JP2004216585A - Vacuum forming mold apparatus - Google Patents

Vacuum forming mold apparatus Download PDF

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Publication number
JP2004216585A
JP2004216585A JP2003003592A JP2003003592A JP2004216585A JP 2004216585 A JP2004216585 A JP 2004216585A JP 2003003592 A JP2003003592 A JP 2003003592A JP 2003003592 A JP2003003592 A JP 2003003592A JP 2004216585 A JP2004216585 A JP 2004216585A
Authority
JP
Japan
Prior art keywords
mold
piping
piping device
vacuum forming
vacuum
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2003003592A
Other languages
Japanese (ja)
Inventor
Koji Ide
幸治 井手
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Life Solutions Asahi Co Ltd
Original Assignee
Asahi Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Matsushita Electric Works Ltd filed Critical Asahi Matsushita Electric Works Ltd
Priority to JP2003003592A priority Critical patent/JP2004216585A/en
Publication of JP2004216585A publication Critical patent/JP2004216585A/en
Pending legal-status Critical Current

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Abstract

<P>PROBLEM TO BE SOLVED: To provide a rational piping mechanism on the assumption of mold replacement. <P>SOLUTION: This vacuum forming mold apparatus is equipped with a mold 2 provided with a plurality of evacuation ports 1 and a piping device 3 detachable with respect to the mold 2. The piping device 3 is provided with a plurality of individual pipes 4 inserted in the respective evacuation ports 2, etc. and one piping 5 formed by collecting the individual pipes 4, etc. A heater 6 which can be brought into contact with the mold 2 in a heat conductive state is provided to the piping device 3. Further, a support device 7 capable of supporting the mold 2 is provided to the piping device 3. <P>COPYRIGHT: (C)2004,JPO&NCIPI

Description

【0001】
【発明の属する技術分野】
本発明は、真空成形金型装置に関する。
【0002】
【従来の技術】
複数の真空引き孔を設けた金型から連通集約した配管を備えた真空成形装置は例えば特許文献1で知られている。
【0003】
【特許文献1】
特開平4−275930号公報
【0004】
【発明が解決しようとする課題】
しかし、金型の交換を配慮した構造にはなっておらず、照明器具のグローブのように多品種を切り替え生産するには不向きであるという解決すべき課題があることに着目されるべきである。本発明はこのような解決すべき課題を鑑み、金型交換を前提として合理的な配管機構をもたらそうとするものである。
【0005】
【課題を解決するための手段】
本発明を要約すると、複数の真空引き孔を設けた金型と、この金型に着脱可能な配管装置とを備え、前記配管装置には、前記各々の真空引き孔に挿入される複数の個別配管と、これらの個別配管から連通集約した集約配管とを設けた真空成形金型装置である。また、配管装置には金型に導熱接触可能なヒーターを設けるとよい。さらにまた、配管装置には金型を支持可能な支持装置を設けるとよい。
【0006】
【発明の実施の形態】
次に、本発明の実施形態を説明するが、それはあくまで本発明に基づいて採択された例示的な実施形態であり、本発明をその実施形態に特有な事項に基づいて限定解釈してはならず、本発明の技術的範囲は、請求項に示した事項さらにはその事項と実質的に等価である事項に基づいて定めなければならない。
【0007】
図示の実施形態は、複数の真空引き孔1…を設けた金型2と、この金型2に着脱可能な配管装置3とを備え、前記配管装置3には、前記各々の真空引き孔1…に挿入される複数の個別配管4…と、これらの個別配管4…から連通集約した集約配管5とを設けた真空成形金型装置である。また、配管装置3には金型2に導熱接触可能なヒーター6を設けている。さらにまた、配管装置3には金型2を支持可能な支持装置7を設けている。
【0008】
さらに詳述すれば、金型2の外周付近には被取付具8が固定され、金型2の上面中央には凹面9が形成されている。金属外殻の配管装置3の下面外周付近には前述した個別配管4…の下端部が前記真空引き孔1…と対応して突出形成され、個別配管4…の根元部分は配管装置3の内部にて集約配管5に連通集約されている。なお、個別配管4…の下端部と真空引き孔1…の上端部間の気密確保のために、個別配管4…の下端部外周には例えばゴムなど弾性材質のOリング4aが装着されている。
【0009】
成形性をよくするために金型2を温めるヒーター6はコイルバネなどの緩衝要素10を介して配管装置3に緩衝性よく支持され、ヒーター6の下面にはシリコンシートのようなクッション性及び導熱性の良い材質の介在部材11を貼付け固定している。なお、ヒーター6はアルミ鋳物などからなる外殻の内部にシーズヒーター6aを内蔵した鋳込みヒーターである。
【0010】
支持装置7はエアシリンダー機構などからなり、それが配管装置3の下面中央付近に固定され、支持装置7からは両方向に支持アーム12を進退可能としている。また、配管装置3は支持具13により上下動可能に支持されている。
【0011】
図1・図4の状態から図5の状態にするには、配管装置3と金型2を近づけて個別配管4…の下端部が金型2の真空引き孔1…の上端大径部に挿入されるようにする。この時、ヒーター6の下面、詳しく言えば介在部材11の下面が凹面9内において金型2の上面にクッション性よく当接する。そして、支持アーム12を延ばしてその先端で被取付具8を支持すると、金型2と配管装置3は結合状態となる。この状態で図外の真空ポンプで集約配管5から空気を引くと、個別配管4…と真空引き孔1…を通じて真空引き孔1…の下端から空気が吸い込まれて、図示されない熱軟化樹脂シートなどを所定形状に成形できるが、成形法それ自体は本発明と直接的には関係ないため、説明を省略する。
【0012】
また、図5の状態から図1・図4の状態にするには、支持アーム12を後退してから配管装置3を上昇させるとよい。
【0013】
本実施形態によれば、個別配管4…と集約配管5のある配管装置3を金型2に結合することにより、金型2にある複数の真空引き孔1…に対して真空引き可能な状態にできるため、金型2を別種類のものに交換するのが容易になり、照明器具用グローブなどの品種切替生産に極めて有利である。
【図面の簡単な説明】
【図1】分解時全体斜視図
【図2】配管装置の上面概略斜視図
【図3】ヒーターの上面概略斜視図
【図4】分解時全体断面図
【図5】結合時全体断面図
【符号の説明】
1 真空引き孔
2 金型
3 配管装置
4 個別配管
5 集約配管
6 ヒーター
7 支持装置
[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a vacuum forming mold device.
[0002]
[Prior art]
2. Description of the Related Art A vacuum forming apparatus provided with a pipe which is communicated and integrated from a mold provided with a plurality of vacuum holes is known, for example, from Japanese Patent Application Laid-Open Publication No. H11-163,837.
[0003]
[Patent Document 1]
Japanese Patent Application Laid-Open No. 4-275930
[Problems to be solved by the invention]
However, it should be noted that there is a problem to be solved that is not suitable for changing molds, and is not suitable for switching and producing many types, such as gloves for lighting fixtures. . The present invention has been made in view of such a problem to be solved, and aims to provide a rational piping mechanism on the premise of mold replacement.
[0005]
[Means for Solving the Problems]
In summary, the present invention includes a mold provided with a plurality of vacuum holes, and a piping device detachable from the mold, wherein the piping device has a plurality of individual holes inserted into the respective vacuum holes. This is a vacuum forming mold apparatus provided with a pipe and an integrated pipe that is connected and integrated from these individual pipes. Further, it is preferable to provide a heater capable of conducting heat contact with the mold in the piping device. Furthermore, it is preferable to provide a support device capable of supporting the mold in the piping device.
[0006]
BEST MODE FOR CARRYING OUT THE INVENTION
Next, an embodiment of the present invention will be described. However, it is an exemplary embodiment adopted based on the present invention, and the present invention should not be interpreted in a limited manner based on matters specific to the embodiment. Instead, the technical scope of the present invention should be determined on the basis of the matters stated in the claims and matters substantially equivalent to the matters.
[0007]
The illustrated embodiment includes a mold 2 provided with a plurality of vacuum holes 1... And a piping device 3 detachable from the mold 2. Are a plurality of individual pipes 4 to be inserted into a plurality of individual pipes 4 and an integrated pipe 5 that is connected and integrated from the individual pipes 4 to each other. Further, the piping device 3 is provided with a heater 6 that can be brought into heat-conducting contact with the mold 2. Furthermore, the piping device 3 is provided with a support device 7 that can support the mold 2.
[0008]
More specifically, a fixture 8 is fixed near the outer periphery of the mold 2, and a concave surface 9 is formed at the center of the upper surface of the mold 2. Near the outer periphery of the lower surface of the metal shell piping device 3, the lower ends of the individual pipes 4 are formed so as to protrude in correspondence with the vacuum drawing holes 1. Are connected and integrated to the integrated pipe 5. An O-ring 4a made of an elastic material such as rubber is attached to the outer periphery of the lower end of the individual pipes 4 to ensure airtightness between the lower end of the individual pipes 4 and the upper end of the vacuum drawing holes 1. .
[0009]
A heater 6 for warming the mold 2 to improve the moldability is supported by the piping device 3 with a good buffering property via a buffering element 10 such as a coil spring, and the lower surface of the heater 6 has a cushioning property and heat conductivity like a silicon sheet. The intermediate member 11 made of a good material is stuck and fixed. The heater 6 is a cast heater in which a sheath heater 6a is built in an outer shell made of an aluminum casting or the like.
[0010]
The support device 7 includes an air cylinder mechanism and the like, which is fixed near the center of the lower surface of the piping device 3, and allows the support arm 12 to advance and retreat in both directions from the support device 7. The piping device 3 is supported by a support 13 so as to be vertically movable.
[0011]
In order to change from the state shown in FIGS. 1 and 4 to the state shown in FIG. 5, the piping device 3 and the mold 2 are brought closer to each other so that the lower end of the individual piping 4. To be inserted. At this time, the lower surface of the heater 6, more specifically, the lower surface of the interposition member 11 abuts on the upper surface of the mold 2 within the concave surface 9 with good cushioning properties. Then, when the support arm 12 is extended and the to-be-attached object 8 is supported at the tip thereof, the mold 2 and the piping device 3 are connected. In this state, when air is drawn from the collecting pipe 5 by a vacuum pump (not shown), air is sucked from the lower end of the vacuum drawing holes 1 through the individual pipes 4 and the vacuum drawing holes 1, and a heat-softening resin sheet (not shown) or the like. Can be formed into a predetermined shape, but since the forming method itself is not directly related to the present invention, the description is omitted.
[0012]
Further, in order to change from the state of FIG. 5 to the state of FIGS. 1 and 4, it is preferable to retract the support arm 12 and then raise the piping device 3.
[0013]
According to the present embodiment, the piping apparatus 3 having the individual pipes 4 and the integrated pipe 5 is connected to the mold 2 so that the plurality of vacuum holes 1 in the mold 2 can be evacuated. Therefore, it is easy to exchange the mold 2 for another type, which is extremely advantageous for production switching of types such as gloves for lighting fixtures.
[Brief description of the drawings]
FIG. 1 is an overall perspective view at the time of disassembly. FIG. 2 is a schematic top view of the piping device. FIG. 3 is a schematic perspective view of the top view of the heater. FIG. 4 is an overall sectional view at the time of disassembly. Description]
DESCRIPTION OF SYMBOLS 1 Vacuum drawing hole 2 Die 3 Piping device 4 Individual piping 5 Centralized piping 6 Heater 7 Support device

Claims (3)

複数の真空引き孔を設けた金型と、この金型に着脱可能な配管装置とを備え、前記配管装置には、前記各々の真空引き孔に挿入される複数の個別配管と、これらの個別配管から連通集約した集約配管とを設けた真空成形金型装置。A mold provided with a plurality of vacuum holes, and a piping device detachable from the mold; the piping device includes a plurality of individual pipes inserted into each of the vacuum holes, Vacuum forming mold equipment provided with an integrated pipe that is connected and integrated from the pipe. 請求項1において、配管装置には金型に導熱接触可能なヒーターを設けた真空成形金型装置。2. The vacuum forming mold device according to claim 1, wherein the piping device is provided with a heater capable of making heat conductive contact with the mold. 請求項1または2において、配管装置には金型を支持可能な支持装置を設けた真空成形金型装置。3. The vacuum forming die device according to claim 1, wherein the piping device is provided with a supporting device capable of supporting the die.
JP2003003592A 2003-01-09 2003-01-09 Vacuum forming mold apparatus Pending JP2004216585A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2003003592A JP2004216585A (en) 2003-01-09 2003-01-09 Vacuum forming mold apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003003592A JP2004216585A (en) 2003-01-09 2003-01-09 Vacuum forming mold apparatus

Publications (1)

Publication Number Publication Date
JP2004216585A true JP2004216585A (en) 2004-08-05

Family

ID=32894812

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003003592A Pending JP2004216585A (en) 2003-01-09 2003-01-09 Vacuum forming mold apparatus

Country Status (1)

Country Link
JP (1) JP2004216585A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100792077B1 (en) 2006-05-16 2008-01-04 엘지전자 주식회사 Die assembly

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100792077B1 (en) 2006-05-16 2008-01-04 엘지전자 주식회사 Die assembly

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