JP2004207389A - Illumination optical apparatus, aligner, method of exposure, method of adjusting illumination optical apparatus, and method of manufacturing aligner - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an illumination optical apparatus which can adjust the position of an illumination area formed on an illuminated face while at the same time suppressing a loss of optical energy. <P>SOLUTION: The illumination optical apparatus illuminates the illuminated face (M) based on the luminous flux from a light source (1). The apparatus comprises an optical integrator (7) which is located in an optical path between the light source 1 and the illuminated face and forms a secondary light source based on the luminous flux from the light source 1, and an optical guide optical system (9, 10, 11) which is located in an optical path between the optical integrator and the illuminated face and guides the luminous flux from the secondary light source to the illuminated face. The optical guide optical system includes a reflection mirror (M2) which is so structured as to make a fine movement in order to adjust the position of the illumination area to be formed on the illuminated face. By making a fine movement of the reflection mirror located in an optical path of the optical guide optical system, the position of the illumination area to be formed on the illuminate face can be adjusted. Unlike the conventional technology where the position of the illumination area is adjusted by moving a field stop, this new method goes substantially without a loss of optical energy in the field stop. Consequently, the position of the illumination area to be formed on the illuminated face can be adjusted while at the same time sufficiently suppressing a loss of optical energy. <P>COPYRIGHT: (C)2004,JPO&NCIPI

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to an illumination optical device, an exposure device, an exposure method, a method for adjusting an illumination optical device, and a method for manufacturing an exposure device. In particular, the present invention relates to an illumination optical device suitable for an exposure apparatus for manufacturing a micro device such as a semiconductor device, an imaging device, a liquid crystal display device, and a thin-film magnetic head by a lithography process.
[0002]
[Prior art]
In a typical exposure apparatus of this type, a light beam emitted from a light source is incident on an optical integrator such as a fly-eye lens, and forms a secondary light source including a large number of light sources on a rear focal plane. The light flux from the secondary light source is condensed by the condenser optical system and then forms an illumination field on a predetermined surface conjugate with the mask (or reticle). A mask blind as an illumination field stop is arranged near the predetermined surface.
[0003]
Therefore, the luminous flux from the illumination field formed on the predetermined surface is restricted via the illumination field stop, and then illuminates the mask on which the predetermined pattern is formed in a superimposed manner via the imaging optical system. Thus, an image of the opening of the illumination field stop is formed as an illumination area on the mask. The light transmitted through the pattern of the mask forms an image on a photosensitive substrate (for example, a wafer) via a projection optical system. Thus, the mask pattern is projected and exposed (transferred) on the photosensitive substrate.
[0004]
[Problems to be solved by the invention]
In an exposure apparatus, an optical path from a light source to a photosensitive substrate via an optical integrator, a light guiding optical system (a condenser optical system, an image forming optical system, and the like), a mask, and a projection optical system is extremely long. Therefore, the exposure apparatus is composed of a plurality of units, and after assembling and adjusting each unit, the exposure apparatus is finally manufactured by comprehensively combining these plurality of units. In particular, since the residual aberration allowed in the projection optical system is very small, the mask, the projection optical system, and the photosensitive substrate are positioned with high accuracy along the optical axis.
[0005]
In this case, a combination unit of the mask, the projection optical system, and the photosensitive substrate positioned with high accuracy along the optical axis is formed on the mask by accurately combining an illumination optical device including a plurality of units. It has been very difficult to match the position of the illumination area with the position of the field of view of the projection optical system. Therefore, in the related art, the position of the illumination area formed on the mask is adjusted in accordance with the position of the field of view of the projection optical system by moving the mask blind in a direction perpendicular to the optical axis. Was.
[0006]
However, in the related art in which the position of the illumination area formed on the mask is adjusted by moving the mask blind, it is necessary to illuminate an area considerably larger than the opening of the mask blind depending on the moving range of the mask blind. As a result, in the related art, a certain amount of light is blocked without contributing to illumination in the mask blind, and the throughput of the exposure apparatus is likely to be reduced due to the loss of light amount in the mask blind.
[0007]
The present invention has been made in view of the above-described problems, and has as its object to provide an illumination optical device that can adjust the position of an illumination area formed on an irradiation surface while favorably suppressing loss of light amount. And In addition, the present invention can perform high-precision projection exposure with high throughput by using an illumination optical device that can adjust the position of an illumination area formed on an irradiation surface while favorably suppressing loss of light amount. An object of the present invention is to provide an exposure apparatus and an exposure method.
[0008]
[Means for Solving the Problems]
In order to solve the above-described problems, according to a first embodiment of the present invention, there is provided an illumination optical device for illuminating an illumination target surface based on a light beam from a light source,
An optical integrator arranged in an optical path between the light source and the illuminated surface to form a secondary light source based on a light beam from the light source,
A light guiding optical system arranged in the optical path between the optical integrator and the irradiated surface, for guiding a light beam from the secondary light source to the irradiated surface,
The light guide optical system includes an illumination optical device including a reflecting mirror configured to be finely movable to adjust a position of an illumination area formed on the irradiation surface.
[0009]
According to a preferred mode of the first mode, the reflecting mirror has a planar reflecting surface. Further, it is preferable that the reflecting mirror is configured to be movable along an optical axis of the light guiding optical system. Further, it is preferable that the reflecting mirror is configured to be rotatable about a predetermined axis.
[0010]
According to a preferred aspect of the first aspect, the light guide optical system is disposed at a position optically substantially conjugate with the surface to be irradiated, and the shape and size of an illumination area formed on the surface to be irradiated. Has a field stop for defining the following. Furthermore, the light guide optical system includes a plurality of reflecting mirrors, the reflecting mirror configured to be finely movable to adjust the position of the illumination area, the reflecting mirror closest to the irradiated surface side of the plurality of reflecting mirrors Preferably, they are arranged.
[0011]
According to a second aspect of the present invention, the illumination optical apparatus of the first aspect, and a projection optical system for projecting and exposing a pattern of a mask disposed on the surface to be irradiated to a photosensitive substrate,
The illumination optical device provides an exposure apparatus, wherein the position of the illumination region is adjusted according to the position of a field region of the projection optical system.
[0012]
In a third aspect of the present invention, an illumination step of illuminating a mask via the illumination optical device of the first aspect,
A projection exposure step of projecting and exposing an image of a pattern formed on the illuminated mask onto a photosensitive substrate,
An exposure method is provided, wherein a position of the illumination area by the illumination optical device is positioned in a field area of the projection optical system.
[0013]
According to a fourth embodiment of the present invention, there is provided a method for adjusting an illumination optical device including a light guide optical system for guiding a light beam from a secondary light source formed based on a light beam from a light source to a surface to be irradiated,
There is provided an adjustment method including an adjustment step of finely moving a reflecting mirror arranged in an optical path of the light guiding optical system to adjust a position of an illumination area formed on the irradiation surface.
[0014]
According to a preferred aspect of the fourth aspect, the adjusting step includes a moving step of moving the reflecting mirror along an optical axis of the light guiding optical system and a rotating step of rotating the reflecting mirror about a predetermined axis. It includes at least one of the steps. Further, the light guide optical system includes a plurality of reflecting mirrors, and in the adjusting step, the reflecting mirror, which is arranged closest to the irradiated surface side among the plurality of reflecting mirrors, is slightly moved to the irradiated surface. Preferably, the position of the formed illumination area is adjusted.
[0015]
According to a fifth aspect of the present invention, there is provided an illumination optical device having a light guide optical system for guiding a light beam from a secondary light source formed based on a light beam from a light source to a mask, and the illumination optical device illuminated by the illumination optical device. In a method of manufacturing an exposure apparatus having a projection optical system for projecting and exposing a pattern of a mask onto a photosensitive substrate,
A first installation step of installing the projection optical system at a predetermined position;
A second installation step of installing the illumination optical device at a predetermined position;
Adjusting a position of an illumination area formed on the mask with respect to a field area of the projection optical system on the mask by finely moving a reflecting mirror arranged in an optical path of the light guiding optical system. A manufacturing method is provided.
[0016]
According to a preferred aspect of the fifth aspect, the adjusting step includes a moving step of moving the reflecting mirror along an optical axis of the light guiding optical system and a rotating step of rotating the reflecting mirror about a predetermined axis. It includes at least one of the steps.
[0017]
BEST MODE FOR CARRYING OUT THE INVENTION
An embodiment of the present invention will be described with reference to the accompanying drawings.
FIG. 1 is a view schematically showing a configuration of an exposure apparatus provided with an illumination optical device according to an embodiment of the present invention. In FIG. 1, the Z axis is along the normal direction of the wafer W as a photosensitive substrate, the Y axis is in the direction parallel to the plane of FIG. 1 in the wafer plane, and the Z axis is perpendicular to the plane of FIG. 1 in the wafer plane. The X axis is set in each direction. The exposure apparatus of FIG. 1 includes an ArF excimer laser light source that supplies light having a wavelength of 193 nm as a light source 1 for supplying exposure light (illumination light).
[0018]
A substantially parallel light beam emitted from the light source 1 along the Y direction has a rectangular cross section elongated in the X direction, and enters a beam expander 2 including a pair of lenses 2a and 2b. Each of the lenses 2a and 2b has a negative refractive power and a positive refractive power in FIG. 1, respectively. In addition, at least one of the pair of lenses 2a and 2b is configured to be movable along the optical axis AX. Therefore, the light beam incident on the beam expander 2 is enlarged in the paper of FIG. 1 according to the distance between the pair of lenses 2a and 2b, and shaped into a light beam having a desired rectangular cross section.
[0019]
The substantially parallel light beam passing through the beam expander 2 as a shaping optical system is deflected in the Z direction by a bending mirror, and then enters the afocal zoom lens 4 via the diffractive optical element 3. Generally, a diffractive optical element is formed by forming a step having a pitch on the order of the wavelength of exposure light (illumination light) on a substrate, and has a function of diffracting an incident beam to a desired angle. Specifically, the diffractive optical element 3 has a function of forming a circular light intensity distribution in its far field (or Fraunhofer diffraction region) when a parallel light beam having a rectangular cross section is incident.
[0020]
Therefore, the light beam having passed through the diffractive optical element 3 forms a circular light intensity distribution at the pupil position of the afocal zoom lens 4, that is, a light beam having a circular cross section. The afocal zoom lens 4 is configured such that the magnification can be continuously changed within a predetermined range while maintaining an afocal system (a non-focus optical system). The light beam having passed through the afocal zoom lens 4 is incident on, for example, a diffractive optical element 5 for annular illumination. The afocal zoom lens 4 optically connects the divergence origin of the diffractive optical element 3 and the diffractive surface of the diffractive optical element 5 almost optically conjugate. Then, the numerical aperture of the light beam condensed on one point of the diffractive surface of the diffractive optical element 5 or a surface in the vicinity thereof changes depending on the magnification of the afocal zoom lens 4.
[0021]
The diffractive optical element 5 for annular illumination has a function of forming a ring-shaped light intensity distribution in its far field when a parallel light beam enters. The light beam having passed through the diffractive optical element 5 enters the zoom lens 6. An entrance surface of a microlens array (or fly-eye lens) 7 is positioned near the rear focal plane of the zoom lens 6. The microlens array 7 is an optical element composed of a large number of microlenses having a positive refractive power arranged vertically and horizontally and densely. In general, a microlens array is formed by, for example, performing an etching process on a parallel flat plate to form a microlens group.
[0022]
Here, each micro lens constituting the micro lens array is smaller than each lens element constituting the fly-eye lens. Also, unlike a fly-eye lens composed of lens elements isolated from each other, the microlens array has a large number of microlenses (microrefractive surfaces) formed integrally without being isolated from each other. However, the microlens array is a wavefront splitting optical integrator similar to a fly-eye lens in that lens elements having positive refractive power are arranged vertically and horizontally. In FIG. 1, the number of microlenses constituting the microlens array 7 is much smaller than the actual number for clarity.
[0023]
As described above, the luminous flux from the circular light intensity distribution formed at the pupil position of the afocal zoom lens 4 via the diffractive optical element 3 is emitted from the afocal zoom lens 4 and then has various angular components. And enters the diffractive optical element 5. On the other hand, the diffractive optical element 5 has a function as a light beam conversion element that forms a ring-shaped light intensity distribution in the far field when a parallel light beam enters. Accordingly, the light beam having passed through the diffractive optical element 5 forms an annular illumination field around the optical axis AX, for example, on the rear focal plane of the zoom lens 6 (and thus on the incident surface of the microlens array 7).
[0024]
The outer diameter of the annular illumination field formed on the incident surface of the microlens array 7 changes depending on the focal length of the zoom lens 6. As described above, the zoom lens 6 connects the diffractive optical element 5 and the incident surface of the microlens array 7 substantially in a Fourier transform relationship. The light beam incident on the microlens array 7 is two-dimensionally divided by a large number of minute lenses, and a light source is formed on the rear focal plane of each minute lens on which the light beam has entered. Thus, on the rear focal plane of the microlens array 7, a substantially annular light source (hereinafter referred to as “secondary light source”) having substantially the same light intensity distribution as the illumination field formed by the light beam incident on the microlens array 7 is provided. A light source) is formed.
[0025]
The light flux from the annular secondary light source formed on the rear focal plane of the microlens array 7 is incident on an aperture stop 8 arranged in the vicinity thereof. The light from the secondary light source through the aperture stop 8 having the annular aperture (light transmitting portion) is subjected to the condensing action of the condenser optical system 9 and then disposed on the rear focal plane or in the vicinity thereof. The mask blind 10 is illuminated in a superimposed manner. In this way, a rectangular illumination field similar to the shape of each micro lens constituting the micro lens array 7 is formed on the mask blind 10 as the illumination field stop.
[0026]
The light beam passing through the rectangular opening (light transmitting portion) of the mask blind 10 receives the light-condensing action of the imaging optical system 11 and then illuminates the mask M on which a predetermined pattern is formed in a superimposed manner. Thus, the imaging optical system 11 forms an image of the rectangular opening of the mask blind 10 on the mask M. In the optical path of the imaging optical system 11, a first plane reflecting mirror M1 for deflecting light incident along the Z direction in the Y direction is arranged. In the optical path between the imaging optical system 11 and the mask M, a second plane reflecting mirror M2 for deflecting light incident along the Y direction in the Z direction is arranged. The configuration and operation of the second plane reflecting mirror M2 will be described later.
[0027]
As described above, the condenser optical system 9, the mask blind 10, and the imaging optical system 11 constitute a light guiding optical system for guiding a light beam from the secondary light source to the mask M. The light flux transmitted through the pattern of the mask M forms an image of the mask pattern on the wafer W as a photosensitive substrate via the projection optical system PL. In this way, by performing collective exposure or scan exposure while controlling the wafer W two-dimensionally in a plane (XY plane) orthogonal to the optical axis AX of the projection optical system PL, each exposure area of the wafer W is masked. The M patterns are sequentially exposed.
[0028]
In the batch exposure, a mask pattern is collectively exposed to each exposure region of the wafer according to a so-called step-and-repeat method. In this case, the shape of the illumination region on the mask M is a rectangular shape close to a square, and the cross-sectional shape of each minute lens of the microlens array 7 is also a rectangular shape close to a square. On the other hand, in scan exposure, according to a so-called step-and-scan method, a mask pattern is scanned and exposed on each exposure region of a wafer while the mask and wafer are relatively moved with respect to a projection optical system. In this case, the shape of the illumination area on the mask M is a rectangular shape having a ratio of the short side to the long side of, for example, 1: 3, and the cross-sectional shape of each microlens of the microlens array 7 is similar to the rectangular shape. It becomes.
[0029]
FIG. 2 is a diagram schematically showing the configuration and operation of the second plane reflecting mirror. Referring to FIG. 2, the second plane reflecting mirror M2 is configured to be movable along the optical axis AX of the light guide optical system (9, 10, 11), that is, to be movable along the Y direction and the Z direction, respectively. Have been. The second plane reflecting mirror M2 is configured to be rotatable about a first axis R1 extending in the X direction through an intersection between the reflecting surface and the optical axis AX. Further, the second plane reflecting mirror M2 is configured to be rotatable around a second axis R2 defined as an intersection line between the reflecting surface and a plane including the optical axis AX.
[0030]
Therefore, by moving the second plane reflecting mirror M2 along the Y direction, or by moving the second plane reflecting mirror M2 along the Z direction, or by moving the second plane reflecting mirror M2 around the first axis R1. , The illumination region IR formed on the mask M can be moved in the Y direction. On the other hand, by rotating the second plane reflecting mirror M2 about the second axis R2, the illumination region IR formed on the mask M can be moved in the X direction.
[0031]
Thus, when manufacturing the exposure apparatus according to the present embodiment, the projection optical system PL is assembled and installed at a predetermined position, and the illumination optical devices (1 to 11) are assembled and installed at the predetermined position. Is finely adjusted to adjust the position of the illumination region IR formed on the mask M with respect to the field of view of the projection optical system PL on the mask M. As described above, in the present embodiment, the position of the illumination region IR formed on the mask M can be adjusted by slightly moving the second plane reflecting mirror M2. Therefore, unlike the related art in which the position of the illumination area is adjusted by moving the mask blind, it is possible to substantially avoid the occurrence of light amount loss in the mask blind 10. That is, in the present embodiment, it is possible to adjust the position of the illumination region IR formed on the mask M according to the position of the field of view of the projection optical system PL while favorably suppressing the loss of light amount, and as a result, high accuracy Projection exposure can be performed with high throughput.
[0032]
In the above-described embodiment, the second plane reflecting mirror M2 is configured to be movable along the Y direction and the Z direction, respectively, and is configured to be rotatable about the first axis R1. However, without being limited to this, to move the illumination region IR formed on the mask M along the Y direction, the second plane reflecting mirror M2 can be moved along the Y direction, or can be moved in the Z direction. May be configured so as to be movable along the axis or rotatable about the first axis R1.
[0033]
In the above-described embodiment, the position of the illumination region IR formed on the mask M is adjusted by slightly moving the second plane reflecting mirror M2 disposed in the optical path between the imaging optical system 11 and the mask M. are doing. However, the present invention is not limited to this. By slightly moving the first plane reflecting mirror M1 disposed in the optical path of the imaging optical system 11, or by moving the second plane reflecting mirror M2 and the first plane reflecting mirror M1. By finely moving both, the position of the illumination region IR can be adjusted. However, it is better to finely move the second plane reflecting mirror M2 arranged closest to the mask side of the two plane reflecting mirrors M1 and M2, that is, to finely move the plane reflecting mirror closer to the mask M in the position of the illumination region IR. Can be adjusted stably.
[0034]
Further, in the above-described embodiment, an illumination field stop for defining the shape and size of the illumination region IR formed on the mask M in the optical path between the microlens array 7 as an optical integrator and the mask M A mask blind 10 is disposed. However, without being limited to this, even in a modified example in which the illumination field stop is not interposed in the optical path between the microlens array 7 as an optical integrator and the mask M as shown in FIG. The position of the illumination region IR formed on the mask M can be adjusted by slightly moving the plane reflecting mirror M3 arranged on the side.
[0035]
Further, in the above-described embodiment, the annular illumination is performed by using the diffractive optical element 5 for annular illumination. However, the present invention is not limited to this. By setting the optical element in the illumination optical path, quadrupole illumination is performed, the diffractive optical element 3 is retracted from the illumination optical path, and a diffractive optical element for circular illumination is set in the illumination optical path instead of the diffractive optical element 5. By doing so, circular illumination can be performed.
[0036]
In the exposure apparatus according to the above-described embodiment, a mask (reticle) is illuminated by an illumination optical device (illumination step), and a transfer pattern formed on the mask is exposed onto a photosensitive substrate using a projection optical system (exposure). Through the steps, a micro device (semiconductor element, imaging element, liquid crystal display element, thin film magnetic head, etc.) can be manufactured. Hereinafter, an example of a technique for obtaining a semiconductor device as a micro device by forming a predetermined circuit pattern on a wafer or the like as a photosensitive substrate using the exposure apparatus of the present embodiment will be described with reference to the flowchart of FIG. Will be explained.
[0037]
First, in step 301 of FIG. 4, a metal film is deposited on one lot of wafers. In the next step 302, a photoresist is applied on the metal film on the l lot of wafers. Thereafter, in step 303, using the exposure apparatus of this embodiment, an image of the pattern on the mask is sequentially exposed and transferred to each shot area on the wafer of the lot through the projection optical system. Thereafter, in step 304, the photoresist on the one lot of wafers is developed, and in step 305, the resist on the one lot of wafers is etched using the resist pattern as a mask, thereby forming a pattern on the mask. A corresponding circuit pattern is formed in each shot area on each wafer. Thereafter, a device such as a semiconductor element is manufactured by forming a circuit pattern of an upper layer and the like. According to the above-described semiconductor device manufacturing method, a semiconductor device having an extremely fine circuit pattern can be obtained with high throughput.
[0038]
In the exposure apparatus of the present embodiment, a liquid crystal display element as a micro device can be obtained by forming a predetermined pattern (circuit pattern, electrode pattern, etc.) on a plate (glass substrate). Hereinafter, an example of the technique at this time will be described with reference to the flowchart of FIG. In FIG. 5, in a pattern forming step 401, a so-called photolithography step of transferring and exposing a mask pattern onto a photosensitive substrate (eg, a glass substrate coated with a resist) using the exposure apparatus of the present embodiment is performed. By this photolithography process, a predetermined pattern including a large number of electrodes and the like is formed on the photosensitive substrate. Thereafter, the exposed substrate undergoes each of a developing process, an etching process, a resist stripping process, and the like, whereby a predetermined pattern is formed on the substrate, and the process proceeds to the next color filter forming process 402.
[0039]
Next, in a color filter forming step 402, a large number of sets of three dots corresponding to R (Red), G (Green), and B (Blue) are arranged in a matrix, or three sets of R, G, B Are formed in a horizontal scanning line direction to form a color filter. Then, after the color filter forming step 402, a cell assembling step 403 is performed. In the cell assembly step 403, a liquid crystal panel (liquid crystal cell) is assembled using the substrate having the predetermined pattern obtained in the pattern formation step 401, the color filter obtained in the color filter formation step 402, and the like. In the cell assembling step 403, for example, a liquid crystal is injected between the substrate having the predetermined pattern obtained in the pattern forming step 401 and the color filter obtained in the color filter forming step 402, and a liquid crystal panel (liquid crystal cell) is formed. ) To manufacture.
[0040]
Thereafter, in a module assembling step 404, components such as an electric circuit and a backlight for performing a display operation of the assembled liquid crystal panel (liquid crystal cell) are attached to complete a liquid crystal display element. According to the above-described method for manufacturing a liquid crystal display device, a liquid crystal display device having an extremely fine circuit pattern can be obtained with high throughput.
[0041]
In the embodiment described above, ArF excimer laser is used a light source, but without having to be limited to this, for example, a wavelength for supplying light of KrF excimer laser light source or the wavelength 156nm supplies light of 248 nm F ₂ Other suitable light sources such as excimer laser light sources can also be used. Further, in the above-described embodiment, the present invention has been described by taking as an example a projection exposure apparatus provided with an illumination optical device. However, the present invention is applied to a general illumination optical device for illuminating an irradiated surface other than a mask. Obviously you can.
[0042]
【The invention's effect】
As described above, in the illumination optical device of the present invention, it is possible to adjust the position of the illumination area formed on the surface to be illuminated by slightly moving the reflector disposed in the optical path of the light guide optical system. Therefore, unlike the related art in which the position of the illumination area is adjusted by moving the field stop, it is possible to substantially avoid the occurrence of light amount loss in the field stop. As a result, it is possible to adjust the position of the illumination area formed on the irradiation surface while favorably suppressing the light amount loss.
[0043]
Therefore, in the exposure apparatus and the exposure method using the illumination optical device of the present invention, the position of the illumination area formed on the mask can be adjusted according to the position of the field of view of the projection optical system, and as a result, highly accurate projection can be performed. Exposure can be performed at a high throughput, and a good device can be manufactured at a high throughput.
[Brief description of the drawings]
FIG. 1 is a view schematically showing a configuration of an exposure apparatus according to an embodiment of the present invention.
FIG. 2 is a diagram schematically showing the configuration and operation of a second plane reflecting mirror.
FIG. 3 is a diagram schematically showing a configuration of an exposure apparatus according to a modification of the present embodiment.
FIG. 4 is a flowchart of a method for obtaining a semiconductor device as a micro device.
FIG. 5 is a flowchart of a method for obtaining a liquid crystal display element as a micro device.
[Explanation of symbols]
Reference Signs List 1 light source 3, 5 diffractive optical element 4 afocal zoom lens 6 zoom lens 7 micro lens array 8 aperture stop 9 condenser optical system 10 mask blind (illumination field stop)
11 imaging optical system M1, M2, M3 plane reflecting mirror M mask PL projection optical system W wafer IR illumination area

Claims (13)

In an illumination optical device for illuminating a surface to be irradiated based on a light beam from a light source,
An optical integrator arranged in an optical path between the light source and the illuminated surface to form a secondary light source based on a light beam from the light source,
A light guiding optical system arranged in the optical path between the optical integrator and the irradiated surface, for guiding a light beam from the secondary light source to the irradiated surface,
The illumination optical device, wherein the light guide optical system includes a reflecting mirror configured to be finely movable to adjust a position of an illumination area formed on the irradiation surface. The illumination optical device according to claim 1, wherein the reflecting mirror has a planar reflecting surface. The illumination optical device according to claim 1, wherein the reflecting mirror is configured to be movable along an optical axis of the light guiding optical system. The illumination optical device according to claim 1, wherein the reflecting mirror is configured to be rotatable about a predetermined axis. The light guide optical system has a field stop arranged at a position optically substantially conjugate with the irradiation surface and defining a shape and a size of an illumination area formed on the irradiation surface. The illumination optical device according to claim 1. The light guiding optical system includes a plurality of reflecting mirrors,
6. The reflection mirror according to claim 1, wherein the reflection mirror configured to be finely movable to adjust a position of the illumination area is disposed closest to the irradiation surface side among the plurality of reflection mirrors. 7. The illumination optical device according to claim 1. An illumination optical device according to any one of claims 1 to 6, further comprising: a projection optical system for projecting and exposing a pattern of a mask disposed on the irradiation surface to a photosensitive substrate.
An exposure apparatus, wherein the illumination optical device adjusts the position of the illumination area in accordance with the position of a visual field area of the projection optical system. An illumination step of illuminating a mask via the illumination optical device according to any one of claims 1 to 6,
A projection exposure step of projecting and exposing an image of a pattern formed on the illuminated mask onto a photosensitive substrate,
An exposure method, wherein the position of the illumination area by the illumination optical device is positioned in a field area of the projection optical system. In an adjustment method of an illumination optical device including a light guide optical system for guiding a light beam from a secondary light source formed based on a light beam from a light source to a surface to be irradiated,
An adjustment method, comprising: adjusting a position of an illumination area formed on the surface to be illuminated by slightly moving a reflecting mirror arranged in an optical path of the light guide optical system. The adjusting step includes at least one of a moving step of moving the reflecting mirror along an optical axis of the light guiding optical system and a rotating step of rotating the reflecting mirror about a predetermined axis. The adjustment method according to claim 9, wherein: The light guiding optical system includes a plurality of reflecting mirrors,
In the adjusting step, the position of the illumination area formed on the irradiated surface is adjusted by finely moving the reflecting mirror, which is disposed closest to the irradiated surface side, of the plurality of reflecting mirrors. The adjustment method according to claim 9 or 10, wherein the adjustment is performed. An illumination optical device having a light guiding optical system for guiding a light beam from a secondary light source formed based on a light beam from a light source to a mask, and a pattern of the mask illuminated by the illumination optical device on a photosensitive substrate. In a method of manufacturing an exposure apparatus including a projection optical system for projection exposure,
A first installation step of installing the projection optical system at a predetermined position;
A second installation step of installing the illumination optical device at a predetermined position;
Adjusting a position of an illumination area formed on the mask with respect to a field area of the projection optical system on the mask by finely moving a reflecting mirror arranged in an optical path of the light guiding optical system. A manufacturing method characterized in that: The adjusting step includes at least one of a moving step of moving the reflecting mirror along an optical axis of the light guiding optical system and a rotating step of rotating the reflecting mirror about a predetermined axis. The method according to claim 12, wherein:

Images