JP2004165684A - Resin coating method for semiconductor device, resin for coating, and liquid crystal display - Google Patents

Resin coating method for semiconductor device, resin for coating, and liquid crystal display Download PDF

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JP2004165684A
JP2004165684A JP2003417102A JP2003417102A JP2004165684A JP 2004165684 A JP2004165684 A JP 2004165684A JP 2003417102 A JP2003417102 A JP 2003417102A JP 2003417102 A JP2003417102 A JP 2003417102A JP 2004165684 A JP2004165684 A JP 2004165684A
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resin
coating
semiconductor element
liquid crystal
coating resin
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JP2004165684A5 (en
JP4120577B2 (en
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Eiji Muramatsu
永至 村松
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Seiko Epson Corp
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Seiko Epson Corp
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a resin coating method for semiconductor device, by which the resin coating can be performed easily and quickly. <P>SOLUTION: In the resin coating method for coating a semiconductor device 2 used for a liquid crystal panel 1 with a resin for coating, the resin 14 is formed in a sheet-like form, and the resin 14 for coating is put around a semiconductor 2. The resin 14 for coating is hardened, and the semiconductor 2 and its perimeter are coated and protected from moisture. The resin 14 for coating can be formed from resin for coating that can be hardened by chemical reaction by heating, ultraviolet curing type resin or the like. If a through hole 16 or recess is arranged in the center of the resin 14 for coating, and the semiconductor device 2 is inserted there, the position of the resin 14 for coating to the semiconductor 2 can be set as a fixed position all the time. <P>COPYRIGHT: (C)2004,JPO

Description

本発明は、半導体素子を被覆用樹脂によって被覆するための樹脂被覆方法、被覆用樹脂及び液晶表示装置に関する。   The present invention relates to a resin coating method for coating a semiconductor element with a coating resin, a coating resin, and a liquid crystal display device.

液晶表示装置では、電極を備えた一対の対向基板間に液晶を充填し、電極への印加電圧を制御することによって液晶の配向を制御して光を変調し、これにより数字、文字、図形等の可視像を基板表面に表示する。電極に対する電圧制御は、通常、半導体素子である駆動用ＩＣによって行われる。この駆動用ＩＣ及びその接続部は湿気に晒されると電気的特性が劣化するおそれがある。   In a liquid crystal display device, liquid crystal is filled between a pair of opposing substrates provided with electrodes, and by controlling the voltage applied to the electrodes, the orientation of the liquid crystal is controlled to modulate the light, thereby forming numbers, characters, figures, and the like. Is displayed on the substrate surface. The voltage control for the electrodes is usually performed by a driving IC which is a semiconductor element. If the drive IC and its connection are exposed to moisture, the electrical characteristics may be degraded.

従来より、駆動用ＩＣ及びその接続部が湿気に晒されるのを防止するために、その駆動用ＩＣ及びその接続部を被覆用樹脂で被覆するという処理が施されている。今、第５図に示すような、ＣＯＧ（Ｃｈｉｐ Ｏｎ Ｇｌａｓｓ）型の液晶パネル１を例に挙げて、これに用いられる駆動用ＩＣ２、その周辺及び露出している透明電極を被覆用樹脂で被覆する場合を考えると、従来は、液状の被覆用樹脂が入っているチューブ５１からその被覆用樹脂Ｒを絞り出しながら、チューブ５１を矢印Ａのように基板４に沿って平行移動させることにより、被覆用樹脂Ｒを駆動用ＩＣ２のまわりに塗布し、その後、その被覆用樹脂Ｒを時間をかけて乾燥させるという作業を行っていた。   2. Description of the Related Art Conventionally, in order to prevent a drive IC and its connection portion from being exposed to moisture, a process of covering the drive IC and its connection portion with a coating resin has been performed. Now, taking a COG (Chip On Glass) type liquid crystal panel 1 as shown in FIG. 5 as an example, a driving IC 2 used in the liquid crystal panel 1, its periphery and an exposed transparent electrode are covered with a covering resin. Conventionally, when the coating resin R is squeezed out of the tube 51 containing the liquid coating resin, the tube 51 is moved in parallel along the substrate 4 as shown by the arrow A, thereby forming the coating. The resin R is applied around the driving IC 2 and then the coating resin R is dried over time.

しかしながら、その従来の樹脂被覆方法では、被覆用樹脂を乾燥して固化させるために非常に長時間を要し、そのため、生産効率が非常に悪かった。また、チューブ５１から被覆用樹脂Ｒを一定量づつ絞り出すための装置及びチューブ５１を平行移動させるための装置が必要となり、設備コストが高かった。   However, in the conventional resin coating method, it takes a very long time to dry and solidify the coating resin, and therefore, the production efficiency is very poor. Further, a device for squeezing the coating resin R from the tube 51 by a predetermined amount and a device for moving the tube 51 in parallel are required, and the equipment cost is high.

本発明は、そのような問題点に鑑みてなされたものであって、液晶表示装置に用いられる半導体素子を簡単且つ迅速に樹脂被覆できる樹脂被覆方法を提供する
ことを目的とする。 The present invention has been made in view of such a problem, and an object of the present invention is to provide a resin coating method capable of easily and quickly coating a semiconductor element used in a liquid crystal display device with a resin.

上記の目的を達成するため、本発明に係る半導体素子の樹脂被覆方法は、被覆用樹脂をシート状に成形し、その被覆用樹脂を半導体素子のまわりに置き、そして、その被覆用樹脂を硬化して半導体素子を被覆することを特徴とする。   In order to achieve the above object, a resin coating method for a semiconductor element according to the present invention comprises forming a resin for coating into a sheet, placing the resin for coating around the semiconductor element, and curing the resin for coating. To cover the semiconductor element.

被覆用樹脂としては、加熱による化学反応で硬化する被覆用樹脂、例えばオレフィン系共重合樹脂を用いることができ、その場合には、その被覆用樹脂を６０℃〜８０℃程度の加熱温度で３０分程度加熱することによりその被覆用樹脂を硬化でき、さらに、その被覆用樹脂を室温で１０分程度冷却することにより、被着体に接着できる。このとき環境温度の上昇により、被覆用樹脂は、かど部分が滑らかな曲線状態になるように軟化し、その後、所定時間室温に放置することにより所定の硬さになる。そして、一旦硬化した後は８０℃程度の加熱では溶けることが無く、より具体的には１２０℃〜１４０℃までは溶けることがない。   As the coating resin, a coating resin which is cured by a chemical reaction by heating, for example, an olefin copolymer resin can be used. In this case, the coating resin is heated at a heating temperature of about 60 ° C to 80 ° C for 30 minutes. The coating resin can be cured by heating for about a minute, and can be bonded to the adherend by cooling the coating resin at room temperature for about 10 minutes. At this time, due to an increase in the environmental temperature, the coating resin is softened so that the corners have a smooth curved state, and then left at room temperature for a predetermined time to have a predetermined hardness. Once cured, it does not melt by heating at about 80 ° C, and more specifically, does not melt from 120 ° C to 140 ° C.

なお、望ましくは、用いる被覆用樹脂を適当に選択して、加熱温度を８０℃程度に設定できるようにするのが良い。その理由は、液晶表示素子にこの方法を用いた場合には、液晶をできるだけ高温に晒さぬ方が望ましいからである。   Preferably, the coating resin to be used is appropriately selected so that the heating temperature can be set to about 80 ° C. The reason is that when this method is used for a liquid crystal display element, it is desirable that the liquid crystal is not exposed to as high a temperature as possible.

本発明では、上記のような熱硬化型樹脂に代えて、ＵＶ（紫外線）硬化型樹脂を用いることもできる。この紫外線硬化型樹脂とは、紫外線が照射されたときに硬化する性質を有する樹脂であって、通常は、１０００ｍＪ程度の紫外線エネルギによって硬化する。   In the present invention, a UV (ultraviolet) curable resin may be used instead of the above-described thermosetting resin. The ultraviolet curable resin is a resin having a property of curing when irradiated with ultraviolet rays, and is usually cured by ultraviolet energy of about 1000 mJ.

以上の構成を有する本発明の樹脂被覆方法によれば、作業者又は作業装置が行うべき機械的な動作としては、被覆用樹脂を半導体素子の上に置くだけということになり、従来のように被覆用樹脂を基板上に塗布するという作業は不要になる。従って、作業が非常に簡単になり、しかも特別に複雑な装置を必要としなくなる。   According to the resin coating method of the present invention having the above-described configuration, the mechanical operation to be performed by the worker or the working device is that the coating resin is merely placed on the semiconductor element, as in the related art. The work of applying the coating resin on the substrate becomes unnecessary. Thus, the operation is very simple and no specially complicated devices are required.

また、液状の被覆用樹脂を乾燥によって硬化させるのではなくて、被覆用樹脂を一旦加熱して化学反応により硬化させたり、あるいは、紫外線を用いて硬化する等といった硬化処理を採用するので、被覆用樹脂を半導体素子のまわりで非常に短時間に硬化させることができる。   Also, instead of curing the liquid coating resin by drying, the coating resin is heated once and cured by a chemical reaction, or a curing treatment such as curing with ultraviolet light is employed. Resin can be cured around the semiconductor element in a very short time.

被覆用樹脂には、半導体素子を収納可能な貫通穴又は凹部を形成しておくことが望ましい。こうしておけば、被覆用樹脂が常に半導体素子を中心とした一定の位置に自動的に置かれるので、半導体素子に対する被覆用樹脂の位置にズレが生じることが無くなる。   It is desirable to form a through-hole or a concave portion in which the semiconductor element can be housed in the coating resin. By doing so, the coating resin is always automatically placed at a fixed position around the semiconductor element, so that the position of the coating resin with respect to the semiconductor element does not shift.

本発明に係る樹脂被覆方法は、任意の構造の液晶表示装置に適用できる。しかしながら請求項６に記載のように、半導体素子をガラス基板上に直接に固着する形式の、いわゆるＣＯＧ型の液晶表示装置に関しては特に有利である。何故ならば、被覆用樹脂は容易にガラス基板に接着する性質を有するからである。   The resin coating method according to the present invention can be applied to a liquid crystal display device having an arbitrary structure. However, a so-called COG type liquid crystal display device in which a semiconductor element is directly fixed on a glass substrate, as described in claim 6, is particularly advantageous. This is because the coating resin has a property of easily adhering to the glass substrate.

又、本発明の半導体素子を被覆するための被覆用樹脂はシート状に成形されていることを特徴とする。そして望ましくは被覆用樹脂は上記半導体素子を収納可能な貫通穴又は凹部を有することを特徴とする。   Further, the coating resin for coating the semiconductor element of the present invention is characterized in that it is formed into a sheet. Preferably, the coating resin has a through hole or a concave portion capable of accommodating the semiconductor element.

又、本発明の液晶表示装置は、液晶を挟んで互いに対向する一対の基板と、少なくとも一方の基板上に直接に接合された半導体素子とを有する液晶表示装置において、前記半導体素子は、被覆用樹脂をシート状に成形し、その被覆用樹脂を前記半導体素子のまわりに置き、そして、その被覆用樹脂を硬化することによって被覆されていることを特徴とする。   Further, the liquid crystal display device of the present invention is a liquid crystal display device having a pair of substrates opposed to each other with a liquid crystal interposed therebetween, and a semiconductor element directly bonded to at least one of the substrates. The resin is formed into a sheet, the coating resin is placed around the semiconductor element, and the coating is cured by curing the coating resin.

（第１実施形態）
第３図は、本発明の樹脂被覆方法を適用できる液晶パネルの一例である、ＣＯＧ型の液晶パネルを示している。この液晶パネルは、透明なガラスによって形成された第１基板３と、同じく透明なガラスによって形成された第２基板４とを環状のシール剤６によって互いに接着し、そして、それらの基板３及び４によって挟まれる空間、いわゆるセルギャップに液晶を充填することによって形成される。それらの基板３及び４の表面には、それぞれ、ストライプ状電極７及びストライプ状電極８や、特殊パターンの電極９が形成される。これらの電極は、ＩＴＯ、酸化すず、その他の透明電極材料によって形成される。この液晶パネルでは、ストライプ状電極７及びストライプ状電極８の交差点に複数個の画素がマトリクス状に形成され、そして特殊パターン電極９によって特定の機能を示すための特殊記号が表示される。 (1st Embodiment)
FIG. 3 shows a COG type liquid crystal panel which is an example of a liquid crystal panel to which the resin coating method of the present invention can be applied. In this liquid crystal panel, a first substrate 3 formed of transparent glass and a second substrate 4 also formed of transparent glass are adhered to each other by an annular sealant 6, and the substrates 3 and 4 are bonded together. It is formed by filling a liquid crystal in a space sandwiched by the liquid crystals, a so-called cell gap. On the surfaces of the substrates 3 and 4, a stripe-shaped electrode 7 and a stripe-shaped electrode 8 and an electrode 9 having a special pattern are formed, respectively. These electrodes are formed of ITO, tin oxide, and other transparent electrode materials. In this liquid crystal panel, a plurality of pixels are formed in a matrix at the intersections of the stripe-shaped electrodes 7 and the stripe-shaped electrodes 8, and a special symbol for indicating a specific function is displayed by the special pattern electrode 9.

第２基板４は第１基板３の外側へ張り出す張出し部分４ａを有しており、その表面上にＩＣ出力配線１１及びＩＣ入力配線１２が形成される。ＩＣ出力配線１１は、半導体素子としての駆動用ＩＣ２の出力端子を各電極７，８，９に接続するための配線であり、一方、ＩＣ入力配線１２は、駆動用ＩＣ２の入力端子を外部回路基板（図示せず）に接続するための配線である。   The second substrate 4 has a protruding portion 4a that protrudes outside the first substrate 3, and IC output wirings 11 and IC input wirings 12 are formed on the surface thereof. The IC output wiring 11 is a wiring for connecting the output terminal of the driving IC 2 as a semiconductor element to each of the electrodes 7, 8, and 9. On the other hand, the IC input wiring 12 connects the input terminal of the driving IC 2 to an external circuit. This is a wiring for connecting to a substrate (not shown).

第１基板３と第２基板４とがシール剤６を挟んで互いに接着され、さらに、セルギャップ内に液晶が充填されると、その後、駆動用ＩＣ２が、例えばＡＣＦ（Ａｎｉｓｏｔｒｏｐｉｃ Ｃｏｎｄｕｃｔｉｖｅ Ｆｉｌｍ：異方性導電膜）を介して第２基板４の張出し部分４ａ上に機械的及び電気的に接着される。また、ＦＰＣ（Ｆｌｅｘｉｂｌｅ Ｐｒｉｎｔｅｄ Ｃｉｒｃｕｉｔ）１３が第２基板４のＩＣ入力配線１２の所に、例えばＡＣＦを介して接着される。   When the first substrate 3 and the second substrate 4 are bonded to each other with the sealant 6 interposed therebetween, and the liquid crystal is filled in the cell gap, the driving IC 2 is then driven by, for example, an ACF (Anisotropic Conductive Film: anisotropic film). The second substrate 4 is mechanically and electrically bonded to the overhanging portion 4a via the conductive film). Further, an FPC (Flexible Printed Circuit) 13 is bonded to the IC input wiring 12 of the second substrate 4 via, for example, an ACF.

第１図は、以上のようにして作製された液晶パネル１を示している。この液晶パネル１の第２基板４の張出し部分４ａ上に装着された駆動用ＩＣ２は湿気から守られることが必要であり、そのため、次のような樹脂被覆処理が施される。   FIG. 1 shows a liquid crystal panel 1 manufactured as described above. The driving IC 2 mounted on the overhanging portion 4a of the second substrate 4 of the liquid crystal panel 1 needs to be protected from moisture, and therefore is subjected to the following resin coating processing.

まず、第１図に示すように、第２基板４の張出し部分４ａの面積に対応した面積を有するシート状の被覆用樹脂１４を用意する。この被覆用樹脂１４は、加熱による化学反応で硬化する性質を有する樹脂、例えばオレフィン系共重合樹脂によって駆動用ＩＣ２の高さとほぼ同じ厚さに形成される。また、この被覆用樹脂１４の中央部には、駆動用ＩＣ２よりもわずかに大きな長方形状の貫通穴１６が形成されている。   First, as shown in FIG. 1, a sheet-like coating resin 14 having an area corresponding to the area of the overhang portion 4a of the second substrate 4 is prepared. The coating resin 14 is formed of a resin having a property of being cured by a chemical reaction due to heating, for example, an olefin copolymer resin, to have a thickness substantially equal to the height of the driving IC 2. Further, a rectangular through hole 16 slightly larger than the driving IC 2 is formed in the center of the coating resin 14.

被覆用樹脂１４は、駆動用ＩＣ２が貫通穴１６にはまり込む状態で第２基板４の張出し部４ａの上に置かれ、その後、所定の温度、例えば６０℃〜８０℃で所定時間、例えば３０分程度加熱される。この加熱処理により、被覆用樹脂１４が硬化して基板４に接着する。その後所定時間、例えば１０分間程度、その樹脂１４を室温に置くと、その樹脂１４は固化して基板４及び駆動用ＩＣ２の側面にしっかりと固着し、これにより第２図に示すように、駆動用ＩＣ２に対する被覆用樹脂被覆処理が完了した液晶パネル１が得られる。なお本実施形態では、駆動用ＩＣ２の頂面が被覆用樹脂１４の外部に露出した状態で被覆が完了するが、その頂面も被覆用樹脂１４によって被覆することもできる。   The coating resin 14 is placed on the overhanging portion 4a of the second substrate 4 in a state where the driving IC 2 is fitted into the through hole 16, and thereafter, at a predetermined temperature, for example, 60 ° C. to 80 ° C. for a predetermined time, for example, 30 seconds. Heat for about a minute. By this heat treatment, the coating resin 14 is cured and adheres to the substrate 4. After that, when the resin 14 is left at room temperature for a predetermined time, for example, about 10 minutes, the resin 14 solidifies and firmly adheres to the side surfaces of the substrate 4 and the driving IC 2, thereby, as shown in FIG. Liquid crystal panel 1 in which the coating resin coating process for coating IC 2 is completed is obtained. In the present embodiment, the coating is completed in a state where the top surface of the driving IC 2 is exposed to the outside of the coating resin 14, but the top surface can also be coated with the coating resin 14.

以上のような樹脂被覆処理によれば、作業者又は作業装置が行う機械的な作業は、被覆用樹脂１４を第２基板４の張出し部分４ａの上に置くだけという、極めて簡単な作業だけであるので、第５図に示した従来の処理のように液状樹脂を塗布する場合に比べて、作業を簡単且つ確実に行うことができる。また、被覆用樹脂を加熱による化学反応で硬化させて固化するという処理を行うので、液状樹脂を乾燥によって固化する場合に比べて、固化時間を著しく短縮できる。また、貫通穴１６を駆動用ＩＣ２にはめ込むようにしたので、駆動用ＩＣ２に対する被覆用樹脂１４の位置を常に一定の位置に設定することができ、その結果、安定した品質の液晶パネルを得ることができる。   According to the resin coating process as described above, the mechanical operation performed by the operator or the working device is an extremely simple operation of merely placing the coating resin 14 on the overhanging portion 4a of the second substrate 4. Therefore, the operation can be performed simply and reliably as compared with the case where the liquid resin is applied as in the conventional processing shown in FIG. In addition, since the coating resin is cured by a chemical reaction by heating and solidified, the solidification time can be significantly reduced as compared with the case where the liquid resin is solidified by drying. Further, since the through holes 16 are fitted into the driving ICs 2, the position of the coating resin 14 with respect to the driving ICs 2 can always be set at a fixed position. As a result, a liquid crystal panel of stable quality can be obtained. Can be.

なお、第１図において、シート状に形成した被覆用樹脂１４には、必ずしも、駆動用ＩＣ２を収納するための貫通穴１６を設けることなく、単なる一様な厚さのシート材とすることもできる。ただし、その場合には、駆動用ＩＣ２に対する被覆用樹脂１４の位置にばらつきが発生するおそれがあるので、注意が必要である。また、貫通穴１６に代えて、第４図に示すような長方形状の凹部１７を被覆用樹脂１４に設け、被覆用樹脂１４を基板上に置く際、その凹部１７内に駆動用ＩＣ１２を収納することもできる。なお、第４図では、１枚の被覆用樹脂１４ｂに貫通穴を開け、それを他の被覆用樹脂１４ａに貼り合わせることにより、シート状に成形した被覆用樹脂１４に凹部１７を形成する。
（第２実施形態）
上記の第１実施形態では、被覆用樹脂１４をオレフィン系共重合樹脂のような、加熱によって硬化する樹脂を用いて形成した。本第２実施形態では、これに代えて、ＵＶ（紫外線）硬化型樹脂によって被覆用樹脂１４を形成する。 In FIG. 1, the coating resin 14 formed in a sheet shape does not necessarily have to have the through hole 16 for accommodating the driving IC 2, and may be simply a sheet material having a uniform thickness. it can. However, in such a case, care must be taken since the position of the coating resin 14 with respect to the driving IC 2 may vary. In addition, instead of the through hole 16, a rectangular concave portion 17 as shown in FIG. 4 is provided in the coating resin 14, and when the coating resin 14 is placed on the substrate, the driving IC 12 is stored in the concave portion 17. You can also. In FIG. 4, a through hole is formed in one coating resin 14b, and the through-hole is bonded to another coating resin 14a, thereby forming a concave portion 17 in the sheet-shaped coating resin 14.
(2nd Embodiment)
In the first embodiment, the coating resin 14 is formed using a resin that is cured by heating, such as an olefin-based copolymer resin. In the second embodiment, the coating resin 14 is formed of a UV (ultraviolet) curable resin instead.

この実施形態では、例えば第１図に示すように、ＵＶ硬化型樹脂によって形成された被覆用樹脂１４を貫通穴１６が駆動用ＩＣ２にはまるように第２基板４の張出し部分４ａの上に置き、さらに被覆用樹脂１４に紫外線を照射して硬化させる。このとき、紫外線照射エネルギは１０００ｍＪ程度とする。この実施形態によっても、非常に簡単な作業によって半導体素子を短時間に被覆用樹脂で被覆できる。
（その他の実施形態）
以上、好ましい実施形態を挙げて本発明を説明したが、本発明はその実施形態に限定されるものではなく、請求の範囲に記載した技術的範囲内で種々に改変できる。 In this embodiment, for example, as shown in FIG. 1, a coating resin 14 made of a UV-curable resin is placed on the overhanging portion 4a of the second substrate 4 so that the through hole 16 fits into the driving IC 2. Then, the coating resin 14 is irradiated with ultraviolet rays to be cured. At this time, the ultraviolet irradiation energy is set to about 1000 mJ. According to this embodiment, the semiconductor element can be covered with the covering resin in a short time by a very simple operation.
(Other embodiments)
As described above, the present invention has been described with reference to the preferred embodiments. However, the present invention is not limited to the embodiments, and can be variously modified within the technical scope described in the claims.

上記の各実施形態では、ＣＯＧ型の液晶パネルに本発明を適用したが、本発明はそれ以外の任意の構造の液晶パネルに対しても適用できる。   In the above embodiments, the present invention is applied to a COG type liquid crystal panel. However, the present invention can be applied to a liquid crystal panel having any other structure.

また、上記の実施形態では、ＦＰＣ１３を第２基板４に接着した後に樹脂被覆処理を行うようにしたが、これに代えて、ＦＰＣ１３の接着処理の前に駆動用ＩＣ２に対する樹脂被覆処理を行い、その樹脂被覆処理が完了した後に、ＦＰＣ１３を基板４に接着することもできる。   Further, in the above embodiment, the resin coating process is performed after the FPC 13 is bonded to the second substrate 4. Instead, the resin coating process is performed on the driving IC 2 before the bonding process of the FPC 13. After the resin coating process is completed, the FPC 13 can be bonded to the substrate 4.

また、本発明は、液晶パネルに限らず、基板に半導体素子を実装し、それを樹脂により被覆する電子装置の構造に適用することが可能である。   Further, the present invention is not limited to a liquid crystal panel, but can be applied to a structure of an electronic device in which a semiconductor element is mounted on a substrate and the semiconductor element is covered with a resin.

本発明に係る半導体素子の樹脂被覆方法によれば、半導体素子を固着した基板の上に被覆用樹脂を単に載せるだけで良いので、作業が簡単であり、しかも、その作業を行うために複雑な装置を必要としない。また、液状樹脂の塗布作業を必要とした従来方法に比べて、作業を短時間に完了できる。   According to the method for coating a semiconductor element with a resin according to the present invention, the work is simple because the coating resin only needs to be placed on the substrate to which the semiconductor element is fixed, and the work is complicated. Requires no equipment. In addition, the operation can be completed in a shorter time than in the conventional method that requires the operation of applying the liquid resin.

また、液状樹脂を乾燥によって硬化させる従来方法に比べて、被覆用樹脂を硬化させるのに要する時間を著しく短縮化できる。   Further, the time required for curing the coating resin can be significantly reduced as compared with the conventional method of curing the liquid resin by drying.

さらに、半導体素子に対する被覆用樹脂の位置を常に一定の位置に自動的に設定できる。   Further, the position of the coating resin with respect to the semiconductor element can always be automatically set to a fixed position.

さらには、本発明に係る半導体素子の樹脂被覆方法は、いわゆるＣＯＧ型の液晶表示装置に対して本発明を適用する場合を想定している。ＣＯＧ型の液晶表示装置は、半導体素子をガラス基板の上に直接に接着する構造を有するから、半導体素子を被覆するための被覆用樹脂は、ガラス基板の上に置かれた状態で、紫外線照射処理又は加熱処理を受けることになる。被覆用樹脂は、ガラス基板に対して接着し易い性質を持っているので、本発明によれば、短時間で正確に被覆用樹脂を基板上に接着できる。   Further, the resin coating method for a semiconductor element according to the present invention assumes that the present invention is applied to a so-called COG type liquid crystal display device. Since the COG type liquid crystal display device has a structure in which a semiconductor element is directly bonded to a glass substrate, the coating resin for coating the semiconductor element is irradiated with ultraviolet light while being placed on the glass substrate. Treatment or heat treatment. Since the coating resin has a property of easily adhering to the glass substrate, according to the present invention, the coating resin can be accurately adhered to the substrate in a short time.

以上述べたように本発明は、半導体素子を簡単且つ迅速に樹脂被覆するために
有用であり、特に半導体素子をガラス基板上に直接に固着する形式の、いわゆる
ＣＯＧ型の半導体素子の実装に好適である。 INDUSTRIAL APPLICABILITY As described above, the present invention is useful for resin coating of a semiconductor element simply and quickly, and is particularly suitable for mounting a so-called COG type semiconductor element in which a semiconductor element is directly fixed on a glass substrate. It is.

第１図は、本発明に係る半導体素子の樹脂被覆方法を実施する際の様子を示す斜視図である。FIG. 1 is a perspective view showing a state when a resin coating method for a semiconductor element according to the present invention is performed. 第２図は、本発明に係る半導体素子の樹脂被覆方法によって作製した液晶パネルの一例を示す斜視図である。FIG. 2 is a perspective view showing an example of a liquid crystal panel produced by the method for coating a semiconductor element with a resin according to the present invention. 第３図は、本発明に係る半導体素子の樹脂被覆方法を適用できる液晶パネルの一例を示す分解斜視図である。FIG. 3 is an exploded perspective view showing an example of a liquid crystal panel to which the resin coating method for a semiconductor element according to the present invention can be applied. 第４図は、シート状に成形した被覆用樹脂の変形例を示す斜視図である。FIG. 4 is a perspective view showing a modification of the coating resin formed into a sheet. 第５図は、従来の半導体素子の樹脂被覆方法の一例を示す斜視図である。FIG. 5 is a perspective view showing an example of a conventional resin coating method for a semiconductor element.

Claims (10)

半導体素子を被覆用樹脂によって被覆するための樹脂被覆方法において、被覆用樹脂をシート状に成形し、その被覆用樹脂を半導体素子のまわりに置き、そして、その被覆用樹脂を硬化して半導体素子を被覆することを特徴とする半導体素子の樹脂被覆方法。 In a resin coating method for coating a semiconductor element with a coating resin, the coating resin is formed into a sheet, the coating resin is placed around the semiconductor element, and the coating resin is cured to form a semiconductor element. A resin coating method for a semiconductor element, comprising: 請求の範囲第１項記載の半導体素子の樹脂被覆方法において、
上記被覆用樹脂は、加熱による化学反応で硬化する被覆用樹脂であり、そして半導体素子のまわりに置いた被覆用樹脂を加熱による化学反応で硬化させることを特徴とする半導体素子の樹脂被覆方法。 The resin coating method for a semiconductor element according to claim 1,
The method of coating a semiconductor element resin, wherein the coating resin is a coating resin which is cured by a chemical reaction by heating, and the coating resin placed around the semiconductor element is cured by a chemical reaction by heating. 請求の範囲第１項記載の半導体素子の樹脂被覆方法において、
上記被覆用樹脂は、紫外線を受けたときに硬化する紫外線硬化型樹脂であり、そして半導体素子のまわりに置いた被覆用樹脂を紫外線の照射によって硬化することを特徴とする半導体素子の樹脂被覆方法。 The resin coating method for a semiconductor element according to claim 1,
The coating resin is an ultraviolet-curable resin that cures when receiving ultraviolet light, and the coating resin placed around the semiconductor element is cured by irradiation with ultraviolet light. . 請求の範囲第１項から第３項のうちのいずれか１つに記載の半導体素子の樹脂被覆方法において、被覆用樹脂は半導体素子を収納可能な貫通穴を有することを特徴とする半導体素子の樹脂被覆方法。 4. The method according to claim 1, wherein the resin for coating has a through hole capable of housing the semiconductor element. Resin coating method. 請求の範囲第１項から第３項のうちのいずれか１つに記載の半導体素子の樹脂被覆方法において、被覆用樹脂は半導体素子を収納可能な凹部を有することを特徴とする半導体素子の樹脂被覆方法。 4. The resin for a semiconductor element according to claim 1, wherein the resin for coating has a recess capable of accommodating the semiconductor element. Coating method. 請求の範囲第１項から第５項のうちのいずれか１つに記載の半導体素子の樹脂被覆方法において、
上記半導体素子は、液晶表示装置に用いられるものであって、
上記液晶表示装置は、液晶を挟んで互いに対向する一対の基板と、少なくとも一方の基板上に直接に接合された半導体素子とを有しており、
上記被覆用樹脂は、半導体素子が接合されている基板上に置かれることを特徴とする半導体素子の樹脂被覆方法。 The resin coating method for a semiconductor element according to any one of claims 1 to 5,
The semiconductor element is used for a liquid crystal display device,
The liquid crystal display device includes a pair of substrates opposed to each other with a liquid crystal interposed therebetween, and a semiconductor element directly bonded to at least one of the substrates,
A resin coating method for a semiconductor element, wherein the coating resin is placed on a substrate to which the semiconductor element is bonded. 半導体素子を被覆するための被覆用樹脂において、
上記被覆用樹脂はシート状に成形されていることを特徴とする被覆用樹脂。 In a coating resin for coating a semiconductor element,
The coating resin, wherein the coating resin is formed in a sheet shape. 請求の範囲第７項に記載の被覆用樹脂において、
上記被覆用樹脂は上記半導体素子を収納可能な貫通穴を有することを特徴とする被覆用樹脂。 The coating resin according to claim 7,
The coating resin has a through hole that can accommodate the semiconductor element. 請求の範囲第７項に記載の被覆用樹脂において、
上記被覆用樹脂は上記半導体素子を収納可能な凹部を有することを特徴とする被覆用樹脂。 The coating resin according to claim 7,
The coating resin has a concave portion capable of housing the semiconductor element. 液晶を挟んで互いに対向する一対の基板と、少なくとも一方の基板上に直接に接合された半導体素子とを有する液晶表示装置において、
前記半導体素子は、被覆用樹脂をシート状に成形し、その被覆用樹脂を前記半導体素子のまわりに置き、そして、その被覆用樹脂を硬化することによって被覆されていることを特徴とする液晶表示装置。
In a liquid crystal display device including a pair of substrates facing each other with liquid crystal interposed therebetween and a semiconductor element directly bonded to at least one substrate,
The liquid crystal display, wherein the semiconductor element is coated by forming a coating resin into a sheet shape, placing the coating resin around the semiconductor element, and curing the coating resin. apparatus.
JP2003417102A 1996-08-08 2003-12-15 Resin coating method for semiconductor element and liquid crystal display device Expired - Fee Related JP4120577B2 (en)

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JP5659294B2 (en) * 2011-03-28 2015-01-28 シャープ株式会社 Display device
EP3012683B1 (en) * 2014-10-20 2022-05-04 LG Display Co., Ltd. Display apparatus

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009198850A (en) * 2008-02-22 2009-09-03 Epson Imaging Devices Corp Electrooptical device and electronic equipment
JP2009198851A (en) * 2008-02-22 2009-09-03 Epson Imaging Devices Corp Electrooptical device and electronic equipment
JP2009198849A (en) * 2008-02-22 2009-09-03 Epson Imaging Devices Corp Electrooptical device and electronic equipment
US7952862B2 (en) 2008-02-22 2011-05-31 Epson Imaging Devices Corporation Electro-optical device and electronic apparatus
US8450838B2 (en) 2009-08-11 2013-05-28 Seiko Epson Corporation Electro-optic apparatus, electronic device, and method for manufacturing electro-optic apparatus
JP2011191608A (en) * 2010-03-16 2011-09-29 Hitachi Displays Ltd Display device
JP5659294B2 (en) * 2011-03-28 2015-01-28 シャープ株式会社 Display device
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