell area 48 surrounded by the area corresponding to the area immediately above the sealing material 46 Since the pressing force applied to the corresponding partial region 42b of the outer surface 42a of the first substrate 42 can be set to a pressing force of a different magnitude, the bending of the first substrate 42 caused by the resistance of the sealing material 46 occurs. Can be performed and the bonding step can be performed. In addition, since a negative pressure, that is, a suction force can be applied to the partial region 42b corresponding to the display cell region 48, for example, the second region is moved from the outer surface of the first substrate in the direction opposite to the direction where the display cell region exists. Even when one substrate is bent, the bonding can be performed while removing the bending by setting the gas pressure in the substrate pressing (suction) space 68 to a negative pressure.
[0075]
Next, a bonding method using the bonding apparatus according to the second embodiment will be described mainly with reference to FIG.
[0076]
The first substrate 42 is placed on the second platen 32 with a sealing material 46 interposed therebetween so as to define a region to be a display cell on the inner side surface 42 c side, that is, a display cell region 48. It is arranged so as to face the second substrate 44.
[0077]
Next, a substrate pressing (suction) space 68 is defined by closely contacting the substrate pressing means 64 so as to match a region of the outer surface 42a immediately above the sealing material 46. When it is necessary to use an airtight holding member (not shown) as described above, this is used to define the substrate pressing (suction) space 68. When the substrate is pressed, the pressing force dispersing members 10 described in the first embodiment are placed in the substrate pressing space 68 one by one for each of the display cell regions 48 arranged in a matrix. May be provided in close contact with each other.
[0078]
With this configuration, the same effect as that of the pressing force dispersing member 10 described in the first embodiment can be further obtained.
[0079]
Next, the substrate pressing means 64 is operated to press a region of the outer side surface 42a corresponding to a position immediately above the sealing material 46.
[0080]
At the same time, a gas such as air or an inert gas is fed into the substrate pressing (suction) space 68 by the gas supply / exhaust hole 66 and the gas pressure adjusting means 72 connected thereto to increase the gas pressure in the space 68. Alternatively, a negative pressure is obtained by suction.
[0081]
By the pressing (suction) force, the bonding can be performed while preventing the first substrate 42 from being bent particularly due to the presence of the sealing material 46.
[0082]
In the case of the bonding apparatus according to the first embodiment, one gas pressure adjustment space is shared by a plurality of display cells (partial regions of the first substrate) formed in a matrix. be able to. Of course, a configuration may be employed in which one gas pressure adjustment space is formed for one display cell.
[0083]
In the configuration of the bonding apparatus according to the second embodiment, of a plurality of display cells (partial regions of the first substrate) formed in a matrix, one substrate is pressed against one display cell. (Suction) space may be formed.
[0084]
【The invention's effect】
ADVANTAGE OF THE INVENTION According to the bonding apparatus and bonding method of the display panel board of this invention, a bonding process can be performed by a simpler process, preventing bending of a display cell area.
[0085]
Specifically, of the outer surface of the first substrate, a pressing force applied to a region directly above the sealing material, and a pressing force applied to the first substrate corresponding to the display cell region surrounded by the region directly above the sealing material. Since the pressing force applied to the partial area on the outer side surface can be made uneven pressing force or different pressing force, the bonding process is performed while preventing the substrate from being bent due to the sealing material. can do.
[Brief description of the drawings]
1 (A) and 1 (B) are explanatory diagrams of a pressing force dispersing member suitable for use in the bonding apparatus of the present invention, and FIG. 1 (A) is a schematic view from the top side. (B) is a cross-sectional view schematically showing a cut surface cut along the II broken line in (A).
FIGS. 2A and 2B are explanatory views of the bonding apparatus according to the first embodiment of the present invention, and FIG. 2A is a schematic plan view viewed from the upper surface side; (B) is a cross-sectional view schematically showing a cross section taken along the broken line II in (A).
FIGS. 3A and 3B are explanatory views of a bonding apparatus according to a second embodiment of the present invention, and FIG. 3A is a schematic plan view viewed from the upper surface side; (B) is a cross-sectional view schematically showing a cross section taken along the broken line II in (A).
FIG. 4 is a schematic diagram of a main part for describing a conventional substrate bonding step and a bonding apparatus.
[Explanation of symbols]
10: pressing force dispersion member
10a: Pressure receiving surface
10b: pressing bottom
12: Pressure distribution area
12a: edge
13: surface
14: Ridge line
15: Top
22, 62, 142: first platen (substrate pressing means)
24: Gas pressure adjustment space
26, 66: Supply and exhaust holes
32, 144: Second surface plate
42, 110: first substrate
42a: Outside surface
42b: partial area
42c: Inside surface
44, 112: second substrate
46, 114: sealing material
48: Display cell area
52, 72: gas pressure adjusting means
64: substrate pressing means
68: Substrate pressing (suction) space
132: X-axis drive mechanism
134: Y-axis drive mechanism
136: Rotation drive mechanism
138: Vertical lifting mechanism
160: Pressurizing cylinder
162: θ table

Claims (16)

In a substrate bonding apparatus for bonding a first substrate and a second substrate with a sealing material interposed therebetween,
Including a substrate pressing means for pressing the outer surface of the first substrate, and a second surface plate holding the second substrate,
The substrate pressing means includes a gas pressure adjustment space defined for pressing the first substrate by gas pressure, and a gas pressure supply space and a gas supply and exhaust gas for adjusting the gas pressure of the gas pressure adjustment space. A gas supply / exhaust hole, gas pressure adjusting means connected to the gas supply / exhaust port, and a uniform gas pressure generated in the gas pressure adjustment space substantially in close contact with the outer surface of the first substrate. A pressure dispersing member that converts the pressure into pressure and transmits the pressure to the outer surface. The pressing force dispersing member is formed of an elastic material, and the pressing force dispersing member is surrounded by at least the sealant among a pressure receiving surface receiving the gas pressure and an outer surface of the first substrate. 2. The device according to claim 1, further comprising one or more pressing force dispersing regions which are substantially in close contact with the entire surface of the partial region corresponding to the set region, and a pressing bottom surface. 3. The bonding apparatus according to claim 1. 3. The bonding apparatus according to claim 2, wherein the shape of the pressing force dispersion region is a cone having a vertex located immediately above the center of the partial region. 4. The bonding apparatus according to claim 3, wherein a side surface of the cone is the pressure receiving surface, and a bottom surface of the cone is the pressing bottom surface. The shape of the pressing force distribution region is a convex body having a curved line formed by connecting a vertex located immediately above the center of the partial region and each point making a round on the periphery of the edge of the pressing force distribution region. 3. The bonding apparatus according to claim 2, wherein: 5. The bonding apparatus according to claim 4, wherein a curved surface of the convex body formed by the curve is the pressure receiving surface, and a bottom surface of the convex body is the pressing bottom surface. 6. The bonding device according to any one of claims 1 to 6, wherein the pressing force dispersion member is a solid member. In a substrate bonding apparatus for bonding a first substrate and a second substrate with a sealing material interposed therebetween,
A first surface plate, corresponding to the outer surface of the first substrate provided on the first surface plate, directly above a sealing material provided on the inner surface side of the first substrate; A substrate pressing unit that contacts and presses an area to be pressed, an airtight substrate pressing space defined so as to be surrounded by the substrate pressing unit, and a gas that can be supplied to and exhausted from the substrate pressing space. And an air supply / exhaust hole provided in the first surface plate, a gas pressure adjusting means connected to the air supply / exhaust hole, and a second surface plate holding the second substrate. Characteristic bonding device. 9. The bonding apparatus according to claim 8, wherein the substrate pressing means is formed of a tubular member having elasticity and having a hollow portion. In a method for bonding a substrate, wherein a sealing material is interposed between a first substrate and a second substrate facing each other to bond the first substrate and the second substrate,
(1) facing the inner surfaces of the first substrate and the second substrate via a sealing material for defining a display cell region;
(2) The pressing force is gradually applied to a partial region on the outer surface corresponding to the display cell region surrounded by the sealing material on the first substrate, from the center of the partial region toward the edge of the partial region. Applying a pressing force to determine a predetermined cell gap so as to increase the pressing force in a region substantially directly above the sealing material, and (3) curing the sealing material Process,
A bonding method comprising: In the step (2), the first pressing force uniformly applied to the entire outer surface of the first substrate is applied to the partial region by using a pressing force dispersing member that is substantially in close contact with at least the entire surface of the partial region. The pressing force is converted so that the pressing force gradually increases from the center of the portion toward the edge of the partial region, and the pressing force in the region substantially directly above the sealing material is maximized. The bonding method according to claim 9, wherein a predetermined cell gap is determined by applying a pressing force of (c). The bonding method according to claim 11, wherein the first pressing force is a pressing force formed of a gas pressure. In a method for bonding a substrate, wherein a sealing material is interposed between a first substrate and a second substrate facing each other to bond the first substrate and the second substrate,
(1) facing the inner surfaces of the first substrate and the second substrate via a sealing material for defining a display cell region;
(2) The pressing force applied to the partial region on the outer surface corresponding to the display cell region surrounded by the sealing material of the first substrate is different from the pressing force in a region substantially directly above the sealing material. Determining a predetermined cell gap by applying a pressing force; and (3) curing the sealing material.
A bonding method comprising: The step (2) includes applying a suction force for removing bending of the first substrate to a partial region on an outer surface corresponding to a display cell region surrounded by the sealant on the first substrate; 14. The bonding method according to claim 13, further comprising the step of determining a predetermined cell gap by applying a pressing force to a region substantially immediately above the sealing material. The step (2) of applying a pressing force to a region substantially directly above the sealing material to determine a predetermined cell gap is provided along the region immediately above the sealing member, and has elasticity. The bonding method according to claim 13 or 14, wherein the step is performed by using a tubular member having a hollow portion and supplying gas to the hollow portion. When bonding the first substrate and the second substrate by applying a constant gas pressure from the outer surface side of the first substrate with a sealant interposed therebetween,
The constant gas pressure is applied to a partial area corresponding to the display cell area on the outer surface of the first substrate after the pressure is converted into a non-uniform pressure using a pressing force dispersing member and then applied. Lamination method.

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