JP2004165548A - Apparatus and tool for bonding - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an apparatus and a tool for bonding that can realize both high-efficiency heating and a stable vibration characteristic. <P>SOLUTION: The bonding apparatus that presses an object to be joined by loading and vibrating is characterized in that the bonding tool 14 which is pressed against the object to be joined comprises a laterally long horn 15, a vibrator 17 which imparts longitudinal vibration along the length, a projection part 30 which is provided projecting from the horn 15 at right angles to the length, and a joining operation part 31 which is provided at an end of the projection part 30 and a heater 18 for heating is inserted into a mount hole 15e formed along the length of the horn 15. Consequently, the influence of assembly of the heater 18 on vibration propagation in the horn can be made as small as possible and even when a high-output heater is incorporated in a small-sized horn, both high-efficiency heating and a stable vibration characteristic can be realized. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to an electronic component bonding apparatus and a bonding tool for bonding an object to be bonded such as an electronic component to a surface to be bonded such as an electrode of a substrate.
[0002]
[Prior art]
2. Description of the Related Art As a method of bonding an object to be bonded such as an electronic component to a surface to be bonded such as an electrode of a substrate, a method using ultrasonic pressure welding is known. In this method, ultrasonic vibration is applied to the electronic component while pressing the electronic component against the surface to be bonded, and the bonding surface is minutely vibrated to bring the electronic component into close contact. The bonding tool used in this method has an elongated horn for transmitting the vibration of the vibration source to the electronic component, and while applying a load and vibration to the electronic component by a bonding action portion provided on the horn. Then, the electronic component is bonded to the surface to be joined by pressing.
[0003]
As such a bonding tool, a tool having a built-in heater in a horn is known. Thus, there is an advantage that the electronic component can be heated via the bonding action portion during bonding, and the bonding efficiency can be improved. Conventionally, as a method for mounting such a heater on a horn, a method of inserting a rod-shaped heater into a mounting hole provided in a direction orthogonal to the longitudinal direction of the horn has been used (for example, see Patent Document 1).
[0004]
[Patent Document 1]
JP 2000-20961 A (FIG. 3)
[0005]
[Problems to be solved by the invention]
By the way, with the miniaturization of electronic components, a small bonding tool is used according to the size of the electronic component. In addition, from the demand for improvement of work efficiency, it is required to employ a high-power heater for the horn described above. However, if the above-described configuration of the conventional heater mounting method is applied as it is to a bonding tool requiring such characteristics, the following problems occur in securing the vibration propagation characteristics.
[0006]
That is, in the conventional configuration, since the rod-shaped heater is inserted across the vibration propagation direction, the heater tends to hinder vibration propagation. This effect is particularly pronounced when a large heater is combined with a small horn for small electronic components. For this reason, it has been difficult for conventional bonding tools to achieve both high-efficiency heating and stable vibration characteristics.
[0007]
Therefore, an object of the present invention is to provide a bonding apparatus and a bonding tool that can achieve both high-efficiency heating and stable vibration characteristics.
[0008]
[Means for Solving the Problems]
2. The bonding apparatus according to claim 1, wherein the bonding apparatus presses the object to be bonded to the surface to be bonded while applying a load and vibration to the object, wherein the bonding tool abuts the object to be bonded and the bonding tool. Pressing means for pressing a tool against the object to be joined, the bonding tool is a horizontally long horn, a vibrator for imparting a longitudinal vibration to the horn in a first direction along the longitudinal direction of the horn, A projecting portion provided from the horn in a second direction substantially perpendicular to the first direction, a projecting portion provided at an end of the projecting portion and abutting on the joining object; A rod-shaped heating means inserted in the first direction.
[0009]
A bonding apparatus according to a second aspect is the bonding apparatus according to the first aspect, wherein the heating unit is fixed to the horn at a position of a node of a standing wave vibration induced in the horn by the vibrator.
[0010]
The bonding tool according to claim 3 is a bonding tool that presses the object to be bonded to a surface to be bonded while applying a load and vibration to the object, and comprises a horizontally long horn and a longitudinal length of the horn with respect to the horn. A vibrator that applies longitudinal vibration in a first direction along a direction, and a convex portion provided at a substantially central position of the fixed portion so as to protrude from the horn in a second direction substantially orthogonal to the first direction, The horn was provided with a joining action portion provided at an end of the convex portion and in contact with the joining object, and a rod-shaped heating means inserted into the horn in a first direction.
[0011]
The bonding tool according to a fourth aspect is the bonding tool according to the third aspect, wherein the heating unit is fixed to the horn at a position of a node of a standing wave vibration induced in the horn by the vibrator.
[0012]
According to the present invention, the influence on the vibration propagation inside the horn can be minimized by inserting the rod-shaped heating means for heating the bonding tool in the first direction along the longitudinal direction of the horn. Even when a high-power heating means is incorporated in the horn, it is possible to achieve both high-efficiency heating and stable vibration characteristics.
[0013]
BEST MODE FOR CARRYING OUT THE INVENTION
(Embodiment 1)
Next, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a front view of an electronic component bonding apparatus according to Embodiment 1 of the present invention, FIG. 2A is a perspective view of an electronic component bonding tool according to Embodiment 1 of the present invention, and FIG. FIG. 3 is a partial upside down perspective view of an electronic component bonding tool according to Embodiment 1 of the present invention, and FIG. 3 is a front view of the electronic component bonding tool according to Embodiment 1 of the present invention.
[0014]
First, the overall structure of an electronic component bonding apparatus will be described with reference to FIG. Reference numeral 1 denotes a support frame, on the front surface of which is provided a first elevating plate 2 and a second elevating plate 3 so as to be able to move up and down. A cylinder 4 is mounted on the first lifting plate 2, and its rod 5 is connected to the second lifting plate 3. The bonding head 10 is mounted on the second lifting plate 3. On the upper surface of the support frame 1, a Z-axis motor 6 is provided. The Z-axis motor 6 rotates a vertical feed screw 7. The feed screw 7 is screwed into a nut 8 provided on the back of the first lifting plate 2. Accordingly, when the Z-axis motor 6 is driven to rotate the feed screw 7, the nut 8 moves up and down along the feed screw 7, and the first lifting plate 2 and the second lifting plate 3 also move up and down.
[0015]
In FIG. 1, a substrate 46 whose upper surface is a surface to which electronic components are joined is placed on a substrate holder 47, and the substrate holder 47 is placed on a table 48. The table 48 is a movable table, and horizontally moves the substrate 46 in the X direction and the Y direction to position the substrate 46 at a predetermined position. The table 48 serves as positioning means for moving the board 46 relative to the electronic component 40.
[0016]
Reference numeral 42 denotes a camera, which is mounted on the uniaxial table 43. A lens barrel 44 extends forward from the camera 42. The camera 42 is moved forward along the uniaxial table 43 and the tip of the lens barrel 44 is positioned between the electronic component 40 with bumps and the substrate 46 held by being sucked and held on the lower surface of the bonding tool 14 as shown by a chain line. In this state, the positions of the electronic component 40 and the substrate 46 are observed by the camera 42.
[0017]
A recognition unit 53 recognizes images of the electronic component 40 and the board 46 captured by the camera 42 and detects their positions. Reference numeral 50 denotes a main control unit which controls the vertical movement of the Z-axis motor 6, that is, the bonding head 10 via a motor drive unit 51, and positions the table 48, that is, the substrate 46, via a table control unit 52. Further, the main control unit 50 calculates a displacement between the electronic component 40 and the board 46 in the horizontal plane from the positions of the electronic component 40 and the board 46 detected by the recognition unit 53, and drives the table 48 so as to correct the displacement. Further, a load control unit 54 and a suction device 56 are connected to the main control unit 50.
[0018]
The cylinder 4 as a pressing means is connected to the main control unit 50 via a load control unit 54, and the pressing load for pressing the bump of the electronic component 40 against the substrate 46 with the bonding tool 14 or the projecting output of the rod 5 of the cylinder 4 is applied. Controlled. The suction device 56 performs suction and release of suction of the electronic component 40 by the bonding tool 14 according to a command from the main control unit 50. The vibrator 17 is connected to the main control unit 50 via the ultrasonic vibrator drive unit 55, and the vibrator 17 is driven by the ultrasonic vibrator drive unit 55 according to a command from the main control unit 50. Ultrasonic vibration is applied to the bonding tool 14. At this time, the vibration of the bonding tool 14 is in a resonance state, and the phase difference between the voltage and the current applied to the vibrator 17 is almost zero.
[0019]
A holder 12 is coupled to the lower end of the main body 11 of the bonding head 10. A block 13 is mounted on the holder 12, and a bonding tool 14 is fixed to the block 13. The protrusion 13 a on the side of the block 13 is connected to the suction device 56. The protrusion 13a is provided with a suction pad 19, and the suction device 19 can suck and hold the electronic component 40 by the suction device 56 when the suction pad 19 contacts the horn 15 as described later.
[0020]
Hereinafter, the bonding tool 14 will be described with reference to FIGS. FIG. 2A is a perspective view of the bonding tool 14 removed from the block 13 as viewed obliquely from above, and FIG. 2B is a partial view of the horn 15 with the bonding tool 14 turned upside down. I have. FIG. 3 shows a front view of the bonding tool 14 and a graph of the amplitude of the standing wave vibration induced on the horn 15 by the vibrator 17.
[0021]
As shown in FIG. 2A, the bonding tool 14 mainly includes a horizontally long horn 15. The horn 15 is made of a metal material (for example, stainless steel, aluminum, titanium, or the like) or the like, has a rod-like shape having a rectangular cross section, and has a vibrator 17 mounted on one side end of the horn 15. The height and width of the rectangular cross section may be changed continuously or stepwise along the longitudinal direction of the horn. Thus, it is possible to adjust the horn 15 to enlarge or reduce the vibration applied by the vibration applying means. By driving the vibrator 17, longitudinal vibration is applied in a first direction (the direction of arrow a) along the longitudinal direction of the horn 15. Therefore, the vibrator 17 serves as a vibration applying unit that applies vibration in the first direction along the longitudinal direction of the horn 15.
[0022]
On both side surfaces 15b of the horn 15, two thin ribs 15c are provided integrally with the horn 15 in a central distribution arrangement. The dimension between the two ribs 15c is set to be equal to a half wavelength (L / 2) of the longitudinal vibration applied by the vibrator 17, in order to minimize the attenuation of the vibration by fixing the vibration component. (See FIG. 3). In addition, the said dimension should just be in the range which can attenuate vibration, and does not necessarily need to be equal to L / 2.
[0023]
The rib 15c is provided to protrude outward from the horn 15, and a bolt (not shown) is inserted into a mounting hole 15d provided in the rib 15c and fastened to the block 13. Fixed in a supported state. That is, the four (two sets) of ribs 15 c are fixing portions for fixing the horn 15 to the block 13.
[0024]
In fixing the horn 5, since the four ribs 15c are arranged symmetrically with respect to the center point of the horn 15, the bonding tool 14 can be fixed to the block 13 in a well-balanced manner. The applied load can be supported in a well-balanced manner. The number of the ribs 15c is not limited to four, and two ribs 15c may be provided above the node of the horn 15, for example.
[0025]
The point is that it is sufficient that the load applied to the horn 15 can be supported in a well-balanced manner, and in this case, the number of ribs may be any number. Further, when the bolt is inserted into the mounting hole 15d and fastened, the bolt does not protrude from the lower surface of the horn 15, so that the bolt can be fixed without causing interference with electronic components on the board at the time of bonding. I have.
[0026]
At approximately the center of the two sets (four) of the ribs 15c, a protruding portion 30 is formed so as to protrude in a second direction (direction of arrow b) orthogonal to the first direction. It is desirable that the material of the protruding portion 30 be the same as the material of the horn 15 because it can be formed integrally with the horn 15, but a different material may be used. In the case of a different material, the shape and dimensions of the convex portion 30 are set in consideration of differences in density, Young's modulus, and Poisson's ratio from the material of the horn 15.
[0027]
At the end of the protruding portion 30, a joining action portion 31 that comes into contact with the electronic component 40 as an object to be joined is provided. By applying a pressing load to the bonding tool 14 in a state where the electronic component 40 is in contact with the joining action section 31, the bumps of the electronic component 40 are pressed against the substrate 46. By driving the vibrator 17 in this state to apply longitudinal vibration to the horn 15, the electronic component 40 is pressed against the substrate 46 by a load and vibration. At this time, since the convex portion 30 is located at the center of the four ribs 15c, a uniform pressing state is realized even when a large component requiring a large pressing load is targeted.
[0028]
As shown in FIG. 2 (b), a suction hole 31b is formed in the bonding surface 31a on the lower surface of the bonding portion 31. The suction hole 31b communicates with a suction hole 16c (see FIG. 2A) opened in the upper surface 15a of the horn 15 through suction paths 16a and 16b formed inside the horn 15, as shown in FIG. ing.
[0029]
With the bonding tool 14 fixed to the block 13, the suction pad 19 provided on the projection 13a abuts on the upper surface 15a of the horn 15 (see FIG. 1), so that the suction hole 31b is connected to the suction passages 16a, 16b and It communicates with the suction pad 19 via the suction hole 16c. Therefore, by driving the suction device 56 (see FIG. 1) connected to the suction pad 19 to suck air, vacuum suction is performed from the suction hole 31b, and the electronic component 40 is vacuum-sucked and held on the bonding surface 31a. be able to. That is, the convex portion 30 has a function as an adsorber that presses the electronic component 40 against the substrate 46 and abuts on the upper surface of the electronic component 40 to suck and hold the electronic component 40.
[0030]
On the opposite side of the horn 15 from the convex portion 30 in the longitudinal direction, there is provided a vibration balance portion 32 that projects in substantially the same shape as the convex portion 30. The material of the vibration balance portion 32 is preferably the same as the material of the horn 15 because it can be formed integrally with the horn 15, but may be a different material. In the case of a different material, the shape and dimensions of the vibration balance portion 32 are set in consideration of the difference in density, Young's modulus and Poisson's ratio from the material of the horn 15.
[0031]
The vibration balance part 32 is provided in the bonding tool 14 to maintain the balance of vibrations above and below the horn 15 mainly by maintaining the mass balance, and the position of the through hole 32 a penetrating in the thickness direction of the horn.・ The balance can be adjusted according to the shape and size. Due to the vibration balance portion 32, the vibration distribution and the mass distribution of the horn 15 are substantially symmetric with respect to the central axis in the first direction, and uniform vibration transmission is ensured.
[0032]
Next, the vibration characteristics of the horn 15 will be described. The ultrasonic transducer driving unit 55 causes the vibrator 17 to have an appropriate frequency according to the horn 15 (a frequency that causes the horn 15 to resonate is sufficient, but is preferably 40 kHz or more and 70 kHz or less, and more preferably about 60 kHz). By driving the horn 15 in the first direction to create a resonance state by driving the horn 15, a standing wave vibration as shown in the graph of FIG. appear.
[0033]
That is, in the standing wave vibration of the horn 15, the position of the rib 15c is a node with little horizontal displacement, and the position of the convex portion 30 located at the center of the rib 15c corresponds to the antinode where the horizontal amplitude becomes maximum. I do. It is desirable that the position of the protruding portion 30 coincide with the position of the antinode of the standing wave vibration. However, as long as the standing wave is located substantially at the center of the rib 15c for fixing the horn 15, the standing wave It may be slightly shifted from the position of the antinode of the vibration.
[0034]
Then, the vibration of the convex portion 30 is transmitted to the electronic component 40 via the bonding action surface 31a. In transmitting the vibration to the electronic component 40, not only the longitudinal vibration applied to the horn 15 by the vibrator 17 but also the bending vibration induced in the convex portion 30 by the longitudinal vibration of the horn 15 as described later is superimposed. Transmitted.
[0035]
Next, the heating means provided in the horn 15 will be described. As shown in FIG. 3, a mounting hole 15 e having a circular cross section is provided in the right half of the horn 15 in the longitudinal direction (first direction), and a heater 18 which is a rod-shaped heating means is provided in the mounting hole 15 e. It is inserted along the longitudinal direction. By operating the heater 18, the horn 15 is heated, and thereby the electronic component 40 is heated via the bonding surface 31 a. By this heating, the bonding of the electronic component 40 to the substrate 46 can be efficiently performed in a short time in the bonding operation.
[0036]
Near the right end face of the horn 15, a plurality of slits 15g are provided in a horizontal direction perpendicular to the longitudinal direction (perpendicular to the paper surface in FIG. 3). When the heater 18 is operated continuously, the heat generated from the heater 18 is transmitted to the vibrator 17 through the horn 15 and raises the temperature of the vibrator 17. Since a rise in the temperature of the vibrator 17 causes a change in vibration characteristics, it is desirable to suppress the heat transfer to the vibrator 17 as much as possible. For this reason, in the horn 15 shown in the present embodiment, by providing the slit 15g on the near side of the vibrator 17 in the heat transfer direction, heat transmitted through the horn 15 is dissipated by the slit 15g, The amount of heat transfer to the vibrator 17 is minimized.
[0037]
Next, a method of fixing the heater 18 to the horn 15 will be described. A bolt hole 15f is provided on the lower surface side of the horn 15 at a position corresponding to the longitudinal position of the rib 15c (see FIG. 2), and a set bolt 33 as a fixing means of the heater 18 is screwed into the bolt hole 15f. Enter. By tightening the set bolt 33 with the heater 18 inserted into the mounting hole 15e, the heater 18 is positioned at the bolt hole 15f, that is, at the node of the standing wave vibration induced in the horn 15 by the vibrator 17. The horn 15 is fixed to the horn 15 by the pressing force of the set bolt 33.
[0038]
As described above, by using the method of fixing the heater 18 at the position where the vibration displacement is smallest in the horn 15, the heater 18 can be fixed stably. As a fixing means of the heater 18, besides a method of fixing the heater 18 by pressing it with the set bolt 33, a split fastening portion may be provided at the above-mentioned position of the horn 15, and the heater 18 may be fastened and fixed from the outer peripheral direction. .
[0039]
Alternatively, a support member may be provided on a base member that is separate from the horn 15 and hardly affects the vibration of the horn 15, and the heater 18 may be supported by the support member. If there is a gap between the heater 18 and the mounting hole 15e, grease or the like that promotes heat conduction may be put in the gap.
[0040]
As described above, by adopting a configuration in which the heater 18 is inserted in the longitudinal direction of the horn 15 in the horn 15 having the heater 18 therein, the conventional method, that is, the heater 18 is inserted in a direction orthogonal to the vibration direction of the horn. The following advantages are obtained as compared with the method of inserting.
[0041]
First, the presence of a discontinuous portion in which a foreign substance such as a heater is interposed inside the horn generally causes a reduction in vibration propagation efficiency and instability of vibration characteristics. , The projected area of the heater insertion portion in the vibration direction can be minimized. Therefore, as compared with the conventional method in which the heater is inserted in a direction orthogonal to the longitudinal direction of the horn and the heater crosses the vibration propagation direction, the influence of the heater insertion portion on the vibration propagation inside the horn is minimized. It becomes possible.
[0042]
Next, in the configuration shown in the present embodiment, since a portion corresponding to the longitudinal dimension of the horn 15 can be used as the heater mounting dimension, it is possible to employ a high-output heater having a large length size. Therefore, compared to the conventional method in which the heater size is limited by the width of the horn, it is possible to combine a high-power heater with a small-sized bonding tool.
[0043]
Further, in the configuration shown in the present embodiment, since the mounting portion of heater 18 can be brought close to bonding action portion 31, the heat transfer efficiency to electronic component 40 to be heated is excellent. Therefore, higher heating efficiency can be obtained as compared with the conventional method in which the relative position between the heater mounting position and the object to be heated is restricted.
[0044]
(Embodiment 2)
FIG. 4 is a front sectional view of the electronic component bonding tool according to the second embodiment of the present invention. According to the second embodiment, in a bonding tool 141 having the same outer shape and outer configuration as the bonding tool 14 described in the first embodiment, a heater 18A having a size equal to or larger than the heater 18 of the first embodiment is replaced by a horn 151. It is configured to be mounted in a substantially symmetrical arrangement inside.
[0045]
In FIG. 4, a mounting hole 151e having a circular cross section is provided in the horn 151 in a longitudinal direction (first direction) from the right end face to a side short of the suction hole 16c, and the mounting hole 151e has a heater as a rod-shaped heating means. 18A is inserted along the longitudinal direction. The function of heater 18A is the same as that of heater 18 shown in the first embodiment. Near the right end face of the horn 151, a slit 151g similar to the slit 15g of the first embodiment is provided.
[0046]
The same set bolt 33 as in the first embodiment is screwed into two bolt holes 151f provided at the positions of the nodes of the standing wave vibration on the upper surface side of the horn 151, and the heater 18A has two sets. The horn 151 is fixed to the horn 151 by bolts 33. The suction passage 16a communicates with the suction hole 16c via a suction passage 16b provided below the mounting hole 151e.
[0047]
By mounting the heater 18A inside the horn 151 in a substantially symmetrical arrangement as in the above configuration, the heating target can be heated from a position immediately adjacent to the convex portion 30 provided at the center of the horn 151, High efficiency and uniform heating are realized.
[0048]
(Embodiment 3)
FIG. 5 is a front sectional view of a bonding tool for an electronic component according to Embodiment 3 of the present invention. In the third embodiment, a bonding tool 142 having substantially the same outer shape and outer configuration as the bonding tool 141 shown in the second embodiment includes a heater 18B having a smaller diameter than the heater 18A of the second embodiment, Are mounted in parallel.
[0049]
In FIG. 5, two mounting holes 152 e having a circular cross section are provided in the horn 152 in parallel in the longitudinal direction (first direction) from the right end surface to a side short of the suction hole 16 c. The arrangement of the mounting holes 152e in a cross section orthogonal to the longitudinal direction of the horn 152 is bilaterally symmetric. In each of the mounting holes 152e, a heater 18B, which is a rod-shaped heating means, is inserted along the longitudinal direction. The function of heater 18B is the same as that of heater 18 shown in the first embodiment. Near the right end face of the horn 152, a slit 152g similar to the slit 15g of the first embodiment is provided.
[0050]
Two bolt holes 152f are provided at positions corresponding to the mounting holes 152 on the upper surface side of the horn 152 at the nodes of the standing wave vibration, respectively, as in the second embodiment. As in the second embodiment, a set bolt 33 for fixing the heater 18B is screwed into the bolt hole 152e, and the two heaters 18B are fixed to the horn 152 by two set bolts 33, respectively.
[0051]
As in the above-described configuration, by mounting the two heaters 18B in the horn 152 substantially symmetrically in the longitudinal direction and symmetrically in the cross-section, the heater 18B of the joining action portion 31 is formed in the same manner as in the second embodiment. The heating target can be heated from the nearest position, and the shape and arrangement of the space inside the horn 152 can be made as symmetrical as possible, realizing high efficiency and uniform heating and stabilization of vibration characteristics. .
[0052]
(Embodiment 4)
FIG. 6 is a front sectional view of a bonding tool for an electronic component according to a fourth embodiment of the present invention. In the first, second, and third embodiments, the example of the double-supported bonding tool that fixedly supports the horn at a plurality of support positions in the longitudinal direction has been described. However, the present invention is limited to the double-supported bonding tool. Instead, the present invention can be applied to a cantilever type bonding tool as shown in FIG.
[0053]
In FIG. 6, the cantilever type bonding tool 143 has a configuration in which the right side portion is cut off from the protruding portion 30 in the bonding tool 141 shown in the second embodiment. Are fixedly supported at positions corresponding to the joints, and the joining action portion 31 is disposed at a position corresponding to the antinode of the standing wave.
[0054]
A mounting hole 153e having a circular cross section is provided in the horn 153 in the longitudinal direction (first direction) from the right end surface to a side short of the suction hole 16c, and the mounting hole 153e is provided with a heater 18C as a rod-shaped heating means. Inserted along the direction. The function of heater 18C is the same as that of heater 18 shown in the first embodiment. Near the right end face of the horn 153, a slit 153g similar to the slit 15g of the first embodiment is provided.
[0055]
A set bolt 33 similar to that of the first embodiment is screwed into a bolt hole 153f provided at a position of the node of the standing wave vibration on the upper surface side of the horn 153. 153. The suction passage 16a communicates with the suction hole 16c via a suction passage 16b disposed below the mounting hole 153e. Also in the above configuration, the heater 18 </ b> C can be disposed in the immediate vicinity of the bonding section 31 to heat the object to be heated, and high-efficiency and uniform heating can be realized.
[0056]
As described above, in the bonding tool according to each embodiment of the present invention, the heater for heating is inserted in the first direction along the longitudinal direction of the horn to minimize the influence on the vibration propagation inside the horn. I try to reduce it. This makes it possible to realize a bonding tool that simultaneously satisfies the demand for downsizing of the bonding tool accompanying the downsizing of electronic components and the demand for higher output of the heater for horn heating required from the viewpoint of improving work efficiency. It is possible to achieve both efficient heating and stable vibration characteristics.
[0057]
【The invention's effect】
According to the present invention, since the rod-shaped heating means for heating the bonding tool is inserted in the first direction along the longitudinal direction of the horn, the influence on the vibration propagation inside the horn can be minimized. Thus, even when a high-power heating means is incorporated in a horn having a small size, both high-efficiency heating and stable vibration characteristics can be achieved.
[Brief description of the drawings]
FIG. 1 is a front view of an electronic component bonding apparatus according to Embodiment 1 of the present invention. FIG. 2A is a perspective view of an electronic component bonding tool according to Embodiment 1 of the present invention, and FIG. FIG. 3 is a partially inverted perspective view of the electronic component bonding tool according to the first embodiment. FIG. 3 is a front view of the electronic component bonding tool according to the first embodiment of the present invention. FIG. FIG. 5 is a front sectional view of a bonding tool for an electronic component according to a third embodiment of the present invention. FIG. 6 is a front sectional view of a bonding tool for an electronic component according to a fourth embodiment of the present invention. Description]
14, 141, 142, 143 Bonding tool 15, 151, 152, 153 Horn 17 Vibrator 18, 18A. 18B, 18C Heater 30 Convex part 31 Joint action part 33 Set bolt 40 Electronic component

Claims (4)

What is claimed is: 1. A bonding apparatus for applying pressure and vibration to an object to be joined and pressing the object to be joined onto a surface to be joined, wherein the bonding tool abuts the object to be joined and the bonding tool is pressed against the object to be joined. The bonding tool comprises a horizontally long horn, a vibrator for imparting a longitudinal vibration to the horn in a first direction along the longitudinal direction of the horn, and the horn substantially extending from the horn in the first direction. A convex portion protruding in a second direction orthogonal to the first direction, a joining action portion provided at an end of the convex portion and abutting on the object to be joined, and a rod-shaped member inserted into the horn in a first direction. A bonding apparatus comprising: a heating unit. The bonding apparatus according to claim 1, wherein the heating unit is fixed to the horn at a position of a node of a standing wave vibration induced in the horn by the vibrator. What is claimed is: 1. A bonding tool for applying pressure and vibration to an object to be joined and pressing the object to be joined to a surface to be joined, comprising: a horizontally long horn; and a horn vertically extending in a first direction along the longitudinal direction of the horn. A vibrator for imparting vibration, a convex portion protruding from the horn at a substantially central position of the fixed portion in a second direction substantially orthogonal to the first direction, and provided at an end of the convex portion A bonding tool, comprising: a bonding action portion for contacting the bonding target; and a rod-shaped heating means inserted into the horn in a first direction. The bonding tool according to claim 3, wherein the heating unit is fixed to the horn at a position of a node of the standing wave vibration induced in the horn by the vibrator.

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