JP2004179313A5 - - Google Patents

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Publication number
JP2004179313A5
JP2004179313A5 JP2002342556A JP2002342556A JP2004179313A5 JP 2004179313 A5 JP2004179313 A5 JP 2004179313A5 JP 2002342556 A JP2002342556 A JP 2002342556A JP 2002342556 A JP2002342556 A JP 2002342556A JP 2004179313 A5 JP2004179313 A5 JP 2004179313A5
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2002342556A
Other versions
JP2004179313A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2002342556A priority Critical patent/JP2004179313A/ja
Priority claimed from JP2002342556A external-priority patent/JP2004179313A/ja
Priority to US10/723,349 priority patent/US7078628B2/en
Publication of JP2004179313A publication Critical patent/JP2004179313A/ja
Publication of JP2004179313A5 publication Critical patent/JP2004179313A5/ja
Pending legal-status Critical Current

Links

JP2002342556A 2002-11-26 2002-11-26 回路配線基板 Pending JP2004179313A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2002342556A JP2004179313A (ja) 2002-11-26 2002-11-26 回路配線基板
US10/723,349 US7078628B2 (en) 2002-11-26 2003-11-25 Substrate for circuit wiring

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002342556A JP2004179313A (ja) 2002-11-26 2002-11-26 回路配線基板

Publications (2)

Publication Number Publication Date
JP2004179313A JP2004179313A (ja) 2004-06-24
JP2004179313A5 true JP2004179313A5 (ja) 2006-01-12

Family

ID=32704590

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002342556A Pending JP2004179313A (ja) 2002-11-26 2002-11-26 回路配線基板

Country Status (2)

Country Link
US (1) US7078628B2 (ja)
JP (1) JP2004179313A (ja)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006100752A (ja) * 2004-09-30 2006-04-13 Sanyo Electric Co Ltd 回路装置およびその製造方法
US8319111B2 (en) * 2006-10-04 2012-11-27 Ngk Spark Plug Co., Ltd. Wiring board having wiring laminate portion with via conductors embedded in resin insulating layers
WO2008129831A1 (ja) * 2007-03-30 2008-10-30 Panasonic Corporation 配線基板
JP2011100718A (ja) * 2009-10-05 2011-05-19 Yazaki Corp コネクタ
US8869775B2 (en) * 2010-02-09 2014-10-28 Denso Corporation Fuel supply apparatus
JP2019021768A (ja) * 2017-07-18 2019-02-07 株式会社デンソー 電子装置
DE102018216126B4 (de) 2017-09-28 2023-12-21 Denso Corporation Elektronische Vorrichtung und Verfahren zur Fertigung der elektronischen Vorrichtung

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2927081B2 (ja) 1991-10-30 1999-07-28 株式会社デンソー 樹脂封止型半導体装置
JPH118450A (ja) 1997-06-16 1999-01-12 Denki Kagaku Kogyo Kk 金属ベース回路基板
CN1146988C (zh) * 1997-12-08 2004-04-21 东芝株式会社 半导体功率器件的封装及其组装方法
US6307749B1 (en) * 2000-10-23 2001-10-23 Delphi Technologies, Inc. Overmolded electronic module with underfilled surface-mount components
JP4283514B2 (ja) * 2002-09-24 2009-06-24 株式会社日立製作所 電子回路装置
US6779260B1 (en) * 2003-03-28 2004-08-24 Delphi Technologies, Inc. Overmolded electronic package including circuit-carrying substrate

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