JP2004163598A - Method for manufacturing electrooptical device, and electronic apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing an electrooptical device by which the electrooptical device is made highly precise, and to provide an electronic apparatus. <P>SOLUTION: The method for manufacturing a liquid crystal panel comprises the steps of: placing a first substrate 10 and a second substrate 20 opposite to each other; photographing first marks 10a provided on the first substrate 10 and second marks 20a provided on the second substrate 20 with a camera 30 arranged so that the camera optical axis 30A is perpendicular to the first substrate 10 and the second substrate 20; and aligning the first substrate 10 and second substrate 20 to each other on the basis of the positional relation of the photographed first and second marks 10a, 20a. In the method for manufacturing, the second marks 20a are brought to the focal point of the cameras 30, 30' and photographed. Subsequently, the first marks 10a are photographed in a state in which the first substrate 10 is moved along the optical axes 30A, 30A' so as to focus the cameras 30, 30' on the first marks 10a. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a method for manufacturing an electro-optical device and an electronic apparatus.
[0002]
[Prior art]
Among the liquid crystal panels, for example, a TFT (thin film transistor) color liquid crystal panel, which is a type of active matrix type, is configured by laminating a TFT array substrate and a color filter substrate. Here, when bonding the TFT array substrate and the color filter substrate which are to be paired with each other, it is necessary to align both of them. Specifically, in order to accurately align components such as active elements finely arranged on a TFT array substrate and components such as colored patterns finely arranged on a color filter substrate, It is necessary to align the TFT array substrate and the color filter substrate with each other.
[0003]
In the related art, for example, an alignment mark including a mark provided on a TFT array substrate and a mark provided on a color filter substrate is used, and alignment is performed based on the positional relationship between the marks provided on both substrates. For example, as shown in FIG. 9, the positional relationship between these marks is such that the first mark 1 a provided on the first substrate 1 and the second mark 2 a provided on the second substrate 2 are captured by the imaging device. It is obtained by taking an image with a certain camera 3 and performing image processing on the taken image. Specifically, the transparent second substrate 2 is arranged facing the first substrate 1 while facing the camera 3 side, and the first mark 1a and the second mark 2a are imaged by the camera 3, and this image is taken. By performing image processing on the image, the positional relationship between the center of gravity G1 of the first mark 1a and the center of gravity G2 of the second mark 2a is obtained.
[0004]
Conventionally, the positional relationship between the centers of gravity of the marks provided on both of the paired substrates is a predetermined positional relationship, for example, a positional relationship separated from each other by a preset mutual distance L on an image. (See, for example, Patent Document 1).
[0005]
[Patent Document 1]
Japanese Patent No. 2525589 (Second Item, FIG. 1)
[0006]
[Problems to be solved by the invention]
By the way, for example, when using a high-magnification camera, when separating a pair of substrates in order to prevent contact and damage to each other, or when using a thick substrate, the paired substrates are separated from each other. There is a possibility that high-precision alignment may be difficult.
[0007]
In these cases, when the pair of substrates provided with the above-described marks are arranged to face each other, the distance (Δd) between the marks in the direction of the optical axis 3A of the imaging optical system of the camera 3 is determined by the depth of field of the camera 3. Therefore, there is a possibility that both marks may not be clearly captured. Here, if both marks cannot be clearly imaged, the positional relationship between the two marks can no longer be obtained with high accuracy, and it becomes difficult to perform high-precision alignment. For this reason, in each of the above cases, the desired alignment accuracy is not obtained, that is, the alignment accuracy between the component provided on one substrate and the component provided on the other substrate is desired. This may lead to a situation where the electro-optical device does not become accurate, which is a factor that hinders improvement in the accuracy of the electro-optical device.
[0008]
The present invention has been made in view of the above circumstances, and has as its object to provide a method of manufacturing an electro-optical device and an electronic apparatus that can increase the precision of the electro-optical device.
[0009]
[Means for Solving the Problems]
In order to achieve the above object, in a method for manufacturing an electro-optical device according to the present invention, a first substrate and a second substrate are arranged to face each other, and the first substrate and the second substrate are arranged using an imaging device. A method of manufacturing an electro-optical device for aligning substrates with each other, wherein the first substrate and the second substrate are arranged so that an optical axis of an imaging optical system intersects at a predetermined intersection angle, and The first substrate is moved so that the first mark is in focus on the device, the first mark is imaged by the imaging device, and the second mark is in focus on the imaging device. Moving at least one of the imaging device and the second substrate along the optical axis to capture an image of the second mark by the imaging device; The substrate or the second Characterized by aligning the substrates.
[0010]
According to the present invention, the first substrate and the second substrate are arranged so that the optical axis of the imaging optical system intersects at a predetermined intersection angle, and the first mark is focused on the imaging device. The first substrate is moved, the first mark is imaged by the imaging device, and at least one of the imaging device and the second substrate is moved so that the second mark is focused on the imaging device. By moving along the optical axis, the second mark is imaged by the imaging device, and the first substrate or the second substrate is aligned based on the imaging result of the imaging device. The first mark and the second mark can be individually imaged according to the focus of the imaging device, and the first substrate, the second substrate, and the imaging device in the direction of the optical axis can be imaged. Depends on location , The positional relationship between the second mark and the first mark captured are the same.
[0011]
The method of manufacturing an electro-optical device according to the next invention is the method according to the above invention, wherein the second substrate is arranged at a predetermined bonding position, and after the second mark is imaged, the second substrate is imaged. Is moved along the optical axis in a direction away from the first substrate, the first substrate is arranged at the bonding position, and after the first mark is imaged, the second substrate is moved. It is characterized by moving along the optical axis to return to the bonding position, and bonding the first substrate and the second substrate at the bonding position.
[0012]
According to the present invention, in a state where the second substrate is arranged at the predetermined bonding position, after imaging the second mark, the second substrate is moved along the optical axis in a direction away from the first substrate. And moving the second substrate along the optical axis and returning to the bonding position after moving the first substrate at the bonding position and imaging the first mark. And bonding the first substrate and the second substrate at the bonding position, so that the first mark on the first substrate located at the bonding position and the first mark at the bonding position The alignment can be performed using an image of the obtained second mark on the second substrate.
[0013]
A method of manufacturing an electro-optical device according to the next invention is characterized in that, in the above invention, the second substrate is moved such that the second mark is located outside the depth of field of the imaging device. And
[0014]
According to the present invention, since the second mark is located outside the depth of field of the imaging device, the second mark is out of focus or not at all on the captured image.
[0015]
The method for manufacturing an electro-optical device according to the next invention is the method according to the above invention, wherein the first mark and the second mark are formed on the surfaces facing each other when the first substrate and the second substrate are arranged to face each other. Characterized by using a mark provided with a mark.
[0016]
According to the present invention, the distance between the first mark and the second mark with respect to the direction of the optical axis is reduced, so that when the first substrate and the second substrate are arranged at the bonding position, A situation where the first mark and the second mark are outside the depth of field of the imaging device can be suppressed.
[0017]
The method for manufacturing an electro-optical device according to the next invention is the method according to the above invention, wherein the first substrate and the second substrate are aligned with each other as the first mark and the second mark. The midpoint between the centers of gravity of the pair of first marks is opposed to a predetermined allowable range including the midpoint between the centers of gravity of the pair of second marks. .
[0018]
According to the present invention, the first substrate and the second substrate are arranged such that the midpoint between the centers of gravity in the first mark pair and the midpoint between the centers of gravity in the second mark pair face each other. Substrates can be aligned with each other.
[0019]
The method for manufacturing an electro-optical device according to the next invention is the method according to the above invention, wherein the first substrate and the second substrate are aligned with each other as the first mark and the second mark. A plane orthogonal to the second substrate through individual centers in the first pair of marks and a plane orthogonal to the first substrate through individual centers in the second pair of marks; It is characterized in that those that cross each other at a predetermined angle are used.
[0020]
According to the invention, a plane orthogonal to the second substrate through the respective centers of the first pair of marks and a plane orthogonal to the first substrate through the respective centers of the second pair of marks. And the first substrate and the second substrate can be aligned with each other such that they intersect with each other at a predetermined angle.
[0021]
A method of manufacturing an electro-optical device according to the next invention is characterized in that, in the above-described invention, a method in which the predetermined angle is set to approximately 90 degrees is used.
[0022]
According to the present invention, since the predetermined angle is set to approximately 90 degrees, the first substrate and the second substrate can be aligned with each other so that the two planes are orthogonal to each other.
[0023]
A method of manufacturing an electro-optical device according to the next invention is characterized in that, in the above invention, the first mark and the second mark are circular.
[0024]
According to the present invention, the first substrate and the second substrate are aligned with each other using the first mark and the second mark that are circular with each other.
[0025]
According to another aspect of the invention, an electronic apparatus includes an electro-optical device manufactured by the method of manufacturing an electro-optical device according to any one of the above-described inventions.
[0026]
According to this invention, an electronic apparatus including the electro-optical device manufactured by the method for manufacturing an electro-optical device according to any one of the above-described inventions is realized.
[0027]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, preferred embodiments of a method for manufacturing an electro-optical device and an electronic apparatus according to the present invention will be described in detail with reference to the accompanying drawings. In the present embodiment, a liquid crystal panel is taken as an example of the electro-optical device, but it is needless to say that the present invention is not limited to this.
[0028]
FIG. 1 is a block diagram showing an alignment apparatus according to an embodiment of the present invention. This alignment apparatus performs alignment in a state in which a first substrate 10 and a transparent second substrate 20 are vertically arranged to face each other. For example, when manufacturing a TFT (thin film transistor) color liquid crystal panel, a TFT array substrate is applied as the first substrate 10, while a color filter substrate is applied as the second substrate 20. Here, components such as active elements are finely arranged on the TFT array substrate, while components such as colored patterns are finely arranged on the color filter substrate.
[0029]
2A and 2B are projection views in FIG. 1. More specifically, FIG. 2A is a projection view in the direction of arrow A in FIG. 1, and FIG. 2B is a projection view in the direction of arrow B in FIG. FIG. In FIG. 2B, the first substrate 10 facing the back side is omitted.
[0030]
In the present embodiment, rectangular substrates are applied as the first substrate 10 and the second substrate 20. The first substrate 10 is provided with a pair of first marks 10a at each of the diagonal corners, while the second substrate 20 is provided with a pair of the second marks 10a at each of the diagonal corners. A mark 20a is provided.
[0031]
The first mark 10a and the second mark 20a constitute an alignment mark in the present embodiment, and the first substrate 10 and the second substrate 20 are arranged to face each other as shown in FIG. In this case, they are provided on surfaces facing each other. Here, as shown in FIG. 2, the first mark 10a and the second mark 20a have a circular shape and different diameters, specifically, the diameter of the first mark 10a is larger than that of the first mark 10a. A mark larger than that of the second mark 20a is applied.
[0032]
The first mark 10a and the second mark 20a are provided when a component provided on the first substrate 10 and a component provided on the second substrate 20 have a desired positional relationship, that is, When the first substrate 10 and the second substrate 20 are aligned with each other, they are arranged so as to have a predetermined positional relationship with each other. This predetermined positional relationship means that the midpoint C10 between the centers of gravity in the pair of the first marks 10a faces the midpoint C20 between the centers of gravity in the pair of the second marks 20a, and Planes orthogonal to the second substrate 20 through individual centers in the pair of marks 10a are orthogonal to each other with planes orthogonal to the first substrate 10 through individual centers in the pair of second marks 20a. It is a positional relationship. When the positional relationship between the first mark 10a and the second mark 20a satisfies the above-described predetermined positional relationship, the positional relationship is as illustrated in FIG.
[0033]
On the other hand, the alignment apparatus shown in FIG. 1 includes an XYZθ table 10A, a Z table 20A, cameras 30, 30 ′, an image processing unit 40, an axis driving unit 50, and a device sequence control unit 60.
[0034]
XYZθ table 10A holds the first substrate 10 on its upper surface, is movable along X, Y axes orthogonal to each other on a horizontal plane and Z axis orthogonal to the horizontal plane, and is in the θ direction around the Z axis. It is configured to be rotatable. The Z table 20A holds the second substrate 20 on its lower surface, and is configured to be movable along the Z axis. Here, in the present embodiment, as shown in FIG. 1, the first substrate 10 held in the XYZθ table 10A is orthogonal to the Z axis, while the second substrate 10 held in the Z table 20A is The substrate 20 is orthogonal to the Z axis.
[0035]
The cameras 30 and 30 'are imaging devices that image the first mark 10a and the second mark 20a via an imaging optical system including components such as lenses 31 and 31'. The cameras 30 and 30 'are arranged along the Z-axis so that the optical axes 30A and 30A' of the imaging optical system are orthogonal to the first and second substrates 10 and 20 in the holding state. It is arranged downward. As the cameras 30 and 30 ', for example, charge-coupled device (CCD) cameras having the same performance as each other can be applied.
[0036]
The image processing unit 40 acquires and stores the images of the respective marks captured by the cameras 30 and 30 ', and, for example, recognizes the acquired images of the respective marks by pattern matching and performs appropriate image processing. .
[0037]
The axis driving section 50 drives the XYZθ table 10A and the Z table 20A according to a command from the apparatus sequence control section 60. The device sequence control unit 60 calculates a correction amount for the X, Y axes and the θ direction based on the image processing result by the image processing unit 40, and drives the XYZ θ table 10A by the calculated correction amount. Command 50. The device sequence control unit 60 also has a function of driving the XYZθ table 10A and the Z table 20A via the axis driving unit 50 along the Z axis. Thereby, in the present embodiment, by driving the XYZθ table 10A and the Z table 20A along the Z axis, the first substrate 10 and the second substrate 20 in the holding state described above are respectively moved along the Z axis. It is made to move.
[0038]
4 to 7 sequentially show steps of aligning the first substrate 10 and the second substrate 20 with each other in the present embodiment. In FIG. 1, only the positional relationship between the first substrate 10 and the second substrate 20 with respect to the camera 30 is shown for convenience of description, but the same positional relationship also applies to the camera 30 '.
[0039]
First, as shown in FIG. 4A, the lower surface of the second substrate 20 is placed at a predetermined bonding position (hereinafter, simply referred to as a bonding position PH) where the first substrate 10 and the second substrate 20 are bonded to each other. To match the position. At this time, the camera 30 is arranged so that the position where the imaging optical system in the camera 30 is in focus coincides with the bonding position PH. As a result, the second mark 20a provided on the lower surface of the second substrate 20 is brought into a state of being focused on the camera 30, and in this state, a pair of the second marks 20a is imaged, and the imaged image is processed by the image processing unit. Stored by 40. At this time, the first substrate 10 is positioned, for example, about 10 mm below the bonding position PH, and is positioned outside the depth of field of the camera 30. As a result, as illustrated in FIG. 4B, the first mark 10a is out of focus or does not appear at all, and only the second mark 20a is clearly imaged.
[0040]
Next, as shown in FIG. 5, the Z table 20A holding the second substrate 20 is driven upward along the Z-axis to move the second substrate 20 away from the first substrate 10, that is, Move upward along the Z axis. Here, the second substrate 20 is moved, for example, by about 10 mm so as to be positioned above the bonding position PH, and the second mark 20 a is positioned outside the depth of field of the camera 30. Here, “out of the depth of field” refers to an area outside the area that can be recognized by the camera.
[0041]
Next, as shown in FIG. 6A, the XYZθ table 10A is driven upward along the Z axis so that the position of the upper surface of the first substrate 10 coincides with the bonding position PH. Is moved upward along the Z-axis. In this state, the pair of first marks 10a is imaged in a state where the position of the upper surface of the first substrate 10 matches the bonding position PH. At this time, the first mark 10a provided on the upper surface of the first substrate 10 is focused on the camera 30, while the second mark 20a is located outside the depth of field of the camera 30. As a result, as illustrated in FIG. 6B, the second mark 20a is out of focus or does not appear at all, and only the first mark 10a is clearly imaged.
[0042]
Next, using the image of the pair of the second marks 20a stored by the image processing unit 40 and the image of the pair of the first marks 10a, the first mark 10a and the second mark The first substrate 10 and the second substrate 20 are aligned with each other so as to satisfy the following positional relationship. Specifically, the image processing unit 40 calculates the position of the midpoint C10 between the centers of gravity G10 of the pair of the first marks 10a and the position of the midpoint C20 between the centers of gravity G20 of the pair of the second marks 20a. Thereafter, as shown in FIG. 8, the device sequence control unit 60 calculates the correction amounts for the X, Y axes and the θ direction so that the midpoint C10 and the midpoint C20 overlap each other in the field of view 30a of the camera 30. . Further, thereafter, the XYZθ table 10A is driven by the device sequence control unit 60 via the axis driving unit 50 by the calculated correction amount, thereby moving the first substrate 10 and performing an alignment operation with respect to the second substrate 20. Do. Note that this alignment operation is not limited to one time, and may be repeated a plurality of times in accordance with a desired alignment accuracy.
[0043]
After the desired alignment accuracy is obtained in this way, as shown in FIG. 7A, the Z table 20A is driven downward along the Z axis, and the second substrate 20 is moved downward along the Z axis. To return to the bonding position PH. Thus, the first substrate 10 and the second substrate 20 are in a state where they are arranged at positions where they are bonded to each other. Thereafter, if this is applied to a method of manufacturing a liquid crystal panel, for example, similar to a well-known manufacturing method, for example, a seal (not shown) applied to opposing surfaces of the first substrate 10 and the second substrate 20. The liquid crystal panel can be manufactured by curing the material, bonding them together, and further performing cutting division, liquid crystal injection, mounting of a polarizing plate, and the like.
[0044]
As described above, in the present embodiment, the first substrate 10 and the second substrate 20 are moved along the Z-axis while being orthogonal to the Z-axis, and the optical axes of the cameras 30 and 30 '. 30A and 30A 'are made parallel to the Z axis. That is, the cameras 30, 30 'are arranged so that the optical axes 30A, 30A' intersect the first substrate 10 and the second substrate 20 at a predetermined intersection angle, specifically, 90 degrees. Further, the first substrate 10 and the second substrate 20 are moved along the optical axes 30A and 30A '. Thus, the position of the second substrate with respect to the optical axis direction of the camera and the projection area of the second mark with respect to the optical axis direction of the camera do not depend on each other, and then the second substrate is positioned with respect to the optical axis of the camera. Along with the camera so that the image is taken with the second mark being focused on the camera. Therefore, in the method of manufacturing the electro-optical device according to the present embodiment, when the distance between the first mark and the second mark in the Z-axis direction is larger than the depth of field of the camera at the time of alignment. Even so, the first mark and the second mark can be individually focused on the focus of the camera, and a clear image can be taken.
[0045]
Therefore, according to the manufacturing method of the electro-optical device according to the present embodiment, when a high-magnification camera is used, when a pair of substrates is separated from each other in order to prevent them from coming into contact with each other and being damaged, In any of the cases where a certain substrate is used, it is possible to prevent a situation in which it is not possible to accurately determine the positional relationship between the first mark and the second mark due to the inability to clearly capture both of the first mark and the second mark. . For this reason, according to the method of manufacturing the electro-optical device according to the present embodiment, the first substrate and the second substrate can be aligned with each other with high accuracy, and the components provided on one substrate And the components provided on the other substrate are positioned with high precision, so that the electro-optical device can have higher precision.
[0046]
In the method of manufacturing the electro-optical device according to the present embodiment, the first mark and the second mark are provided on the surfaces facing each other when the first substrate and the second substrate are arranged to face each other. The distance between the first mark and the second mark in the direction of the optical axis of the camera is reduced by using the first mark. In the method for manufacturing an electro-optical device according to the present embodiment, while the first substrate 10 is arranged at a predetermined bonding position, the first mark 10a is focused on the focal point of the camera 30, and an image is taken. In a state where the second substrate 20 is arranged at a predetermined bonding position, an image is taken with the second mark 20a being focused on the focal point of the camera 30. Accordingly, in the method of manufacturing an electro-optical device according to the present embodiment, when the first substrate and the second substrate are arranged at positions where they are bonded to each other, the first mark and the second mark are focused on the camera. It is possible to take an image in a state where both of them are combined. Therefore, according to the manufacturing method of the electro-optical device of the present embodiment, before the first substrate and the second substrate are bonded to each other, the positional relationship between the first mark 10a and the second mark 20a is increased. Accuracy can be confirmed. It is needless to say that the alignment may be performed again as needed based on the result of this confirmation.
[0047]
In the method of manufacturing the electro-optical device according to the present embodiment, the midpoint between the centers of gravity in the first pair of marks and the midpoint between the centers of gravity in the second pair of marks are opposed to each other. In this case, the alignment error is prevented from occurring due to a measurement error such as a calibration error of the camera 30 in accordance with the distance between the mark and the second mark in the field of view of the camera. be able to. For this reason, according to the method of manufacturing an electro-optical device according to the present embodiment, it is possible to further improve the alignment accuracy, and to further improve the accuracy of the electro-optical device.
[0048]
Further, in the method of manufacturing the electro-optical device according to the present embodiment, the plane perpendicular to the second substrate through the respective centers of gravity of the first pair of marks and the individual centers of gravity of the second pair of marks are defined. Alignment is performed so that a plane passing through the first substrate and orthogonal to the first substrate overlap each other at a predetermined intersection angle, specifically, 90 degrees. Moreover, in the method of manufacturing the electro-optical device according to the present embodiment, the first mark and the second mark provided at the diagonal corners of the first substrate and the second substrate having the same rectangular shape are provided. Alignment is performed using an alignment mark composed of the following marks. As a result, according to the alignment mark of the present embodiment, it is possible to suppress as much as possible a situation in which the first substrate and the second substrate are inclined with respect to each other in the above-described θ direction to cause an alignment error. For this reason, according to the method of manufacturing an electro-optical device according to the present embodiment, it is possible to further improve the alignment accuracy, and to further improve the accuracy of the electro-optical device.
[0049]
Furthermore, in the method of manufacturing an electro-optical device according to the present embodiment, when one of the first mark and the second mark is imaged with the focus of the camera, the other mark is used for the camera. Since the image is arranged at a position outside the depth of field, the other mark is out of focus or not at all on the captured image, which makes it easy to identify the one mark during image processing. In addition, in the method of manufacturing the electro-optical device according to the first embodiment, since the first mark and the second mark are each formed in a circular shape, the first mark and the second mark are affected by the posture in the coordinates on the visual field of the camera. This makes it possible to perform pattern matching of each mark without any problem, and to easily perform image processing. As a result, in the method of manufacturing an electro-optical device according to the present embodiment, the burden of image processing can be reduced as much as possible, so that alignment can be performed with high efficiency. It is possible to improve the throughput in manufacturing the device.
[0050]
In the present embodiment described above, the first substrate and the second substrate are moved while the camera side is fixed, and the first mark and the second mark are individually focused on the camera. However, the present invention is not limited to this. Specifically, even if the camera side is moved with respect to the first substrate and the second substrate so that the first mark and the second mark are individually focused on the camera, The same operation and effect as those of the embodiment can be obtained.
[0051]
Further, in the present embodiment, when one of the first mark and the second mark is imaged while being focused on the camera, the other is positioned outside the depth of field of the camera. It is not done. For example, by performing mask processing by image processing, one of the first mark and the second mark that becomes unnecessary can be removed from the captured image, so that one of the marks can be removed from the object field of the camera. It does not have to be located outside the depth.
[0052]
Further, in this embodiment, the case where the second mark is imaged in a state where the first substrate and the second substrate are arranged to face each other has been described, but the present invention is not limited to this. Specifically, when imaging the second mark, the first substrate having the first mark to be imaged later does not necessarily need to be arranged to face the second substrate. The first substrate may be arranged to face the second substrate after the image of the mark is taken.
[0053]
Note that the liquid crystal panel manufactured by the manufacturing process according to the present embodiment is mounted on various electronic devices, and functions as a liquid crystal display device. Examples of electronic devices equipped with this liquid crystal display device include a mobile phone, a portable information device called a PDA (Personal Digital Assistants), a portable personal computer, a personal computer, a digital still camera, a vehicle monitor, a digital video camera, and a liquid crystal display. Examples include a television, a viewfinder type, a monitor direct-view type video tape recorder, a car navigation device, a pager, an electronic organizer, a calculator, a word processor, a workstation, a videophone, and a POS terminal.
[0054]
Further, in this embodiment, the TFT color liquid crystal panel has been exemplified, but the present invention is not limited to this. For example, a thin film diode color liquid crystal panel, which is also a kind of active matrix type liquid crystal panel, or The present invention can be similarly applied to a passive matrix type liquid crystal panel. The present embodiment is not limited to a color liquid crystal panel, but can be applied to a monochrome liquid crystal panel.
[0055]
The electro-optical device to which the present invention can be applied is not limited to a liquid crystal panel, but can be applied to, for example, an organic EL display. Further, as a substrate to which the present invention can be applied, for example, it can be applied to bonding of glass and plastic, glass and film, or glass and, for example, Si wafer.
[0056]
【The invention's effect】
As described above, according to the present invention, it is possible to increase the precision of the electro-optical device.
[Brief description of the drawings]
FIG. 1 is a block diagram of an alignment apparatus according to an embodiment of the present invention.
FIGS. 2A and 2B are projection diagrams in FIG. 1, wherein FIG. 2A is a projection diagram in the direction of arrow A in FIG. 1 and FIG. 2B is a projection diagram in the direction of arrow B in FIG.
FIG. 3 is an explanatory diagram showing a positional relationship between marks after alignment.
FIG. 4 is a diagram illustrating a step of aligning a first substrate and a second substrate with each other in the present embodiment, and is an explanatory diagram illustrating the first step;
FIG. 5 is a diagram illustrating a step of aligning a first substrate and a second substrate with each other in the present embodiment, and is an explanatory diagram illustrating a second step.
FIG. 6 is a diagram illustrating a step of aligning a first substrate and a second substrate with each other in the present embodiment, and is an explanatory view illustrating a third step.
FIG. 7 is a diagram illustrating a step of aligning a first substrate and a second substrate with each other in the present embodiment, and is an explanatory view illustrating a fourth step.
FIG. 8 is an explanatory view showing a state of alignment in the present embodiment.
FIG. 9 is an explanatory diagram illustrating a conventional alignment method.
[Explanation of symbols]
10 first substrate, 10a first mark, 10A XYZθ table, 20 second substrate, 20a second mark, 20AZ table, 30, 30 ′ camera, 30A, 30A ′ optical axis, 31, 31 ′ lens , 30a, 30a 'field of view, 40 image processing unit, 50 axis driving unit, 60 device sequence control unit, C10, C20 midpoint, G10, G20 center of gravity, PH bonding position

Claims (9)

A method for manufacturing an electro-optical device in which a first substrate and a second substrate are arranged to face each other, and the first substrate and the second substrate are aligned with each other using an imaging device,
The first substrate and the second substrate are arranged such that the optical axis of the imaging optical system intersects at a predetermined intersection angle;
Moving the first substrate so that the first mark is in focus on the imaging device, and imaging the first mark with the imaging device;
By moving at least one of the imaging device and the second substrate along the optical axis so that the second mark is in focus on the imaging device, the imaging device captures an image of the second mark. ,
A method of manufacturing an electro-optical device, comprising: aligning the first substrate or the second substrate based on an imaging result of the imaging device. After imaging the second mark in a state where the second substrate is arranged at a predetermined bonding position, move the second substrate along the optical axis in a direction away from the first substrate. And disposing the first substrate at the bonding position, and after imaging the first mark, moving the second substrate along the optical axis to return to the bonding position, The method for manufacturing an electro-optical device according to claim 1, wherein the first substrate and the second substrate are bonded at the bonding position. The method according to claim 2, wherein the second substrate is moved so that the second mark is located outside the depth of field of the imaging device. 4. The method according to claim 1, wherein the first substrate and the second substrate are each provided with the first mark and the second mark on surfaces facing each other when the first substrate and the second substrate are arranged to face each other. The method for manufacturing an electro-optical device according to any one of the above. When the first substrate and the second substrate are aligned with each other as the first mark and the second mark, the midpoint between the centers of gravity of the pair of first marks is the second mark. 5. The electro-optical device according to claim 1, wherein a mark is used which faces a predetermined allowable range including a center point between the centers of gravity of the pair of marks. 6. Method. When the first substrate and the second substrate are aligned with each other as the first mark and the second mark, the second substrate passes through respective centers of the pair of the first marks. And a plane perpendicular to the first substrate and passing through respective centers of the pair of second marks and orthogonal to the first substrate at a predetermined angle. 3. The method for manufacturing an electro-optical device according to claim 1. 7. The method according to claim 6, wherein the predetermined angle is set to approximately 90 degrees. 8. The method according to claim 1, wherein the first mark and the second mark are circular. An electronic apparatus comprising an electro-optical device manufactured by the method of manufacturing an electro-optical device according to claim 1.

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