JP2004134519A - Photoresist supply system and method therefor - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for supplying a material of a photoresist or the like for substantially preventing formation of minute bubbles, and to provide its system. <P>SOLUTION: The photoresist supply system includes a resist storing bottle, and an acceptor connected so that a fluid passes through thereto. A vacuum pump is ventilated with and connected to the acceptor, and a vacuum condition is formed inside the acceptor to suck the resist from the storing bottle so as to take it in the acceptor. An introduction part of the acceptor is formed so as to allow the resist to flow in downward from the inner wall. The resist flows out from the acceptor to flow in a resist supply container, and is pumped therefrom to a feed nozzle to be applied on a wafer or a substrate. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates generally to semiconductor wafer and compact disc manufacturing, and more particularly to a system and method for providing photoresist or other similar processing fluid.
[0002]
[Prior art]
In the fabrication of semiconductor wafers, photolithographic processes are used to create patterns on the surface of the wafer. Photolithography, a key step in wafer fabrication, generally determines the surface dimensions of the circuits and circuit structures to be fabricated. As integrated circuits are becoming smaller and transistor densities on integrated circuit chips are increasing, the ability to make photolithography precision and patterns even smaller is becoming increasingly important in semiconductor manufacturing innovation. .
[0003]
Generally speaking, a photolithography process applies a photoresist to a surface layer of a semiconductor wafer, then transfers a pattern to the photoresist, and changes the structure and characteristics of the photoresist in a region corresponding to the pattern. Illuminating the photoresist through the pattern to provide. The photoresist is then developed to remove either the photoresist in the pattern or the photoresist around the pattern, depending on the type of photoresist used, to define the pattern in the photoresist on the surface layer of the wafer. Is done. Once the desired photoresist is developed, specific circuit portions are defined in the surface layer of the semiconductor wafer according to a pattern from a process such as etching. As a typical example, the photoresist is resistant to chemical etchants, and only the defined areas of the semiconductor wafer surface layer where the photoresist has been removed from the surface of the wafer by development to form specific circuit portions To do.
[0004]
In other technical fields, photoresist is also used in optical disc mastering processes. In the fabrication of an optical disc master, a substrate of glass, polycarbonate, or other suitable material is coated with a photoresist. The photoresist covered disk is then selectively exposed by a mastering laser. After exposure, the disc is treated with a developer to remove either the exposed or unexposed areas of the photoresist, depending on the type of photoresist used. The developed disc with the photoresist remaining forms a physical template of the disc structure.
[0005]
As is well known, photoresists are generally photosensitive chemicals and sensitivity typically corresponds to a particular range of light wavelengths. Exposure to light within the wavelength range to which the photoresist is sensitive changes the structure and properties of the photoresist. Depending on the type of photoresist used, changes in structure and properties usually occur from a dissolved state to an insoluble state, or from a generally insoluble structure to a more soluble structure. In each case, after exposure, the photoresist is typically developed so that the soluble portions of the photoresist are removed, leaving a pattern generally defined by the insoluble photoresist remnants.
[0006]
In order to define smaller and more complex features in the photoresist, the photoresist must be free of contaminants, have the desired viscosity, and have a uniform density. The size of the wafer or disk to which the photoresist is applied is determined by considering the desired viscosity of the photoresist and the desired thickness at which the photoresist is applied. The photoresist must be evenly distributed and of sufficient thickness to act as an etch barrier in the areas remaining on the wafer or disk surface to define the pattern, and to adhere uniformly to the surface of the wafer or disk. Must have.
[0007]
Photoresist is typically applied to the wafer or disk using a spin chuck or other similar device and deposited in the center area of the wafer or disk. The wafer or disk rotates and the photoresist is distributed across the surface. Photoresist is usually supplied from nozzles located on the surface of the wafer or disk. The photoresist is pumped through a nozzle during application, typically maintained in a storage tank or receiver. In such a system, the photoresist is first pumped into a supply receiver and then from the supply receiver to a supply nozzle.
[0008]
[Problems to be solved by the invention]
In a typical prior art photoresist delivery system as described above, microbubbles may be introduced into the photoresist. Such microbubbles are unacceptable foreign matter in the photoresist. The presence of microbubbles causes defects in the processed structure in various aspects. Distortion of the pattern transferred and produced on the surface layer of the wafer or disk due to hindering sharp definition of the pattern boundary region, inability to form the required etching barrier, and inhibition of adhesion to the surface layer of the wafer or disk This is caused by accidental peeling of the photoresist during the developing process and other processing defects.
[0009]
In view of the foregoing, there is a need for a method and system for providing a photoresist or other similar material that substantially prevents the formation of microbubbles.
[0010]
[Means to solve the problem]
In general, the present invention relates to a vacuum or negative pressure photoresist that connects to one or more photoresist storage bottles via a bottle automatic conversion valve to supply photoresist or other similar material. Meeting these needs by providing a supply system. The invention can be implemented in numerous ways, including as processes, apparatus, systems and methods. Various embodiments of the present invention are described below.
[0011]
According to one aspect of the present invention, a photoresist supply system is provided. In one embodiment, the photoresist supply system includes a resist storage bottle for storing the photoresist material. The resist storage bottle has a resist outlet. The photoresist supply system further includes a resist receiver, and the resist receiver is provided with a resist introduction unit, and is connected to the resist storage bottle so that the fluid flows. A vacuum pump is breathably connected to the resist receiver.
[0012]
In another embodiment, a photoresist supply system includes a second resist storage bottle for storing photoresist material. The second resist storage bottle also has a resist outlet. The photoresist supply system further includes a second resist receiver having a resist introduction, and is connected to the second resist storage bottle for fluid communication. A second vacuum pump is communicatively connected to the second resist receiver.
[0013]
In yet another embodiment, the photoresist supply system has an automatic bottle change valve connected to the outlet of the first receiver and the outlet of the second receiver for fluid communication. The automatic bottle change valve is configured to select one of the first and second receivers and connect to the resist supply receiver.
[0014]
In yet another embodiment, the introduction of the first receiver of the photoresist supply system is configured to flow photoresist in contact with the inner wall of the first receiver, and the introduction of the second receiver is The photoresist is configured to flow in contact with the inner wall of the second receiver.
[0015]
In another embodiment, a photoresist supply system has a resist supply pump connected in fluid communication with a resist supply receiver. The supply nozzle is connected to the supply pump so that the fluid can flow, and is configured to supply the photoresist to the surface of the substrate.
[0016]
According to another aspect of the present invention, a photoresist supply method is provided. In this method, a first resist receiver is fluidly connected to a resist supply receiver, and photoresist is vacuumed from the first resist reservoir into the first resist receiver. The second resist receiver is connected to the resist supply receiver so that a fluid can flow therethrough, and the photoresist is similarly vacuum-sucked from the second resist storage into the second resist receiver. Photoresist selectively flows from one of the first and second resist receivers into a resist supply receiver.
[0017]
In one embodiment, the photoresist is drawn into the first and second receivers by contacting the inner walls of each of the receivers with the photoresist.
The advantages of the present invention are numerous. One significant benefit and advantage is that the vacuum or negative pressure photoresist delivery system of the present invention provides photoresist to a tool or system by utilizing a vacuum or negative pressure to flow the photoresist through the system. Is to substantially eliminate the formation of microbubbles caused by pressurized nitrogen or other gases or media typically used in conventional delivery systems. Microbubbles inherently contaminate the photoresist resulting in unacceptable and costly manufacturing defects and waste. The present invention increases production by substantially eliminating sources of microbubble formation, thereby reducing costs associated with manufacturing.
Another benefit is that it further eliminates the formation of microbubbles by providing a photoresist inlet to flow the photoresist down along the inner wall of the photoresist receiver in the negative pressure photoresist supply system. is there. By flowing the photoresist down along the inner wall, the formation of microbubbles caused by the photoresist flowing through the inlet pipe to the resist receiver or resist storage tank and falling into the photoresist storage receiver is essentially prevented. You. The photoresist supply system of the present invention incorporates an inlet formed to flow down along the interior wall of the photoresist reservoir or receiver. As the photoresist flows into the storage tank or receiver through the resist inlet, the photoresist flows toward the interior wall of the storage tank or receiver and then flows smoothly down there to avoid excessive mixing and inflow of the photoresist. To prevent the formation of microbubbles.
[0020]
A further benefit is the automatic bottle conversion valve used in embodiments of the present invention. This automatic bottle conversion valve is designed to provide two sources so that when one source is depleted, another source is automatically connected, thereby maintaining continuous supply without interrupting system operation. Connect one or more photoresist supply systems. Ensuring a continuous supply prevents any need for system cleaning if air, nitrogen or other gases or media enter the system during the switch.
[0021]
Other advantages of the present invention will become apparent from the following detailed description, taken in conjunction with the accompanying drawings, illustrating by way of example the principles of the invention.
[Embodiment]
[0022]
Various embodiments of the photoresist supply system are described below. In an embodiment, the supply system has a negative pressure supply system and a photoresist receiver with an inlet design feature such that the formation of microbubbles inside the photoresist supply system is substantially prevented. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. However, it will be apparent to one skilled in the art that the present invention may be practiced without some or all of these specific details. In other instances, well known process operations have not been described in detail in order to avoid unnecessarily obscuring the present invention.
[0023]
FIG. 1 is a schematic diagram of a photoresist supply system 100 according to one embodiment of the present invention. As shown in FIG. 1, the first storage bottle 110 supplies the resist to the first receiver 112 through the first introduction pipe 114. The second storage bottle 116 is shown supplying resist to the second receiver 118 through the second inlet tube 120. The first vacuum pump 122 is mounted on the first receptacle 112 and the second vacuum pump 124 is mounted on the second receptacle 118. In the embodiment shown, the photoresist supply system has a dual vacuum system with two vacuum pumps 122, 124 and two separate receivers 112 to maintain a continuous supply of photoresist. , 118, one for each. In another embodiment, a photoresist supply system is a single vacuum system comprising a single vacuum pump mounted on one or more receivers for supplying photoresist, according to desires or system requirements; It has multiple vacuum systems with two or more vacuum pumps mounted on multiple receivers, or any combination of vacuum pumps and receivers.
[0024]
The photoresist supply system 100 shown in FIG. 1 includes an automatic bottle conversion valve 126 to control the supply of photoresist so that the photoresist is supplied from one of the first resist receiver 112 and the second resist receiver 118. The supply of the photoresist is made constant. In another embodiment, the automatic bottle conversion valve 126 is designed to incorporate the same number of resist receivers as the photoresist supply system 100. In yet another embodiment, a number of automatic bottle conversion valves are provided to manage photoresist selection from resist receivers as much as possible integrated into the photoresist supply system.
[0025]
The resist supply tube 128 of the resist supply supplies the photoresist from the selected receiver 112 or 118 to the resist supply receiver 130. The resist supply receiver vacuum pump 133 creates a negative pressure in the resist supply receiver 130 to flow photoresist from the selected receiver 112 or 118 into the resist supply receiver 130.
[0026]
In one embodiment, a system controller (not shown) manages the photoresist supply and automatically indicates a selection when the photoresist reaches a predetermined level in a selected resist receiver 112 or 118. To switch from one of the resist receivers 112 or 118 to the other. In one embodiment, when the photoresist reaches a predetermined level in the selected resist receiver 112 or 118, a system operator is alerted to prompt manual activation of the automatic bottle conversion valve 126 or to automatically convert the bottle. An imminent system operation of valve 126 is recommended.
[0027]
In the illustrated embodiment, the photoresist in the resist supply receptacle 130 is pumped by a supply pump 132 through a resist supply nozzle 134 onto the surface of a wafer or disk (not shown). As shown in FIG. 1, one embodiment of the photoresist supply system of the present invention includes a photoresist supply system including two storage bottles 110 and 116 and two resist receivers 112 and 118, and a first photoresist supply system. It has at least two vacuum systems corresponding to the two receivers 112, 118 with a first vacuum pump 122 mounted on the receiver 112 and a second vacuum pump 124 mounted on the second receiver 118. . An automatic bottle conversion valve 126 is included to maintain a continuous supply of photoresist, and the photoresist flows through a supply system to a resist supply receiver 130.
[0028]
A third vacuum pump 133 is provided to create and maintain a negative pressure within the resist delivery receptacle 130 so that photoresist flows from the selected receptacle 112, 118 into the resist delivery receptacle 130. Is integrated into the photoresist supply system. Photoresist is supplied to the surface of the wafer or disk by pumping the photoresist from a resist supply receptacle 130 through a resist supply nozzle 134.
[0029]
One embodiment of the present invention operates to provide a negative pressure supply system for the supply and distribution of photoresist or other similar material. As mentioned above, the photoresist must be maintained and distributed free of foreign matter. For purposes of describing the present invention, microbubbles in the photoresist material are considered foreign. In embodiments of the present invention, the formation of microbubbles in the photoresist supply system is substantially eliminated. Unlike prior art photoresist delivery systems that pressurize the photoresist delivery system under positive pressure, which typically introduces microbubbles into the photoresist due to nitrogen gas, the photoresist is drawn through the photoresist delivery system For the purpose of flushing and flowing, a negative pressure is used in embodiments of the present invention, thereby substantially eliminating the formation of microbubbles.
[0030]
In one embodiment of the invention, the source of contaminants is substantially eliminated by using vacuum pumps 122, 124 and 133 in the photoresist supply system. The first vacuum pump 122 is attached to the first receiver 112 and generates a negative pressure in the receiver 112. The first vacuum pump 122 allows the resist to flow out of the first storage bottle 110 through the first resist outlet 111 and flow into the first resist receiver 112 through the first resist introduction pipe 114. To generate a sufficient negative pressure. In one embodiment, the generated negative pressure is sufficient to cause the resist to flow out of the first storage bottle 110 and into the first receiver 112, but the resist is discharged from the first receiver 112 to the outlet tube 115. Not large enough to prevent it from flowing through. Accordingly, the resist can flow from the first resist receiver 112 through the outlet pipe 115, furthermore, pass through the automatic bottle conversion valve 126, and flow from the supply resist introduction pipe 128 into the resist supply receiver 130.
[0031]
Similarly, a second vacuum pump 124 is mounted on the second receptacle 118 to create a negative pressure in the second receptacle 118. The negative pressure in the second receiver 118 causes the photoresist to flow out of the second storage bottle 116 via the second resist outlet 123 and through the second resist inlet tube 120 to the second resist receiver. It flows into 118. The second vacuum pump 124 causes the photoresist to flow out of the second storage bottle 116 through the second resist outlet 123 and flow into the second resist receiver 118 through the second resist introduction tube 120. In order to generate a sufficient negative pressure. In one embodiment, the generated negative pressure is sufficient to cause the resist to flow out of the second storage bottle 116 and into the second receiver 118, but the resist is discharged from the second receiver 118 to the outlet tube 125. Not large enough to prevent it from flowing through. Accordingly, the photoresist can flow from the second resist receiver 118 through the outlet tube 125, further through the bottle automatic conversion valve 126, and from the supply resist inlet tube 128 into the resist supply receiver 130.
[0032]
Finally, a third vacuum pump 133 is attached to the resist supply receptacle 130 to generate a negative pressure in the resist supply receptacle 130. The negative pressure generated in the resist supply receptacle 130 sucks the resist from the selected resist receptacle 112 or 118 and flows into the resist supply receptacle 130 via the bottle automatic conversion valve 126 and the supply resist introduction pipe 128.
[0033]
In another embodiment, a single vacuum pump is used for one or more resist receivers. Multiple vacuum pumps are incorporated for embodiments where multiple resist receivers are incorporated into a large photoresist delivery system due to system requirements.
[0034]
In a vacuum or negative pressure system, the photoresist flows from storage to supply without introducing nitrogen or other gases that can generate microbubbles in the liquid. The bottle automatic conversion valve 126 keeps supplying the photoresist constantly even when the storage container is empty. In addition, the automatic bottle conversion valve 126 essentially eliminates the need to interrupt system operation to replenish the photoresist supply bottle, and substantially eliminates the need to clean the system with photoresist supply bottle replacement. By doing so, the system throughput is increased, and a more economical and efficient method of using the system is provided. The automatic bottle conversion valve 126 may receive one or more inflow sources from the resist receiver and one or more resist supply receptacles via one or more resist supply inlets 128. There may be a connection for one or more valve outlets flowing into 130. The automatic bottle conversion valve 126 is configured to select between one and many inflow sources for flowing photoresist through the valve outlet.
[0035]
In addition to the tendency of pressurized nitrogen gas to form microbubbles in the photoresist, prior art photoresist delivery systems also provide a photo-resist to any of the receivers 112, 118, 130 within the photoresist delivery system. Fine bubbles are easily formed in the photoresist at the entrance of the resist. In one embodiment of the present invention, each inlet tube 114, 120, 128 through which the photoresist flows into the associated receiver 112, 118, 130 is connected to the associated receiver 112, 120 through the inlet tube 114, 120, 128. Along the inner walls of 118, 130, the photoresist is configured to flow down. In one embodiment, the inlet tubes 114, 120, 128 are configured to allow the outflowing photoresist to flow down from the inner walls of the receivers 112, 118, 130.
[0036]
FIG. 2A is a diagram illustrating details of the first receiver 112 according to an embodiment of the present invention. It should be understood that the first receiver 112 is essentially equivalent to the second receiver 118 (see FIG. 1) and is used herein to illustrate features of the present invention. Unless otherwise noted, features described with respect to the first receiver 112 apply equally to the second receiver 118 and any number of additional receivers listed in other embodiments of the present invention. it can.
[0037]
The first receiver 112 shown in FIG. 2A has a first introduction pipe 114, a vacuum introduction pipe 113, a discharge pipe 115, and an inner wall 117. The vacuum introduction tube 113 is connected to a first vacuum pump 122 that generates a vacuum state in the first receiver 112 (see FIG. 1). The introduction tube 114 is configured such that the photoresist flowing out of the resist introduction tube 114 contacts the inner wall 117 near 119 and flows downward along the inner wall 117.
[0038]
According to one embodiment of the present invention, a vacuum or negative pressure is introduced into the first receiver 112 via the vacuum introduction tube 113. Due to the sufficient vacuum in the first receiver 112, the photoresist is sucked from the first storage bottle 110 (see FIG. 1) into the first receiver 112 through the resist introduction tube 114. Unlike typical prior art photoresist delivery systems, where the system is normally pressurized with nitrogen gas and the photoresist is simply dropped by gravity into the receiver from the inlet, one embodiment of the present invention employs an inlet tube. 114 is configured to allow the photoresist flowing out of the inlet tube 114 to flow downward along the inner wall 117 of the first receiver 112. In one embodiment, the photoresist contacts inner wall 117 near 119.
[0039]
As the photoresist flows through the resist introduction tube 114, the resist reaches the first receiver 112, flows downward along the inner wall 117, and is collected in the first receiver 112. FIG. 2B shows details of the first receiver shown in FIG. 2A with the photoresist collected in the first receiver 112 according to one embodiment of the present invention. . By considering the shape and setting position of the resist introduction tube 114, the photoresist 121 flows downward from the inner wall 117, and substantially removes the microbubble forming source. The photoresist flowing through the inlet tube 114 not only collects the photoresist 121 but also avoids excessive agitation and mixing of the photoresist 121, thereby preventing the formation of microbubbles. Further, in one embodiment, the location of the resist introduction tube 114 of the first receiver 112 is higher than the level of photoresist collected in the first receiver 112.
[0040]
Returning to FIG. 1, the resist supply receptacle 130 also contains photoresist flowing out of the resist supply inlet tube 128 when the photoresist is collected in the resist supply receptacle 130 in one embodiment of the present invention. It has an inlet tube 128 for supplying the resist, which is configured to flow in contact with the wall and flow downward along the wall. The inlet tube shape of each of the first receiver 112, the second receiver 118, and the resist supply receiver 130 substantially prevents the formation of microbubbles in these areas of the photoresist supply system. In one embodiment of the present invention, the combination of vacuum or negative pressure with the point of contact of the resist inlet essentially eliminates the formation of microbubbles in the photoresist delivery system.
[0041]
As illustrated in FIGS. 1, 2A and 2B, one embodiment of the present invention is a photoresist supply system incorporating two vacuum or negative pressure supply systems each having a receptacle connected to a storage bottle. Having. A vacuum pump is connected to the resist receiver and is used to generate a vacuum or negative pressure inside the receiver. The vacuum or negative pressure draws the photoresist from the storage bottle into the receiver without forming microbubbles. Similarly, a vacuum or negative pressure in the resist supply receiver causes photoresist to flow from the selected receiver through the automatic bottle conversion valve into the resist supply receiver. The photoresist is then pumped from a resist supply receiver to a resist supply nozzle for use in photoresist and other resist coating operations. The bottle automatic conversion valve seamlessly switches the receiver that supplies resist without interrupting system operation. In an alternative embodiment, one or more vacuum systems are configured for one or more resist receivers, which are then connected to one or more resist storage bottles. .
[0042]
While the above invention has been described in some detail for purposes of clarity of understanding, it will be apparent that certain changes and modifications may be practiced within the scope of the appended claims. Therefore, the present embodiments should be considered illustrative rather than limiting, and the present invention should not be limited to the details provided herein, but rather by the claims and equivalents thereof. Can be modified within range.
[0043]
The accompanying drawings, which are incorporated in and form a part of the specification, illustrate specific embodiments of the present invention and, together with the description, serve to explain the principles of the invention.
[Brief description of the drawings]
FIG. 1 is a schematic diagram of a photoresist supply system according to one embodiment of the present invention.
FIG. 2A is a detailed view of a resist receiver according to one embodiment of the present invention, and FIG. 2B is a resist receiver of FIG. 2A in a collected state of photoresist according to one embodiment of the present invention. .
[Explanation of symbols]
100 Photoresist supply system
110 Storage Bottle
111 Resist Derivation Unit
112 resist receiver
113 Vacuum inlet tube
114 Resist introduction tube
115 Outlet tube
116 Storage Bottle
117 Inner wall
118 Resist Receptor
120 Resist introduction tube
121 Photoresist
122 vacuum pump
123 Resist derivation unit
124 vacuum pump
125 Outgoing pipe
126 Bottle automatic conversion valve
128 Resist introduction tube
130 Receiver for supplying resist
132 feed pump
133 vacuum pump
134 resist supply nozzle

Claims (15)

A resist storage bottle storing the photoresist material and having a lead-out section;
A resist receiver connected to the storage bottle and through which the fluid passes, and provided with a resist introduction unit,
A photoresist supply system comprising a resist receiver and a vacuum pump operatively connected thereto. The storage bottle is a first storage bottle, the resist receiver is a first resist receiver, the vacuum pump is a first vacuum pump, and the photoresist supply system further comprises:
A second resist storage bottle storing the photoresist material and having a lead-out unit;
A second resist receiver connected to the second storage bottle for fluid passage and having a resist introduction portion;
2. The photoresist supply system according to claim 1, further comprising a second vacuum pump permeablely connected to the second resist receiver. A bottle automatic conversion valve connected to the outlet of the first resist receiver and the outlet of the second resist receiver so as to allow fluid to pass therethrough;
Further comprising a bottle automatic conversion valve and a resist supply receiver connected to allow fluid to pass through a resist supply introduction pipe,
The bottle automatic conversion valve is formed so that a resist supply receiver is selectively connected to one of the first and second resist receivers so that a fluid can pass therethrough. Item 3. A photoresist supply system according to Item 2. The first vacuum pump forms a vacuum in the first resist receiver, sucks the resist from the outlet of the first resist storage bottle, and introduces the resist into the first resist receiver from the resist inlet. The photoresist supply system according to claim 3. The second vacuum pump forms a vacuum in the second resist receiver, sucks the resist from the outlet of the second resist storage bottle, and introduces the resist into the second resist receiver from the resist inlet. The photoresist supply system according to claim 3. 5. The photoresist supply system according to claim 4, wherein the resist introduction part of the first resist receiver is formed so that the resist flows downward from the inner side wall of the first resist receiver. 6. The photoresist supply system according to claim 5, wherein the resist introduction portion of the second resist receiver is formed so that the resist flows downward from the inner side wall of the second resist receiver. Connecting the first resist receiver with the resist supply receiver so that the fluid passes therethrough, and vacuum-suctioning the resist from the first storage container into the first resist receiver;
The resist supply receiver and the second resist receiver are connected so that a fluid passes therethrough, and the resist is vacuum-suctioned from the second storage container to the second resist receiver;
A method of supplying a photoresist, comprising: selectively flowing a resist from one of a first and a second resist receiver into the resist supply receiver. 9. The photoresist supply of claim 8, wherein the step of vacuum-suctioning the resist from the first storage container to the first resist receiver includes contacting the resist with an inner wall of the first resist receiver. Method. The photoresist supply according to claim 8, wherein the operation of vacuum-suctioning the resist from the second storage container to the second resist receiver includes contacting the resist with an inner wall of the second resist receiver. Method. The operation of selectively flowing the resist from one of the first and second resist receivers to the resist supply receiver is performed by controlling the automatic conversion valve to transfer the resist to the first or second resist receiver. 9. The photoresist supply method according to claim 8, further comprising: causing the photoresist to flow from one side into a resist supply receiver. A first resist storage bottle storing the photoresist solution and having a resist outlet;
A first resist receiver connected to the first resist storage bottle so that the fluid passes therethrough, the first resist receiver having an inlet and an outlet;
A first vacuum pump communicatively connected to the first resist receiver;
A second resist storage bottle storing the photoresist solution and having a resist outlet;
A second resist reservoir having an inlet and an outlet, connected to the second resist storage bottle for fluid passage, and a second vacuum pump operably connected to the second resist receiver;
A resist supply receiver for storing the photoresist solution sent from the first and second resist receivers and having a supply resist introduction unit;
A bottle automatic conversion valve connected to allow a fluid to pass to a resist outlet and a supply resist inlet of the first and second resist receivers;
A resist supply pump connected to the resist supply receiver so that the fluid passes therethrough, and a resist supply nozzle connected to the resist supply pump so that the fluid passes and formed to supply the photoresist onto the substrate surface. A photoresist supply system, comprising: 13. The photoresist supply system according to claim 12, wherein the resist introduction portion of the first resist receiver is formed so that the resist flows down the inner side wall of the first resist receiver. 13. The photoresist supply system according to claim 12, wherein the resist introduction portion of the second resist receiver is formed so that the resist flows downward on the inner side wall of the second resist receiver. 13. The photoresist supply system according to claim 12, wherein the supply resist introduction part is formed so that the resist flows downward on the inner side wall of the resist supply receiver.

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