JP2004142427A - Manufacturing process for three-dimensionally shaped product - Google Patents
Manufacturing process for three-dimensionally shaped product Download PDFInfo
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
- B22F10/30—Process control
- B22F10/38—Process control to achieve specific product aspects, e.g. surface smoothness, density, porosity or hollow structures
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
- B22F10/30—Process control
- B22F10/37—Process control of powder bed aspects, e.g. density
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
- B22F10/30—Process control
- B22F10/36—Process control of energy beam parameters
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
- B22F10/30—Process control
- B22F10/36—Process control of energy beam parameters
- B22F10/366—Scanning parameters, e.g. hatch distance or scanning strategy
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
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Abstract
Description
本発明は粉末材料を光ビームで焼結硬化させることで三次元形状造形物を製造する三次元形状造形物の製造方法に関するものである。 The present invention relates to a method for producing a three-dimensional shaped article, which produces a three-dimensional shaped article by sintering and hardening a powder material with a light beam.
光造形法として知られている三次元形状造形物の製造方法がある。特許第2620353号(特許文献1)などに示された該製造方法は、無機質あるいは有機質の粉末材料の層の所定箇所に光ビームを照射して該当箇所の粉末を焼結(融着)することで焼結層を形成し、この焼結層の上に粉末材料の新たな層を被覆して該粉末層の所定箇所に光ビームを照射して該当箇所の粉末を焼結することで下層の焼結層と一体になった新たな焼結層を形成するということを繰り返すことで、複数の焼結層が積層一体化された粉末焼結部品(三次元形状造形物)を作成するものであり、三次元形状造形物の設計データ(CADデータ)であるモデルを所望の層厚みにスライスして生成する各層の断面形状データをもとに光ビームを照射することから、マシニングセンターのような装置が無くとも任意形状の三次元形状造形物を製造することができるほか、切削加工などによる製造方法に比して、迅速に所望の形状の造形物を得ることができる。 There is a method for producing a three-dimensional shaped object known as stereolithography. The manufacturing method disclosed in Japanese Patent No. 2620353 (Patent Document 1) sinters (fuses) the powder at a corresponding portion by irradiating a predetermined portion of the layer of the inorganic or organic powder material with a light beam. A sintered layer is formed by coating a new layer of the powder material on the sintered layer, and a predetermined portion of the powder layer is irradiated with a light beam to sinter the powder at the corresponding portion, thereby lowering the lower layer. By repeating the formation of a new sintered layer integrated with the sintered layer, a powder sintered part (three-dimensional shaped object) in which a plurality of sintered layers are laminated and integrated is created. There is a device such as a machining center because a light beam is irradiated based on cross-sectional shape data of each layer generated by slicing a model, which is design data (CAD data) of a three-dimensional shaped object, into a desired layer thickness. 3D shape modeling of any shape even without Addition can be produced, compared to the manufacturing method such as by cutting, it is possible to obtain a molded article rapidly desired shape.
この時、造形時間や内部応力による反り・割れなどの問題を考慮すると、造形物全体を一様な焼結条件で一様な密度で仕上げるのではなく、必要な部分のみを高焼結条件による高密度焼結層とし、他の部分は低焼結条件による低密度焼結層として造形するのが好ましい。たとえば、製作しようとする造形物が射出成形金型である場合、成形品が転写される表層部分や冷却水用配管部については高密度に、他の部分は低密度で仕上げるのが好ましい。 At this time, considering problems such as warping and cracking due to modeling time and internal stress, the entire model is not finished with uniform density under uniform sintering conditions, but only necessary parts are subjected to high sintering conditions. It is preferable that the high density sintered layer is formed and the other part is formed as a low density sintered layer under low sintering conditions. For example, when the molded article to be manufactured is an injection mold, it is preferable to finish the surface layer portion and the cooling water piping portion to which the molded product is transferred at a high density and the other portions at a low density.
ところで、高焼結条件で形成する高密度焼結層は、粉末をほぼ完全溶融させて固化させるために仕上げ後の面は非常にきれいであるとともに、冷却水の配管を造形した場合にも水漏れを起こさないが、粉末を薄く敷いた粉末層の密度が50〜60%であるのに対して、上記高密度焼結層はほぼ100%の密度となっていることから、図11に示すように、厚みt0で形成した粉末層10に対して高焼結条件での光ビームLを照射して高密度焼結層11Hを形成した時、粉末層10の表面よりも高密度焼結層11の表面はδだけ低くなることになる。
By the way, the high-density sintered layer formed under high sintering conditions has a very clean finished surface because the powder is almost completely melted and solidified. Although no leakage occurs, the density of the powder layer in which the powder is thinly spread is 50 to 60%, whereas the high-density sintered layer has a density of almost 100%. As described above, when the high-density sintered layer 11H is formed by irradiating the
また、形成する粉末層10の厚みを図12に示すように、ステージ20の一定下降量で決定している場合、高密度焼結層11Hの上に形成した粉末層10の厚みは、設計値tよりも上記δ分だけ厚いものとなり、さらにこの粉末層10を高焼結条件で焼結して高密度焼結層11Hとすると、粉末層10の表面よりも高密度焼結層11の表面は段差δa(δa>δ)だけ低くなることになる。
In addition, as shown in FIG. 12, when the thickness of the
そして更に粉末層10を形成し、今度は低焼結条件で低密度焼結層11Lを形成すると、図13に示すようにこの時の粉末層10の厚みは設計値tよりも上記段差δa分だけ厚いものとなる。
Further, when the
ここにおいて、低密度焼結条件で照射する光ビームLは、厚みがtである粉末層10を前提にその条件が決定されていることから、設計値tよりも段差δa分が厚くなってしまっている粉末層10に対しては、その下部まで焼結させることができなかったり、焼結させることができても下層に位置する高密度焼結層11Hとの結合力(密着力)が弱くて剥がれが発生しやすい低密度焼結層11Lしか得ることができなくなる。
本発明は上記の点に鑑みなされたものであって、その目的とするところは高密度焼結層から低密度焼結層に移行する部分の結合力を高めることができる三次元形状造形物の製造方法を提供するにある。 The present invention has been made in view of the above points. The object of the present invention is to provide a three-dimensional shaped object that can increase the bonding force of the portion that moves from the high-density sintered layer to the low-density sintered layer. To provide a manufacturing method.
しかして本発明は、無機質あるいは有機質の粉末材料の層の所定箇所に光ビームを照射して該当箇所の粉末を焼結させて焼結層を形成し、この焼結層の上に粉末材料の新たな層を被覆して所定箇所に光ビームを照射して該当箇所の粉末を焼結させることで下層の焼結層と一体になった新たな焼結層を形成することを繰り返して複数の焼結層が積層一体化された三次元形状造形物を製造するにあたり、高焼結条件で形成した高密度焼結層と低焼結条件で形成した低密度焼結層とを選択的に形成するとともに、高密度焼結層のための高焼結条件から低密度焼結層のための低焼結条件への移行に際し、両条件の中間の焼結条件で光ビームを照射した中密度焼結層を高密度焼結層上に形成し、この中密度焼結層上に低密度焼結層を形成することに第1の特徴を有している。高密度焼結層と低密度焼結層との間に中密度焼結層を介在させることで結合力の低下が生じないようにしたものである。 Therefore, the present invention irradiates a predetermined portion of the layer of the inorganic or organic powder material with a light beam to sinter the powder at the corresponding portion to form a sintered layer, and the powder material is formed on the sintered layer. A plurality of layers are formed by repeatedly forming a new sintered layer integrated with the lower sintered layer by coating a new layer and irradiating a predetermined part with a light beam to sinter the powder at the corresponding part. When manufacturing a three-dimensional shaped object in which sintered layers are laminated and integrated, a high-density sintered layer formed under high sintering conditions and a low-density sintered layer formed under low sintering conditions are selectively formed. In addition, during the transition from the high sintering condition for the high-density sintered layer to the low sintering condition for the low-density sintered layer, the medium-density sintering irradiated with the light beam under the intermediate sintering condition of both conditions The first step is to form a binder layer on the high-density sintered layer and to form a low-density sintered layer on the medium-density sintered layer. It has a feature of. By interposing a medium density sintered layer between the high density sintered layer and the low density sintered layer, a decrease in the bonding force is prevented.
この時、中密度焼結層を複数層積層するとともに、これらの中密度焼結層のための焼結条件を暫時低密度焼結層のための低焼結条件に近づけて上層の中密度焼結層ほど密度を低くするようにして、高密度焼結層と低密度焼結層との間の特性差をなだらかにしたり、中密度焼結層のための焼結条件を、粉末層の厚みに応じて決定するようにして、適切な焼結条件での中密度焼結層を形成することができるようにしてもよい。 At this time, a plurality of medium density sintered layers are laminated, and the sintering conditions for these medium density sintered layers are temporarily brought close to the low sintering conditions for the low density sintered layer, and the medium density sintered layer of the upper layer is sintered. The density of the sintered layer is reduced by increasing the density of the sintered layer, so that the characteristic difference between the high-density sintered layer and the low-density sintered layer is smoothed. The medium density sintered layer may be formed under appropriate sintering conditions.
また本発明は、無機質あるいは有機質の粉末材料の層の所定箇所に光ビームを照射して該当箇所の粉末を焼結させて焼結層を形成し、この焼結層の上に粉末材料の新たな層を被覆して所定箇所に光ビームを照射して該当箇所の粉末を焼結させることで下層の焼結層と一体になった新たな焼結層を形成することを繰り返して複数の焼結層が積層一体化された三次元形状造形物を製造するにあたり、高焼結条件で形成した高密度焼結層と低焼結条件で形成した低密度焼結層とを選択的に形成するとともに、高密度焼結層のための高焼結条件から低密度焼結層のための低焼結条件への移行に際し、最上層の高密度焼結層上に厚みが所定の値よりも小さい粉末層を設け、この粉末層を低焼結条件で焼結して低密度焼結層を形成することに他の特徴を有している。低密度焼結層とする粉末層の厚みが厚くなりすぎないようにコントロールするのである。 The present invention also provides a method for irradiating a predetermined portion of a layer of an inorganic or organic powder material with a light beam to sinter the powder at the corresponding portion to form a sintered layer, and forming a new powder material on the sintered layer. A plurality of firings by repeatedly forming a new sintered layer that is integrated with the underlying sintered layer by irradiating a predetermined portion with a light beam and sintering the powder at that location to sinter the desired layer. When manufacturing a three-dimensional shaped object in which the layers are laminated and integrated, a high density sintered layer formed under high sintering conditions and a low density sintered layer formed under low sintering conditions are selectively formed. In addition, the thickness of the uppermost high-density sintered layer is smaller than a predetermined value when shifting from the high-sintered condition for the high-density sintered layer to the low-sintered condition for the low-density sintered layer. Another feature is to provide a powder layer and sinter this powder layer under low sintering conditions to form a low density sintered layer. It is. The thickness of the powder layer used as the low density sintered layer is controlled so as not to be too thick.
また本発明は、無機質あるいは有機質の粉末材料の層の所定箇所に光ビームを照射して該当箇所の粉末を焼結させて焼結層を形成し、この焼結層の上に粉末材料の新たな層を被覆して所定箇所に光ビームを照射して該当箇所の粉末を焼結させることで下層の焼結層と一体になった新たな焼結層を形成することを繰り返すとともに、焼結層の形成後にそれまでに作成した造形物の表面部及びまたは不要部分の除去を行う工程を複数回の焼結層の作成工程中に挿入して複数の焼結層が積層一体化された所要の三次元形状造形物を製造するにあたり、高焼結条件で形成した高密度焼結層と低焼結条件で形成した低密度焼結層とを選択的に形成するとともに、高密度焼結層のための高焼結条件から低密度焼結層のための低焼結条件への移行に際し、最上層の高密度焼結層上に厚みが所定の値よりも小さい粉末層を設け、この粉末層を高焼結条件で焼結して余剰高密度焼結層を形成し、次いで余剰高密度焼結層上に低密度焼結層を形成することに特徴を有している。高密度焼結層で段差を埋めた後に低密度焼結層を形成するのである。 The present invention also provides a method for irradiating a predetermined portion of a layer of an inorganic or organic powder material with a light beam to sinter the powder at the corresponding portion to form a sintered layer, and forming a new powder material on the sintered layer. And repeatedly forming a new sintered layer that is integrated with the underlying sintered layer by irradiating a predetermined portion with a light beam to sinter the powder at that location and sintering the powder at that location. The process of removing the surface part and / or unnecessary part of the shaped object created so far after the formation of the layer is inserted into the process of creating the sintered layer multiple times, and the multiple sintered layers are laminated and integrated In producing a three-dimensional shaped article, a high-density sintered layer formed under high sintering conditions and a low-density sintered layer formed under low sintering conditions are selectively formed, and a high-density sintered layer is formed. In transition from high sintering conditions for low-sintering conditions for low-density sintered layers, A powder layer having a thickness smaller than a predetermined value is provided on the upper high-density sintered layer, and this powder layer is sintered under high sintering conditions to form an excessive high-density sintered layer, and then the excessive high-density sintered layer is formed. It is characterized by forming a low density sintered layer on the bonding layer. After the step is filled with the high-density sintered layer, the low-density sintered layer is formed.
最上層の高密度焼結層上に厚みが所定の値よりも小さい粉末層を設けるにあたっては、それまでに形成した造形物を載せているステージの粉末層の厚みを決定する降下量をゼロとして次の粉末層を形成してもよい。ステージの下降に要する時間を削減することができる。 When providing a powder layer with a thickness smaller than a predetermined value on the uppermost high-density sintered layer, the amount of descent that determines the thickness of the powder layer of the stage on which the molded object formed so far is set to zero The next powder layer may be formed. The time required for lowering the stage can be reduced.
また、高密度焼結層のための高焼結条件から低密度焼結層のための低焼結条件への移行に際して、それまでに形成した造形物の高さの測定結果に基づいて次の粉末層の厚みとこの粉末層の焼結条件とを決定したり、前回の粉末層の形成の際に粉末層表面を均すブレードの駆動負荷の測定結果に基づいて次の粉末層の厚みとこの粉末層の焼結条件とを決定してもよい。低密度焼結層とする粉末層の厚みが厚くなり過ぎることを確実に防ぐことができる。 In the transition from high sintering conditions for high-density sintered layers to low sintering conditions for low-density sintered layers, Determine the thickness of the powder layer and the sintering conditions for this powder layer, and determine the thickness of the next powder layer based on the measurement results of the driving load of the blade that smoothes the surface of the powder layer during the previous powder layer formation. You may determine the sintering conditions of this powder layer. It can be reliably prevented that the thickness of the powder layer as the low density sintered layer becomes too thick.
また本発明は、高焼結条件で形成した高密度焼結層と低焼結条件で形成した低密度焼結層とを選択的に形成するとともに、高密度焼結層のための高焼結条件から低密度焼結層のための低焼結条件への移行に際し、高密度焼結層を設計値以上の高さまで形成し、次いで高密度焼結層を設計値まで切削除去し、その後、低密度焼結層を形成することに特徴を有している。低密度焼結層が本来始まる高さまで高密度焼結層を追加することで、低密度焼結層とする粉末層の厚みが本来の値になるようにしたものである。 In addition, the present invention selectively forms a high-density sintered layer formed under high sintering conditions and a low-density sintered layer formed under low sintering conditions, and provides high sintering for high-density sintered layers. In the transition from the condition to the low sintering condition for the low density sintered layer, the high density sintered layer is formed to a height higher than the design value, and then the high density sintered layer is cut and removed to the design value. It is characterized by forming a low density sintered layer. By adding the high-density sintered layer to a height at which the low-density sintered layer originally starts, the thickness of the powder layer used as the low-density sintered layer is set to the original value.
以上のように本発明にあっては、高密度焼結層と低密度焼結層との間に介在させた中密度焼結層の存在や、粉末層の厚みのコントロールあるいは余剰高密度焼結層の形成などによって低密度焼結層とする粉末層の厚みが厚くなりすぎることがないようにしているために、低密度焼結層と高密度焼結層との間で剥離が生じることがないものである。 As described above, in the present invention, the presence of the medium density sintered layer interposed between the high density sintered layer and the low density sintered layer, the control of the thickness of the powder layer, or the excessive high density sintered layer. Since the thickness of the powder layer used as the low-density sintered layer is not excessively increased due to the formation of the layer, separation may occur between the low-density sintered layer and the high-density sintered layer. There is nothing.
以下本発明を実施の形態の一例に基づいて詳述すると、光造形による三次元形状造形物の製造装置としては、どのような形態のものを用いてもよいが、図示例では造形タンク25で外周が囲まれた空間内に上下昇降するステージ20を配して、造形タンク25内のステージ20上に供給した無機質あるいは有機質の粉末材料をスキージング用ブレードでならすことで所定厚みの粉末層10を形成するとともに、スキャン光学系を介して上記粉末層10の所定箇所に光ビーム(レーザ)Lを照射することで焼結層11を形成するものを用いている。
Hereinafter, the present invention will be described in detail based on an example of an embodiment. As an apparatus for producing a three-dimensional shaped object by stereolithography, any form may be used, but in the illustrated example, a
また、上記光ビームLを出力する光ビーム出力手段には、光ビームLの走査ピッチや走査速度を変更することができるものを用いて、走査ピッチを小さくしたり走査速度を遅くした高焼結条件での照射時に高密度焼結層11Hを形成し、走査ピッチを粗くしたり走査速度を速くした低密度条件での照射時に低密度焼結層11Lを形成することができるようにしている。なお、光ビーム出力手段の出力自体を変更することで上記条件変更を行うようにしたものであってもよい。 Further, as the light beam output means for outputting the light beam L, one that can change the scanning pitch and scanning speed of the light beam L is used, and the high sintering is achieved by reducing the scanning pitch or slowing the scanning speed. The high-density sintered layer 11H is formed at the time of irradiation under conditions, and the low-density sintered layer 11L can be formed at the time of irradiation under low-density conditions where the scanning pitch is roughened or the scanning speed is increased. The condition may be changed by changing the output itself of the light beam output means.
今、図1に示すように、ステージ20上に高焼結条件(たとえばレーザ出力200W、走査ピッチ0.2mm、走査速度50mm/sec)で2層の高密度焼結層11H,11Hを形成した後、低焼結条件(たとえばレーザ出力200W、走査ピッチ0.5mm、走査速度300mm/sec)で低密度焼結層11Lを形成するにあたっては、両条件の中間の焼結条件(たとえばレーザ出力200W、走査ピッチ0.3mm、走査速度100mm/sec)で光ビームLを照射した中密度焼結層11Mをまず形成し、その後、低密度焼結層11Lを形成する。低密度焼結層11Lを形成するための低焼結条件での光ビームLでは十分な熱を加えることができない厚みの粉末層10でも、中焼結条件での光ビームLでは十分な熱を加えることができるために高密度焼結層11Hとの間で剥離が生じることはない。
As shown in FIG. 1, two high-density sintered layers 11H and 11H are formed on the
この時、図2に示すように、中密度焼結層を複数層11Ma,11Mb,11Mc形成するとともに、これら中密度焼結層11Ma,11Mb,11Mcのための焼結条件を暫時低密度焼結層11Lのための低焼結条件に近づけていくようにしてもよい。たとえば、高密度焼結層11Hに接する中密度焼結層11Maはレーザ出力200W、走査ピッチ0.3mm、走査速度100mm/secの焼結条件で、中密度焼結層11Mbはレーザ出力200W、走査ピッチ0.35mm、走査速度150mm/secの焼結条件で、低密度焼結層11Lに接することになる中密度焼結層11Mcはレーザ出力200W、走査ピッチ0.4mm、走査速度200mm/secの焼結条件で焼結するのである。 At this time, as shown in FIG. 2, a plurality of medium density sintered layers 11Ma, 11Mb, and 11Mc are formed, and the sintering conditions for these medium density sintered layers 11Ma, 11Mb, and 11Mc are temporarily low-density sintered. You may make it approach the low sintering conditions for layer 11L. For example, the medium density sintered layer 11Ma in contact with the high density sintered layer 11H has a laser output of 200 W, a scanning pitch of 0.3 mm, and a scanning speed of 100 mm / sec. The medium density sintered layer 11Mc that comes into contact with the low density sintered layer 11L under the sintering conditions of pitch 0.35 mm and scanning speed 150 mm / sec has a laser output of 200 W, a scanning pitch of 0.4 mm, and a scanning speed of 200 mm / sec. Sintering is performed under sintering conditions.
また、高密度焼結層11Hの形成後、図3に示すように、粉末層10の表面と高密度焼結層11Hの表面との高さの差δaの値を高さ測定用プローブPなどを用いて測定することで、次の粉末層10の厚み(t+δa)を求め、この厚み(t+δa)の値に応じた中焼結条件で中密度焼結層11Mを形成するようにしてもよい。なお、厚み(t+δa)の値に応じた中焼結条件は実験結果などから予め定めておくものとする。
Further, after the formation of the high-density sintered layer 11H, as shown in FIG. 3, the height difference probe δa between the surface of the
図4に他例を示す。高密度焼結層11Hの次に低密度焼結層11Lを形成するにあたり、通常であればステージ20を所定量tだけ降下させるのであるが、ここでは降下量を所定量tよりも小さく(降下量ゼロを含む)することで、次の粉末層10の厚みが厚くなりすぎないようにしておき、この状態で低焼結条件での低密度焼結層11Lの形成を行っている。
Figure 4 shows another example. In forming the low-density sintered layer 11L next to the high-density sintered layer 11H, the
このほか、図5に示すように、粉末層10の表面と高密度焼結層11Hの上面との間の高さδaの段差を解消するために、高密度焼結層11Hの焼結が終わった後、ステージ20を下降させることなく(もしくはステージ20の下降量を設計値tより小さい値として)粉末の供給を行って、上記段差の部分に粉末を埋め、この状態で高焼結条件での高密度焼結層11H’を形成することで段差を低くした後、低焼結条件での低密度焼結層11Lの作製を行うようにしてもよい。なお、上記段差が大きい場合は、上記高密度焼結層11H’を上記と同じ手順で複数層形成するとよい。この場合、厚みが漸次薄くなる高密度焼結層11H’が積層された後、低密度焼結層11Lが形成されることになる。図中21はスキージング用ブレードである。
In addition, as shown in FIG. 5, the sintering of the high-density sintered layer 11 </ b> H is finished in order to eliminate the step of the height δa between the surface of the
また、前述の高さ測定用プローブPなどを用いて図6(a)にも示すように粉末層10の表面と高密度焼結層11Hの表面との高さの差δaの値を測定する場合、この測定結果に応じて上記高密度焼結層11H’を形成した後に低密度焼結層11Lの形成を行うか、あるいは上記高密度焼結層11H’を形成することなく低密度焼結層11Lの形成を行うかを決定するようにしてもよい。差δaが大きい場合には、図6(b)に示すように、ステージ20を下降させることなく粉末の供給を行って上記高密度焼結層11H’を形成することで差δaを小さくし、差δaが当初から小さい場合はステージ20を下降させて粉末を供給し、低密度焼結層11Lを形成するのである。
Further, as shown in FIG. 6 (a), the height difference δa between the surface of the
上記高さの差δaの検出は、図7に示すように、ブレード21を動かして粉末を均す際にブレード21の駆動に必要な力(ブレード21にかかる負荷)Fを検出することで代用してもよい。負荷Fが小さい場合は、ブレード21と高密度焼結層11Hとの間の間隔が大(図7(a))であることから、次層もステージ20を下降させることなく粉末の供給を行うものとし、負荷Fが大である場合は、ブレード21と高密度焼結層11Hとの間の間隔が微小(図7(b))であることから、次層はステージ20を下降させた上で粉末を供給するのである。
As shown in FIG. 7, the height difference δa is detected by detecting a force F (load applied to the blade 21) F required to drive the
ちなみに、ブレード21にかかる負荷が大きいと移動指令に追従しようとして駆動用のモータに流れる電流が大きくなり、逆に負荷が小さいとブレード21を動かすだけの電流に限りなく近づく。ここで、前回焼結した面の上をブレード21が通過する場合、通常は上記の面の凹凸のために抵抗を受けてこれが負荷となるものであり、ブレード21が上記面から離れておれば、上記抵抗を受けることはない。従って図7(c)に示すように、始動電流が流れた等速移動中の電流値を監視し、この電流値が予め実験結果などから定めた閾値より大きいか小さいかでステージ20を下降させるか下降させないかを判断する。
Incidentally, when the load applied to the
また、図8に示すように、高密度焼結層11Hから低密度焼結層11Lへ切り換える時、ステージ20の下降量を設計値t(たとえば50μm)よりも小さい値ts(たとえば20μm)に無条件に変更し、この状態で粉末層10を形成して低焼結条件での低密度焼結層11Lの形成を行うようにしてもよい。
Further, as shown in FIG. 8, when switching from the high-density sintered layer 11H to the low-density sintered layer 11L, the amount of lowering of the
図9に更に他例を示す。これは高密度焼結層11Hのための高焼結条件から低密度焼結層11Lのための低焼結条件への移行に際し、高密度焼結層11Hを余分に形成して高密度焼結層11Hの高さを設計上の高さよりいったん高くし、次いで高密度焼結層11Hの上面を設計値まで切削除去し、その後、低密度焼結層11Lを形成するようにしたものである。 Fig. 9 shows another example. This is because the high-density sintered layer 11H is excessively formed in the transition from the high-sintered condition for the high-density sintered layer 11H to the low-sintered condition for the low-density sintered layer 11L. The height of the layer 11H is once higher than the designed height, and then the upper surface of the high-density sintered layer 11H is cut off to the design value, and then the low-density sintered layer 11L is formed.
以上の各例では、一つの焼結層が高焼結条件もしくは低焼結条件あるいは中焼結条件のいずれかだけで焼結されるものを図で示したが、本発明は一つの焼結層中に高密度焼結部と低密度焼結部とが混在するものにおいても適用することができる。つまり、図10に示すように、ある焼結層中の高密度焼結部Hの上に他の焼結層の低密度焼結部Lが配設される部分に対しても適用することができる。図中Mは中密度焼結部である。 In each of the above examples, one sintered layer is shown in the figure as being sintered only under either high sintering conditions, low sintering conditions, or medium sintering conditions. The present invention can also be applied to a case where a high density sintered portion and a low density sintered portion are mixed in the layer. That is, as shown in FIG. 10, it can be applied to a portion where a low density sintered portion L of another sintered layer is disposed on a high density sintered portion H in a certain sintered layer. it can. In the figure, M is a medium density sintered part.
なお、無機質の粉末材料としては、特開2001−152204号に示されている鉄系粉末を好適に用いることができ、有機質の粉末材料としては、ナイロン、ABS等を主成分とした熱可塑性樹脂を好適に用いることができる。 As the inorganic powder material, iron-based powders disclosed in JP-A-2001-152204 can be preferably used, and as the organic powder material, a thermoplastic resin mainly composed of nylon, ABS or the like. Can be suitably used.
L 光ビーム
11H 高密度焼結層
11L 低密度焼結層
11M 中密度焼結層
20 ステージ
L Light beam 11H High-density sintered layer 11L Low-density sintered layer 11M Medium-
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JP3599056B2 (en) | 2004-12-08 |
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