JP2004130161A - Element manufacturing process - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an optical element manufacturing process for forming a film comprising organic matter or the like while using a dispenser so as to enhance positional accuracy and thickness accuracy. <P>SOLUTION: When a liquid drop is discharged to the predetermined position between the partition walls 2 or the like formed on a substrate 1 using the dispenser, the interval (d) between the tip of the nozzle 5 of a syringe 4 and a substrate 1 or the projected structure on the substrate 1 is set smaller than diameter H in the height direction of the liquid drop 6 formed to the tip of the nozzle 5 when no substrate is provided under the nozzle 5. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a method for manufacturing an element such as a color filter, a polarizing element, an EL element (particularly, an organic EL element), an organic transistor, or an organic solar cell.
[0002]
[Prior art]
In order to manufacture such an element, an organic material or the like is formed on a substrate by various processes such as a dry process and a wet process. In particular, the latter wet process includes a spin coating method, an ink jet method, a printing method, and the like, and has an advantage that a film can be formed relatively easily as compared with a dry process.
[0003]
In manufacturing an element, in addition to forming a film uniformly on a substrate, a film may be formed in a pattern shape, and there are a method of vapor deposition through a mask, a method of separately applying by an inkjet method, and the like. However, in these methods, the manufacturing process becomes complicated, and the low use efficiency of the material and the influence of environmental conditions at the time of manufacturing remain as problems.
[0004]
For example, in the method of vapor deposition through a mask, as the pattern of the mask becomes finer, it is necessary to make the mask thinner, and it becomes difficult to manufacture the mask by fine processing, and when the distance between the substrate and the mask is large. In addition, it is difficult to form an accurate vapor deposition film due to the wraparound of the vapor deposition material. If the substrate and the mask are brought into close contact with each other, there is a problem that the substrate is damaged, and a high-precision and expensive vacuum apparatus is required.
[0005]
In addition, in the method of separately applying the ink jet method, in addition to the positioning error, a slight angle deviation generated when the droplet flies causes a flight deflection of the droplet, and the processing on the substrate is performed for correction. I need. In addition, there is a problem that advanced technology is required to form the same amount of droplets.
[0006]
An attempt to perform different coating using a dispenser is disclosed in Japanese Patent Application Laid-Open No. 2001-76872 (for example, Claim 1). Is not disclosed, and a drawback that positional accuracy and thickness accuracy decrease due to horizontal movement of the coating liquid when the coating liquid falls is inevitable.
[0007]
[Problems to be solved by the invention]
It is an object of the present invention to provide a method of manufacturing an optical element that can form a film of an organic substance or the like with improved positional accuracy and thickness accuracy while using a dispenser.
[0008]
[Means to solve the problem]
According to the study of the inventor, deposition of an organic substance or the like is performed by a dispenser method, and the discharge port at that time is discharged very close to a target substrate, thereby achieving high positional accuracy and high thickness accuracy. It turned out that membranes were possible and could reach the present invention.
[0009]
According to a first aspect of the present invention, an optical layer forming coating liquid is discharged to a predetermined position on a substrate by using a dispenser, and after the discharge, drying is performed to form an optical layer. In the case of, the distance between the discharge port of the dispenser and the substrate,
When the substrate is not provided below the dispenser, the diameter of the droplet of the coating liquid for forming an optical layer formed at the discharge port of the dispenser is less than a diameter in a height direction. Things.
[0010]
According to a second aspect of the present invention, the coating liquid for forming an optical layer is discharged to a predetermined position on a substrate by using a dispenser, and after the discharge, drying is performed to form an optical layer. On top, a convex structure surrounding the periphery of the optical layer is laminated, and the distance between the discharge port of the dispenser and the convex structure at the time of the discharge is such that the substrate is below the dispenser. The present invention relates to a method for manufacturing an element, wherein the diameter of a coating liquid for forming an optical layer formed at a discharge port of the dispenser is less than a diameter in a height direction when no liquid is present.
[0011]
In a third aspect based on the first or second aspect, the distance between the discharge port of the dispenser and the substrate or the distance between the discharge port of the dispenser and the convex structure is other than at the time of the discharge. And a method for manufacturing an element, wherein the diameter of the droplet is not less than the diameter in the height direction of the droplet.
[0012]
In a fourth aspect based on the first aspect, the discharge using the dispenser includes: (1) positioning the object and the discharge port; and (2) adjusting the distance between the discharge port and the substrate by the dispenser. (3) lowering the discharge port so that the diameter of the optical layer forming coating liquid formed at the discharge port of the dispenser is less than the diameter in the height direction of the droplet when the substrate is not provided below the substrate. The present invention relates to a method for manufacturing an element, comprising: performing (1) to (4) sequentially discharging the coating liquid and (4) raising the discharge port. .
[0013]
In a fifth aspect based on the second aspect, the discharge using the dispenser includes: (1) positioning the object and the discharge port; and (2) adjusting the distance between the discharge port and the convex structure. When the substrate is not below the dispenser, lowering the discharge port so as to be less than the diameter in the height direction of the droplet of the coating liquid for forming an optical layer formed at the discharge port of the dispenser, 3. The method according to claim 2, wherein (3) discharging the coating liquid, and (4) sequentially raising (1) to (4) raising the discharge port. The present invention relates to a method for manufacturing an element.
[0014]
A sixth invention relates to a method for manufacturing an element according to any one of the first to fifth inventions, wherein a critical angle of the discharge port with respect to the coating liquid is 20 ° or more.
[0015]
BEST MODE FOR CARRYING OUT THE INVENTION
1 to 3 are views showing a method for manufacturing an element of the present invention, and FIG. 4 is a view showing a cross-sectional structure of an EL element obtained by the method of the present invention.
[0016]
In the method for manufacturing an element of the present invention, as shown in FIGS. 1 and 2, the partition walls 2 each having a convex structure that surrounds the periphery of the optical layer to be formed are preferably laminated. A coating liquid 7 is discharged from a nozzle 5 which is a discharge port of a syringe 4 provided in a dispenser, for each area 3 surrounded by a partition wall 2 on the provided substrate 1 to form an optical layer (coating). Things. The partition walls 2 on the substrate 1 are preferably formed in advance in order to form a different coating film for each area 3 by changing the material of the coating liquid 7, and as shown in FIG. Alternatively, the left and right surfaces of the liquid repellent material may be formed of a lyophilic material. When the partition walls 2 are stacked, a coating film is formed according to the shape, but the formation of the partition walls 2 can be omitted. Alternatively, if a liquid-repellent pattern having a width similar to that of the partition wall 2 and having substantially no height is formed, unrestricted spreading of the coating liquid 7 is suppressed, and coating is performed only in a predetermined area. The liquid 7 can be spread, or / and a lyophilic pattern is provided, and the coating liquid 7 can be spread only on the lyophilic pattern.
[0017]
The relationship between the nozzle 5 and the substrate when discharging the coating liquid 7 will be described with reference to FIG. 2. The nozzle 5 is located close to the substrate 1 on the substrate 1 on which the partition walls 2 are provided. As shown in FIG. 2B, when the distance d between the tip of the nozzle 5 and the substrate is equal to or less than the diameter of the droplet (optical The height is preferably adjusted so as to be less than the diameter (H in FIG. 2A) in the height direction of the layer-forming coating liquid. The interval d is preferably very small, and may be 0 μm or more. Further, the distance d is preferably 10 μm or less.
[0018]
A convex structure surrounding the periphery of the optical layer is laminated on the substrate 1 like the above-described partition wall 2, and the nozzle 5 is positioned at a higher position than on the convex structure to discharge the coating liquid. In this case, when the distance d ′ between the tip of the nozzle 5 and the convex structure is equal to the height of the droplet formed by adhering to the tip of the nozzle 5 when the substrate 1 is not below the nozzle 5 serving as the discharge port. It is preferable that the height is adjusted so as to be less than the diameter in the vertical direction. In this case, as in the previous paragraph, d ′ is preferably very small, and may be 0 μm or more. Further, the distance d ′ is preferably 10 μm or less.
[0019]
Although the shape of the nozzle 5 is not particularly limited, it is preferable that the material of the nozzle 5, at least the outside of the nozzle 5 be liquid-repellent, and more specifically, when the critical angle with respect to the coating liquid is 20 ° or more, It is preferable because the coating liquid is prevented from adhering to the outside of the nozzle 5 and crawling up, and the coating liquid adhered to the nozzle 5 is prevented from dripping when the nozzle 5 is separated from the substrate 1 after discharge. . If the critical angle is less than 20 °, the coating liquid adhering to the nozzle 5 may drop. The material of the tip portion of the nozzle 5 is not particularly limited as long as the nozzle 5 does not deform due to the pressure of the coating liquid and does not swell with respect to the solvent of the coating liquid. Inorganic materials. This is because these inorganic materials can avoid deformation and swelling of the nozzle which causes an error in the droplet volume.
[0020]
When applying to a micro area using a dispenser, it is preferable that the tip of the nozzle is thinner because the droplet generated from the nozzle must be small. However, if the tip of the nozzle is excessively thin, the coating liquid dries easily and becomes clogged, and periodic cleaning or replacement of the tip of the nozzle is required. Therefore, by narrowing the interval between the tip of the nozzle and the object as in the present invention, rather than applying the droplet to the object after a predetermined amount of droplets are generated at the tip of the nozzle, the tip of the nozzle is excessively moved. It is possible to apply to a minute area without thinning.
[0021]
Since the application of the coating liquid is generally performed over the entire surface of the substrate 1 at each predetermined location, it is preferable that the coating liquid is applied by repeating the steps described below with reference to FIG. .
[0022]
First, as shown in FIG. 3A, the nozzle 5 is moved to a predetermined position on the substrate 1 to perform positioning. Positioning is performed by relatively moving one or both of the nozzle 5 and the substrate 1.
[0023]
The positioned nozzle 5 is lowered toward the substrate 2 as shown in FIG. At this time, when the distance d between the tip of the nozzle 5 and the substrate 1 (or the distance d ′ between the tip of the nozzle 5 and the convex structure) is not attached to the tip of the nozzle 5 when there is no substrate 1 below the nozzle 5, In this case, the diameter of the droplet formed is smaller than the diameter in the height direction.
[0024]
As shown in FIG. 3C, the coating liquid 7 is discharged from the nozzle 5 that has descended. Since the coating liquid 7 has a crushed hemispherical shape as it is discharged, the tip of the nozzle 5 is immersed in the coating liquid 7.
[0025]
Thereafter, as shown in FIG. 3D, when the nozzle 5 is raised and the nozzle 5 is separated from the discharged coating liquid 7, the coating liquid 7 spreads in the area surrounded by the partition 2, and 'Occurs. Alternatively, the coating liquid 7 spreads during the discharging process. Thereafter, the nozzle 5 is moved to the next predetermined position on the substrate 1 to perform positioning, and the nozzle 5 is lowered, the coating liquid is discharged, the nozzle 5 is raised and moved again, 1 is applied over the entire surface.
[0026]
If necessary, a large number of nozzles 5 may be arranged to perform ejection at a time to a plurality of areas, or a different coating liquid may be supplied to each of the nozzles to apply the coating liquid to a plurality of areas at once. May be performed. In addition, in the case of discharging the coating liquid described with reference to FIG. 3C, the nozzle 5 is positioned substantially at the center between the adjacent partitions, but the nozzle 5 is located near any of the partitions. It can be located at any location, such as located. Further, the discharge may be performed while the nozzle 5 is kept parallel to the substrate 2 while being moved in parallel from the position where the nozzle 5 is initially positioned in the area surrounded by the partition wall 2.
[0027]
It is particularly preferable that the method for producing an element of the present invention is applied to the production of an organic EL element. As shown in FIG. 4, the organic EL element 10 includes, for example, a first partition 11 corresponding to a pixel on a substrate 1, and a convex partition formed on the substrate 1 so as to surround a pixel area. 2, a hole injection layer 12, a light emitting layer 13, an electron injection layer 14, a second electrode 15, and the like are sequentially stacked in an area surrounded by the partition wall 2. If necessary, a sealant layer may be further applied in addition to the above layers. Among these layers, it is preferable to apply the method for manufacturing an element of the present invention particularly when the light emitting layer 13 is formed.
[0028]
In terms of the principle of light emission, the organic EL element 10 serves as a layer involved in light emission between the first electrode 11 and the second electrode 15 (this layer may be referred to as an EL layer in this specification). It is sufficient that at least one light-emitting layer is provided, but it usually has the above-described laminated structure, and in addition to the above-described layers, a layer that is usually used in an organic EL element may be added. . Examples of the layers that can be added include those already mentioned, for example, a hole transport layer that transports holes to the light emitting layer and an electron transport layer that transports electrons (these may be collectively referred to as a charge transport layer. ), And a hole injection layer that injects holes into the light emitting layer or the hole transport layer and an electron injection layer that injects electrons into the light emitting layer or the electron transport layer (these may be collectively referred to as a charge injection layer). .) Can be provided. Although not directly related to light emission, a layer in which polysiloxane or the like is hydrophilized by the action of a photocatalyst such as titanium dioxide may be provided between the first electrode and each layer involved in light emission. .
[0029]
The substrate 1 can be made of a transparent material or an opaque material, and the first electrode itself can be used as the substrate. However, usually, the first electrode is provided on the substrate 1 directly or via an intermediate layer. . As the substrate 1, a substrate made of an inorganic material such as glass, a resin, or the like can be used.
[0030]
The resin that can constitute the substrate 1 is not particularly limited as long as it can be formed into a film, but a polymer material having relatively high solvent resistance and heat resistance is preferable. If necessary, a substrate having a gas barrier property for blocking gas such as moisture and oxygen may be used. Specifically, fluorine resin, polyethylene, polypropylene, polyvinyl chloride, polyvinyl fluoride, polystyrene, ABS, polyamide, polyacetal, polyester (polyethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate, or polymicroixylene dimethylene terephthalate) Etc.), polycarbonate, modified polyphenylene ether, polysulfone, polyarylate, polyetherimide, polyethersulfone, polyamideimide, polyimide, polyphenylene sulfide, liquid crystalline polyester, polyoxymethylene, polyetheretherketone, polyacrylate, acrylonitrile-styrene Resin, phenolic resin, urea resin, melamine resin, unsaturated polyester resin, epoxy resin, Examples thereof include urethane, silicone resin, and amorphous polyolefin. In addition to these, any polymer material that satisfies the conditions can be used. A combination of two or more monomers used to manufacture these resins is also available. It may be a copolymer obtained by using the same.
[0031]
The first electrode 11 is made of, for example, a transparent conductive layer, and is usually made of a thin film of indium tin oxide (ITO), indium oxide, gold, polyaniline, or the like, and is provided uniformly on the entire surface. Thereafter, a resist pattern is formed and etched to form the first electrode 11 having a desired shape.
[0032]
The first electrode and the second electrode are referred to as a first electrode 11 on the substrate 1 and a second electrode 15 on an EL layer which may be a plurality of layers involved in light emission. . The first electrode 11 and the second electrode 15 may be formed on the entire surface of the substrate 1 or may be formed in a pattern. It is preferable that one of the first electrode 11 and the second electrode 15 is an anode and the other is a cathode, and one of the first electrode 11 and the second electrode 15 is transparent or translucent. The cathode is preferably made of a conductive material having a large work function, and the cathode is preferably made of a conductive material having a small work function so that electrons can be easily injected. The resistance of each electrode is preferably as small as possible. In general, a metal material is used, but an organic substance or an inorganic compound may be used.
[0033]
Specific anode materials that can form the first electrode 11 and the second electrode 15 include indium tin oxide (ITO), indium oxide, gold, and polyaniline, and specific cathode materials include magnesium alloy. (MgAg etc.), aluminum alloys (AlLi, AlCa, AlMg etc.), or metallic calcium. Both the anode material and the cathode material may be a mixture of a plurality of materials.
[0034]
The partition walls 2 are formed on the substrate 1 on which the first electrodes 11 are provided, at positions corresponding to between the patterns of the first electrodes 11. The partition wall 2 can be formed by printing a thick film, or by coating a coating film of a coating solution containing a photosensitive resin on the entire surface of the substrate 1 on which the first electrode 11 is provided, and forming a mask pattern for exposure. The coating liquid is subjected to pattern exposure by, for example, arranging it on the coating film and performing exposure, and after pattern exposure, is developed using a predetermined developing solution. Then, the partition 2 is formed. If necessary, it may be cured by heating.
[0035]
Therefore, the partition walls 2 can be made of a cured product of a photosensitive resin, but also made of a cured product of a resin curable by irradiation with ionizing radiation including an electron beam, a cured product of a thermosetting resin, or a thermoplastic resin. Can be done. The partition wall 2 may be configured to include a liquid-repellent component or may be configured not to include a liquid-repellent component. When the partition 2 is liquid repellent, it is possible to prevent the coating liquid from protruding from an area surrounded by the partition 2 to an adjacent area. However, since the coating liquid is repelled, a disadvantage that a central portion swells easily occurs.
[0036]
The partition wall 2 may have both surfaces perpendicular to the substrate 1. However, if the cross-sectional shape is a trapezoidal shape, a triangular shape, or the like, an upwardly tapering shape such as a trapezoid, a coating liquid is applied along the partition wall 2 near the partition wall 2. This is preferable because the effect on the light emission due to the increase or decrease in the surface can be reduced.
[0037]
A coating solution for forming a hole injection layer is applied between the partition walls 2 on the substrate 1 on which the first electrodes 11 and the partition walls 2 are formed. The application may be performed by a dispenser method of dropping using an appropriate dispenser, or by applying by an inkjet method, or may be performed by dropping at an appropriate place on the substrate 1 and then rotating the substrate 1 at a high speed. The coating may be performed by a so-called spin coating method in which the coating liquid is spread. Of course, it may be performed by applying the method for manufacturing an element of the present invention.
[0038]
Materials constituting the hole injection layer (or anode buffer material) include oxides such as phenylamine, starburst amine, phthalocyanine, vanadium oxide, molybdenum oxide, ruthenium oxide, and aluminum oxide, amorphous carbon, and polyaniline. Or polythiophene derivatives.
[0039]
Also, commercially available as a composition for forming a hole injection buffer, for example, poly (3,4) ethylenedioxythiophene / polystyrene sulfonate (abbreviation: PEDOT / PSS, manufactured by Bayer AG, trade name: Baytron P AI 4083, as an aqueous solution) The commercially available aqueous solution can also be used as a coating solution for forming a hole injection layer. Alternatively, the hole injection layer can be constituted by a multilayer film formed by alternate adsorption.
[0040]
The applied coating liquid for forming a hole injection layer is heated by a heat treatment such as a vacuum heat treatment to form the hole injection layer 12.
[0041]
The light emitting layer 13 is formed between each partition on the substrate 1 on which the hole injection layer 12 is formed. For example, red, green, and blue light-emitting layer-forming coating liquids are applied, and then dried and solidified by heating or vacuum drying, for example, to emit red light and green light. And blue light-emitting layers are formed. In order to form such a light-emitting layer 13, a light-emitting layer 13 having a different light emission color is formed adjacent to each other across the partition wall 2. Alternatively, it is preferable to carry out the method by an ink-jet method. Depending on the type of the organic EL element 10, a light-emitting layer that gives the same light-emitting color may be formed between the partition walls 2, and in such a case, a relatively large area such as a spin coating method is used. It can also be applied by a method that allows uniform application.
[0042]
The material constituting the light emitting layer 13 is roughly classified into a dye-based material, a metal complex-based material, and a polymer-based material.
[0043]
As the dye system, cyclopentadiene derivative, tetraphenylbutadiene derivative, triphenylamine derivative, oxadiazole derivative, pyrazoloquinoline derivative, distyrylbenzene derivative, distyrylarylene derivative, silole derivative, thiophene ring compound, pyridine ring compound, There are perinone derivatives, perylene derivatives, oligothiophene derivatives, oxadiazole dimers, and pyrazoline dimers.
[0044]
Examples of the metal complex system include aluminum quinolinol complex, benzoquinolinol beryllium complex, benzoxazole zinc complex, benzothiazole zinc complex, azomethyl zinc complex, porphyrin zinc complex, and europium complex, and the like. , Tb, Eu, or Dy, and a metal complex having a ligand such as an oxadiazole, thiadiazole, phenylpyridine, phenylbenzimidazole, or quinoline structure.
[0045]
Examples of the polymer system include a polyparaphenylene vinylene derivative, a polythiophene derivative, a polyparaphenylene derivative, a polysilane derivative, a polyacetylene derivative, a polyvinyl carbazole, and the like, or a polyfluorene derivative.
[0046]
The material constituting the light-emitting layer may be mixed with a doping material. Examples of the doping material include perylene derivatives, coumarin derivatives, rubrene derivatives, quinacridone derivatives, squarium derivatives, porphyrin derivatives, styryl dyes, tetracene derivatives, and pyrazoline derivatives. , Dekacyclene, or phenoxazone.
[0047]
An electron injection layer (or a cathode buffer material layer) 14 is formed on the light emitting layer 13 on the substrate 1 on which the light emitting layer 13 is formed. The electron injection layer 14 is made of aluminum lithium alloy, lithium fluoride, strontium, magnesium oxide, magnesium fluoride, strontium fluoride, calcium fluoride, barium fluoride, aluminum oxide, strontium oxide, calcium, polymethyl methacrylate, or polystyrene sulfone. It is composed of materials such as sodium acid.
[0048]
On the electron injection layer 14, a second electrode is formed. The material constituting the second electrode is basically the same as the material of the first electrode, but a magnesium alloy (MgAg or the like), an aluminum alloy (AlLi, AlCa, AlMg or the like), or metal calcium is preferred. Can be mentioned.
[0049]
The material constituting each layer of the EL layer including the hole injection layer 12, the light emitting layer 13, and the electron injection layer 14 described above is prepared by dissolving or dispersing in water or an organic solvent to form a coating liquid for forming each layer. Each layer can be formed by preparing and discharging using a nozzle as in the method of manufacturing an element of the present invention. The solvent is preferably one that can be dried at a temperature that does not adversely affect each material in the drying step of removing the solvent after the application of the coating liquid.
[0050]
By the way, when manufacturing an organic EL element, a typical object for forming the above-mentioned EL layer is the substrate 1 on which the first electrodes 11 are already laminated. According to the method of the present invention, for example, when the tip of the nozzle 5 is positioned substantially at the center between adjacent partition walls and the discharge of the coating liquid is performed, the tip of the nozzle 5 touches the first electrode 11 and the first electrode 11 contacts the first electrode 11. 11 could be damaged. In order to avoid the damage of the first electrode 11 due to the contact of the nozzle 5, the coating liquid is discharged by disposing the tip of the nozzle 5 on a place where the first electrode 11 is not exposed, for example, on the partition wall 2. More preferably, the application is performed in a predetermined area by flowing and spreading the liquid. In this case, as a place where the tip of the nozzle 5 is located, for example, near the wall surface on the partition wall 2 is preferable. Further, when the partition 2 has a cross-sectional shape in which the skirt is widened, such as a trapezoid or a triangle, the tip of the nozzle 5 may be located above the slope of the partition 2 having such a cross-sectional shape.
[0051]
【Example】
(Example)
After forming an ITO film on a glass plate, a grid-shaped convex liquid-repellent partition having a height of 1 μm and an opening size of 5 mm × 5 mm is applied to a photosensitive resin by application, exposure and development. It was formed by performing a process. As a coating solution, a solution prepared by dissolving a luminescent material composed of polyvinyl carbazole and a coumarin derivative in xylene and adjusting the solid content concentration to 1% (by mass) was prepared. A dispenser was used to apply the coating liquid, and the tip of the nozzle attached to the syringe was set at a position of 300 μm from the surface of the ITO film. When this coating liquid is slowly discharged without an object to be coated below the nozzle, the diameter in the height direction of the droplet of the coating liquid formed on the tip of the nozzle is 500 μm. Was. In such a state, the coating liquid was discharged from a nozzle into the opening surrounded by the partition walls to perform coating, and dried by vacuum drying to form a light emitting layer. Observation at the stage when the light emitting layer was formed revealed that the coating liquid spread without gaps in each area surrounded by the partition walls, there was no coating unevenness, and there was no protrusion of the coating liquid to the adjacent area. Had been applied. On the formed light emitting layer, calcium was deposited so as to have a thickness of 5 nm, and further, silver was deposited thereon so as to have a thickness of 250 nm to obtain an EL element.
[0052]
(Comparative example)
The same procedure was followed as in the example, except that the tip of the nozzle attached to the syringe was set at a position 800 μm from the surface of the ITO film. In the area, unevenness in the thickness of the coating film and protrusion of the coating liquid to the adjacent area were observed.
[0053]
【The invention's effect】
According to the first or second aspect of the present invention, when the coating liquid is applied using the dispenser, the distance between the discharge port and the substrate or the distance between the discharge port and the convex structure on the substrate is determined by the discharge port. When there is nothing below, the discharged coating liquid is regulated by both the discharging port and the target substrate by making the diameter of the coating liquid formed in the discharge port smaller than the diameter in the height direction. Therefore, it is possible to provide a method for manufacturing an optical element in which the accuracy of the application position is high, and therefore, coating unevenness is unlikely to occur.
[0054]
According to the third aspect of the invention, in addition to the effects of the first or second aspect, the position of the discharge port is raised at times other than discharge, so that there is no problem in moving or positioning the discharge port. A method can be provided.
[0055]
According to the invention of claim 4 or claim 5, in addition to the effect of the corresponding invention of claim 1 or claim 2, an optical element suitable for applying a coating liquid to a large number of locations on a substrate is provided. A manufacturing method can be provided.
[0056]
According to the invention of claim 6, in addition to the effect of any one of claims 1 to 5, the critical angle of the discharge port with respect to the coating liquid is defined, so that the coating liquid crawls along the outside of the discharge port. It is possible to provide a method for manufacturing an optical element which can prevent the occurrence of the optical element.
[Brief description of the drawings]
FIG. 1 is a diagram showing an outline of a method for manufacturing an element of the present invention.
FIG. 2 is a diagram showing a positional relationship between a nozzle and a substrate.
FIG. 3 is a diagram showing each step of ejection.
FIG. 4 is a view showing an organic EL element.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Substrate 2 Partition wall 3 Area 4 Syringe 5 Nozzle 6 Droplet 10 Organic EL element 11 First electrode 12 Hole injection layer 13 Light emitting layer 14 Electron injection layer 15 Second electrode

Claims (6)

For a predetermined position on the substrate, the coating liquid for forming an optical layer is formed by discharging using a dispenser, and after the discharging, drying is performed to form an optical layer. When the substrate is not below the dispenser, the distance between the discharge port and the substrate is less than the diameter in the height direction of the droplet of the optical layer forming coating liquid formed at the discharge port of the dispenser. A method for manufacturing an element, comprising: An optical layer forming coating liquid is discharged to a predetermined position on a substrate by using a dispenser, and after the discharge, drying is performed to form an optical layer. When a convex structure surrounding the periphery of the layer is laminated, and the distance between the discharge port of the dispenser and the convex structure at the time of the discharge is smaller than the dispenser, the dispenser Wherein the diameter of the droplet of the coating liquid for forming an optical layer formed in the discharge port is smaller than the diameter in the height direction. The distance between the discharge port of the dispenser and the substrate, or the distance between the discharge port of the dispenser and the convex structure, is not less than the diameter in the height direction of the droplet except at the time of the discharge. The method for manufacturing a device according to claim 1 or 2, wherein: The discharge using the dispenser includes: (1) positioning the object and the discharge port; and (2) setting the distance between the discharge port and the substrate such that the dispenser is positioned when there is no substrate below the dispenser. (4) lowering the discharge port so that the diameter of the optical layer forming coating liquid formed at the discharge port is smaller than the diameter of the liquid droplet in the height direction; (3) discharging the coating liquid; 2. The method according to claim 1, wherein the steps (1) to (4) of raising the discharge port are sequentially performed. When the discharge using the dispenser is (1) positioning the target and the discharge port, and (2) the distance between the discharge port and the convex structure is when the substrate is not below the dispenser. Lowering the discharge port so that the diameter of the droplet of the coating liquid for forming an optical layer formed in the discharge port of the dispenser is smaller than a diameter in a height direction; (3) discharging the coating liquid; 3. The method according to claim 2, wherein (1) to (4) of raising the discharge port are sequentially performed. 6. The method according to claim 1, wherein a critical angle of the discharge port with respect to the coating liquid is 20 [deg.] Or more.

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