JP2004137598A - Film-deposition apparatus and method for exchanging film-control device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a film-depositing apparatus in which a film-control device for controlling the film thickness etc., of sputtered film formed on a substrate can be exchanged, and a method for exchanging the film-control device. <P>SOLUTION: This film-depositing apparatus is provided with a first vacuum chamber 1 for exchanging the substrate, a second vacuum 2 chamber which can independently be vacuumized even by connecting with the first vacuum chamber 1, a substrate holding tool 5 for holding the above substrate, a conveying mechanism 19 for conveying the substrate holding tool 5 from the first vacuum chamber 1 to the second vacuum chamber 2, the plurality of film-control devices 11, 13, 15, 17 arranged in the second vacuum chamber 2 and controlling the formation of the sputtered film on the substrate, targets 3, 4 set to one of these film control devices in the second vacuum chamber 2 and exchanging mechanism 12, 14, 16, 18 which can selectively be positioned at a prescribed position with interval to the substrate conveyed into the second vacuum chamber 2. <P>COPYRIGHT: (C)2004,JPO

Description

The present invention relates to an apparatus for forming an optical thin film by a sputtering method, and relates to a film forming apparatus for exchanging a film controller and a method for exchanging a film controller.

光学 Conventionally, optical thin films have been formed by vapor deposition, but in recent years, a film forming apparatus by a sputtering method capable of obtaining an optical thin film having a dense and stable characteristic has been developed. The optical thin film includes a single-layer film, a multilayer film in which two types of films having a high refractive index and a low refractive index are alternately laminated, or a multilayer film in which three or more types of films are laminated. This is the most important factor in determining the optical characteristics of the optical thin film, that is, accurately controlling the film thickness is an important matter in an optical thin film forming apparatus. In the current optical thin film, it is necessary to suppress the thickness error from several percent or less to 1% or less in severe specifications.

On the other hand, there are an optical film thickness meter and a quartz vibrating film thickness meter as devices for measuring the thickness of a thin film during film formation. It is difficult to use an optical film thickness gauge that measures the reflected light or transmitted light by applying the light to the surface. The correct measurement value cannot be obtained due to the influence of.

Therefore, when an optical thin film is formed by sputtering, the time required to form a predetermined film thickness is calculated according to a previously set film forming rate, and sputtering is performed. Therefore, stabilizing the film forming speed of the film forming apparatus is the most important matter.

FIG. 19 shows an example of an apparatus for producing an optical thin film while always keeping a film forming chamber in which a target is installed in a vacuum. This is a configuration in which a vacuum chamber for replacing a substrate is added to an apparatus for performing sputter film formation. A first vacuum chamber 101 for exchanging substrates and a second vacuum chamber 102 for film formation are provided. Two types of targets 105 and 108 are installed in the second vacuum chamber 102, and a rotating substrate holder is provided. A film is formed on the substrate held by 109 by sputtering. In this apparatus, the substrate formed by sputtering is immediately moved to the oxidation zone 110 by rotation of the substrate holder and is irradiated with oxygen ions or oxygen radicals to become an oxide film, thereby obtaining an optical thin film.

Next, a description will be given of the normal operation. The gate valve 111 is closed, the atmosphere is introduced only into the first vacuum chamber, the door 112 is opened, and the substrate holder 109 which has been transported to the first vacuum chamber 101 in advance is formed. Attach the substrate to be filmed. The door 112 is closed, the first vacuum chamber 101 is evacuated, and the gate valve 111 is opened. Then, the substrate holder 109 is transferred to the second vacuum chamber 102 by the transfer mechanism 113, and the gate valve 111 is closed. Sputtering is started after further evacuation until the inside of the second vacuum chamber 102 reaches a predetermined degree of vacuum. After the sputtering of the two kinds of targets 105 and 108 and the film formation by the oxidation zone 110 are completed, the gate valve 111 is opened, the substrate holder 109 is transferred to the first vacuum chamber 101, and the gate valve 111 is closed. Air is introduced into the first vacuum chamber 101 to open the door 112 and take out the substrate.

In this series of steps, the second vacuum chamber in which the target is installed can be kept in a vacuum throughout the normal steps of mounting a substrate, forming a film, and taking out the substrate, so that a clean surface can be maintained without oxidizing the target by air. . Therefore, the film formation rate of sputtering can be stabilized (for example, see Patent Document 1).
JP 2001-234338 A

課題 Here, a problem arises when the film thickness distribution on the substrate and the film thickness distribution on the entire surface of the substrate holder in which many substrates are arranged in a large area are taken into consideration.

First of all, all the characteristics of the substrate to be produced should be uniform, so the film thickness distribution on the entire surface of the substrate holder must be controlled. However, in practice, the thickness distribution varies depending on the material and structure of the target used, manufacturing errors of the target, and the like. The film thickness distribution also changes depending on the structure of the film forming apparatus to be mounted and the conditions for introducing the gas introduced for causing discharge.

Further, the film thickness distribution may be different between when the target is new and the surface is clean and flat, and when the target is dug after a long time of sputtering and the shape changes, and the oxide adheres to the non-erosion portion. . The film thickness distribution is not limited to being uniform over the entire surface, and a non-uniform film in which the film thickness is positively changed from one substrate to another or within the same substrate may be formed.

膜 To achieve such various film thickness distributions, it is best to use a film controller. The film controller is a plate-shaped instrument installed between the target and the substrate, and is an object that blocks some of the particles sputtered from the target and scattered toward the substrate.By adjusting the shape of the film controller, The purpose of the present invention is to make it possible to uniformly correct the film thickness distribution and to obtain a desired non-uniform film whose film thickness varies depending on the location.

Since the film controller is installed between the target and the substrate as shown in 103 and 104 in FIG. In the case of FIG. 19, the door 107 and 106 for fixing the targets 105 and 108 are opened by introducing air, and the door 107 and 106 are opened for replacement.

In this case, the target is completely exposed to air, and the surface is strongly oxidized. Therefore, in the subsequent sputter deposition, there is a problem that the deposition rate changes and it becomes difficult to obtain a predetermined thickness.

Opportunities for replacing the film controller include, when examining an experiment for adjusting the film thickness distribution to a desired distribution, when correcting distribution fluctuations due to excavation of the targets 105 and 108, when switching the type of optical thin film product, and when performing sputtering. It is required to be performed frequently at various occasions, such as when the distribution is changed by changing the data. Then, each time the air is introduced into the second vacuum chamber 102 to oxidize the targets 105 and 108, the subsequent rate changes, and when performing pre-sputtering for removing the oxide film, time is required. There was a problem that the target wasted.

The present invention provides an exchange method and an apparatus for exchanging a film controller without deteriorating a target in consideration of the problems of the conventional film forming apparatus described above.

In order to achieve the above object, a first aspect of the present invention is to provide a first vacuum chamber for exchanging substrates, and a sputtering chamber connected to the first vacuum chamber, which can be evacuated independently. A second vacuum chamber for forming a film, a substrate holder for holding the substrate, a transfer mechanism for transferring the substrate holder from the first vacuum chamber to the second vacuum chamber, A plurality of film controllers arranged in a vacuum chamber for controlling the formation of a sputter film on the substrate, one of the film controllers being provided in a target installed in the second vacuum chamber, and And a replacement mechanism that can be selectively positioned at a predetermined position between the substrates conveyed into the second vacuum chamber.

According to a second aspect of the present invention, in the film forming apparatus of the first aspect, the exchange mechanism moves the plurality of film controllers by expansion and contraction between the predetermined position and a holding position retracted from the predetermined position. A telescopic gripper for moving a selected one of the plurality of membrane controllers from the holding position to the predetermined position by the telescopic gripper. .

According to a third aspect of the present invention, in the film forming apparatus according to the first aspect, the exchange mechanism moves the plurality of film controllers between the predetermined position and a holding position retracted from the predetermined position. And a mechanism configured to move a selected one of the plurality of membrane controllers from the holding position to the predetermined position along the guide.

According to a fourth aspect of the present invention, in the film forming apparatus according to the first aspect, the exchange mechanism moves the plurality of film controllers by rotation between the predetermined position and a holding position retracted from the predetermined position. A rotary gripper for moving the selected one of the plurality of membrane controllers from the holding position to the predetermined position by the rotary gripper. .

In a fifth aspect of the present invention, the plurality of film controllers in the film forming apparatus according to any one of the first to fourth aspects have different shapes.

In a sixth aspect of the present invention, there is provided a first vacuum chamber for exchanging substrates, and a second vacuum for sputter deposition capable of being independently evacuated and connected to the first vacuum chamber. A third vacuum chamber connected to the second vacuum chamber and capable of being independently evacuated, a substrate holder for holding the substrate, and the first vacuum A first transfer mechanism for transferring from the chamber to the second vacuum chamber, and a film disposed at a predetermined position between a target installed in the second vacuum chamber and the substrate transferred into the second vacuum chamber. An exchange mechanism capable of positioning a controller, a gripper for gripping the membrane controller provided in the exchange mechanism, and transporting the exchange mechanism between the third vacuum chamber and the second vacuum chamber By doing, the membrane controller gripped by the exchange mechanism from the predetermined position and the predetermined position A film forming apparatus and a second transfer mechanism for moving between avoided by said third vacuum chamber.

７A seventh aspect of the present invention is the film forming apparatus according to the sixth aspect, wherein the third vacuum chamber also serves as the first vacuum chamber.

An eighth aspect of the present invention is the film forming apparatus according to the sixth aspect, wherein the first transport mechanism for transporting the substrate holder is also used as a second transport mechanism for transporting the exchange mechanism. is there.

According to a ninth aspect of the present invention, in the sixth aspect, a rotation mechanism is further provided in the second vacuum chamber, and the exchange mechanism is rotated by the rotation mechanism, so that the membrane controller is rotated. The film forming apparatus is an exchange mechanism that can be positioned at the predetermined position.

In a tenth aspect based on the ninth aspect, the rotation mechanism is configured to rotate the membrane controller in a direction opposite to the direction of rotation when the membrane controller is positioned at the predetermined position and when the membrane controller is removed from the predetermined position. This is a film forming apparatus as a mechanism.

In an eleventh aspect based on the sixth aspect, the gripper is an arm that expands and contracts to the predetermined position, and the exchange mechanism extends the arm to the predetermined position and moves the membrane controller to the predetermined position. This is a film forming apparatus that is an exchange mechanism that can be positioned at

Further, a twelfth aspect of the present invention is a method for exchanging a film controller using the film forming apparatus of the first aspect of the present invention. Positioning one of the plurality of film controllers disposed in the second vacuum chamber at the predetermined position using a mechanism; and sputtering the substrate conveyed into the second vacuum chamber on the substrate. Performing the film formation, moving the film controller from the predetermined position to the holding position retracted by using the exchange mechanism, and using the exchange mechanism to perform another one of the film controllers. And a step of positioning the membrane controller at the predetermined position.

A thirteenth aspect of the present invention is a method for exchanging the film controller using the film forming apparatus according to the sixth aspect of the present invention, wherein the second vacuum chamber is maintained at a vacuum. A step of causing the exchange mechanism to grip the membrane controller, a step of evacuating the third vacuum chamber, and a step of causing the membrane controller held by the exchange mechanism to perform a third vacuum using the second transport mechanism. Transferring the film controller from the first vacuum chamber to the second vacuum chamber, positioning the film controller at the predetermined position by an exchange mechanism transferred to the second vacuum chamber, Forming a sputter film on the substrate transferred by the first transfer mechanism in the second vacuum chamber, and transferring the exchange mechanism holding the film controller from the second vacuum chamber to the third vacuum chamber. Transporting using the second transport mechanism, and opening the third vacuum chamber to the atmosphere. Remove the Kimaku controller from the switch fabric, a membrane controller method of replacement that includes a step of grasping a new film controls the exchange mechanism.

According to the present invention, a film controller and a film controller capable of changing a film controller for controlling a film thickness of a sputter film formed on a substrate can be exchanged while a vacuum chamber in which a target is installed is kept in a vacuum. A method can be provided.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.

(Embodiment 1)
FIG. 1 is a plan view of a main part of the film forming apparatus according to the first embodiment, and FIG. 2 is a cross-sectional view of the main part.

成膜 The film forming apparatus of the first embodiment has a vacuum chamber 1 for exchanging substrates.

{Circle around (2)} The vacuum chamber 2 is connected to the vacuum chamber 1 for performing sputtering film formation. The vacuum chamber 1 is provided with a door 8 for loading and unloading substrates. A gate valve 7 is provided between the vacuum chamber 1 and the vacuum chamber 2 for independently evacuating each vacuum chamber. Further, the film forming apparatus of the first embodiment has a drum-shaped substrate holder 5, and the substrate holder 5 is transferred from the vacuum chamber 1 to the vacuum chamber 2 by the transfer mechanism 19. The substrate holder 5 can be rotated by a rotation mechanism (not shown) installed in the vacuum chamber 2.

{Circle around (2)} On the side surface of the vacuum chamber 2, two targets 3 and 4 are provided to face each other. An oxidation zone 6 whose opening portion is partitioned by a cover or the like is provided between the side surface of the vacuum chamber 2 and the substrate holder 5 which faces the gate valve 7. A film controller 11 is provided between the target 3 and the substrate holder 5, and a film controller 15 is provided between the target 4 and the substrate holder 5. The membrane controllers 11 and 15 are gripped by telescopic exchange mechanisms 12 and 16.

FIG. 2 is a longitudinal sectional view of the target 3 viewed from the center of the vacuum chamber 2 with the substrate holder 5 omitted. As shown in the figure, the membrane controller 11 includes a plate-shaped membrane controller 11a having a shape similar to an ellipse, and columns 11b extending above and below the membrane controller. The exchange mechanism 12 includes a pedestal portion 12a fixed to the left of the target 3 when viewed from the center of the vacuum chamber 2, and a telescopic arm 12b extending from the pedestal portion 12a. The film controller 11 has a column 11b extending vertically above and below the film controller 11 fixed between the target 3 and the substrate holder 5 by an arm 12b. On the right side of the target 3, a membrane controller 13 as shown in the figure having a different shape from the membrane controller 11 gripped by the extensible exchange mechanism 14 is located at a position where the arm of the exchange mechanism 14 is contracted. That is, it is provided at a position not facing the target 3.

The film thickness is controlled by blocking a part of the sputtered particles by the shape of the film controller 11 so that the particles do not adhere to the substrate. The film controller 11 according to the first embodiment is for uniformizing the film thickness distribution on the substrate. Initially, the film controller 11 installed in front of the target 3 as shown in FIG. Can make the film thickness distribution uniform. However, the film thickness distribution changes when the target 3 is dug and the final stage is reached. Therefore, the film thickness is changed by replacing the film controller 13 with the film controller 13 evacuated in the lateral direction of the target 3. The distribution can be made uniform.

The target 4 side also has the same configuration as the target 3 side. When viewed in the direction of the target 4 from the center of the vacuum chamber 2, the target 4 is gripped by a telescopic exchange mechanism 16 extending from the right side of the target 4. The film controller 15 is provided between the target 4 and the substrate holder 5. On the left side of the target 4, a membrane controller 17 held by a telescopic exchange mechanism 18 is provided at a position where the arm of the exchange mechanism 18 is contracted.

排 気 The exhaust pump, sputter power supply, various control devices, measuring instruments, and the like that are naturally included in the sputtering apparatus are not shown in the drawings.

成膜 A film forming method for exchanging a film controller using the film forming apparatus having the above configuration will be described below.

FIGS. 3, 4, and 5 are plan views of a main part of the film forming apparatus, showing a method of replacing the film controller.

First, as shown in FIG. 3, the substrate holder 5 is in the vacuum chamber 1, and the vacuum chamber 2 is maintained in a vacuum state by closing the gate valve 7 regardless of whether the vacuum chamber 1 is vacuum or open to air. I'm dripping. Further, membrane controllers 11 and 15 are installed in front of the targets 3 and 4.

(4) Next, in the membrane controllers 11 and 15, the exchanging mechanisms 12 and 16 are contracted and retracted in the lateral direction of the targets 3 and 4, as shown in FIG. Then, the film controllers 13 and 17 are installed in front of the targets 3 and 4 instead of the film controllers 11 and 15 by extending the extensible exchange mechanisms 14 and 18.

Next, a normal film forming process will be described.

(4) As shown in FIG. 4, the substrate holder 5 is in the vacuum chamber 1, the gate valve 7 is closed, and the vacuum chamber 2 is kept in vacuum. From this state, the door 8 is opened and a substrate on which a film is to be formed is mounted. After installing the substrate, the door 8 is closed, and the vacuum chamber 1 is evacuated to a vacuum.

Next, the gate valve 7 is opened, the substrate holder 5 is transferred to the vacuum chamber 2 by the transfer mechanism 19, and the gate valve 7 is closed. This state is shown in FIG.

Next, the vacuum chamber 2 is further evacuated to reach a predetermined pressure. The substrate holder 5 is rotated by a rotation mechanism (not shown) to a position facing the target 3 or the target 4. Although the target 3 is made of Ti and the target 4 is made of Si, various other materials such as Nb, Ta, Zr and their oxides, nitrides and carbides can be used.

Here, a cover (not shown) is provided around the targets 3 and 4 for controlling the atmosphere around the targets 3 and 4, and a gas for plasma discharge is introduced near the targets in the cover. I do. For example, an argon gas or a gas in which oxygen is mixed with argon is used.

(4) Subsequently, a voltage is applied to the targets 3 and 4 to generate argon plasma, and sputtering is started. The argon ions in the plasma are attracted to and collide with the targets 3 and 4 by the magnetic force, sputter the target material, and the scattered particles adhere to the substrate to form a metal thin film.

Next, the substrate holder 5 is rotated and moved to the oxidation zone 6. By exposure to oxygen ions or oxygen radicals, the metal on the substrate becomes an oxide, and an oxide film functioning as an optical thin film can be obtained. Alternatively, without providing an oxidation zone, the target may be made of an oxide such as titanium oxide or silicon oxide, or by using a mixed gas containing a sufficient amount of oxygen mixed with argon to deposit the oxide. An oxide film functioning as a thin film can be obtained.

Note that, as an example of the predetermined position of the present invention, in the first embodiment, the arm provided in the exchange mechanisms 12, 14, 16, and 18 corresponds to a position where the arm is extended. As an example, it corresponds to the position where the arm is contracted, and in FIG. 1, it corresponds to the position of the membrane controllers 13 and 17.

In the first embodiment, the exchange mechanism according to the second aspect of the present invention includes an exchange mechanism 12, 14, 16, which comprises a fixed portion and an arm corresponding to the telescopic gripper of the second aspect of the present invention. 18, a configuration having one exchange mechanism on one side of each of the targets 3 and 4 may be used, as long as the exchange mechanism has a telescopic gripper. It is effective to provide a holding mechanism capable of storing a plurality of membrane controllers at the holding positions of the membrane controllers, and to use a single exchange mechanism to exchange a plurality of types of membrane controllers.

(Embodiment 2)
The second embodiment has the same basic configuration as the first embodiment, but the exchange mechanism and the exchange method of the membrane controller are different. Therefore, the description will focus on this difference. The same components as those in the first embodiment are denoted by the same reference numerals.

FIG. 6 is a cross-sectional view of a main part when the target 3 side is viewed from the center of the vacuum chamber 2 except for the substrate holder 5.

The film forming apparatus of the second embodiment has two types of film controllers 21 and 22 having different shapes in parallel with the target 3. The film controller 21 is provided at a position facing the target 3. Guides 23 are installed above and below the membrane controllers 21 and 22, and upper and lower columns of the membrane controllers 21 and 22 are fitted to the guide 23. Here, the membrane controllers 21 and 22 can be slid left and right by guides 23 provided at the top and bottom. Further, the support on the membrane controllers 21 and 22 is connected to a wire 24 stretched in parallel with the guide 23. The wire 24 is connected to winders 25 and 26 installed near both ends of the guide 23. Here, the winders 25 and 26 are configured to be able to control the rotation by a motor (not shown).

交換 A method for replacing a film controller using the film forming apparatus having the above-described configuration will be described below.

As in the first embodiment, the winders 25 and 26 are rotated in a state where the substrate holder 5 is in the vacuum chamber 1, the gate valve 7 is closed, and the vacuum chamber 2 is kept in a vacuum. As a result, the wire 24 moves left and right. The film controllers 21 and 22 connected to the wire 24 move in front of the target 3 along the guide 23. Here, a desired film controller is moved to a position facing the target 3, and the substrate holder 5 holding the substrate is transferred to the vacuum chamber 2 to perform sputtering film formation, as in the first embodiment.

回 転 By rotating the winders 25 and 26, an arbitrary film controller can be moved to a position facing the target 3 while keeping the vacuum chamber 2 at a vacuum.

In the second embodiment, an example of the predetermined position of the present invention corresponds to a position facing the target 3, and an example of the holding position of the present invention is a film position at the position facing the target 3. This corresponds to a position where there is no controller, and corresponds to the position of the membrane controller 22 in FIG. 6 as an example of the holding position.

Further, in the second embodiment, the exchange mechanism of the present invention includes the guide 23, the wire 24, and the winders 25 and 26. However, the position, the number, and the number of the guide shown in FIG. The mechanism is not limited to a winding mechanism using a wire, but may be any mechanism for exchanging a membrane controller using a guide.

In the second embodiment, the membrane controller of the present invention corresponds to the two membrane controllers 21 and 22. However, two or more membrane controllers may be provided in the guide 23.

(Embodiment 3)
The third embodiment has the same basic configuration as the first embodiment, but the exchange mechanism and the exchange method of the membrane controller are different. Therefore, the explanation will be focused on this difference. The same components as those in the first embodiment are denoted by the same reference numerals.

FIG. 7 is a plan view of a main part of the film forming apparatus according to the third embodiment.

膜 As shown in the figure, the film controller 31 is located between the target 37 and the substrate holder 5 in the vacuum chamber 2. Further, the membrane controller 31 is gripped by a gripper 33. The gripper 33 is fixed to a rotation mechanism 35 installed on the side surface inside the vacuum chamber 2 and on the left side of the target 37 when viewed from above. Further, the film controller 32 is located at a retracted position from between the target 37 and the substrate holder 5, and is gripped by the gripper 34 similarly to the film controller 31. The gripper 34 is fixed to a rotation mechanism 36 installed on the side surface inside the vacuum chamber 2 and on the right side of the target 37 when viewed from above.

In the third embodiment, the target 37 is divided into two electrodes, and is configured to discharge by applying an AC voltage between the two electrodes.

交換 A method for replacing a film controller using the film forming apparatus having the above-described configuration will be described below.

As in the first embodiment, when the substrate holder 5 is in the vacuum chamber 1, the gate valve 7 is closed, and the vacuum chamber 2 is kept in a vacuum, the film controllers 31 and 32 are replaced. Do. When the film controller 31 is retracted from between the target 37 and the substrate holder 5, the film controller 31 is rotated leftward with the rotation mechanism 35 as a fulcrum, so that the film controller 31 is moved between the target 37 and the substrate holder 5 drawn by a dotted line. Move to the position.

In addition, the film controller 32 located at a position other than between the target 37 and the substrate holder 5 performs a left rotation in the direction of the arrow using the rotation mechanism 36, thereby positioning the film controller 32 between the target 37 and the substrate holder 5. Can be made. The arrow in FIG. 7 indicates the direction of rotation by the rotation mechanisms 35 and 36. Subsequently, as in the first embodiment, the substrate holder 5 holding the substrate is transported to the vacuum chamber 2 and a sputter film is formed.

As described above, by rotating the rotation mechanisms 35 and 36, a desired film controller can be moved to a position between the target 37 and the substrate holder 5 while maintaining the vacuum in the vacuum chamber 2. .

In the third embodiment, an example of the predetermined position of the present invention corresponds to a position between the target 37 and the substrate holder 5, and an example of the holding position of the present invention This corresponds to a position other than between the substrate holders 5, and in FIG. 7 corresponds to the position of the film controller 32.

In the third embodiment, the exchange mechanism according to the fourth aspect of the present invention corresponds to an exchange mechanism configured by rotating mechanisms 35 and 36 and grippers 33 and 34, but is not limited to the above-described configuration. In short, all that is required is an exchange mechanism that can position one of the membrane controllers at a predetermined position by rotating.

Further, in the first, second, and third embodiments, by providing a plurality of types of film controllers in the vacuum chamber 2, it is possible to make the film thickness uniform more precisely according to the sputtering conditions. In addition, it is possible to continuously produce a plurality of types of optical thin films without opening the vacuum chamber 2 to the air, thereby improving productivity.

(Embodiment 4)
The fourth embodiment has the same basic configuration as the first embodiment, but the exchange mechanism and the exchange method of the membrane controller are different. Therefore, the description will be focused on this difference. The same components as those in the first embodiment are denoted by the same reference numerals.

FIG. 8 is a plan view of a main part of the film forming apparatus according to the fourth embodiment.

As shown in the figure, the film forming apparatus according to the fourth embodiment has an exchange mechanism 43. The exchange mechanism 43 shown in the figure is an exchange mechanism when attaching the membrane controllers 41 and 46. The exchange mechanism 43 is mounted on a rotation mechanism of the substrate holder 5 (not shown). Further, the exchange mechanism 43 has a cylindrical shape, and arms 42 and 47 are provided on the side surface of the column vertically from the side surface of the column. Note that the arm 42 and the arm 47 are installed facing each other in the diameter direction of the circle. The dotted line indicates the position when the substrate holder 5 is transferred into the vacuum chamber 2, and is provided between the targets 3 and 4 and the substrate holder 5 for fixing the film controllers 41 and 46. Fixtures 45 and 48 are provided. The arms 42 and 47 have a length that allows the film controllers 41 and 46 to be positioned on the fixtures 45 and 48.

FIG. 10 is an enlarged view of the distal end of the arm 47 holding the membrane controller 46 and the fixing tool 48. As shown in the figure, a rectangular parallelepiped gripping tool 49 is provided at the tip of the arm 47. The gripping tool 49 has a notch 49b in a direction perpendicular to the arm 47 from the left side surface when viewed from the exchange mechanism 43. A leaf spring 49a is provided on the upper surface of the gripping tool 49 along the cut 49b. FIGS. 11A, 11B, and 11C are views showing a process of attaching the membrane controller 46 to the fixture 45 when viewing the fixture 48 from the center of the vacuum chamber 2 and shown in the drawings. As described above, the leaf spring 49a has a pin shape, and the leaf spring spreads in the opening direction of the notch 49b of the gripper 49.

The exchange mechanism for removing the membrane controller 46 has the same basic configuration as the exchange mechanism for attaching the membrane controller 46, except that the opening direction of the leaf spring 49a is parallel to the notch 49b. It is upside down. FIGS. 12A, 12B, and 12C are views of the process of removing the membrane controller 46 from the fixture 45 as viewed from the center of the vacuum chamber 2 toward the fixture 48. As shown in FIGS. When the membrane controller 46 is removed, the leaf spring 49c is expanded in the direction opposite to the opening direction of the cut 49b.

Further, the fixture 48 is also a rectangular parallelepiped, and has a cutout portion 48a parallel to the side surface on which the target 4 of the vacuum chamber 2 is provided from the left side when viewed from the center of the vacuum chamber 2. ing.

The film controller 46 has a film controller 46a, and a support 46b extends above the film controller 46a. In addition, two pins 46c are provided above the film controller 46a of the support 46b so as to be vertically opposed to the support 46b. Further, a film control fixing portion 46d is provided on the top of the pin 46c at the tip of the column 46b. The width of the film control fixing portion 46d is larger than the width of the cut portion 48a. In addition, the width of the support 46 b is smaller than the width of the notch 49 b of the gripping tool 49 and the width of the notch 48 a of the fixing tool 48.

A method of attaching a film controller using the film forming apparatus having the above configuration will be described below.
FIGS. 9A, 9B, and 9C are plan views of main parts of a film forming apparatus showing a process of attaching a film controller.

First, FIG. 9A shows a state in which a film controller is not installed in the vacuum chamber 2, and the door 8 is opened with the gate valve 7 closed and the vacuum chamber 2 kept in vacuum.

Next, the substrate holder 5 used for film formation is removed from the transport mechanism 19, and the replacement mechanism 43 for mounting the film controller 46 on the empty transport mechanism 19 is mounted. Then, the support 46b between the pin 46c and the membrane controller 46a is inserted into the notch 49b of the gripper 49 at the tip of the arm 42, 47 of the exchange mechanism 43, and the membrane controller 46 is grasped. Here, the leaf spring 49a prevents the film controller 46 from dropping from the gripper 49 during the later-described conveyance. FIG. 9A shows this state.

Next, the door 8 is closed, the vacuum chamber 1 is evacuated to a vacuum, the gate valve 7 is opened, and the exchange mechanism mounted on the transport mechanism 19 is transported to the vacuum chamber 2, and the vacuum chamber 2 is shown in FIG. The replacement mechanism 43 is placed on a rotating mechanism that has not been rotated, and the gate valve 7 is closed. FIG. 9B shows this state.

Subsequently, when the rotation mechanism of the vacuum chamber 2 is rotated clockwise as viewed from above, the exchange mechanism 43 also rotates. The arrow shown in FIG. 9B indicates the rotation direction of the exchange mechanism 43.

Here, FIGS. 11A, 11B, and 11C are longitudinal cross-sectional views of a main part of the vacuum chamber 2 as viewed from the center direction, showing a process in which the film controller 46 is fitted to the fixture 48. The arrow in the figure indicates the rotation direction of the exchange mechanism. FIG. 11A shows a state in which the rotation of the arm 47 causes the membrane controller 46 to approach the fixture 48.

Next, the support 46b between the pin 46c and the membrane control fixing portion 46d of the membrane controller 46 is fitted into the cutout 48a of the fixture 48. This state is shown in FIG. At this time, the leaf spring 49a is pressed by the pin 46c.

Subsequently, since the arm 47 rotates to the right in the drawing, the gripper 49 is separated from the membrane controller 46 along the cut 49b of the gripper 49 while leaving the membrane controller 46 in the fixture 48. . This state is shown in FIG. These operations attach the membrane controller 46 to the fixture 48. The same operation is also performed on the arm 42 side, so that the membrane controller 41 is fixed to the fixture 45.

Next, the gate valve 7 is opened again, and the exchange mechanism 43 is transported to the vacuum chamber 1 by the transport mechanism 19.

Finally, after closing the gate valve 7, air is introduced into the vacuum chamber 1, the door 8 is opened, and the replacement mechanism 43 and the substrate holder 5 are replaced, and sputtering film formation is performed in the same manner as in the first embodiment. Do.

(4) A method for removing the film controllers 41 and 46 installed in front of the target in the vacuum chamber 2 will be described below.

(4) First, as in the case of attachment, the vacuum chamber 1 is opened, and the substrate holder 5 is replaced with the replacement mechanism 43 when the substrate holder 5 is removed. Next, the vacuum chamber 1 is evacuated to a vacuum, the gate valve 7 is opened, and the exchange mechanism 43 is transported to the vacuum chamber 2 and placed on the rotating mechanism.

Subsequently, the rotation mechanism is rotated counterclockwise when viewed from the top, which is the opposite direction when the membrane controllers 41 and 46 are attached. This state is shown in FIG.

FIGS. 12A, 12B, and 12C are views of the process of removing the membrane controller 46 from the fixture 45 when viewing the fixture 48 from the center of the vacuum chamber 2. The arrow in FIG. 12A indicates the direction in which the arm 47 rotates. FIG. 12A shows a state in which the arm 47 approaches the membrane controller 46 fixed to the fixture 48 by rotation.

Next, the support 46b between the membrane control fixing portion 46d of the membrane controller 46 and the pin 46c is fitted along the cut portion 49b of the gripper 49. This state is shown in FIG. At this time, the leaf spring 49c is pressed by the pin 46c.

支 The support 46b of the membrane controller 46 fits into the notch 49b of the gripper 49, and the membrane controller 46 is removed along the notch 48a of the fixture 48 as the arm 47 rotates. FIG. 12C shows this state.

膜 In addition, the membrane controller 41 is also removed through the same process as the fixing tool 48.

Finally, while holding the membrane controllers 41 and 46, the exchange mechanism 43 is transported to the vacuum chamber 1, the gate valve 7 is closed, and then the vacuum chamber 1 is opened to air, and the membrane controller can be removed. It becomes.

Here, the removed film controllers 41 and 46 can be replaced with a film controller to be used next and mounted, or if it is desired to perform film formation without a film controller, The exchange mechanism 43 can be mounted on the substrate holder 5 and the process can be shifted to the sputtering film formation process.

As described above, the membrane controller can be replaced while the vacuum chamber 2 is kept at a vacuum. Therefore, the same effect as in the first embodiment can be obtained.

Further, in the fourth embodiment, the film controller is taken out of the film forming apparatus via the vacuum chamber 1 without being limited to the attachment and detachment of the film controller to a predetermined position in the vacuum chamber 2 and a new one. It is possible to attach a membrane controller. Thus, unlike the first, second, and third embodiments, a plurality of predetermined film controllers are stored in the vacuum chamber 2, and appropriate film control is performed without being limited by the number of film controllers to be used. A desired film thickness distribution is realized by using a vessel, and a desired optical thin film product can be produced.

Also, a newly created or adjusted desired film controller can be immediately installed in front of the target. Therefore, it is possible to evaluate the film thickness distribution of the previously installed film controller and to immediately use a film controller finely adjusted to further improve the accuracy.

In addition, although the leaf springs 49a and 49c are provided to prevent the exchange mechanism 43 from dropping when being transported, the leaf springs 49a and 49c may not be provided if the vibration caused by the transport is small. In this case, the same replacement mechanism can be used when attaching the membrane controller 46 and when removing the membrane controller 46.

In the fourth embodiment, the exchange mechanism rotated by the rotation mechanism according to the eighth aspect of the present invention is an exchange mechanism including a gripper 49, a leaf spring 49c, a notch 49b, an arm 47, and an arm 42 having the same configuration. It corresponds to the mechanism 43, and fixes the membrane controller 46 at a predetermined position of the present invention by being inserted into the notch portion 48a of the fixing tool 48. However, the structure of the exchange mechanism 43 and the fixing tool 48 is not required. In short, any exchange mechanism that can be rotated by the rotation mechanism to position the membrane controller at a predetermined position can be used.

(Embodiment 5)
The fifth embodiment has the same basic configuration as that of the first embodiment, but the exchange mechanism and the exchange method of the membrane controller are different. Therefore, the description will focus on this difference. The same components as those in the first embodiment are denoted by the same reference numerals.

FIGS. 13A and 13B are plan views of a main part of a film forming apparatus according to the fifth embodiment.

成膜 As shown in the drawing, the film forming apparatus according to the fifth embodiment has an exchange mechanism 55 that can be replaced in the transport mechanism 19. The exchanging mechanism 55 has arms 53 and 54 that can extend and contract perpendicular to the transport direction, and are attached to opposing side surfaces. In addition, fixtures 56 and 57 for fixing the film controllers 51 and 52 are installed in the upper front part of the targets 3 and 4 in the vacuum chamber 2.

Here, FIG. 14 is an enlarged view of the arm 53 and the fixture 56 that grip the membrane controller 51. As shown in the figure, two grippers 53a are provided at the tip of the arm 53 in parallel in the direction of movement of the arm. The fixture 56 has a rectangular parallelepiped shape protruding from the side surface of the vacuum chamber 2 above the target 3. A fixing groove 56 a is dug in the top surface of the fixing tool 56 in parallel with the target 3. Further, the insertion portion 56b is dug in the fixture 56 vertically from the tip of the fixture 56 to a portion intersecting with the fixing groove 56a, and from the upper surface to the lower surface of the fixed portion 56.

The membrane controller 51 has a membrane controller 51a, and a support 51b is fixed above the membrane controller 51a. Further, the tip of the support 51b is a fixed portion 51c having a wide support 51b. Note that the width of the support 51b is smaller than the insertion portion 56b, and the width orthogonal to the widened width of the fixing portion 51c is smaller than the width of the fixing groove 56a.

As shown in FIGS. 13A and 13B, a connection port 59 is provided in the vacuum chamber 1, and a control signal for expansion and contraction of the arms 53 and 54 is provided from the exchange mechanism 55 to the connection port 59. An electric wire 58 is connected to supply electric power.

A method of attaching a film controller using the film forming apparatus having the above configuration will be described below.
FIGS. 13A and 13B are plan views of main parts of a film forming apparatus showing a process of attaching a film controller. 15 (a), (b), (c), and (d) are longitudinal cross-sectional views of a main part from the direction of the gate valve 7 showing a process of attaching the film controller 51 to the fixture 56.

FIG. 13A shows a state in which the film controllers 51 and 52 are not installed on the fixtures 56 and 57 in front of the targets 3 and 4.

First, the arms 53 and 54 of the exchange mechanism 55 hold the membrane controllers 51 and 52. Here, as shown in FIG. 14, the support 51b of the membrane controller 51 is fixed between the two rods of the gripper 53a at the tip of the arm 53 by being sandwiched therebetween. Similarly, the membrane controller 52 is fixed, and the door 8 is closed. Next, the vacuum chamber 1 is evacuated to a vacuum, the gate valve 7 is opened, and the exchange mechanism 55 is transported to the vacuum chamber 2 by the transport mechanism 19.

(4) Here, since the electric wire 58 extends from the connection port 59 of the vacuum chamber 1 to the vacuum chamber 2, the membrane controllers 51 and 52 are attached and detached with the gate valve 7 kept open.

Next, as shown in FIG. 13B, the arms 53 and 54 of the exchange mechanism 55 transported to the vacuum chamber 2 are extended, and the membrane controllers 51 and 52 are inserted into the fixtures 56 and 57, respectively.

FIG. 15A shows a state in which the arm 53 extends rightward, which is the direction of the arrow in the figure, and approaches the fixing tool 56.

Subsequently, when the arm 53 is extended, the column 51b of the membrane controller 51 is fitted along the insertion portion 56b of the fixture 56. FIG. 15B shows this state.

Next, by lowering the arm 53, the fixing portion 51c of the membrane controller 51 fits into the fixing groove 56a of the fixing device 56. FIG. 15C shows this state.

Next, the grip of the film controller 51 by the gripping tool 53a is released, and the arm 53 is contracted. FIG. 15D shows this state. The arrow in the figure indicates the direction in which the arm 53 is contracted.

膜 The membrane controller 52 is also attached to the fixture 57 in the same manner as in the above process.

Next, the exchange mechanism 55 is transported to the vacuum chamber 1, the gate valve 7 is closed, air is introduced into the vacuum chamber 1, and the door 8 is opened.

(4) Finally, the electric wire 58 is removed, the replacement mechanism 55 is mounted on the substrate holder 5, and a step of forming a film by sputtering on the substrate is performed as in the first embodiment.

(4) A method for removing the film controllers 51 and 52 installed in front of the target in the vacuum chamber 2 will be described below.

First, the door 8 of the vacuum chamber 1 is closed using the exchange mechanism 55 that does not hold the membrane controllers 51 and 52, and after the vacuum is established, the gate valve 7 is opened and the exchange mechanism 55 is transported to the vacuum chamber 2. I do.

Subsequently, the arms 53 and 54 are extended. Here, FIG. 16A shows a state in which the arm 53 extends and approaches the fixing fixture 56. The arrow in the figure indicates the direction in which the arm 53 is extended.

Next, the arm 53 is continuously extended, and the support 51b of the membrane controller 51 is inserted between the two grippers 53a at the tip of the arm 53, and is gripped by being sandwiched. FIG. 16B shows this state.

Next, the membrane controller 51 is lifted by moving the arm 53 upward, and the fixing portion 51c is removed from the fixing groove 56a. FIG. 16C shows this state.

Next, the arm 53 is contracted while holding the membrane controller 51. FIG. 16D shows this state. The direction of the arrow in the drawing indicates the direction in which the arm 53 is contracted.

{Circle around (5)} Similarly to the membrane controller 51, the membrane controller 52 is gripped and removed by the arm 54.

Next, the exchange mechanism 55 is returned to the vacuum chamber 1, the gate valve 7 is closed, the vacuum chamber 1 is opened to air, and the membrane controllers 51 and 52 are taken out.

As described above, in the fifth embodiment, it is possible to replace the membrane controller while keeping the vacuum chamber 2 at a vacuum.

Further, similarly to the fourth embodiment, the film controller is not limited to the attachment and detachment of the film controller at a predetermined position in the vacuum chamber 2 but is taken out of the film forming apparatus via the vacuum chamber 1. A new membrane controller can be installed.

In the replacement mechanisms of the fourth and fifth embodiments, it is also effective to mount a battery as a power source and drive the arm.

The vacuum chamber in which the third vacuum chamber of the present invention is also used as the first vacuum chamber corresponds to the vacuum chamber 1 in the fourth and fifth embodiments. The transport mechanism in which the first transport mechanism of the present invention also serves as the second transport mechanism corresponds to the transport mechanism 19.

(Embodiment 6)
The sixth embodiment has the same basic configuration as the first embodiment, but the exchange mechanism and the exchange method of the membrane controller are different. Therefore, the explanation will be focused on this difference. The same components as those in the first embodiment are denoted by the same reference numerals.

FIGS. 17 (a), (b), and (c) are main part cross-sectional configuration diagrams of the film forming apparatus according to the sixth embodiment, and FIG. 18 is a main part enlarged cross-sectional configuration diagram.

As shown in the figure, the film forming apparatus according to the sixth embodiment has a vacuum chamber 61 connected to the vacuum chamber 2 above the target 3. Further, the vacuum chamber 61 is connected to the vacuum chamber 2 via a gate valve 65, and can be evacuated independently.

搬 送 A transfer mechanism 63 is installed in the vacuum chamber 61, and an exchange mechanism 66 is installed in the transfer mechanism 63. Further, a fixture 64 for fixing the film controller 62 is provided between the target 3 and the substrate holder 5 in the vacuum chamber 2. Here, FIG. 18 shows an enlarged view of the vacuum chamber 61 portion. FIG. 18 is a diagram illustrating a state where the membrane controller 62 is gripped. As shown in the figure, the transfer mechanism 63 is a rail-shaped transfer mechanism installed on the upper and lower sides of the vacuum chamber 61, and has an exchange mechanism 66 that can move up and down along the transfer mechanism 63. Further, the exchange mechanism 66 has a gripper 66 a extending in a direction perpendicular to the transport mechanism 63. The gripper 66a can be moved by a motor (not shown) while maintaining the upper surface of the exchange mechanism 66 parallel to the bottom surface of the vacuum chamber 61.

The film controller 62 has a film controller 62a, and a support 62d is fixed above the film controller 62a. The support 62d above the membrane control unit 62a has a fixing portion 62c perpendicular to the support 62d, and a grip 62b is provided at the tip of the support 62d above the 62c perpendicular to the support 62d. .

方法 A method of attaching a film controller using the film forming apparatus having the above configuration will be described below.

(1) First, the vacuum chamber 61 is opened to air while the gate valve 65 is closed. Next, the membrane controller 62 is set on the exchange mechanism 66 by placing the grip portion 62b of the membrane controller 62 on the gripper 66a of the exchange mechanism 66. FIG. 17A shows this state.

Next, the vacuum chamber 61 is evacuated to vacuum, the gate valve 65 is opened, and the exchange mechanism 66 holding the film controller 62 is transported from the vacuum chamber 61 to the vacuum chamber 2 using the transport mechanism 63.

は The transported film controller 62 has the fixing portion 62c of the film controller 62 placed and fixed on a fixture 64 located above and in front of the target 3. This state is shown in FIG.

(5) Next, the gripper 66a of the exchange mechanism 66 is moved in parallel to the bottom surface of the vacuum chamber 61 to release the grip of the membrane controller 62 placed on the exchange mechanism 66. Subsequently, with the membrane controller 62 placed on the fixture 64, the exchange mechanism 66 is moved upward, housed in the vacuum chamber 61, and the gate valve 65 is closed. This state is shown in FIG.

According to the above description, the film controller 62 can be attached to a predetermined position while the vacuum chamber 2 is kept at a vacuum.

(4) A method of removing the film controller 62 installed in front of the target in the vacuum chamber 2 will be described below.

(4) After evacuating the vacuum chamber 61, the gate valve 65 is opened, and the replacement mechanism 66 is lowered into the vacuum chamber 2. Next, by moving the gripper 66a in parallel, the gripper 62b of the film controller 62 is placed on the gripper 66a. Subsequently, the film controller 62 is transported upward. After the film controller 62 and the exchange mechanism 66 are housed in the vacuum chamber 61, the gate valve 65 is closed and the vacuum chamber 61 is opened to the air, whereby the film controller 62 can be taken out.

The target 4 side has the same configuration as the target 3 side, so that the membrane controller can be located in front of the target 4 and can be removed.

The effect of the sixth embodiment is the same as that of the fourth and fifth embodiments. In addition, it is not necessary to replace the substrate holder and the film control and exchange mechanism in the vacuum chamber 1, and the exchange mechanism is eliminated. However, since it has a relatively small size and a simple configuration, it has the advantages of being rational and reducing the cost of the apparatus.

Note that the third vacuum chamber of the present invention corresponds to the vacuum chamber 61 provided with the gate valve 65 in the sixth embodiment, but this is not the case. The membrane controller 62 can be replaced while the vacuum chamber 2 is kept in a vacuum even with a configuration in which a place capable of accommodating the 62 and its exchange mechanism 66 is provided.

The third vacuum chamber of the present invention corresponds to the vacuum chamber 61 in the sixth embodiment. The first transport mechanism of the present invention corresponds to the transport mechanism 19, and the second transport mechanism corresponds to the transport mechanism 63. Further, the predetermined position of the present invention corresponds to a position where the membrane controller 62 is fixed to the fixture 64.

The first vacuum chamber of the present invention corresponds to the vacuum chamber 1, and the second vacuum chamber of the present invention corresponds to the vacuum chamber 2.

The purpose of using / exchanging the film controller is to replace the film controller with a controller with the optimal shape when the target is dug and the film thickness distribution changes due to changes in the target itself. Correcting the change in thickness distribution to obtain a desired distribution, forming a desired non-uniform film thickness on a substrate, forming different film thickness distributions to make different optical thin film types, and so on. If the target film thickness distribution is good and the required accuracy is satisfied without using a film controller, all the film controllers may be evacuated to form a film. It is also effective to use the film controller of the present invention to further finely control the film thickness while fixing the plate at another place in front of the target.

In the first, second, third, fourth, fifth and sixth embodiments, the sputter deposition apparatus of the present invention has two types of targets, an oxidation zone, and a mechanism for exchanging a film controller. The method of exchanging the film controller of the present invention is also effective for an apparatus which does not have an oxidation zone having only one type of target, and is effective for an apparatus for performing sputter film formation.

A method for exchanging a film forming apparatus and a film controller according to the present invention is a method for controlling a film thickness of a sputter film formed on a substrate while maintaining a second vacuum chamber in which a target is installed in a vacuum. It has an effect that the container can be replaced, and is useful for an apparatus for forming an optical thin film by a sputtering method.

FIG. 2 is a plan view of a main part of the film forming apparatus according to the first embodiment of the present invention. FIG. 1 is a vertical sectional view of a main part of a film forming apparatus according to a first embodiment of the present invention. FIG. 4 is a plan view of a main part of the film forming apparatus for explaining a step of replacing the film controller according to the first embodiment of the present invention. FIG. 3 is a plan view of a main part of the film forming apparatus for explaining a step of replacing the film controller according to the first embodiment of the present invention. FIG. 4 is a plan view of a main part of the film forming apparatus for explaining a step of replacing the film controller according to the first embodiment of the present invention. FIG. 6 is a vertical sectional view of a main part of a film forming apparatus according to a second embodiment of the present invention. FIG. 9 is a plan view of a main part of a film forming apparatus according to a third embodiment of the present invention. FIG. 13 is a plan view of a main part of a film forming apparatus according to a fourth embodiment of the present invention. (A) The figure for demonstrating the process which positions the film | membrane controller in the predetermined position in Embodiment 4 of this invention. (B) is a diagram for explaining the positional relationship between the exchange mechanism 43 and the fixtures 45 and 48 in the step of positioning the membrane controller at a predetermined position according to the fourth embodiment of the present invention. (C) A diagram for explaining the positional relationship between the exchange mechanism 43 and the fixtures 45 and 48 in the step of removing the membrane controller from the predetermined position according to the fourth embodiment of the present invention. FIG. 14 is an enlarged view of an arm 47, a membrane controller 46, and a fixing tool 48 according to Embodiment 4 of the present invention. (A) The figure for demonstrating the positional relationship of the film | membrane controller 46, the fixing tool 48, and the arm 47 in the process of positioning the film | membrane controller 46 in the predetermined position in Embodiment 4 of this invention. (B) A diagram for explaining the positional relationship among the membrane controller 46, the fixture 48, and the arm 47 in the step of positioning the membrane controller 46 at a predetermined position in the fourth embodiment of the present invention. (C) A diagram for explaining the positional relationship among the membrane controller 46, the fixture 48, and the arm 47 in the step of positioning the membrane controller 46 at a predetermined position in the fourth embodiment of the present invention. (A) The figure for demonstrating the positional relationship of the film controller 46, the fixing tool 48, and the arm 47 in the process of removing the film controller 46 from a predetermined position in Embodiment 4 of this invention. (B) A diagram for explaining a positional relationship among the membrane controller 46, the fixture 48, and the arm 47 in the step of removing the membrane controller 46 from a predetermined position in the fourth embodiment of the present invention. (C) A diagram for explaining a positional relationship among the membrane controller 46, the fixture 48, and the arm 47 in the step of removing the membrane controller 46 from a predetermined position in the fourth embodiment of the present invention. (A) The figure for demonstrating the process which positions the film | membrane controller 51, 52 in the predetermined position in Embodiment 5 of this invention. (B) A diagram for explaining a step of positioning the film controllers 51 and 52 at predetermined positions according to the fifth embodiment of the present invention. FIG. 15 is an enlarged view of an arm 53, a membrane controller 51, and a fixture 56 according to a fifth embodiment of the present invention. (A) The figure for demonstrating the positional relationship of the film controller 51, the fixing tool 56, and the arm 53 in the process of positioning the film controller 51 in a predetermined position in Embodiment 5 of this invention. (B) is a diagram for explaining the positional relationship among the membrane controller 51, the fixture 56, and the arm 53 in the step of positioning the membrane controller 51 at a predetermined position in the fifth embodiment of the present invention. (C) A diagram for explaining the positional relationship among the membrane controller 51, the fixture 56, and the arm 53 in the step of positioning the membrane controller 51 at a predetermined position according to the fifth embodiment of the present invention. (D) A diagram for explaining the positional relationship among the membrane controller 51, the fixing tool 56, and the arm 53 in the step of positioning the membrane controller 51 in the predetermined position according to the fifth embodiment of the present invention. (A) The figure for demonstrating the positional relationship of the film | membrane controller 51, the fixing tool 56, and the arm 53 in the process of removing the film | membrane controller 51 in Embodiment 5 of this invention from a predetermined position. (B) A diagram for explaining the positional relationship among the membrane controller 51, the fixture 56, and the arm 53 in the step of removing the membrane controller 51 from the predetermined position according to the fifth embodiment of the present invention. (C) A diagram for explaining a positional relationship among the membrane controller 51, the fixture 56, and the arm 53 in the step of removing the membrane controller 51 from a predetermined position in the fifth embodiment of the present invention. (D) A diagram for explaining the positional relationship among the membrane controller 51, the fixture 56, and the arm 53 in the step of removing the membrane controller 51 from the predetermined position in the fifth embodiment of the present invention. (A) The figure for demonstrating the process of positioning the film | membrane controller 62 in the predetermined position in Embodiment 6 of this invention. (B) is a diagram for explaining a step of positioning the membrane controller 62 at a predetermined position according to the sixth embodiment of the present invention. {Circle around (c)} is a diagram for explaining a step of positioning the membrane controller 62 at a predetermined position according to the sixth embodiment of the present invention. FIG. 14 is an enlarged cross-sectional view of a main part of a vacuum chamber 61 and a transport mechanism 63 of a film controller 62 according to a sixth embodiment of the present invention. FIG. 9 is a plan view of a main part of a conventional film forming apparatus.

Explanation of reference numerals

1 Vacuum chamber 2 Vacuum chamber 3 Target 4 Target 5 Substrate holder 6 Oxidation zone 7 Gate valve 8 Door 11 Membrane controller 11a Membrane controller 11b Post 12 Exchange mechanism 12a Pedestal portion 12b Arm 13 Membrane controller 14 Exchange mechanism 15 Membrane control 16 exchange mechanism 17 membrane controller 18 exchange mechanism 19 transport mechanism

Claims (13)

A first vacuum chamber for exchanging substrates,
A second vacuum chamber connected to the first vacuum chamber and capable of being independently evacuated and performing sputter film formation;
A substrate holder for holding the substrate,
A transfer mechanism for transferring the substrate holder from the first vacuum chamber to the second vacuum chamber;
A plurality of film controllers arranged in the second vacuum chamber and controlling formation of a sputter film on the substrate;
An exchange mechanism that can selectively position one of the film controllers at a predetermined position between a target installed in the second vacuum chamber and the substrate transferred into the second vacuum chamber; A film forming apparatus comprising: The exchange mechanism includes a telescopic gripper for moving the plurality of membrane controllers between the predetermined position and a holding position retracted from the predetermined position by expansion and contraction, and the plurality of membrane controllers are controlled by the telescopic gripper. The film forming apparatus according to claim 1, wherein a selected one of the containers is moved from the holding position to the predetermined position. The exchange mechanism includes a guide for moving the plurality of membrane controllers between the predetermined position and a holding position retracted from the predetermined position, and the plurality of membrane controllers are moved along the guide. 2. The film forming apparatus according to claim 1, wherein a selected one of them is moved from said holding position to said predetermined position. The exchange mechanism includes a rotary gripper that rotates the plurality of membrane controllers between the predetermined position and a holding position retracted from the predetermined position, and the plurality of membrane controllers are controlled by the rotary gripper. The film forming apparatus according to claim 1, wherein a selected one of the containers is moved from the holding position to the predetermined position. The film forming apparatus according to any one of claims 1 to 4, wherein the plurality of film controllers have different shapes. A first vacuum chamber for exchanging substrates,
A second vacuum chamber connected to the first vacuum chamber for performing sputter film formation that can be independently evacuated;
A third vacuum chamber connected to the second vacuum chamber and capable of being evacuated independently;
A substrate holder for holding the substrate,
A first transfer mechanism for transferring the substrate holder from the first vacuum chamber to the second vacuum chamber;
An exchange mechanism that can position a film controller at a predetermined position between a target installed in the second vacuum chamber and the substrate transferred into the second vacuum chamber;
A gripper for gripping the membrane controller provided in the exchange mechanism,
By transporting the exchange mechanism between the third vacuum chamber and the second vacuum chamber, the film controller held by the exchange mechanism is retracted from the predetermined position and the predetermined position. A film forming apparatus comprising: a second transfer mechanism that moves between third vacuum chambers. 7. The film forming apparatus according to claim 6, wherein the third vacuum chamber is also used as the first vacuum chamber. 7. The film forming apparatus according to claim 6, wherein the first transport mechanism that transports the substrate holder also functions as the second transport mechanism that transports the exchange mechanism. 7. The exchange mechanism according to claim 6, further comprising a rotation mechanism installed in the second vacuum chamber, wherein the exchange mechanism is configured to be rotated by the rotation mechanism to position the membrane controller at the predetermined position. 8. Film forming equipment. 10. The film forming apparatus according to claim 9, wherein the rotation mechanism is a rotation mechanism in which a rotation direction is reversed when the film controller is positioned at the predetermined position and when the film controller is removed from the predetermined position. 7. The film forming apparatus according to claim 6, wherein the gripper is an arm that expands and contracts to the predetermined position, and the exchange mechanism is an exchange mechanism that extends the arm to the predetermined position to position the film controller at the predetermined position. . A method for exchanging a film controller using the film forming apparatus according to claim 1,
With the second vacuum chamber kept in a vacuum, one of a plurality of film controllers arranged in the second vacuum chamber is positioned at the predetermined position using the exchange mechanism. Process and
Performing a sputter deposition on the substrate transported into the second vacuum chamber;
Using the exchange mechanism to move the membrane controller from the predetermined position to a retracted holding position,
Using the exchange mechanism to position another one of the membrane controllers at the predetermined position. A method for replacing the film controller using the film forming apparatus according to claim 6,
A step of causing the exchange mechanism to grip a membrane controller while the second vacuum chamber is maintained at a vacuum;
Evacuating the third vacuum chamber;
Transporting the film controller gripped by the exchange mechanism from a third vacuum chamber to a second vacuum chamber using the second transport mechanism;
A step of positioning the membrane controller at the predetermined position by an exchange mechanism transported to the second vacuum chamber;
Forming a sputter film on a substrate transferred by the first transfer mechanism from the first vacuum chamber into the second vacuum chamber;
Transporting the exchange mechanism gripping the membrane controller from the second vacuum chamber to the third vacuum chamber using the second transport mechanism;
Opening the third vacuum chamber to the atmosphere, removing the membrane controller from the exchange mechanism, and causing the exchange mechanism to grip a new membrane controller.

Images