JP2004195269A - Endoscopic equipment - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide endoscopic equipment capable of reducing trouble such as flare or the like. <P>SOLUTION: In the endoscopic equipment having a solid-state image pickup device arranged to its distal end part and equipped with a treatment applicance channel into which a treatment appliance is inserted, an optical black region is arranged adjacent to at least one side of the image region of the solid-state image pickup device and the hole for the treatment appliance channel provided to the end suface of an endoscope is arranged at a position adjacent to the side provided with the optical black region of the image region. <P>COPYRIGHT: (C)2004,JPO&NCIPI

Description

  The present invention relates to an endoscope apparatus that reduces emission of unnecessary radiation noise from an endoscope and mixing of unnecessary noise into the endoscope.

  2. Description of the Related Art In recent years, it has become increasingly desirable that electrical equipment used in hospitals and the like be adequately provided with EMC (collectively, electromagnetic interference (EMI) and electromagnetic interference (EMS)) countermeasures. Under such circumstances, EMC measures are one of the important technical matters for endoscope devices.

  To cope with this, for example, Japanese Unexamined Patent Publication No. Hei 7-184852 by the present applicant discloses a cable for driving a solid-state imaging device (hereinafter referred to as a CCD) and extracting electric signals by twisting a plurality of signal lines. There is disclosed a technology in which a shield body for shielding noise is provided on the outer periphery. In the CCD cable, a coaxial signal line is used as a signal line for transmitting a drive signal and a CCD output signal among input / output signals of the CCD, and the coaxial signal line is made of, for example, a copper alloy wire. Inner conductor layer, dielectric (insulator) layer made of Teflon (R) resin, outer conductor layer made of copper alloy, and insulator layer made of Teflon (R) resin Are laminated.

  According to such a technique, noise radiated from a signal line or the like transmitting a drive signal is shielded by an outer conductor layer of the signal line (coaxial signal line) or a shield disposed at the outermost periphery of the cable.

  However, when the frequency of the transmitted signal increases, noise generated during signal transmission may not be sufficiently shielded only by the external conductor and the shield. Particularly, the driving frequency of the horizontal transfer pulse for driving the CCD is as high as several MHz to several tens of MHz, and there is a possibility that the noise generated when transmitting the horizontal transfer pulse can no longer be completely shielded.

  In general, in a distal end portion 150 of an electronic endoscope into which a treatment tool such as a cannula as shown in FIG. 23A can be inserted, as shown in FIG. A component channel 154 is provided adjacent to a solid-state imaging device (hereinafter referred to as a CCD) 151. Here, reference numeral 152 in the drawing denotes a light-receiving unit capable of capturing an image in the CCD 151, and reference numeral 153 denotes a light-shielding unit (OB unit: optical black unit) of the CCD 151.

  However, in such an electronic endoscope, when a treatment tool made of metal such as a cannula and the like having a high reflectance is inserted into the treatment tool channel 154, the distal end portion 150 receives a part of the illumination light emitted from an illumination window (not shown). The part is reflected by the treatment tool and is incident on the CCD 151, which may cause a problem such as flare on the captured image. If the distance between the CCD 151 and the treatment instrument channel 154 is increased in response to this, the above-mentioned problem is solved, but it causes the end of the endoscope to have a large diameter.

  The present invention has been made in view of the above circumstances, and an object of the present invention is to provide an endoscope apparatus that can reduce problems such as flare.

  In the endoscope apparatus according to the present invention, the solid-state imaging device is disposed at the distal end, and further includes a treatment tool channel through which a treatment tool is inserted, wherein at least one side of an image area of the solid-state imaging device is provided. The optical black region is disposed adjacent to the endoscope, and the treatment tool channel hole on the end surface of the endoscope is disposed at a position adjacent to the side where the optical black region is provided.

  ADVANTAGE OF THE INVENTION According to this invention, the endoscope apparatus which can reduce malfunctions, such as a flare, can be provided.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  1 to 4 relate to an embodiment of the present invention, FIG. 1 is an overall configuration diagram showing an endoscope device, FIG. 2 is a sectional view of a main part of a distal end portion of an electronic endoscope, and FIG. FIG. 4 is a cross-sectional view showing a main part of the coaxial signal line.

First, an outline of an endoscope apparatus to which the present invention is applied will be described with reference to FIG.
An endoscope device 1 shown in FIG. 1 includes an electronic endoscope 2 provided with an electromagnetic interference countermeasure, a light source device 3 for supplying illumination light by connecting the electronic endoscope 2, and an electronic endoscope. A video processor 5 connected to the endoscope 2 via the scope cable 4 and performing signal processing on a solid-state imaging device (hereinafter abbreviated as CCD) 25 (see FIG. 2) built in the electronic endoscope 2; A color monitor 6 that is input via a monitor cable connected to the processor 5 and displays a video signal.

  The electronic endoscope 2 includes an elongated insertion section 7 that can be inserted into a body cavity or the like, an operation section 8 connected to a rear end of the insertion section 7, and a universal cord section extending from the operation section 8. 9 and a scope connector section 10 provided at an end of the universal cord section 9 and detachably connected to the light source device 3.

  Here, a contact connector section 10a is provided on a side of the scope connector section 10, and the scope cable 4 is detachably connected to the contact connector section 10a via an electric connector 4a. Further, a video processor 5 is detachably connected to the other end of the scope cable 4 via an electric connector 4b.

  The insertion section 7 includes a front end portion 12 in which a solid-state imaging device 22 is provided, a bendable bending portion 13 formed at a rear end of the front end portion 12, and an operating portion from the rear end of the bending portion 13. 8 and a long flexible tube portion 21 reaching the front end.

  The operation section 8 is provided with a bending operation knob 14, and the bending section 13 is bent by gripping the grip section 18 and operating the bending operation knob 14. An air supply / water supply control unit 15 for performing air supply / water supply control and a suction control unit 16 for controlling suction are provided on a side surface of the operation unit 8. Further, a switch unit 17 having a plurality of switches 17a is provided on the top of the operation unit 8.

  In addition, a light guide (not shown) for transmitting illumination light is inserted through the inside of the insertion section 7, the operation section 8, and the universal cord section 9. The rear end of the light guide reaches the scope connector 10, transmits the illumination light supplied from the lamp inside the light source device 3, and emits the light forward from the distal end surface fixed to the illumination window 20 of the distal end portion 12. It illuminates a subject such as an affected part.

  A subject image illuminated by the illumination light is transmitted through an objective optical system unit 23 mounted in an observation window 19 adjacent to the illumination window 20 to a solid-state imaging device (hereinafter, referred to as a CCD and a CCD) arranged at the image forming position. 25) and photoelectrically converted by the CCD 25 (see FIG. 2).

  Further, a CCD cable 30 is connected to the CCD 25, and the CCD cable 30 is connected to the scope cable 4 via a noise reducer (not shown) housed in the scope connector unit 10, and the scope cable 4 is connected to the video processor 5. Is connected to

  An air supply / water supply conduit (not shown) is inserted into the insertion section 7. The air supply / water supply line is connected to the air supply / water supply control unit 15 by the operation unit 8, and the end thereof is connected to the scope connector unit 10 through the air supply / water supply line inserted through the universal cord unit 9. And is connected to the air / water supply mechanism in the light source device 3.

  A suction pipe (not shown) inserted into the insertion section 7 is branched into two near the front end of the operation section 8, one of which is communicated with the forceps port 11 b, and the other is connected to the universal cord section via the suction control section 16. The suction connector communicates with the suction conduit in the pipe 9 and reaches a suction base (not shown) of the scope connector section 10.

  In addition, the suction conduit is opened as a front end opening 11a at the front end portion 12, and this front end opening 11a functions as a suction port for performing suction during a suction operation, and when forceps are inserted from the forceps port 11b, the forceps are projected. Functions as a forceps outlet.

Next, the configuration of the solid-state imaging device mainly at the distal end portion 12 of the electronic endoscope 2 will be described with reference to FIG.
The distal end portion 12 includes the objective optical system unit 23 and a solid-state imaging device 22 disposed behind the objective optical system unit 23.

  The objective optical system unit 23 includes an objective lens group 24 including a plurality of lenses, and an objective lens frame 28 that holds the objective lens group 24 therein. It is held by the distal end portion 12 by being fitted.

  Further, a CCD holder 27 is externally fitted to the base end side of the objective lens frame 28, and the solid-state imaging device 22 is held by the objective optical system unit 23 via the CCD holder 27.

  Specifically, a cover glass 26 facing the objective lens group 24 is held on the inner periphery of the CCD holder 27.

  Further, a CCD 25 is attached to the base end surface of the cover glass 26. The CCD 25 includes a CCD chip 25a. The CCD chip 25a is attached to the cover glass 26 via a cover glass 25b attached to the front surface.

  A bump 25e as a contact is provided on a part of the front surface of the CCD chip 25a, and the CCD chip 25a is connected to the circuit board 25c via the bump 25e.

  Here, the circuit board 25c has a so-called TAB structure and includes a polyimide base 25f and a conductor pattern 25d made of copper foil provided on the polyimide base 25f. A part of the conductor pattern 25d extends from the end of the polyimide base material 25f near the bump 25e, and the extended conductor pattern 25d is joined to the bump 25e to exchange signals with the CCD chip 25a. It has become to be. The periphery of the joint between the conductor pattern 25d and the bump 25e is sealed with a sealing resin 25g.

  A land (not shown) is provided on the circuit board 25c, and electronic components including an IC for amplifying an output signal from the CCD chip 25a, a capacitor for canceling noise, a resistor for ensuring impedance matching, and the like. 29 are implemented. The IC, the capacitor and the resistor may be built in the CCD chip 25a in advance.

  A CCD cable 30 for transmitting and receiving signals to and from a CCU (camera control unit) and the like is connected on the circuit board 25c. The CCD cable 30 includes, for example, a coaxial signal line 39 for transmitting a drive signal to 25a, a coaxial signal line 40 for transmitting an output signal from the CCD chip 25a to a processor (not shown), and a drive for driving the CCD chip 25a. And a simple signal line 41 for power supply. These signal lines extend from the distal end of the CCD cable 30 and are connected to the circuit board 25c. Here, the external conductor group 42 of the plurality of coaxial signal lines is connected to the GND potential wired from the CCD chip 25a. As shown in the figure, when the size of the solid-state imaging device 22 is reduced and it is difficult to provide a plurality of signal line connection lands on the circuit board 25c, the signal lines are provided on the electrodes of the electronic component 29. Is arranged. The more detailed configuration of the CCD cable 30 will be described later.

  Further, a shield member 32 is externally fitted to the CCD holder 27. The shield member 32 extends to the vicinity of the distal end of the CCD cable 30 to suppress unnecessary radiation and covers the outer periphery of the CCD 25, and is electrically connected to a GND line (not shown) of the CCD 25.

  An insulating member for preventing the CCD 25 from contacting the shield member 32 and short-circuiting to the GND potential is provided on the inner periphery of the shield member 32 and the outer periphery from the base of the CCD holder 27 to the CCD 25. 31 are coated.

  A covering member 34 is provided on the outer periphery of the shield member 32. The covering member 34 covers and seals the entire solid-state imaging device 22 from the distal end of the CCD holder 27 to the distal end of the CCD cable 30. When the covering member 34 is sealed, the CCD 25 and the circuit board 25c are used. The filler 33 is filled around each signal line and the like. The filler 33 may be, for example, an epoxy-based or silicone-based adhesive.

  Here, in the solid-state imaging device 22 configured as described above, the CCD holder 27 is fitted and fixed to the objective lens frame 28 while focusing is performed between the objective lens group 24 and the CCD chip 25a. It is fixed to the optical system unit 23. When the objective lens frame 28 and the CCD holder 27 are fixed, for example, an epoxy-based adhesive is used.

  A bending first frame 37 that forms a bending tube (not shown) is connected to the base end side of the distal end frame 35.

  A resin-made tip cover 36 is provided on the front side of the tip frame 35, and a rubber covering member 38 is provided on the outer periphery of the tip frame 35 and the curved first frame 37. Is sealed.

  In such an electronic endoscope 2, various signals are transmitted and received between the CCD 25 and the processor via the CCD cable 30 in order to drive the CCD 25. In particular, as signals for driving the CCD 25, there are a horizontal transfer pulse, a vertical transfer pulse, and a drive power source. In particular, the drive frequency of the horizontal transfer pulse is as high as several MHz to several tens of MHz. Therefore, it is known that the cause of the radiation noise of the electronic endoscope 2 is mainly the horizontal transfer pulse signal, which is emitted from the signal line transmitting the horizontal transfer pulse signal.

  Next, a configuration of the CCD cable 30 applied to the electronic endoscope 2 and suitable for transmitting a horizontal transfer pulse signal will be described in detail with reference to FIGS. As shown in FIG. 3, the CCD cable 30 includes a coaxial signal line 39 transmitting a horizontal transfer pulse, a vertical transfer pulse having a relatively low driving frequency, and a coaxial signal line 40 transmitting an output signal from the CCD. It mainly comprises a twisted group of signal lines including a simple signal line 41 for transmitting a driving power supply for a CCD and a hybrid IC and a coaxial signal line 43 for transmitting another signal such as a vertical transfer pulse having a relatively low driving frequency. I have.

  An intervening member 30d made of, for example, a cotton yarn or an elastic body is provided at the twist center of these signal lines.

  A protective tape 30c made of, for example, a Teflon (R) tape is wound around the outer periphery of the stranded wire group.

  A shield 30b is provided on the outer periphery of the protective tape 30c to cover the entire stranded wire group and to suppress unnecessary radiation or prevent intrusion of radiated noise from other sources.

  Further, a sheath 30a made of Teflon (R) is provided on the outer circumference of the protection tape 30c which is the outermost circumference of the CCD cable 30.

  As shown in FIG. 4, the coaxial signal line 39 has an inner conductor 39a at the center thereof, and an outer periphery of the inner conductor 39a is coated with an insulator 39b made of, for example, Teflon (R).

  A first outer conductor 39c is provided on the outer periphery of the insulator 39b, and a second outer conductor 39d is provided on the outer periphery of the first outer conductor 39c.

  Here, the first outer conductor 39c is formed of a stranded wire obtained by twisting about 20 copper alloy wires having a wire diameter of 0.03 mm, and is wound horizontally around the outer periphery of the insulator 39b. The copper alloy wire is subjected to, for example, tin plating. When the conductor resistance of the first outer conductor 39c is to be kept low, silver plating may be performed instead of tin plating.

  The second outer conductor 39d is formed by depositing a metal having a low conductor resistance on a polyester tape as a base material, and is wound around the outer periphery of the first outer conductor 39c without a gap or overlapping. ing. Copper or aluminum is applied as the metal to be deposited. Such metal deposition may be performed on both sides of the polyester substrate, or may be performed on one side depending on the level of radiation noise. When the second outer conductor 39d is formed by depositing metal on only one side of the polyester tape, the second outer conductor 39d is wound around the first outer conductor with the metal deposition surface in close contact with the first outer conductor. Is done.

  Further, an insulator 39e made of, for example, Teflon (R) is provided on the outer periphery of the second outer conductor 39d.

  The coaxial signal line 40 for transmitting the vertical transfer pulse and the output signal from the CCD has substantially the same configuration as the coaxial signal line 39 except that the second outer conductor 39d is not provided. . Further, the simple signal line 41 has a configuration in which the outer periphery of the inner conductor is covered with an insulator.

According to such an embodiment, a double shield is provided on the coaxial signal line 39 for transmitting a horizontal transfer pulse with a high drive frequency, so that the horizontal conductor is radiated from the internal conductor 39a when transmitting the horizontal transfer pulse. The radiation noise can be suppressed.
In addition, since the shield 30b is provided on the outer periphery of a group of twisted wires in which a plurality of signal wires including the coaxial signal wire 39 are twisted and bundled to constitute the CCD cable 30, the noise radiated from the coaxial signal wire 39 can be more reliably reduced. Can be suppressed.

  Further, since the first external conductor 39c is wound horizontally around the outer periphery of the insulator 39b, the first external conductor 39c is superimposed at the time of winding and the coaxial signal line 39 has a large diameter. Can be prevented.

  Further, since the second outer conductor 39d is formed by depositing metal on a polyester tape, the thickness of the second outer conductor 39d can be reduced, and the coaxial signal due to the provision of the double shield is provided. The increase in the diameter of the wire 39 can be minimized.

  Next, FIG. 5 shows a modification of the above-described embodiment according to the present invention, and FIG. 5 is a sectional view showing a main part of a CCD cable. The endoscope device of this modification is different from the above-described embodiment in the structure of the CCD cable. Note that the same components as those in the above-described embodiment are denoted by the same reference numerals, and description thereof is omitted.

  At the center of the CCD cable 44 in this modified example, a first stranded wire group 44e, which is formed by twisting a coaxial signal line 39 for transmitting a horizontal transfer pulse as a high-frequency drive signal, is provided. .

  An intervening member 44h is provided on the outer periphery of the first stranded wire group 44e, and a first shield body 44d is provided on the outer periphery of the intervening member 44h.

  Further, on the outer periphery of the first shield body 44d, a coaxial signal line 40 for transmitting an output signal from the CCD, a simple signal line 41 for transmitting a power supply for driving the CCD and the hybrid IC, and a vertical line having a relatively low driving frequency. A coaxial signal line 43 for transmitting another signal such as a transfer pulse, and a second group of twisted wires 44f formed by twisting and bundling a linearly formed intervening member 44g are provided. The intervening member 44g may be omitted when the inner diameter of the second stranded wire group 44f has a predetermined inner diameter.

  A protective tape 44c made of Teflon (R) is spirally wound closely around the outer periphery of the second stranded wire group 44f.

  A second shield body 44b is provided on the outer circumference of the protective tape 44c, and a sheath 44a made of Teflon (R) is provided on the outer circumference of the second shield body 44b.

  According to such a modification, the coaxial signal line 39 for transmitting a horizontal transfer pulse, which is a source of a large noise, is arranged at the center, and the outer periphery of the coaxial signal line 39 is placed around the first shield body 44d and the second shield 44d. By covering with the stranded wire group 44f and the second shield body 44b, the shielding effect of radiation noise generated from the coaxial signal line 39 can be improved, and the level of unnecessary radiation can be reduced more effectively. be able to.

[Appendix]
(Supplementary Note 1-1)
An endoscope device having a solid-state imaging device and having a cable for transmitting input / output signals to the solid-state imaging device,
Among the plurality of signal lines constituting the cable, a signal line for transmitting a high-frequency signal is constituted by a coaxial signal line, and an outer conductor of the present coaxial signal line is a double line comprising a first outer conductor and a second outer conductor. An endoscope device comprising a shield.

(Appendix 1-2)
In the double shield body, the first outer conductor forming the first shield is formed of a horizontally wound copper alloy wire, and the second outer conductor forming the second outer conductor is formed of a polyester base material. The endoscope apparatus according to Supplementary Note 1-1, wherein a metal having a high conductivity is formed by vapor deposition.

(Appendix 1-3)
The endoscope apparatus according to attachment 1-1, wherein the signal line having the double shield body is a signal line transmitting at least a horizontal transfer pulse signal.

(Appendix 1-4)
The cable for transmitting input / output signals to the solid-state imaging device,
The endoscope according to Supplementary Notes 1-1 to 1-3, further comprising a shield body that covers an outer periphery of a plurality of signal lines including at least the signal line that transmits a high-frequency signal and blocks noise. apparatus.

(Appendix 1-5)
The cable for transmitting input / output signals to the solid-state imaging device,
A first stranded wire group disposed at the center of the cable and formed by twisting a plurality of signal lines including the signal line transmitting at least a high-frequency signal;
A first shield body that covers the outer periphery of the first stranded wire group and blocks noise, and a signal wire other than the first stranded wire group is stranded around the outer periphery of the first shield body. A second stranded wire group;
The endoscope apparatus according to any one of appendices 1-1 to 1-3, further comprising: a second shield body that covers an outer periphery of the second stranded wire group and blocks noise.

  By the way, in an electronic endoscope in which a solid-state imaging device is provided at a distal end, a solid-state imaging device is configured to include a solid-state imaging device and a circuit board on which electronic components are mounted. Are connected to a CCD cable via a circuit board, and signals are exchanged with the control device via the CCD cable. In such a case, the solid-state imaging device, the circuit board, and the CCD cable are serially arranged along the longitudinal direction of the insertion section and connected to each other.

However, when the above members are serially connected along the longitudinal direction of the insertion portion, the length of the distal end portion is lengthened.
Further, when the above members are serially connected, it is difficult to partially replace the constituent members when a part of the members constituting the solid-state imaging device breaks down.

  In view of the above problems, an endoscope apparatus in which the length of the distal end portion is shortened and the component members of the solid-state imaging device can be easily replaced partially will be described.

  FIG. 6 relates to an embodiment of an endoscope apparatus in which the length of the distal end portion can be shortened and the components of the solid-state imaging device can be easily exchanged. FIG. It is principal part sectional drawing of a part.

  Reference numeral 12A in the figure indicates a distal end portion of an electronic endoscope constituting the endoscope apparatus. The distal end portion 12A includes an objective optical system unit 46, and a solid-state imaging device 45 disposed behind the objective optical system unit 46.

The objective optical system unit 46 includes an objective lens group 57 including a plurality of lenses, and an objective lens frame 58 that holds the objective lens group 57 therein. By being fitted, it is held by the distal end portion 12A.

  A CCD holder 49 is externally fitted on the base end side of the objective lens frame 58 facing the inside of the distal end frame 56, and the solid-state imaging device 45 is held by the objective optical system unit 46 via the CCD holder 49. Have been.

  Specifically, a cover glass 48 facing the objective lens group 57 is held on the inner periphery of the CCD holder 49.

  A solid-state imaging device (hereinafter, referred to as a CCD) 47 is attached to a base end surface of the cover glass 48. Here, the CCD 47 is disposed so as to be substantially stored in the distal end frame 56, and only the leads 47 a provided on the base end surface of the CCD 47 are exposed outside the distal end frame 56.

  A first circuit board 50 is provided on the lead 47a. The first circuit board 50 is composed of, for example, a flexible board in which a copper foil pattern 50a is laminated on a polyimide base material. The first circuit board 50 is provided with a lead connection hole 50b into which the lead 47 can be inserted, and the lead 47 is inserted into the lead connection hole 50b and fixed with solder or the like, so that the first circuit board 50 While being held by the CCD 47, transmission and reception of signals between the CCD 47 and the first circuit board 50 are performed. A land (not shown) is provided on the first circuit board 50, and includes an IC for amplifying an output signal from the CCD 47, a capacitor for canceling noise, and a resistor for securing impedance matching. The component 51 is mounted. The IC, the capacitor, and the resistor may be built in the CCD 47 in advance. Here, the first circuit board 50 has its board surface disposed parallel to the base end face of the CCD 47, and only one end of the first circuit board 50 faces the tip end of the tip end 12A. And is bent in an L-shape. The pattern 50a extends from the polyimide substrate from the tip of the bent one end of the first circuit board 50.

  A second circuit board 52 made of the same material as the first circuit board 50 is provided on the base end side of the front end frame 56. The second circuit board 52 has a substantially L-shape. One end of the second circuit board 52 is disposed along the periphery of the front end frame 56, and the end of the second circuit board 52 extends from the first circuit board 50. It is exposed to the extended pattern 50a. That is, one end side of the second circuit board 52 is formed in an arc shape along the periphery of the end frame 56. A land (not shown) is provided at one end of the second circuit board 52, and the pattern 50a is soldered to the land, for example, so that the first circuit board 50 and the second circuit board 52 Is connected. On the other hand, the other end of the second land is disposed so as to protrude from the base end of the front end frame 56, and a land 52a is provided near the end. A signal line 54 constituting the CCD cable 53 is connected to the land 52a by soldering or the like.

  Reference numeral 55 in the figure denotes a light guide for transmitting illumination light from a light source device (not shown).

According to such an embodiment, the following operations and effects are obtained.
A circuit board interposed between the CCD 47 and the CCD cable 53 is composed of a first circuit board 50 and a second circuit board 52, and the first circuit board 50 is parallel to the base end face of the CCD 47. And the second circuit board 52 is arranged along the edge of the end frame 56, so that the space in the longitudinal direction for providing the circuit board can be shortened, and the end portion 12A of the electronic endoscope can be shortened. Can be shortened.

  Further, since the fixed portion of the CCD cable 53 can be disposed on the front side with respect to the hard length of the electronic endoscope, the strength of the fixed portion of the CCD cable 53 can be secured.

  Also, the first circuit board 50 is connected to the CCD 47, and the second circuit board 52 is connected to the CCD cable 53. The CCD 47 and the CCD cable 53 are connected via the first and second circuit boards 50 and 53. Is connected, the CCD 47 and the CCD cable 53 can be separately repaired, so that repairability and serviceability are improved.

  In the present embodiment, an example is shown in which the shape of one end of the second circuit board 52 is formed in an arc shape. However, the present invention is not limited to this. For example, the shape may be cylindrical along the periphery of the end frame 56. It may be formed, or may be formed in a rectangular tube shape.

  By the way, in an electronic endoscope in which a solid-state imaging device is provided at a distal end, a solid-state imaging device is configured to include a solid-state imaging device and a circuit board on which electronic components are mounted. Are connected to a CCD cable via a circuit board, and signals are exchanged with the control device via the CCD cable. In such a solid-state imaging device, connection between a circuit board and signal lines of a CCD cable is generally performed by soldering or the like.

However, in the endoscope apparatus, since the CCD cable is bent or pulled due to a bending operation or the like of the bending portion, the connection between the CCD cable and the circuit board may be disconnected. . To cope with this, if the strength of the connecting portion between the CCD cable and the circuit board is improved, it is difficult to reduce the size of the connecting portion.
Therefore, in view of the above problems, an endoscope apparatus capable of improving the connection strength of the CCD cable connection section will be described.

  7 to 9 show a first embodiment of an endoscope device capable of improving the connection strength of a CCD cable connection portion, FIG. 7 is a cross-sectional view of a main part of a solid-state imaging device, and FIG. FIG. 9 is a bottom view near the circuit board in FIG. 7, and FIG. 9 is a developed view of the cable holding member.

  In FIG. 7, reference numeral 60 denotes a solid-state imaging device. The solid-state imaging device 60 is externally fitted to the objective optical system unit 69 via a CCD holder 61d provided at a distal end portion. Here, the CCD holder 61d is fitted to the objective optical system unit 69 in a state where a solid-state imaging device (hereinafter referred to as a CCD) 61 described later is focused on the objective optical system unit 69. It is fixed via an adhesive.

  A cover glass 61c is fitted and fixed to the inner periphery of the CCD holder 61d, and the CCD 61 is attached to a base end surface of the cover glass 61c.

  The CCD 61 is provided with leads 61a and 61b, which extend toward the proximal end of the endoscope.

  A signal line 65b constituting a CCD cable 65 is connected to the lead 61a by solder or the like, and a signal for driving the CCD 61 is transmitted.

  On the other hand, a circuit board 62 is connected and fixed to the leads 61b with solder or the like.

  On the circuit board 62, an IC 63 for amplifying an output signal from the CCD 61 and other electronic components 64 are mounted. Further, a land (not shown) is provided on the circuit board 62, and another signal line 65a constituting the CCD cable 65 is connected through the land. For example, the signal line 65a transmits an output signal from the CCD 61 to the video processor 5.

  Here, the CCD cable 65 is fixed to the circuit board 62 via a cable holding member 66 in order to improve the connection strength of each signal line.

  More specifically, as shown in FIG. 9, the cable holding member 66 includes a board holding portion 66 a that can be narrowly attached to the left and right sides of the circuit board 62, a cable holding portion 66 b that can be wound around the CCD cable 65, And a flat plate member provided with

  As shown in FIGS. 7 and 8, the cable holding member 66 is interposed between the circuit board 62 and the CCD cable 65, and the board holding portion 66a is bent toward the circuit board 62, so that the left and right sides of the circuit board 62 are formed. At the same time, the cable holding portion 66b is bent toward the CCD cable 65 and the CCD cable 65 is wound around the cable holding portion 66b, thereby fixing the CCD cable 65 to the circuit board 62.

  A shield member 67 is provided on the outer periphery of the electrical component around the CCD 61 and the circuit board 62, and a covering member 68 is provided on the outer periphery of the shield member 67.

  According to such an embodiment, since the CCD cable 65 is fixed to the circuit board 62 via the cable holding member 66, the fixing strength of the CCD cable 65 can be improved. Therefore, the movement of each signal line during the bending of the endoscope can be restricted, and the disconnection of the CCD cable 65 can be reduced.

  Next, FIG. 10 shows a second embodiment of the endoscope apparatus capable of improving the connection strength of the CCD cable connection section, and FIG. 10 is a cross-sectional view of a main part of the solid-state imaging device.

  In FIG. 10, reference numeral 70 denotes a solid-state imaging device. The solid-state imaging device 70 is externally fitted to the objective optical system unit 71 via a CCD holder 79 provided at a distal end portion. Here, the CCD holder 79 is fitted to the objective optical system unit 71 in a state where a solid-state image sensor (hereinafter referred to as a CCD) 72 described later is focused on the objective optical system unit 71, and for example, an epoxy-based It is fixed via an adhesive.

  A cover glass 78 is fitted and fixed to the inner periphery of the CCD holder 79, and the CCD 72 is attached to a base end surface of the cover glass 78.

  The CCD 72 is provided with leads 72a and 72b, which extend toward the proximal end of the endoscope.

  A signal line 74a constituting the CCD cable 74 is connected to the lead 72a by solder or the like, and a signal for driving the CCD 72 is transmitted by the signal line 74a.

  On the other hand, the lead 72b is for transmitting an output signal from the CCD 72, for example, and a circuit board 73 on which an IC for amplifying the output signal from the CCD 72 is mounted and connected to the lead 72b by soldering or the like. .

  A land (not shown) is provided on the circuit board 73, and another signal line 74b constituting the CCD cable 74 is connected to the land.

  A shield member 75 is externally fitted to the base end side of the CCD holder 79. More specifically, the shield member 75 mainly covers the outer periphery of the CCD 72 and the circuit board 73 in order to suppress unnecessary radiation of noise, and is formed as a substantially cylindrical member having a cable insertion hole 75a at the bottom. . The shield member 75 is held by the open end fitted to the base end of the CCD holder 79.

  A CCD cable 74 is inserted into the cable insertion hole 75a. The CCD cable 74 is strongly caulked by a ring-shaped fixing member 76 inside the CCD holder to prevent the CCD cable 74 from coming off.

  Further, the CCD cable 74 is fixed to a shield member 75 via a fixing member 77. The fixing member 77 is made of, for example, an epoxy-based adhesive.

  According to such an embodiment, since the CCD cable 74 is strongly caulked by the fixing member 76 in the shield member 75 and is fixed by the fixing member 77, the CCD cable 74 is pulled to the proximal end side by the CCD cable 74 or the like. Even if a force is applied, the force is absorbed by the fixing member 76 and no stress is applied to the signal lines 74a and 74b in the shield member 75, so that disconnection of the signal line can be reduced.

  Next, FIG. 11 shows a third embodiment of the endoscope apparatus capable of improving the connection strength of the CCD cable connection section, and FIG. 11 is a cross-sectional view of a main part of the solid-state imaging device.

  Reference numeral 12B in the figure indicates a distal end portion of an electronic endoscope that constitutes the endoscope apparatus. The distal end portion 12B includes an objective optical system unit 81 and a solid-state imaging device 80 disposed behind the objective optical system unit 81.

  The objective optical system unit 81 is fitted and held on a distal end frame 89 provided on the distal end side of the distal end portion 12B.

  Further, a CCD holder 84 is externally fitted to the base end side of the objective optical system unit 81, and the solid-state imaging device 80 is held via the CCD holder 84. Here, the solid-state imaging device 80 is held in a state where a solid-state imaging device (hereinafter, referred to as a CCD) 82, which will be described later, is in focus with the objective optical system unit 81.

  Specifically, a cover glass 83 is fitted and held on the inner periphery of the CCD holder 84, and the CCD 82 is attached to a base end surface of the cover glass 83.

  The CCD 82 has a lead 82a and a lead 82b on the base end side, and a part of a signal line 87a constituting a CCD cable 87 is connected to the lead 82a, while a circuit board 85 is connected to the lead 82b. Is connected to another signal line 87a.

  A shield member 86 is externally fitted to the base end side of the CCD holder 84 to suppress radiation of unnecessary noise. The shield member 86 mainly covers the outer periphery of the CCD 82 and the circuit board 85.

  A cable fixing member 90 is attached to the distal end frame 89, and extends toward the base end of the endoscope. Here, the cable fixing member 90 is formed of a plate-shaped member having a predetermined curvature or a plate-shaped member having no curvature. The cable fixing member 90 may be fixed in the front end frame 89 with an adhesive, or may be fixed with a screw (not shown) or the like.

  The CCD cable 87 is provided with a fixing member 88 formed in a ring shape, and the fixing member 88 is fixed to the cable fixing member 90.

  A curved first piece 92 constituting a curved tube (not shown) is externally fitted and fixed to the base end side of the distal end frame 89. Here, the connecting portion 91 between the fixing member 88 and the cable fixing member 90 is configured to fit within the distal end of the curved first top 92.

  According to such an embodiment, the CCD cable 87 can be securely fixed, and disconnection and the like can be prevented.

  In such an embodiment, an intermediate board may be provided between the CCD cable 87 and the circuit board 85. As this substrate, for example, a flexible substrate using polyimide as a base material is used.

  That is, in general, an imaging unit including the CCD 82 and the circuit board 85 is connected to each signal line of a cable to the CCD 82 and the circuit board 85 and the like. When the solid-state imaging device is repaired (for example, replacement of the cable) due to disconnection of the cable or the like, an operation of removing the adhesive occurs. This work takes a considerable amount of time, but by connecting the CCD cable 87 and the circuit board 85 via the flexible board, the repair work can be performed only on the flexible board without removing the adhesive. And the number of work steps can be minimized. In other words, by employing a configuration in which the circuit board 85 and the CCD cable 87 provided in the solid-state imaging device 80 are interposed by a flexible substrate or the like, even if a failure occurs in the solid-state imaging device 80 or the CCD cable 87, By separating the flexible substrate from the CCD cable 87, the repair can be minimized, and the repairability of the endoscope is improved.

  Next, FIG. 12 shows a fourth embodiment of an endoscope apparatus capable of improving the connection strength of the CCD cable connection section, and FIG. 12 is a cross-sectional view of a main part of the solid-state imaging device 95. In this embodiment, the same members as those in the third embodiment of the endoscope device capable of improving the connection strength of the CCD cable connection portion described above are denoted by the same reference numerals and described. Omitted.

  A lead 96a extends from the proximal end of the CCD 96, and a circuit board 97 is connected and fixed to the lead 96a.

  A land (not shown) is provided on the circuit board 97, and a CCD cable 98 is connected to the land. That is, the signal lines 98a constituting the CCD cable 98 extend from the distal end of the CCD cable 98, and the extended signal lines 98a are connected to lands provided on the circuit board 97.

  A plurality of signal lines 98a extending from the CCD cable 98 are provided with a covering member 100 for bundling and covering the signal lines 98a, and the outer periphery of the covering member 100 is caulked by a fixing member 101. The distal end side of the CCD cable 98 is fixed by joining the fixing member 101 to the curved first top 92 by, for example, a brazing 102.

  Here, the fixing member 101 is fixed inside the curved first frame 92. Although not shown, the outermost sheath of the cable may be peeled off in the entire area of the bending tube, and the signal line group may be arranged in the bending tube.

  According to such an embodiment, since the signal line 98a is fixed by the fixing member 101, even when the bending operation is performed, no stress is applied to the distal end more than the fixing member 1O1. Therefore, no stress is applied to the signal line 98a, and disconnection can be prevented.

  Next, FIGS. 13 to 16 show a fifth embodiment of an endoscope apparatus capable of improving the connection strength of a CCD cable connection portion, and FIG. 13 is a cross-sectional view showing a main part of a solid-state imaging device. FIG. 14 is a cross-sectional view taken along line AA of FIG. 13, FIG. 15 is a perspective view of the circuit board viewed obliquely from above, and FIG. 16 is a perspective view of the circuit board viewed obliquely from below.

  In FIG. 13, reference numeral 110 denotes a solid-state imaging device of an electronic endoscope. The solid-state imaging device 110 includes a solid-state imaging device (hereinafter, referred to as a CCD) 111, a cover glass 112 attached to a front surface of the CCD 111, And a pair of circuit boards 116 and 117.

  On the upper and lower side surfaces of the CCD 111, a circuit board (TAB substrate) 113 having a pattern 113a made of copper foil arranged on a polyimide substrate 113b is provided so as to sandwich the CCD 111 therebetween. The pattern 113a is connected to the CCD 111 via, for example, a bump (not shown), and an end of the pattern 113a extends behind the CCD 111.

  As shown in FIGS. 15 and 16, the circuit board 116 is formed in a substantially rectangular shape, and lands 122 corresponding to the patterns 113a are provided on the upper surface of the circuit board 116. On the lower surface of the circuit board 116, an IC 118 and an electronic component 119 for amplifying an output signal from the CCD 111 are mounted.

  A land 121 for cable connection is provided on the front end surface of the circuit board 116. Here, the land 121 has a configuration in which a copper foil is provided in a side through hole provided on a front end surface of the circuit board 116 and solder plating is applied thereon.

  The circuit board 117 has substantially the same configuration as the circuit board 116, has an electronic component 119 mounted on the upper surface, has a land 122 corresponding to the pattern 113a on the lower surface, and has a cable connection on the front end surface. Land 121 is provided.

  As shown in FIG. 14, the circuit boards 116 and 117 are disposed in parallel with each other with the lands 122 exposed to the outside, and the leading end of the CCD cable 115 is held between the circuit boards 116 and 117. Have been. At this time, the CCD cable 115 is sandwiched between the circuit boards 116 and 117 while being disposed between the electronic components 119.

  At the tip of the CCD cable 115, the ends of the signal lines 115a and 115b constituting the CCD cable 115 are extended, and these extended signal lines 115a and 115b are connected to the circuit boards 116 and 117, respectively. (See FIG. 13) by soldering or the like.

  Such a unit in which the circuit boards 116 and 117 sandwich the CCD cable 115 is fitted into the gap between the patterns 113a while the pattern 113a and the land 122 are slid, so that the connection with the CCD 111 is realized and It is held behind the CCD 111.

  Further, a gap between the CCD 111 and the circuit boards 116 and 117 is filled with a filler 120 made of, for example, an epoxy-based adhesive.

  According to such an embodiment, since the CCD cable 115 is sandwiched between the circuit boards 116 and 117, the strength of the connection portion of the CCD cable 115 is improved. Further, since the CCD cable 115 is sandwiched between the circuit boards 116 and 117, and the CCD cable 115 and the circuit boards 116 and 117 are connected at the front ends of the circuit boards 116 and 117, the length of the connecting portion can be shortened. The hard length of the imaging device 110 can be reduced.

  Further, by arranging the electronic component 119 between the CCD cables 115, the CCD cable 115 can be securely fixed.

  In an endoscope apparatus provided with an electronic endoscope, a connection between a solid-state imaging device and a circuit board on which an IC or the like for amplifying a signal from the solid-state imaging device is generally performed by soldering. I was

  However, connecting the solid-state imaging device and the circuit board by soldering in this manner increases the number of man-hours for performing an assembling operation and a repair operation. In view of the above problems, an embodiment of an endoscope apparatus capable of improving the assemblability of a solid-state imaging device and a circuit board will be described.

  17 and 18 relate to an embodiment of an endoscope apparatus capable of improving the assemblability of the solid-state imaging device and the circuit board. FIG. 17 is an exploded side view of the solid-state imaging device and the circuit board. FIG. 18 is a side view showing a state where the solid-state imaging device and the circuit board are connected.

  17 and 18, reference numeral 105 indicates a solid-state imaging device (hereinafter, referred to as CCD), and reference numeral 106 indicates a circuit board.

  The CCD 105 is provided with a plurality of leads 105a made of a member having a predetermined elasticity. These leads 105 a are arranged in two rows on the base end face of the CCD 105, whereby lead rows 103 facing each other are formed on the base end face of the CCD 105.

  The circuit board 106 has a conductor pattern (not shown) on both sides, and an IC 108 for amplifying a signal from the CCD 105 and other electronic components 109 are mounted on the circuit board 106.

  A land (not shown) for connecting a cable is provided on the circuit board 106. A plurality of signal lines 107a extending from the CCD cable 107 are connected to the land by soldering or the like. I have.

  Further, lands 106a corresponding to the leads 105a of the CCD 105 are provided on both front end sides of the circuit board 106.

  Here, the gap between the lead rows 103 in which the leads 105a are arranged is set to be smaller than the board pressure of the circuit board 106.

  In order to maintain the connection between the CCD 105 and the circuit board 106, first, the leading end of the circuit board 106 is inserted into the gap between the lead rows 103 where the lead rows 103 are spread outward (see FIG. 17). After the respective positions of the lead 105a and the land 106a are aligned, the alignment is performed by closing the lead row 103 using the elasticity of the lead 105a.

  According to such an embodiment, the lead 105a and the land 106a are connected without soldering, so that assembly is easy.

  In addition, even if the CCD cable 107 is broken, the circuit board 106 can be pulled out of the CCD 105 and repaired or replaced, so that the CCD cable can be repaired without affecting the expensive CCD 105.

  Further, even if bending stress is applied to the solid-state imaging device, the stress can be absorbed by using the elasticity of the lead 105a, so that no stress is applied to the connection portion of the CCD cable 107 and disconnection can be prevented. I can do it.

  By the way, in an electronic endoscope in which a solid-state imaging device is provided at a distal end, a solid-state imaging device is configured to include a solid-state imaging device and a circuit board on which electronic components are mounted. Are connected to a CCD cable via a circuit board, and signals are exchanged with the control device via the CCD cable. In such a case, the solid-state imaging device, the circuit board, and the CCD cable are serially arranged and connected along the longitudinal direction of the insertion section.

However, when the above members are serially connected along the longitudinal direction of the insertion portion, the length of the distal end portion is lengthened.
In view of the above problems, an endoscope apparatus capable of reducing the length of the distal end will be described.

  19 to 22 relate to an embodiment of an endoscope apparatus capable of shortening the length of a distal end portion, FIG. 19 is an exploded cross-sectional view showing a main part of a solid-state imaging device, and FIG. FIG. 21 is an explanatory diagram showing another contact configuration, and FIG. 22 is an explanatory diagram showing still another contact configuration.

  20, reference numeral 125 denotes a solid-state imaging device of an electronic endoscope. The solid-state imaging device 125 includes a solid-state imaging device (hereinafter, referred to as a CCD) 126 and a CCD holding substrate 127 provided behind the CCD 126. The CCD cable 132 is connected to the CCD holding substrate 127.

  More specifically, the CCD 126 is provided with a lead 126a on the base end surface, and the lead 126a extends rearward.

  The CCD holding substrate 127 is formed of a short cylindrical member having an open rear, and a pattern 128 made of copper foil is provided on the inner periphery thereof. Further, a lead insertion hole 129 into which the lead 126a can be inserted is provided on the tip end surface of the CCD holding substrate 127. On the other hand, the inside of the short cylinder of the CCD holding substrate 127 is formed as a cable fixing portion 130 into which the tip of the CCD cable 132 can be inserted.

  Here, the CCD 126 is held on the CCD holding substrate 127 by inserting the leads 126a into the lead insertion holes 129 of the CCD holding substrate 127 and soldering the leads to the pattern 128.

  Further, the CCD cable 132 includes a plurality of simple signal lines 133 arranged along the inner periphery of the outer sheath 132a (see FIG. 19A). A conductive pin 134 connected to the signal line core 133a is provided at the end of the simple signal line 133, and the end of the conductive pin 134 is disposed so as to protrude from the outer sheath 132a of the CCD cable 132. .

  Here, the conductive pins 134 protruding from the outer skin 132a and the patterns 128 provided on the inner periphery of the CCD holding substrate 127 are provided at corresponding positions 136, respectively.

  The CCD cable 132 is electrically connected to the CCD 126 by inserting the distal end of the CCD cable 132 into the cable fixing portion 130 in a state where the conductive pins 134 and the pattern 128 are aligned. At this time, an insulating member 131 for preventing a short circuit between the conductive pin 134 and the lead 126a is interposed between the CCD holding substrate 127 and the CCD cable 132.

  Here, as shown in FIG. 21, the connection between the CCD 126 and the CCD cable 132 is made by providing a pattern 139 on the outer peripheral surface of the CCD fixed substrate 127 instead of the pattern 128 provided on the CCD fixed substrate 127. The conductive pin 134 bent forward from the base end portion of the pattern 128 may be connected and fixed to the pattern 128 by the solder fixing portion 141.

  Further, as shown in FIG. 22, when the CCD cable 132 connected to the solid-state imaging device 125 has a coaxial signal line 144, the conductive pins connected to the core 144a of the coaxial signal line 144 are provided. An insulating portion 143 for preventing a short circuit between the shield member 144b of the coaxial signal line 144 and the conductive pin 142 is provided in the middle of 142.

  According to such an embodiment, the connection between the CCD and the CCD cable is performed by connecting the conductive pins protruding from the outer periphery of the CCD cable and the pattern provided on the CCD holding substrate on the side of the distal end of the CCD cable. Therefore, the hard length can be shortened.

  Further, before connecting the CCD 126 and the CCD cable 132, each unit may be assembled, so that the assemblability of the entire solid-state imaging device 125 can be improved.

  By the way, generally, as shown in FIG. 23 (b), a distal end portion 150 of an electronic endoscope through which a treatment tool such as a cannula can be inserted as shown in FIG. A component channel 154 is provided adjacent to a solid-state imaging device (hereinafter referred to as a CCD) 151. Here, reference numeral 152 in the drawing denotes a light-receiving unit capable of capturing an image in the CCD 151, and reference numeral 153 denotes a light-shielding unit (OB unit: optical black unit) of the CCD 151.

  However, in such an electronic endoscope, when a treatment tool made of metal such as a cannula and the like having a high reflectance is inserted into the treatment tool channel 154, the distal end portion 150 receives a part of the illumination light emitted from an illumination window (not shown). The part is reflected by the treatment tool and is incident on the CCD 151, which may cause a problem such as flare on the captured image. If the distance between the CCD 151 and the treatment instrument channel 154 is increased in response to this, the above-mentioned problem is solved, but it causes the end of the endoscope to have a large diameter. In view of the above circumstances, an endoscope apparatus that can reduce defects such as flare without increasing the diameter of the distal end will be described.

  FIG. 24 shows an embodiment of an endoscope apparatus capable of reducing problems such as flare without increasing the diameter of the end portion of the endoscope. FIG. FIG. 24 (b) is an explanatory view showing an example of an image captured by the electronic endoscope shown in FIG. 24 (a), and FIG. 24 (c) is a lower digestion view. FIG. 24D is a layout diagram illustrating a main part of a distal end portion of the electronic endoscope for a tube, and FIG. 24D is an explanatory diagram illustrating an example of an image captured by the electronic endoscope illustrated in FIG.

  In FIG. 24A, reference numeral 150 denotes a distal end portion of the electronic endoscope. The distal end portion 150 is adjacent to the CCD 151 having a light-shielding portion 153 provided on one side of a light-receiving portion 152 capable of capturing an image. And a treatment tool channel 154 through which a treatment tool (not shown) can be inserted.

  The CCD 151 includes a light-shielding part 153 disposed near the treatment instrument channel 154 and a light-receiving part 152 adjacent to the light-shielding part 153.

  In the endoscope apparatus including such an electronic endoscope, when used, a treatment tool 155 having a high reflectance made of metal is inserted into the treatment tool channel 154 and protrudes from the endoscope distal end 150. At that time, the treatment tool is irradiated with illumination light from an illumination window (not shown), and a part of the illumination light is reflected toward the distal end 150.

  At this time, since the light shielding portion 153 is interposed between the light receiving portion 152 and the treatment instrument channel 154, the light receiving portion 152 can be positioned farther from the treatment instrument channel 154 by the width of the light shielding portion 153. Since a large amount of unnecessary light can be prevented from entering the light receiving section 152, problems such as flare can be reduced (see FIG. 24B). Therefore, problems such as flare can be reduced without increasing the diameter of the tip.

  As shown in FIGS. 24 (c) and 24 (d), the distal end of the electronic endoscope for the lower gastrointestinal tract has the same layout as the distal end of the electronic endoscope for the upper gastrointestinal tract. The same operation and effect can be obtained.

  By the way, in general, a conventional endoscope is inconvenient to carry because it is necessary to connect a universal cord to a light source. To cope with this, for example, there is a technique disclosed in Japanese Patent Application No. 8-280612.

  However, in the above-mentioned prior art, since the lamp (illumination light supply unit) is configured to be detachable from the endoscope operating unit, the unit may be handled carelessly when the unit is removed, and the lamp may be damaged. That is, when attaching or detaching the illumination light supply unit, a large amount of stress is applied due to an act of pulling out the operation unit from the operation unit. At this time, there is a possibility that an operator may carelessly touch the lamp and damage the lamp. was there. Therefore, an endoscope device that can prevent the lamp from being damaged will be described.

  FIG. 25 relates to an embodiment of an endoscope apparatus capable of preventing breakage of a lamp, and is an explanatory diagram near an operation unit of the endoscope.

  An illumination lamp 156 is provided inside the operation unit 161 of the endoscope 160. The illumination lamp 156 is provided with a lead 163, and the lead 163 extends to the side of the operation unit 161.

  A power supply unit 158 derived from a power source (not shown) is provided on the side of the operation unit 161 so as to be detachable from the operation unit 161. Specifically, a socket 162 is provided at the tip of the power supply unit 158, and the socket 162 and the lead 163 are detachably connected.

  In addition, a reflector 157 that reflects illumination light emitted from the illumination lamp 156 toward the distal end of the endoscope 160 is provided in the operation unit 161. The light emitted from the illumination lamp 156 is reflected by the reflecting mirror 157, enters the light guide fiber 159, and emits light from the end of the endoscope 160.

  According to such an embodiment, since the power supply unit is detachable from the operation unit, it is easy to carry the endoscope.

  In addition, since the lamp is provided in the operation unit, it is possible to prevent the lamp from being carelessly damaged when the power supply unit is attached or detached.

  By the way, in the past, some electronic endoscopes have a plurality of objective optical systems at the distal end in order to obtain a plurality of different captured images simultaneously with the same endoscope. In such a case, the electronic endoscope generally has a plurality of different solid-state imaging devices, and these solid-state imaging devices are configured to form images on different objective optical systems.

However, when a plurality of solid-state imaging devices are provided in the same electronic endoscope, the outer diameter of the insertion portion tends to increase.
In view of the above circumstances, an endoscope apparatus that can simultaneously configure a plurality of observation units using a single solid-state imaging device will be described.

  FIGS. 26 and 27 relate to a first embodiment of an endoscope apparatus capable of simultaneously forming a plurality of observation means 2 using a single solid-state imaging device, and FIG. 26 is a front end of an electronic endoscope. FIG. 27 is an explanatory diagram of an image on a monitor.

  In FIG. 26, reference numeral 165 indicates a distal end portion of an electronic endoscope constituting the endoscope apparatus. A single solid-state imaging device (hereinafter, referred to as a CCD) 166 is provided at the tip 165, and an objective lens group 167 is provided at the tip of the CCD 166.

  In addition, two inclined surfaces inclined in different directions with respect to the longitudinal direction of the endoscope are provided on the end surface of the distal end portion 165 of the electronic endoscope, and one of the inclined surfaces is provided with the first observation surface. A window 171 is arranged, and a second observation window 172 is arranged on the other inclined surface.

  Further, a first liquid crystal shutter 169 is provided behind the first observation window 171, while a second liquid crystal shutter 170 is provided in the second observation window 172.

  Here, the first and second liquid crystal shutters 169 and 170 are respectively connected to a processor processing system (not shown) via a signal line (not shown), and the processor processing system allows the first and second liquid crystal shutters 169 and 170 to pass through the first and second observation windows. Is controlled to be transmitted and cut off.

  A prism 168 is provided behind the first and second liquid crystal shutters 169 and 170. The prism 168 has one incident surface connected to the first liquid crystal shutter 169, the second incident surface connected to the second liquid crystal shutter 170, and the light incident from these incident surfaces. The exit surface is disposed at a position facing the distal end side of the objective lens group 167.

  That is, the light incident from the first observation window 171 is incident on the objective lens group 167 via the first liquid crystal shutter 169 and the prism 168, and is imaged on the CCD 166. The light incident from the second observation window 172 is incident on the objective lens group 167 via the second liquid crystal shutter 170 and the prism 168, and is formed on the CCD 166. In other words, the first observation window 171, the first liquid crystal shutter 169, the prism 168, the objective lens group 167, and the CCD 166 constitute an observation unit, and the second observation window 172, the second liquid crystal shutter 170, The prism 168, the objective lens group 167, and the CCD 166 form another observation unit.

  An illumination window 174 is provided near the first observation window 171 for irradiating illumination light to a subject to be observed through the first observation window 171. Further, an illumination window is provided behind the illumination window 174. A first light guide 175 that is continuous with the lens that constitutes 174 is provided. Similarly, a second illumination window 176 is provided in the vicinity of the second observation window 172, and a second light guide 177 is provided continuously to the second illumination window 176.

  CCD leads 166a and 166b are provided on the base end side of the CCD 166. Signal lines 173a and 173b constituting the CCD cable 173 are connected to the CCD leads 166a and 166b, respectively. Here, the signal lines 173a and 173b are signal lines for transmitting an output signal from the CCD 166, the signal line 173a transmits an even-numbered line signal among the field signals output from the CCD 166, and the signal line 173b is output from the CCD 166. The odd-numbered lines of the field signals are transmitted.

  These signal lines 173a and 173b are connected to a monitor 178 via a processor processing system (not shown). The monitor 178 is configured as a monitor that can simultaneously display two different images, and displays an image based on an image signal transmitted from the signal line 173a on one screen 178a, and displays a signal line 173b on the other screen 178b. An image based on the image signal transmitted from the PC is displayed.

  That is, the first liquid crystal lens 169 transmits the light to the objective lens system 167 in synchronization with the transmission of the output signal of the signal line 173a, and the first liquid crystal lens 169 synchronizes with the output signal of the signal line 173b. A state is created that blocks light to the light. On the other hand, the second liquid crystal shutter 170 shuts off the light to the objective lens system 167 in synchronization with the transmission of the output signal of the signal line 173a, and operates in synchronization with the transmission of the output signal of the signal line 173b. A state where light is transmitted is created at 167.

  More specifically, the first and second liquid crystal shutters 169 and 170 shield and transmit light rays incident from the first and second observation windows 171 and 172 in synchronization with an output signal from the CCD 166. In general, when an output signal from the CCD 166 is output to the monitor 178 through the processor processing system, an odd-numbered scanning line on the monitor is scanned at 1/30 SEC (first field signal) and the next signal is output. Even lines are scanned by 1/30 SEC (second field signal), and one image is constituted by 1/60 SEC in total.

  With such a configuration, a single objective lens system 167 is used to configure two observation optical systems, and a single CCD 166 is used to display images from the two observation optical systems on the monitor 178. Can be done.

  According to such an embodiment, two different visual fields can be simultaneously observed using a single objective lens system and a CCD, and the diameter of the distal end can be reduced.

  In addition, since the transmission and blocking control of the incident light incident from the first and second observation windows is performed by the liquid crystal shutter, a mechanical shutter mechanism is not required, and the tip portion can be reduced in size. .

  Next, FIGS. 28 and 29 relate to a second embodiment of an endoscope apparatus capable of simultaneously configuring a plurality of observation means using a single solid-state imaging device. FIG. FIG. 29 is an explanatory view of an image on a monitor, showing a cross-sectional view of a main part of the distal end portion of the mirror.

  In FIG. 28, reference numeral 180 indicates a distal end portion of an electronic endoscope constituting the endoscope apparatus. A solid-state imaging device (hereinafter, referred to as a CCD) 181 is provided at the distal end portion 180, and an objective lens unit 182 is provided at the distal end side of the CCD 181.

  The objective lens unit 182 includes an objective lens frame 183, an objective lens group 184 is provided on the objective lens frame 183, and a liquid crystal lens 185 is provided immediately after the objective lens group 184 to constitute a main part. .

  Here, the liquid crystal lens 185 is connected to a processor processing system (not shown) via a signal line (not shown). The liquid crystal lens 185 controls the liquid crystal so that two modes of normal observation and magnified observation can be selected. Operate. That is, the liquid crystal lens 185 enables the change of the optical path length of the objective optical system and the change of the observation depth.

  Further, a first lead 181a and a second lead 181b extend from the base end side of the CCD 181. A first signal line 186a constituting the CCD cable 186 is connected to the first lead 181a, and a second signal line 186b constituting the CCD cable 186 is connected to the second lead 181b. Here, the signal line 186a transmits an odd-numbered line among the field signals of the output signal output from the CCD 181, and the signal line 186b transmits an even-numbered line.

  These signal lines 186a and 186b are connected to a monitor 187 via a processor processing system (not shown). The monitor 187 is configured as a monitor that can simultaneously display two different images, and displays an image based on an image signal transmitted from the signal line 186a on one screen 188, and displays a signal line 186b on the other screen 189. An image based on the image signal transmitted from the PC is displayed.

  That is, while the liquid crystal lens 185 is operated by the processor processing system, normal observation is performed in synchronization with transmission of the CCD output signal from the signal line 186a, while transmission of the CCD output signal from the signal line 186b is performed. It is set so that magnification observation is performed in synchronization.

  According to such an embodiment, since a liquid crystal lens is used, a mechanical zoom mechanism is not required, and the hard length can be reduced.

  In addition, since a part of the normal observation screen is always enlarged on the monitor, diagnosis can be performed quickly.

[Appendix]
(Appendix 2-1)
It has two objective optical systems respectively provided with a first liquid crystal shutter and a second liquid crystal shutter capable of transmitting and blocking incident light, and one solid-state imaging device, and both of the two objective optical systems are as described above. An endoscope apparatus configured to form an image on a solid-state imaging device, wherein a behavior of the liquid crystal shutter is synchronized with each of a first field signal and a second field signal output from the solid-state imaging device. An endoscope apparatus characterized in that the endoscope apparatus is operated.

(Appendix 2-2)
An objective optical system having a liquid crystal lens capable of variably setting the optical path length of incident light to at least two different optical path lengths, and one solid-state imaging device, and two different optical path lengths passing through the objective optical system Is an endoscope device configured so that any of the incident light forms an image on the solid-state imaging device, wherein a first field signal and a second field signal output from the solid-state imaging device include: An endoscope apparatus wherein the behavior of a liquid crystal lens is synchronized.

  By the way, in an endoscope apparatus, generally, a solid-state imaging device is configured such that signal lines of a CCD cable are connected to an imaging unit including a solid-state imaging device (hereinafter referred to as a CCD), a circuit board, and the like. And the main part is constituted. Such solid-state imaging devices are of various standards depending on the use of the endoscope device. Therefore, it is necessary to manufacture imaging units corresponding to various standards for solid-state imaging devices. Was.

However, manufacturing an imaging unit of a plurality of standards in this manner causes an increase in manufacturing cost.
In view of the above circumstances, an object of the present invention is to provide an imaging unit that can correspond to various solid-state imaging devices having different standards with one type of imaging unit.

  FIG. 30 is a perspective view illustrating a main part of an imaging unit according to an embodiment of an imaging unit that can support various solid-state imaging devices having different standards with one type of imaging unit.

  In the figure, reference numeral 190 denotes an imaging unit provided in the solid-state imaging device of the endoscope apparatus. The imaging unit 190 includes a solid-state imaging device (hereinafter, referred to as a CCD) 191 and a circuit board 192. The main part is configured.

  The circuit board 192 is formed of, for example, a flexible board having a TAB structure in which a copper foil 198 is attached to a polyimide base material 197.

  In the circuit board 192, a part of the copper foil 198 constituting the pattern of the circuit board 192 extends from one side of the polyimide base material 197 and is formed as an inner lead 196 connectable to the CCD 191.

  A CCD 191 is provided near the inner leads 196 on the circuit board 192, and the inner leads 196 and the bumps 199 provided on the CCD 191 are connected and fixed by thermal welding.

  On the circuit board 192, a main pad 193 that can be connected to a signal line (not shown) is provided in the middle of the pattern extending from the inner lead 196, and furthermore, the main pad 193 is located on the periphery from the main pad 193. Auxiliary pads 194 that can be connected to the signal lines are provided on the pattern extending toward the front. Here, the auxiliary pad 194 has a larger area than the main pad 193.

  The connection between the imaging unit 190 configured as described above and a signal line (not shown) is performed when there is a margin in the size of a solid-state imaging device to be applied or when the cable needs to have strength. , Through an auxiliary pad 194 that can increase the connection area of the signal line on the pad.

  On the other hand, the connection between the imaging unit 190 and a signal line (not shown) is made via the main pad 193 when the solid-state imaging device needs to be miniaturized or when the durability of the cable is not regarded as important. . At this time, by cutting the circuit board 192 from the cutting boundary 195 around the main pad 193, the size of the imaging unit 190 can be reduced.

  In the description of the above embodiment, an example in which a TAB tape in which a copper foil is attached to a polyimide base material is used as a circuit board is disclosed, but the present invention is not limited to this.

  Further, the circuit board may be formed of, for example, a flexible substrate made of a polyimide base material having no inner leads. In this case, the connection with the bump portion of the CCD is made between a pad provided on the flexible substrate.

  If the strength of the circuit board itself is required, a hard base such as ceramics or glass epoxy resin may be used. Even in this case, one circuit board can support a plurality of solid-state imaging devices.

  According to such an embodiment, since a single type of imaging unit can be used for a plurality of solid-state imaging devices, it is possible to achieve commonality of components and cost reduction.

[Appendix]
(Appendix 3-1)
An imaging unit including a solid-state imaging device and a circuit board, wherein two or more pads are provided at different positions on the same circuit provided on the circuit board.

(Appendix 3-2)
The imaging unit according to attachment 3-1, wherein a cable is selectively connected to the pad according to a solid-state imaging device.

(Appendix 3-3)
The imaging unit according to Supplementary Notes 3-1 and 3-2, wherein the circuit board is configured by a flexible board.

(Appendix 3-4)
The imaging unit according to attachment 3-3, wherein the flexible substrate is made of TAB.

  By the way, conventionally, a solid-state imaging device used for an electronic endoscope is provided with an insulator for insulating between a solid-state imaging element and a living body. In general, ceramics and the like are often used for this insulator.

  However, when the insulator is made of ceramics or the like, the distal end of the electronic endoscope tends to have a complicated structure and a large outer diameter.

  In view of the above circumstances, an endoscope apparatus capable of reducing the diameter of the distal end of the electronic endoscope will be described.

  FIG. 31 is a sectional view of a main part of the distal end portion of the electronic endoscope according to the first embodiment of the endoscope device capable of reducing the diameter of the distal end portion of the electronic endoscope.

  In the figure, reference numeral 312 denotes a distal end of the electronic endoscope. The distal end 312 includes the objective optical system unit 323 and a solid-state imaging device 322 disposed behind the objective optical system unit 323. It is configured.

  The objective optical system unit 323 includes an objective lens group 324 composed of a plurality of lenses, and an objective lens frame 328 that holds the objective lens group 324 therein. By being fitted, it is held by the tip 312.

  A CCD holder 327 is externally fitted to the base end side of the objective lens frame 328, and the solid-state imaging device 322 is held by the objective optical system unit 323 via the CCD holder 327.

  Specifically, a cover glass 326 facing the objective lens group 324 is held on the inner periphery of the CCD holder 327.

  A solid-state imaging device (hereinafter referred to as a CCD) 325 is attached to a base end surface of the cover glass 326. The CCD 325 includes a CCD chip 325a, and the CCD chip 325a is attached to the cover glass 326 via a cover glass 325b attached to the front surface.

  A bump 325e as a contact is provided on a part of the front surface of the CCD chip 325a, and the CCD chip 325a is connected to the circuit board 325c via the bump 325e.

  Here, the circuit board 325c has a so-called TAB structure and includes a polyimide base 325f and a conductor pattern 325d made of copper foil provided on the polyimide base 325f. A portion of the conductor pattern 325d extends from the end of the polyimide base 325f near the bump 325e, and the extended conductor pattern 325d is joined to the bump 325e to transmit and receive signals to and from the CCD chip 325a. It has become to be. The periphery of the joint between the conductor pattern 325d and the bump 325e is sealed with a sealing resin 325g.

  A land (not shown) is provided on the circuit board 325c, and electronic components including an IC for amplifying an output signal from the CCD chip 325a, a capacitor for canceling noise, a resistor for ensuring impedance matching, and the like. 329 are implemented. The IC, the capacitor, and the resistor may be built in the CCD chip 325a in advance.

  Further, a CCD cable 330 for transmitting and receiving signals to and from a CCU (camera control unit) and the like is connected on the circuit board 325c. The CCD cable 330 includes, for example, a coaxial signal line 339 for transmitting a drive signal to the CCD chip 325a, a coaxial signal line 340 for transmitting an output signal from the CCD chip 325a to a processor (not shown), the CCD chip 325a and the And a simple signal line 341 for power supply for driving the IC 329. These signal lines extend from the distal end of the CCD cable 330 and are connected to the circuit board 325c. Here, the external conductor group 342 of the plurality of coaxial signal lines is connected to the GND potential wired from the CCD chip 325a. Further, as shown in the figure, when the size of the solid-state imaging device 322 is reduced and it is difficult to provide a plurality of signal line connection lands on the circuit board 325c, the signal lines are provided on the electrodes of the electronic component 329. Is arranged.

  Further, a shield member 332 is externally fitted to the CCD holder 327. The shield member 332 extends to near the end of the CCD cable 330 to suppress unnecessary radiation and covers the outer periphery of the CCD 325, and is electrically connected to a GND line (not shown) of the CCD 325.

  An insulating member for preventing the CCD 325 from contacting the shield member 332 and short-circuiting to the GND potential is provided on the inner periphery of the shield member 332 and on the outer periphery from the base of the CCD holder 327 to the CCD 325. 331 are coated. Here, the insulating member 331 is formed of, for example, a heat-shrinkable tube.

  Further, a covering member 334 is provided on the outer periphery of the shield member 332. The covering member 334 covers and seals the entire solid-state imaging device 322 from the distal end of the CCD holder 327 to the distal end of the CCD cable 330. When the covering member 334 is sealed, the CCD 325 and the circuit board 325c are used. The filler 333 is filled around each signal line and the like. The filler 333 may be, for example, an epoxy-based or silicone-based adhesive.

  Here, in the solid-state imaging device 322 configured as described above, the CCD holder 327 is fitted and fixed to the objective lens frame 328 in a state where the focus is performed between the objective lens group 324 and the CCD chip 325a. It is fixed to the optical system unit 323. When the objective lens frame 328 and the CCD holder 327 are fixed, for example, an epoxy-based adhesive is used.

  A bending first frame 337 that forms a bending tube (not shown) is connected to the base end side of the distal end frame 335.

  A resin-made tip cover 336 is provided on the front side of the tip frame 335, and a rubber covering member 338 is provided on the outer periphery of the tip frame 335 and the curved first frame 337. Is sealed.

  According to such an embodiment, the insulating member 331 is covered over the outer periphery of the CCD 325 and the CCD holder 327, and the shield member 332 is provided on the outer periphery. Therefore, the shield member 332 having the same potential as the GND of the CCD 325 is provided. Even if the CCD 325 and the CCD 325 are arranged close to or in contact with each other, the CCD 325 does not short-circuit to GND. That is, conventionally, the creepage distance between the CCD 325 and the shield member 332 is sufficiently separated so that they are not short-circuited. However, since the creepage distance can be shortened by this configuration, the size of the solid-state imaging device 322 is reduced. Thus, the outer diameter of the endoscope can be reduced.

  Further, since the insulating member 331 provided on the outer periphery of the CCD 325 is firmly fixed on the outer periphery of the CCD 325, the fixing strength between the CCD 325, the cover glass 326 and the CCD holder 327 increases, and the reliability can be improved.

  Further, since the insulating member 331 is not made of ceramic or the like, the manufacturing cost can be reduced.

  Next, FIG. 32 relates to a second embodiment of the endoscope apparatus capable of reducing the diameter of the distal end of the electronic endoscope, and is a cross-sectional view of a main part of the distal end of the electronic endoscope. . In this embodiment, the same components as those in the first embodiment of the endoscope device capable of reducing the diameter of the distal end of the above-mentioned electronic endoscope are denoted by the same reference numerals and described. Omitted.

  The solid-state imaging device 300 will be described with reference to FIG. An objective lens group 324 is provided in the objective lens frame 3O1.

  Further, a cover glass 325b is attached to the tip end side of the CCD chip 325a, and a cover glass 326 is attached to the tip end side. The cover glass 326 is fitted to the base end side of the objective lens frame 301 in a state where the CCD 325 and the objective lens group 324 are focused. That is, in this embodiment, the objective lens frame 301 also functions as a CCD holder for holding the CCD 325.

  A projection 302 is provided at the base end of the objective lens frame 301 so as to cover the CCD 325, and a gap 303 between the projection 302 and the CCD 325 is filled with an adhesive. The projecting portion 302 may be provided so as to cover the entire circumference of the CCD 325, or may be provided so as to face a part of the surface of the CCD 325.

  Further, an outer periphery of the CCD 325 and the objective lens frame 301 is covered with an insulating member 331.

  According to such an embodiment, substantially the same effects as those of the first embodiment of the endoscope apparatus capable of reducing the diameter of the distal end portion of the electronic endoscope can be obtained.

  Further, as in the present embodiment, the objective lens frame 301 also serves as a CCD holder, and the projection portion 302 that covers the CCD 325 is provided at the base end of the objective lens frame 301. The connection strength to 301 can be further improved.

[Appendix]
(Supplementary Note 4-1)
In an endoscope device provided with an electronic endoscope having a solid-state imaging device at a distal end portion,
The solid-state imaging device includes a solid-state imaging device, and a shield member that covers at least the outer periphery of the solid-state imaging device,
A cover glass was attached to the front surface of the solid-state imaging device, the solid-state imaging device was connected to a frame via at least the cover glass, and the shield member was disposed on the outer periphery of the solid-state imaging device via an insulating member. An endoscope apparatus characterized by the above-mentioned.

(Supplementary Note 4-2)
4. The endoscope apparatus according to claim 1, wherein the insulating member is formed of a heat-shrinkable tube.

  By the way, conventionally, a coaxial signal line is generally used as a signal line connected to a solid-state imaging device provided at a distal end portion of an electronic endoscope and transmitting a high-frequency signal to a control device or the like.

However, when a coaxial signal line is connected to such a solid-state imaging device, the core wire is exposed from the covering member and connected to the solid-state imaging device, and a shield wire is exposed behind the exposed core wire to GND. , The rigid length of the distal end becomes longer. In addition, connection of not only the core wire but also the shield wire in the narrow distal end hard portion causes a reduction in workability.
In view of the above circumstances, an endoscope apparatus that can reduce the rigid length of the distal end and improve the workability of signal line connection will be described.

  FIG. 33 relates to an embodiment of an endoscope apparatus capable of shortening the rigid length of the distal end portion and improving the workability of signal line connection, and is a main part of the distal end portion of the electronic endoscope. FIG.

  Reference numeral 370 in the figure indicates a distal end portion of the electronic endoscope constituting the endoscope apparatus. The distal end portion 370 includes an objective optical system unit 381 and a solid-state imaging device 380 disposed behind the objective optical system unit 381.

  The objective optical system unit 381 is fitted and held in a distal end frame 389 provided on the distal end side of the distal end portion 370.

  Further, a CCD holder 384 is externally fitted to the base end side of the objective optical system unit 381, and the solid-state imaging device 380 is held via the CCD holder 384. Here, the solid-state imaging device 380 is held in a state where a solid-state imaging device (hereinafter referred to as a CCD) 382 is in focus with the objective optical system unit 381. Specifically, a cover glass 383 is fitted and held on the inner periphery of the CCD holder 384, and the CCD 382 is attached to a base end surface of the cover glass 383. The CCD 382 has a lead 382a on the base end side, and a circuit board 385 is connected to the lead 382a.

  A first bending piece 392a of a bending tube 392 formed by combining a plurality of bending pieces is fitted and held on the base end side of the distal end frame 389. Here, the first bending piece 392a is provided so as to cover at least the outer circumferences of the CCD 382 and the circuit board 385.

  Further, a plurality of coaxial signal lines extending from the distal end of the CCD cable 387 are connected to the circuit board 385. Here, the distal end of the CCD cable 387 faces the rear of the curved tube 392, and the shield wire constituting the coaxial signal line is exposed near the distal end of the CCD cable 387 and connected to GND (not shown). Have been. The core wire 387a constituting the coaxial line is exposed near the circuit board 385 and connected to the circuit board 385. At this time, the plurality of core wires 387a connected to the circuit board 385 are extended to the vicinity of the circuit board 385 in a state where they are stranded together.

  According to such an embodiment, the shield line 387b of the coaxial signal line is grounded in the vicinity of the curved tube 392 without extending to the rigid end portion of the endoscope distal end portion 370, and only the core wire 387a is connected to the distal end. Since it extends to the hard portion and is connected to the circuit board 385, it is possible to shorten the tip hard length and improve the workability of signal line connection.

  Further, since the signal line in the bending tube can be made thinner, the diameter of the bending tube can be made smaller. Further, the filling rate of the signal line in the curved tube can be reduced, and the durability of the signal line is improved.

1 to 4 relate to an embodiment of the present invention, and FIG. 1 is an overall configuration diagram showing an endoscope apparatus. Cross-sectional view of the main part of the tip of the electronic endoscope Sectional view showing main part of CCD cable Sectional view showing main part of coaxial signal line FIG. 5 is a cross-sectional view illustrating a main part of a CCD cable according to a modification of the embodiment. FIG. 6 relates to an embodiment of an endoscope apparatus in which the length of the distal end portion can be shortened and component members of the solid-state imaging device can be easily exchanged. Part sectional view 7 to 9 show a first embodiment of an endoscope device capable of improving the connection strength of a CCD cable connection portion, and FIG. 7 is a sectional view of a main part of a solid-state imaging device. Bottom view near the circuit board in FIG. Exploded view of cable holding member FIG. 10 shows a second embodiment of an endoscope device capable of improving the connection strength of a CCD cable connection portion, and FIG. 10 is a sectional view of a main part of a solid-state imaging device. FIG. 11 shows a third embodiment of an endoscope apparatus capable of improving the connection strength of a CCD cable connection portion, and FIG. 11 is a sectional view of a main part of a solid-state imaging device. FIG. 12 shows a fourth embodiment of an endoscope apparatus capable of improving the connection strength of a CCD cable connection section, and FIG. 12 is a sectional view of a main part of a solid-state imaging device. 13 to 16 show a fifth embodiment of an endoscope device capable of improving the connection strength of a CCD cable connection portion, and FIG. 13 is a sectional view showing a main part of a solid-state imaging device. AA sectional view of FIG. A perspective view of the circuit board viewed from obliquely above. A perspective view of the circuit board viewed from diagonally below. 17 and 18 relate to an embodiment of an endoscope apparatus capable of improving the assemblability of the solid-state imaging device and the circuit board. FIG. 17 is an exploded side view of the solid-state imaging device and the circuit board. Figure Side view showing the state where the solid-state imaging device and the circuit board are connected 19 to 22 relate to an embodiment of an endoscope apparatus capable of shortening the length of a praise part, and FIG. 19 is an exploded cross-sectional view illustrating a main part of a solid-state imaging device. Sectional view of main parts of solid-state imaging device Explanatory drawing showing another contact configuration Explanatory drawing showing still another contact configuration FIG. 23 shows a distal end portion of a conventional electronic endoscope, FIG. 23 (a) is a side view of the distal end portion of the electronic endoscope, and FIG. 23 (b) is a sectional view taken along line AA of FIG. FIG. 24 shows an embodiment of an endoscope apparatus capable of reducing problems such as flare without increasing the diameter of the distal end. FIG. 24A shows the distal end of an electronic endoscope for the upper digestive tract. FIG. 24B is an explanatory diagram showing an example of an image taken by the electronic endoscope shown in FIG. 24A. FIG. 24C is an electronic endoscope for the lower digestive tract. FIG. 24D is an explanatory diagram showing an example of an image captured by the electronic endoscope shown in FIG. 24C. FIG. 25 relates to an embodiment of an endoscope apparatus capable of preventing damage to a lamp, and is an explanatory view near an operation unit of the endoscope. FIGS. 26 and 27 relate to a first embodiment of an endoscope apparatus capable of simultaneously forming a plurality of observation means 2 using a single solid-state imaging device, and FIG. 26 is a front end of an electronic endoscope. Sectional view of main part Is an illustration of the image on the monitor FIGS. 28 and 29 relate to a second embodiment of an endoscope apparatus which can simultaneously constitute a plurality of observation means using a single solid-state imaging device. FIG. Sectional view of main part Illustration of the image on the monitor FIG. 30 is a perspective view illustrating an essential part of an imaging unit according to an embodiment of an imaging unit that can support various solid-state imaging devices having different standards with one type of imaging unit. FIG. 31 relates to a first embodiment of an endoscope apparatus capable of reducing the diameter of the distal end of the electronic endoscope, and is a cross-sectional view of a main part of the distal end of the electronic endoscope. FIG. 32 is a sectional view of a main part of the distal end portion of the electronic endoscope, according to a second embodiment of the endoscope device capable of reducing the diameter of the distal end portion of the electronic endoscope. FIG. 33 relates to an embodiment of an endoscope apparatus capable of shortening the rigid length of the distal end portion and improving the workability of signal line connection, and is a main part of the distal end portion of the electronic endoscope. Cross section showing

Explanation of reference numerals

DESCRIPTION OF SYMBOLS 1 ... Endoscope apparatus 25 ... Solid-state image sensor 30 ... CCD cable 39 ... Coaxial signal line 39c ... 1st outer conductor 39d ... 2nd outer conductor 40 ... Coaxial signal line 41 ... Simple signal line
Attorney Susumu Ito

Claims (1)

In an endoscope apparatus provided with a treatment tool channel through which a solid-state imaging device is disposed at a distal end portion and through which a treatment tool is inserted,
An optical black region is arranged adjacent to at least one side of the image region of the solid-state imaging device, and a treatment tool channel hole on an endoscope end face is arranged at a position adjacent to a side where the optical black region is provided. Endoscope device characterized.

Images