JP2004144940A - Liquid crystal device, and method for manufacturing liquid crystal device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a liquid crystal device in which liquid crystal materials are divided in a simple and safe division process, and to provide a method for manufacturing the liquid crystal device. <P>SOLUTION: In the liquid crystal device having three pieces or more glass substrates 1, 2-1, 2-2 which are substrate materials and having two or more regions with the liquid crystal materials injected between these substrates, the liquid crystal device has a groove 5 formed in an etching process on groove positions 3-1 - 3-4, which are to be a side face where injection ports 7-1, 7-2 to make the liquid crystal materials injected inside are placed, on the one or more substrate materials out of the glass substrates 1, 2-1, 2-2 which are three pieces or more of the substrate materials. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a liquid crystal device having two or more liquid crystal surfaces and a method for manufacturing a liquid crystal device.
[0002]
[Prior art]
Conventional liquid crystal devices generally have a structure in which a liquid crystal material is formed in an area sandwiched between two glass substrates as typified by a liquid crystal display. In a phase correction device used for an application, a liquid crystal material having a plurality of surfaces has been experimentally manufactured. This liquid crystal device has a structure in which three substrates are provided and a liquid crystal material is disposed between the substrates in order to reduce the size and weight of the device.
[0003]
In a conventional liquid crystal device, that is, a device having one liquid crystal surface and two substrates disposed so as to sandwich the liquid crystal surface, a surface not in contact with the liquid crystal material is exposed. When dividing a substrate, it is common practice to divide the substrate by a method of dividing the substrate from scratches formed by scribing processing using a tool such as diamond on the surface not in contact with the liquid crystal material It is a target.
[0004]
As shown in FIG. 10, a conventional liquid crystal device dividing step is a small liquid crystal device in which a voltage-supplied substrate is formed smaller than a voltage-supplied substrate in order to perform the process efficiently. It is common to attach Then, in this step, before the liquid crystal material injection step shown in FIG. 10A, the glass substrate 2 (102) is placed at each of the divided positions so that the liquid crystal material injection port is arranged in one line with respect to the glass substrate 1 (101). A liquid crystal material is injected between the glass substrate 1 (101) and the glass substrate 2 (102) in the step after the liquid crystal injection shown in FIG. After the blockage, the cell is divided at each of the division positions 104-1 to 104-5.
[0005]
Then, in the dividing step before the liquid crystal material injecting step shown in FIG. 10A, as shown in the conventional liquid crystal device scribing dividing step in FIG. 11, the glass substrate 1 (101) in FIG. 2 (102) can be divided by scribing division steps at scribing positions 105-1 to 105-4. Further, in FIG. 11B, after the liquid crystal material injection step at the liquid crystal injection port positions 106-1 to 106-4, the two substrates of the glass substrate 1 (101) and the glass substrate 2 (102) bonded by an adhesive are further added. Although it must be divided into small pieces, it is not easy to use the scribing process at the scribing positions 105-1 to 105-4. In this case, the division is performed by the dicing division step of the conventional liquid crystal device shown in FIG. .
[0006]
However, as shown in FIG. 12A, the liquid crystal between the glass substrate 1 (111) and the glass substrate 2-1 (112-1) and the liquid crystal between the glass substrate 1 (111) and the glass substrate 2-2 (112-2) In a liquid crystal device having two surfaces, diamond for performing a scribing process cannot be arranged near an injection port for injecting the liquid crystal material. The scribing process shown cannot be used. Therefore, the dicing step shown in FIG. 12A must be used. At this time, a dicing process is performed on the glass substrate 2-1 (112-1) and the glass substrate 2-2 (112-2) at the dicing positions 113-1 to 113-5 with respect to the glass substrate 1 (111). To divide. In FIG. 12B, after the liquid crystal material injection step at the liquid crystal injection port positions 114-1 to 114-4, the glass substrate 2-1 (112-1) and the glass substrate 2-2 ( 112-2) is divided at dicing positions 113-1 to 113-5 by using a dicing process, and discarded portions 115-1 and 115-2 are discarded.
[0007]
[Patent Document 1]
JP-A-9-73058
[Patent Document 2]
JP-A-10-268804
[0008]
[Problems to be solved by the invention]
Since the conventional dicing process of the liquid crystal device shown in FIG. 12 is a process of dividing the substrate material by a rotating blade, the blade material is broken into pieces of the substrate material, the worn blade pieces, Since this is a dividing step in an environment where a large amount of cooling water used for cooling is present, cooling water that may contain debris of the substrate material and blades is applied to the part where the liquid crystal material is injected. There is a disadvantage that a washing step must be performed after the dividing step because of mixing.
[0009]
In addition, since the liquid crystal material is once immersed in water, the risk of moisture being contained in the liquid crystal material increases unless the subsequent drying step is carefully performed for a long time.
[0010]
When the adhesive used to form the seal portion into which the liquid crystal material is injected is a material produced by a process including a heating process, the shape of the portion enclosing the liquid crystal material due to expansion of residual air in the heating process is reduced. Since it is necessary to prevent collapse, it is necessary to form an air bleeding pattern in the vicinity of the injection port, so that it is difficult to increase the arrangement of cells in the substrate material.
[0011]
Further, in the dicing step, since the substrate is removed by the blade, there is an inconvenience that a large amount of material is wasted as compared with the dividing step using the scribing process.
[0012]
Therefore, the present invention has been made in view of the above, and it is an object of the present invention to provide a liquid crystal device and a method for manufacturing a liquid crystal device that can divide a liquid crystal material in a simple and safe dividing step.
[0013]
[Means for Solving the Problems]
The liquid crystal device of the present invention has three or more substrate materials, and in a liquid crystal device having two or more regions into which the liquid crystal material is injected between the substrates, one or more of the three or more substrate materials A groove formed by an etching process is formed on an end surface of the substrate material where an injection port for injecting a liquid crystal material is arranged.
[0014]
Therefore, according to the present invention, the following operations are performed.
According to the liquid crystal device of the present invention, in a device in which a dicing step must be used even before a liquid crystal material injection step, an injection port for injecting a liquid crystal material in one or more substrate materials among three or more substrate materials. Since the groove formed by the etching step is formed on the end face where the is disposed, the dicing step and the cleaning step before the liquid crystal material injection step can be eliminated.
[0015]
Further, the method for manufacturing a liquid crystal device according to the present invention includes a method for manufacturing a liquid crystal device having three or more substrate materials and having two or more regions into which the liquid crystal material is injected between the substrates. The substrate dividing step of arranging the injection port at the end is performed by a destruction step starting from a groove formed in one or more substrate materials of the three or more substrate materials by the etching step.
[0016]
Therefore, according to the present invention, the following operations are performed.
According to the liquid crystal device manufacturing method of the present invention, since the groove used as the destruction starting point used in the substrate dividing step is formed by the etching step, the groove has higher precision than the scratch caused by the scribing processing using the diamond tool. Therefore, the substrate dividing step can be stabilized. Therefore, the substrate size can be stabilized.
[0017]
BEST MODE FOR CARRYING OUT THE INVENTION
Embodiments of the present invention will be described below with reference to the drawings as appropriate.
[0018]
As shown in FIG. 1, the liquid crystal device of the present invention has three or more substrate materials of a glass substrate 2-1 (2-1) and a glass substrate 2-2 (2-2) with respect to a glass substrate 1 (1). And a liquid crystal device having two or more regions in which a liquid crystal material is injected between the substrates, wherein the glass substrate 2-1 (2-1) and the glass substrate 2 -2 (2-2) is an end face on which injection port positions 4-1 to 4-4 for injecting a liquid crystal material in one or more substrate materials among the three or more substrate materials are formed by an etching process. A groove is formed at groove positions 3-1 to 3-4 formed by.
[0019]
That is, as shown in FIG. 1A, in a groove forming step (S7 described later) by an etching step before a glass substrate bonding step (S13 and S16 described later), grooves are formed at groove positions 3-1 to 3-4. Is done.
[0020]
Then, as shown in FIG. 1B, in the dividing step (S17 to be described later), the glass substrate 1 (1) is placed on the end face where the injection port positions 4-1 to 4-4 for injecting the liquid crystal material are arranged. Three or more substrate materials of the substrate 2-1 (2-1) and the glass substrate 2-2 (2-2) are divided.
[0021]
At this time, as shown in FIG. 1C, a groove 5 formed in a groove forming step (S7 described later) by an etching step and a groove 6 formed in a dividing step (S17 described later) are formed on the glass substrate 1 (1). Appears, the liquid crystal injection port 7-1 between the glass substrate 1 (1) and the glass substrate 2-1 (2-1) and the glass substrate 2-2 (2-2) A liquid crystal injection port 7-2 is formed.
[0022]
The dividing step of the substrate of the liquid crystal device is a breaking step in which the grooves 5 formed in the etching step (S7) are regarded as the same as the scratches formed by the scribing process, and stress is concentrated on the portions. This is the result of the division performed in (S17).
[0023]
The method of manufacturing the liquid crystal device will be described with reference to FIGS.
In FIG. 2, first, in step S1, an anti-reflection coating 11 is applied to the glass substrate 1.
[0024]
In step S2, a step (first surface) of forming a transparent electrode using ITO 12 is performed.
Here, an ITO (Indium Tin Oxide) material 12 is used as a transparent electrode material. At this time, for example, when the sputtering method is used as the formation method, a dedicated etching solution is used after the ITO thin film is formed to be in an amorphous state by containing water during the sputtering step. Patterning is performed by wet etching.
[0025]
In step S3, a patterning step (first surface) of the positive and negative ITO electrodes 13 is performed on the ITO 12.
[0026]
In step S4, a transparent electrode forming step (second surface) using the ITO 14 is performed.
[0027]
In step S5, a patterning step (second surface) of the positive and negative ITO electrodes 15 is performed on the ITO.
In this step, it is necessary to protect the transparent electrode material on the first surface.
[0028]
In step S6, a firing process (first surface, second surface) of the ITO electrode material is performed.
In order to make the electrical characteristics of both surfaces of the substrate uniform, it is desirable to perform the firing process of the transparent electrodes on the first surface and the second surface simultaneously. For example, when an ITO material is formed in an amorphous state, it is necessary to perform a heat treatment in order to optically reduce the absorption of the ITO film and to stabilize electric conductivity. The conditions for the heat treatment are generally 350 ° C. for about 30 minutes in an air atmosphere.
[0029]
In step S *, a groove 16 is formed on the first surface of the glass substrate 1 by an etching process.
Here, the groove 16 is formed along the end face of the ITO electrode 13.
Here, the etching is, for example, dry etching such as an ion milling / FIB (F (fluorine) ion beam) / RIE (Reactive Ion Etching) process.
[0030]
In FIG. 3, in step S7, formation (first surface) of the alignment film 17 is performed.
In order to orient the liquid crystal material in a predetermined direction, a structure having electrical, mechanical, and magnetic anisotropy is required. Generally, a film having high polarizability (alignment film 17) is formed because it is easy to provide anisotropy electrically. In a method of manufacturing a liquid crystal display, a method of forming the alignment film 17 is generally, for example, flexographic printing because the substrate is large. However, when the size of the substrate is small, a spin coating method is also possible.
[0031]
For example, when a polyimide-based material, which is common in liquid crystal displays, is used as the alignment film 17, it is necessary to form the film by printing or spin coating, and then to bake it. Since the baking step is basically a dehydration reaction, the baking step is generally performed at a processing temperature of 200 ° C. or more. In some cases, a baking treatment at 220 ° C. is necessary after a drying treatment at 90 ° C.
[0032]
In step S8, formation (second surface) of the alignment film 18 is performed.
Here, among the heat treatment steps included in the baking step of the alignment films 17 and 18, there is a possibility that the high-temperature heat treatment step can be commonly used.
[0033]
In step S9, an alignment process (rubbing process) (first surface) is performed.
For example, when an organic material such as a polyimide-based alignment film is used as an alignment film material, the alignment direction of the polymer material is generally random immediately after the film is formed, so that the polymer has electrical anisotropy. Absent. Therefore, as a process for generating electrical anisotropy, an orientation process for aligning the orientation direction is required. There are two general methods for the alignment treatment: a rubbing treatment using a rubbing cloth and a light alignment method using light. The method is commonly used.
[0034]
In step S10, an alignment process (rubbing process) (second surface) is performed.
[0035]
In step S11, a step of forming a spacer-mixed conductive adhesive 19 (first surface) is performed.
In order to apply a voltage to the liquid crystal material, the voltage needs to be supplied to the glass substrates on both sides of the portion where the liquid crystal material is sealed. In many types of liquid crystal elements, a structure for simplifying the structure in which an external electric signal can be applied to one substrate constitutes a wall for enclosing a liquid crystal material. A method is used in which the substrates on both sides sandwiching the liquid crystal material are partially electrically connected by imparting conductivity to the material. The specific method of making the electrical connection is to adopt the conductive particles having a diameter slightly larger than the diameter of the spacer that defines the distance between the glass substrates, so that the distance defined by the spacer is obtained. At this time, the conductive particles are crushed by the glass substrate, and electrical connection is obtained. The spacer is formed of a hard material such as glass, and the conductive particles are formed of a soft material such as a gold-plated plastic material.
[0036]
In step S12, a pre-baking step (first surface) of the spacer-mixed conductive adhesive is performed.
When bonding the glass substrates, air must not come out from inside the adhesive because it is a surface bond, so in addition to the bubbles inside the adhesive being defoamed before full curing, the solvent Desirably it has been removed. In the case where the screen printing method is used as a method of forming the adhesive, bubbles inside the application medium are often removed when passing through the mesh of the screen. In this case, the solvent inside the adhesive is removed. The solvent is removed by a heat treatment at a temperature at which the curing agent of the adhesive does not react.
[0037]
Here, the steps of the glass substrate facing the liquid crystal material on the first surface side of the glass substrate 1 will be described.
In FIG. 4, in step S1-1, an antireflection coating 21 is applied to the glass substrate (2-1) 2-1. This is the same as the content of the step S1.
[0038]
In step S1-2, a transparent electrode made of ITO22 is formed.
In the case where a high-precision electrode pattern is formed on the glass substrate (2-1) 2-1 on the cover glass side, the same steps as those in Steps S2 and S3 need to be performed, but high pattern accuracy is not required. (About 0.1 mm), patterning can be performed by a method such as shadow sputtering.
[0039]
In step S1-3, firing of the ITO electrode material is performed.
This step has the same contents as the step S6.
[0040]
In step S1-4, formation of the alignment film 23 is performed.
This step has the same contents as the steps S7 and S8.
[0041]
In step S1-5, an alignment process (rubbing process) is performed.
This step has the same contents as the steps S9 and S10.
[0042]
In step S1-6, a substrate dividing step (a scribing process is possible) is performed.
The substrate is processed into a bar shape in order to make the substrate size suitable for the bonding step. Here, as a method of dividing the substrate, a division method using a scribing process can be applied if accuracy can be obtained, and a dicing method can also be applied.
[0043]
In FIG. 5, in step S13, a glass substrate bonding step (first surface) is performed.
If the temperature applied in steps S7 and S9 of forming the alignment film is high, it is necessary to form the alignment film on both surfaces in the process of step S13. Will be pressed against the press jig 24.
[0044]
The glass substrates are bonded with the adhesive formed in the previous step. It is desirable that the bonding condition of the glass substrate is centered on the condition specified by the adhesive maker.
[0045]
In step S14, a step of forming the spacer-mixed conductive adhesive 25 (second surface) is performed.
[0046]
In step S15, a pre-baking step (second surface) of the spacer-mixed conductive adhesive is performed.
[0047]
Here, the steps of the glass substrate facing the liquid crystal material on the second surface side of the glass substrate 1 will be described.
6, in step S2-1, a non-reflective coating 31 is applied to a glass substrate (2-2) 2-2. This is the same as the content of the step S1.
[0048]
In step S2-2, a transparent electrode made of ITO32 is formed.
When forming a high-precision electrode pattern on the glass substrate (2-2) 2-2 on the cover glass side, it is necessary to perform the same steps as in Steps S2 and S3, but when high pattern precision is not required. (About 0.1 mm), patterning can be performed by a method such as shadow sputtering.
[0049]
In step S2-3, firing of the ITO electrode material is performed.
This step has the same contents as the step S6.
[0050]
In step S2-4, formation of the alignment film 33 is performed.
This step has the same contents as the steps S7 and S8.
[0051]
In step S2-5, an alignment process (rubbing process) is performed.
This step has the same contents as the steps S9 and S10.
[0052]
In step S2-6, a substrate dividing step (a scribing process is possible) is performed.
The substrate is processed into a bar shape in order to make the substrate size suitable for the bonding step. Here, as a method of dividing the substrate, a division method using a scribing process can be applied if accuracy can be obtained, and a dicing method can also be applied.
[0053]
In FIG. 7, in step S16, a glass substrate bonding step (second surface) is performed.
[0054]
In step S17, division into a Bar-shaped size is performed.
In this step, it was not easy to use a scribing process because there was no space for disposing the diamond, so a dicing step had to be used.In this embodiment, however, a groove formed by an etching method was used as a starting point. It is possible to divide by broken destruction.
[0055]
In order to fill a glass substrate with a liquid crystal material, the substrate is divided so that a liquid crystal injection port is at an end. In this step, both the dividing method using a scribing process and the dicing method can be applied.However, in the case of performing the division using the dicing process, pure water as a cutting fluid or powder of a dicing knife is used. Since there is a high risk that the liquid crystal material is mixed into the space to be injected, a cleaning step is required after the division.
[0056]
In step S18, a vacuuming step is performed.
In order to fill the liquid crystal material 35, the container 36 in which the liquid crystal material 35 is dipped is evacuated 36. In order to increase the degree of vacuum, it is desirable to perform a bake step for drying in advance. The ultimate degree of vacuum may be a vacuum pump for rough grinding such as a rotary pump.
[0057]
In step S19, a liquid crystal material is filled.
With the vacuum maintained, the liquid crystal injection port of the sample is positioned so as to touch the liquid crystal material, and then nitrogen N2 is introduced into the vacuum container as indicated by 37. Then, the liquid crystal material is filled by returning the pressure to the atmospheric pressure. Here, the reason for introducing nitrogen N2 is to enhance the storage stability of the liquid crystal material.
[0058]
In FIG. 8, in step S20, the liquid crystal material 38 corresponding to the injection port of the liquid crystal element is extruded.
An external load is applied to a portion of the liquid crystal element filled with the liquid crystal material 38 so that the liquid crystal material 38 corresponding to the volume of the liquid crystal material 38 of the liquid crystal element filled in the injection port is extruded from the injection port. .
[0059]
In step S21, the liquid crystal material 38 is replaced with a UV (Ultra Violet ray) curing adhesive 39.
The liquid crystal material 38 extruded in the step S20 is wiped off, and a UV curing adhesive 39 for sealing the liquid crystal material 38 is applied to the wiped portion. Then, by releasing the applied load, the portion of the liquid crystal material injection port of the liquid crystal element is filled with the UV curing adhesive 39.
[0060]
In step S22, a UV irradiation step is performed.
The UV light 40 is applied to cure the UV curing adhesive 39 filled in the step S21. Here, since the liquid crystal material 38 has not so strong light resistance to the UV light 40, the UV light 40 is irradiated from the injection port side so that the liquid crystal material 38 is not irradiated with the UV light 40. Therefore, when selecting the UV-curable adhesive 39, it is necessary to use an adhesive having high transmittance for the UV light 40 in addition to selecting an adhesive having low reactivity with the liquid crystal material 38.
[0061]
In step S23, a dividing step for each cell is performed.
Although not shown, a step of dividing the liquid crystal device connected in a bar shape into a small size suitable for a use form is performed. Since the dividing method used here is a state in which two glass substrates (2-1) and (2-2) are laminated on the glass substrate 1, in the method using the scribing process, A dicing step is desirable because dimensional errors are likely to occur. Since the liquid crystal injection port is already closed, there is no fear that cutting fluid or the like may enter the injection port.
[0062]
Next, the operation principle and usage of a liquid crystal device for spherical aberration correction using a liquid crystal device manufactured by the above-described liquid crystal device manufacturing method will be described. FIG. 9 is a diagram illustrating the operation principle of aberration correction using a liquid crystal device.
[0063]
FIG. 9 shows the operation principle of a phase modulation device (including a spherical aberration correction device) using a refractive index change phenomenon by applying a voltage to a liquid crystal material. In this case, by arranging the optically uniaxial liquid crystal material in the liquid crystal device 51 so as to be linearly aligned, the phase of the light can be changed without changing the polarization plane of the light and the traveling direction of the light. Can be modulated.
[0064]
That is, by generating the “small” refractive index change region 58 and the “large” refractive index change region 59 in the liquid crystal device 51, the phase and traveling direction 56 of the incident light are uniform, but the phase and The traveling direction can be changed in phase in the same traveling direction as shown by 57. Therefore, this phase modulation device is an effective phase modulation device for light having a polarization component in the direction defined by the alignment film of the liquid crystal device 51.
[0065]
In order to apply a spherical aberration correction device to an optical disk device, the liquid crystal material of the liquid crystal device 51 needs to have a phase change that cancels spherical aberration caused by a difference in cover thickness due to a difference in a layer for recording and reproduction on the optical disk. It is necessary to apply the voltages VS (52) and VL (53). The pattern electrodes of the low-resistance conductive films 55-1 and 55-2 and the high-resistance conductive film 54 for applying a predetermined voltage distribution based on the voltages VS (52) and VL (53) to the liquid crystal material of the liquid crystal device 51 It is desirable to fix the incident light. Therefore, in a system in which the spherical aberration correction device has a fixed position in the xy direction with respect to the aperture and the objective lens, that is, in a system in which tracking servo is performed using a two-axis actuator, the liquid crystal device is mounted on the two-axis actuator. Is desirable.
[0066]
As described above, since the phase modulation device is a phase modulation device effective for light having a polarization component in the direction defined by the alignment film of the liquid crystal device 51, recording and reproduction are performed by the circular polarization optical system. In the optical disk system, it is desirable that the quarter-wave plate is mounted on the biaxial actuator together with the liquid crystal device.
[0067]
For example, a laser beam having a wavelength of 405 nm is used as a light source, and an NA (Numerical) is used.
In an optical disc system (blue ray) having a cover having a thickness of about 0.1 mm with an objective lens having an aperture of 0.85, since it has a short wavelength and a high NA, even if it has a thin-film cover layer configuration, In order to increase the number of recording layers, the tolerance for spherical aberration is not wide. Therefore, by introducing a spherical aberration correction device utilizing a change in the refractive index by applying a voltage to the liquid crystal material, the tolerance for the spherical aberration of light incident on the optical disk is relaxed, and a multilayer ROM (Read Only Memory) disk is used. Can be played.
[0068]
Further, as shown in the above-described embodiment, the inventor of the present application prototyped a liquid crystal device having two liquid crystal surfaces, and obtained both the light incident on the optical disk having the phase change recording film and the reflected light from the optical disk. It was shown that the method of correcting spherical aberration can apply the spherical aberration technology using a liquid crystal device to a recording medium.
[0069]
It is needless to say that the present invention is not limited to the above-described embodiment, but can take other configurations as appropriate without departing from the scope of the present invention.
[0070]
【The invention's effect】
The liquid crystal device of the present invention has three or more substrate materials, and has two or more regions into which the liquid crystal material is injected between the substrates, wherein one of the three or more substrate materials is provided. According to the liquid crystal device of the present invention, before the liquid crystal material injection step, the groove formed by the etching step is formed on the end surface of the substrate material where the injection port for injecting the liquid crystal material is arranged. This also has the effect of eliminating the dicing and cleaning steps prior to the liquid crystal material injection step in devices that must use the dicing step.
[0071]
Further, in the liquid crystal device according to the present invention, since the end face formed by the destruction step is present in contact with the groove formed by the etching step in the liquid crystal device according to claim 1, the substrate dividing step of the liquid crystal device is performed. Has the effect that the grooves formed by the above-mentioned etching step can be regarded as the same as the scratches formed by the scribing process, and the division can be made by the destruction step in which stress is concentrated on the portion.
[0072]
In the liquid crystal device according to the present invention, the liquid crystal device records or reproduces data recorded on a medium by focusing a laser beam on the recording medium. A phase adjustment liquid crystal device used for an optical recording / reproducing device and capable of partially adjusting the refractive index of a liquid crystal material, so that a polarization component in a direction defined by an alignment film of the liquid crystal device is used. This has the effect that phase modulation can be effectively performed on light having the following.
[0073]
Further, according to the method for manufacturing a liquid crystal device of the present invention, there is provided a method for manufacturing a liquid crystal device having three or more substrate materials and two or more regions into which the liquid crystal material is injected between the substrates. Since the substrate dividing step of arranging the injection port to be injected at the end is performed by a destruction step starting from a groove formed in one or more substrate materials of the three or more substrate materials by an etching step, the glass substrate In the step of forming a groove by an etching step before the bonding step, a groove is formed, and in the dividing step, three or more substrate materials are divided at an end face where an injection port position for injecting a liquid crystal material is arranged. Since the grooves formed in the step of forming the grooves by the etching step and the grooves formed in the dividing step appear, a liquid crystal injection port is thereby formed, In the step of dividing the substrate of the liquid crystal device, the groove formed by the above-described etching step is regarded as the same as the scratch formed by the scribing process, and the division can be performed by the destruction step in which stress is concentrated on the portion. To play.
[0074]
In the method for manufacturing a liquid crystal device according to the present invention, the liquid crystal device is used in an optical recording / reproducing apparatus for recording or reproducing data recorded on a medium by focusing a laser beam on a recording medium. Since it is a phase adjustment liquid crystal device in which the refractive index of the liquid crystal material can be partially adjusted, light having a polarization component in a direction defined by an alignment film of the liquid crystal device is used. There is an effect that phase modulation can be performed effectively.
[0075]
In the method for manufacturing a liquid crystal device of the present invention, in the above description, since the etching step is a dry etching step, the groove used as a starting point of destruction used in the plate dividing step is formed by the dry etching step. Therefore, the substrate can be manufactured with higher precision than the scratches caused by the scribing process using a diamond tool, so that the substrate dividing step can be stabilized, and the substrate size can be stabilized.
[Brief description of the drawings]
FIG. 1 is a diagram showing a groove and a liquid crystal injection port formed by an etching process of a liquid crystal device applied to the present embodiment, and FIG. 1A is a diagram showing a position and a diagram of a groove by an etching configuration before a glass substrate bonding process; 1B shows a liquid crystal injection port, and FIG. 1C shows a groove formed by an etching step, a groove formed by a division step, and a liquid crystal injection port.
FIG. 2 is a diagram illustrating a method for manufacturing a liquid crystal device applied to the present embodiment.
FIG. 3 is a diagram showing a method for manufacturing a liquid crystal device applied to the present embodiment.
FIG. 4 is a diagram showing a method for manufacturing a liquid crystal device applied to the present embodiment.
FIG. 5 is a diagram showing a method for manufacturing a liquid crystal device applied to the present embodiment.
FIG. 6 is a diagram illustrating a method for manufacturing a liquid crystal device applied to the present embodiment.
FIG. 7 is a diagram illustrating a method for manufacturing a liquid crystal device applied to the present embodiment.
FIG. 8 is a diagram illustrating a method for manufacturing a liquid crystal device applied to the present embodiment.
FIG. 9 is a diagram illustrating the principle of aberration correction using a liquid crystal device applied to the present embodiment.
10A and 10B are diagrams showing a dividing step of a conventional liquid crystal device. FIG. 10A shows a dividing step before liquid crystal injection, and FIG. 10B shows a dividing step after liquid crystal injection.
11A and 11B are views showing a scribing division process of a conventional liquid crystal device, wherein FIG. 11A shows a scribing position and FIG. 11B shows a liquid crystal injection port position.
12A and 12B are views showing a dicing division step of a conventional liquid crystal device, wherein FIG. 12A shows a dicing position and FIG. 12B shows a liquid crystal injection port position.
[Explanation of symbols]
1. Glass substrate 1, 2-1 Glass substrate 2-1, 2-2 Glass substrate 2-2, 3-1 to 3-4 ... Groove position, 4-1 to 4-4 ... Position of liquid crystal injection port, 5: groove formed by etching step, 6: groove formed by division step, 7-1, 7-2: liquid crystal injection port, 11: anti-reflection coating, 12 ... ITO, 13: ITO electrode, 14: ITO, 15: ITO, 16: Groove, 17, 18: Orientation film, 19: Particle-mixed adhesive, 21: Anti-reflective coating, 22: ITO , 23 ... alignment film, 24 ... press jig, 25 ... particle adhesive, 31 ... anti-reflection coating, 32 ... ITO, 33 ... alignment film, 34 ... press jig, 35 ... liquid crystal material, 36 ...... Vacuuming, 37 ... Nitrogen, 38 ... Liquid crystal material, 39 ... UV curing adhesive , 40 UV, 51 liquid crystal device, 52, 53 voltage (VS, VL), 54 high-resistance conductive film, 55-1, 55-2 low-resistance conductive film, 56 ... Phase and traveling direction of incident light, 57... Phase and traveling direction of transmitted light, 58... Region with a small refractive index, 59... Region with a large refractive index

Claims (6)

In a liquid crystal device having three or more substrate materials and having two or more regions into which the liquid crystal material is injected between the substrates,
A liquid crystal device, characterized in that a groove formed by an etching step is formed on an end face where an injection port for injecting a liquid crystal material in one or more substrate materials of the three or more substrate materials is arranged. . 2. The liquid crystal device according to claim 1, wherein an end face formed by a destruction step is present in contact with the groove formed by the etching step. 2. The liquid crystal device according to claim 1, wherein the liquid crystal device is used in an optical recording / reproducing apparatus that performs recording or reproduction of data recorded on a recording medium by focusing a laser beam on the recording medium. A liquid crystal device, which is a phase adjustment liquid crystal device capable of partially adjusting a refractive index of a liquid crystal material. In a method for manufacturing a liquid crystal device having three or more substrate materials and having two or more regions into which a liquid crystal material is injected between the substrates,
The substrate dividing step of arranging an injection port for injecting a liquid crystal material at an end is performed by a destruction step starting from a groove formed by an etching step in one or more of the three or more substrate materials. A method for manufacturing a liquid crystal device, comprising: 5. The method for manufacturing a liquid crystal device according to claim 4, wherein the liquid crystal device is used for an optical recording / reproducing apparatus that records or reproduces data recorded on a recording medium by focusing a laser beam on the recording medium. A method of manufacturing a liquid crystal device, wherein the method is a phase adjustment liquid crystal device in which the refractive index of a liquid crystal material can be partially adjusted. 5. The method according to claim 4, wherein the etching step is a dry etching step.

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