JP2004126819A - Method for manufacturing ic card - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing an IC card capable of shortening a manufacturing time, and preventing the performance of each product from fluctuating. <P>SOLUTION: This method for manufacturing an IC card 5 functioning in a predetermined frequency band, which is formed with antenna coils 11 respectively equipped with coils 14 revolving like almost whirlpools comprises a coil position adjusting process for adjusting a distance between the predetermined coils, and for matching it with the predetermined frequency band. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a method for manufacturing an IC card using an antenna coil.
[0002]
[Prior art]
For an antenna coil using a conventional coil, there is a method of embedding the coil while melting the base material at the stage of forming the antenna with the coil.
[0003]
In addition, there is a method of mounting an already wound coil on a base material to form an antenna coil.
[0004]
The antenna coil formed by the above method is used as an IC card on which an IC module is mounted and which functions in a predetermined frequency band.
[0005]
[Problems to be solved by the invention]
However, the method of embedding the coil while melting the base material has a problem that it takes a long time to manufacture the antenna coil.
[0006]
In addition, in a method of loading a coil that has already been wound on a substrate, the capacitance generated between the coils generally varies, so that the inductance of the coil, the capacitance generated between the coils, and the capacitance of the IC chip module are reduced. However, there is a problem that variation occurs when the frequency is adjusted to the target frequency band. In particular, when Q is high, a capacitor or the like is separately provided, and its capacity is adjusted to match a predetermined frequency.
[0007]
The problem to be solved by the present invention includes the above-mentioned problem as an example.
[0008]
Therefore, an object of the present invention is to provide a method of manufacturing an IC card which can reduce the manufacturing time and does not cause variations in the performance of individual products.
[0009]
[Means for Solving the Problems]
Hereinafter, the present invention will be described. In addition, in order to facilitate understanding of the present invention, reference numerals in the accompanying drawings are added in parentheses, but the present invention is not limited to the illustrated embodiment.
[0010]
The invention according to claim 1 is a method for manufacturing an IC card that functions in a predetermined frequency band by forming an antenna coil (10) including a coil (14) that circulates in a substantially spiral shape. A coil position adjusting step of adjusting a distance between the coils to adjust to the predetermined frequency band.
[0011]
According to the present invention, the inductance and the capacitance can be controlled by adjusting the position of the coil, and the frequency can be easily adjusted to a predetermined frequency band (target value). As a result, it is possible to reduce variations in products generated in the manufacturing process.
[0012]
The invention described in claim 2 is characterized in that the adjustment is performed by changing an installation position of a part of the coil support members (13a) among the coil support members for supporting the coils.
[0013]
According to the present invention, the position of a predetermined coil can be adjusted by moving some of the coil support members among the coil support members for supporting the coil. As a result, the inductance and the capacitance can be controlled and easily adjusted to a predetermined frequency band (target value).
[0014]
The invention according to claim 3 is characterized in that a step for pressing and joining the surface of the antenna coil to a holding sheet (20) having an adhesive layer (22) is provided.
[0015]
According to the present invention, the amount of the adhesive necessary for bonding the antenna coil and the holder sheet is provided in the holder sheet in advance, so that the amount of the adhesive can be minimized. In addition, since the adhesive layer is provided on the surface of the holding sheet in advance, the adhesive can be easily spread over the entire antenna coil. Further, since the amount of the adhesive can be minimized, the IC card can be formed thinner as compared with the related art. Further, since the antenna coil can be easily and quickly joined to the holder sheet, the manufacturing time can be reduced.
[0016]
The invention according to claim 4 is a first step in which the position of the coil support member for supporting the coil is installed on the base material so that the IC card functions in a predetermined frequency band, and the coil is mounted on the coil support member. A second step of winding in a substantially spiral shape; and a step of pressing the IC module so that an end of the coil is in contact with a coil mounting position (7a, 7b) of the IC module (7). A third step of moving the installation positions of some of the coil support members and adjusting again so that the IC card functions in a predetermined frequency band; a fourth step of installing the IC module; And a fifth step of pressing and joining the surface of the member manufactured in the four steps to the holding sheet provided with the adhesive layer.
[0017]
According to the present invention, as a method of manufacturing an IC card, an antenna coil is pressed and joined to a holding sheet provided with an adhesive layer, so that an IC card can be manufactured easily and quickly. Further, by manufacturing the IC card by pressing and bonding the antenna coil to the holding sheet provided with the adhesive layer, the amount of the adhesive can be minimized, so that the IC card can be formed thin. In addition, since the method includes a step of moving some of the coil supporting members to adjust the coil supporting members to function in a predetermined frequency band, it is possible to reduce variations in products generated in the manufacturing process.
[0018]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, an embodiment of the present invention will be described with reference to FIGS.
[0019]
FIG. 1 shows a schematic configuration of an IC card according to the present invention. FIG. 1 (a) is a plan view, and FIG. 1 (b) is a cross-sectional view along AA. FIG. 2 is an enlarged view of B in FIG. 1B. FIG. 3 is a schematic diagram of the pressurizing device. As illustrated, the IC card 5 includes an antenna coil 10 with an IC module and a holder sheet 20 that holds the surface of the antenna coil 10. In the antenna coil 10 with an IC module, the IC module 7 is attached to a predetermined position of the antenna coil 11.
[0020]
The antenna coil 11 includes a rectangular base member 12, pins 13, 13,..., 13 serving as coil support members disposed on one surface (front surface) of the base member 12, and the pin 13. And a coil 14 circling in a substantially spiral shape along the peripheral edge of the base material.
[0021]
The base material 12 has an insulating property. The substrate 12 is, for example, a synthetic resin such as PET (polyethylene terephthalate) having a thickness of about 120 μm. The substrate 12 preferably uses PETG (polyethylene terephthalate glycogen).
[0022]
The pin 13 is, for example, a round bar of about 100 μm. Copper is used as the material. The pins 13 are disposed so that the coil 14 is supported in a substantially spiral shape inward from the periphery of the base 12. The pins 13 are provided so that the distance between the coils arranged in a substantially spiral shape is maintained at a predetermined interval.
[0023]
Further, in the innermost wiring pattern of the coil 14 formed in a substantially spiral shape, the pins 13a, 13a on the upper right side in the drawing have pin position moving means for changing the positions of the pins 13a. The pin position moving means is, for example, a method in which a plurality of holes 15, 15, 15 are provided on the base material 12, and the pin position is changed by inserting and removing the pin 13a. By changing the position of the pin 13a, the capacitance generated between the coils is changed, and the frequency is adjusted to a predetermined frequency band in which the IC card functions. The movement of the pin position may be performed manually, or may be performed automatically by a machine or the like.
[0024]
Further, since the capacity between the coils is inversely proportional to the distance between the coils, the capacity can be increased as the distance between the coils is shorter. However, if the distance between the coils is increased to reduce the capacitance, the opening area of the antenna is reduced, and the communication distance is shortened.
[0025]
As a result, it is possible to correct the variation in the capacitance generated between the coils and adjust the capacitance to a predetermined frequency band. In addition, variations in the performance of the IC card to be manufactured can be reduced, and a product (IC card) having a certain performance (quality) can be manufactured.
[0026]
The coil 14 is, for example, about 100 μm of copper. The coil 14 circulates in a substantially spiral shape inward from the peripheral edge of the base material 12 via the pin 13, and maintains a constant interval between the coils 14.
[0027]
Both ends of the coil 14 are connected to the antenna mounting positions 7a and 7b of the IC module 7 by heat fusion, solder, ultrasonic waves, or the like.
[0028]
The holder sheet 20 is a two-layer sheet including a first layer 21 and an adhesive layer 22 provided on one surface (front surface) of the first layer 21. The first layer 21 is, for example, a base material of a synthetic resin such as PETG having a thickness of about 150 μm. The adhesive layer 22 is, for example, an adhesive having a thickness of about 30 μm, or a base material of, for example, a synthetic resin such as PETG having a low melting point. The adhesive layer 22 is melted by pressurization and is bonded to the surface of the antenna coil 10 with an IC module. More specifically, the coil 14 is fixedly held by being embedded in a part of the adhesive layer 22.
[0029]
Next, the manufacturing process of the IC card of the present invention will be described.
[0030]
The IC card 5 firstly positions the pins 13 on the base material 12 so that the IC card functions in a predetermined frequency band, and the coil 14 is wound in a substantially spiral shape via the pins 13. In the second step of winding, a part of the pin 13a (moving the pin position) while holding down the IC module 7 so that the end of the coil 14 contacts the coil mounting positions 7a and 7b (antenna mounting position) of the IC module 7 The installation position of the pin having the means is moved, the coil position adjustment step (third step) of adjusting the position of the coil 14 again so that the IC card functions in a predetermined frequency band, and the IC module 7 is installed. A fourth step, and a fifth step in which the surface of the antenna with an IC module 10 manufactured in the first to fourth steps is pressurized and bonded to the holding sheet 20 provided with the adhesive layer 22. It is produced by.
[0031]
In the first step, the pins 13 and 13a are set on the base material 12 so that the IC card 5 functions in a predetermined frequency band.
[0032]
In the second step, the distance between the coils adjacent to each other in a substantially spiral shape inside the substrate 12 while the coil 14 orbits the periphery of the substrate 12 via the pins 13 and 13a installed in the first step. Is wound while maintaining a predetermined interval.
[0033]
In the third step, while the IC module 7 is pressed against the coil end so that the coil (antenna) mounting positions 7a and 7b of the IC module 7 come into contact with the end of the coil 14, the pin position moving means is moved. The position of the pin 13a is moved to change the capacitance generated between the coils, and is adjusted to match a predetermined frequency band. As a result, performance variations of the product can be almost eliminated.
[0034]
In the fourth step, the IC module 7 is attached to the base 12 by heat welding, soldering, ultrasonic waves, or the like.
[0035]
In the fifth step, the surface of the antenna coil 10 with the IC module manufactured in the first to fourth steps is bonded to the holding sheet 20 provided with the adhesive layer 22 by pressing. Specifically, this is performed by the pressurizing device shown in FIG.
[0036]
The pressurizing device 30 includes a first loading plate 31 for loading the antenna coil 10 with an IC module, and a second loading plate 33 for loading the holder sheet 20 with the adhesive layer 22 facing upward. I have. Further, the ends of the first and second stacking plates are connected via a rotating means 35. The antenna coil 10 with the IC module is rotated by 180 degrees by the rotation means 35, and is superimposed on the holder sheet 20 and pressed. At this time, since the coil 14 or the first and second loading plates 31 and 33 are heated by pressing, the adhesive layer 22 is melted and joined to the antenna coil 10 with the IC module.
[0037]
Further, in order to reduce the thickness of the card, the height of the IC chip of the IC module 7 is set to be the same as the thickness of the holder sheet 20 so that the IC module 7 A hole may be made at the position where is disposed, and the IC module 7 may be inserted into the hole. Further, a second holder sheet may be provided so as to cover the outer periphery or one side of the antenna coil 10 with the IC module to which the holder sheet 20 is joined.
[0038]
Further, when the pressure is applied, only the adhesive layer 22 of the two-layer sheet is melted, and the coil 14 and the IC module 7 are buried and joined in a part of the adhesive layer 22.
[0039]
As described above, a method of manufacturing an IC card that has an antenna coil 10 provided with a coil 14 that circulates in a substantially spiral shape and that functions in a predetermined frequency band is performed by adjusting a distance between predetermined coils. A coil position adjusting step (fourth step) for adjusting to a predetermined frequency band is provided. This adjustment is performed by changing the installation position of a part (pin 13a) of the coil supporting member for supporting the coil. Further, a step (fifth step) for pressing and joining the surface of the antenna coil 10 to the holding sheet 20 provided with the adhesive layer 22 is provided.
[0040]
More specifically, a method of manufacturing an IC card that functions in a predetermined frequency band by forming an antenna coil 10 having a coil 14 that circulates in a substantially spiral shape is used as a coil support member for supporting the coil 14. A first step of placing the pin 13 on the base material 12 so that the IC card functions in a predetermined frequency band at the position of the pin 13, and winding the coil 14 in a substantially spiral shape via the pin 13 to thereby mount the antenna coil 11. In the second step of forming, the installation position of the pin 13a is moved while the IC module 7 is pressed so that the end of the coil 14 comes into contact with the coil installation positions 7a and 7b of the IC module 7, and the predetermined frequency is again set. A third step of adjusting the IC card to function in the band and forming the antenna coil 10 with the IC module, and a fourth step of installing the IC module. It includes a fifth step of joining by pressurizing the holding sheet 20 to the surface of the member manufactured by the first to fourth step (IC module with the antenna coil 10) with an adhesive layer 22.
[0041]
By manufacturing the IC card 5 in this manner, the manufacturing time can be reduced and the IC card can be manufactured. Further, the performance of the manufactured IC card does not vary.
[0042]
The present invention is not limited to the above embodiments, but may be implemented in various forms. For example, the pin position control means is not limited to the present embodiment, but may be any type as long as the distance between the coils can be changed. Although the number of pins for changing the distance between the coils is two in the present embodiment, any number of pins may be provided.
[0043]
Further, in the present embodiment, the pins 13 and 13a are installed on the base material 12, and the coil 14 is wound around the pins 13 and 13a in a substantially spiral shape, and attached (the IC module 7 is temporarily installed). 7 is pressed, the predetermined pin 13a is moved, the IC card is adjusted to function in a predetermined frequency band, and the IC module 7 is installed. When the IC module 7 is installed on the base material 12, the IC module 7 may be temporarily installed together.
[Brief description of the drawings]
FIG. 1 shows a schematic configuration of an IC card according to the present invention, FIG. 1 (a) is a plan view, and FIG. 1 (b) is a cross-sectional view along AA.
FIG. 2 is an enlarged view of B in FIG. 1 (b).
FIG. 3 is a schematic diagram of a pressurizing device.
[Explanation of symbols]
5 IC card 10 Antenna coil (antenna coil with IC module)
13 Coil support member (pin)
14 Coil 20 Holder sheet 22 Adhesive layer

Claims (4)

A method for manufacturing an IC card that functions in a predetermined frequency band by forming an antenna coil including a coil that circulates in a substantially spiral shape,
A method for manufacturing an IC card, comprising: a coil position adjusting step of adjusting a distance between predetermined coils to match the predetermined frequency band. 2. The method according to claim 1, wherein the adjustment is performed by changing an installation position of a part of the coil supporting members among the coil supporting members for supporting the coils. 2. The method for manufacturing an IC card according to claim 1, further comprising a step of pressing and bonding the surface of the antenna coil to a holding sheet provided with an adhesive layer. A first step of installing a coil supporting member for supporting the coil on the base material such that the IC card functions in a predetermined frequency band;
A second step of winding the coil in a substantially spiral shape via the coil support member;
In a state where the IC module is pressed so that the end of the coil is in contact with the coil mounting position of the IC module, among the coil supporting members, the installation positions of some of the coil supporting members are moved, and again at a predetermined frequency band. A third step of adjusting the IC card to function;
A fourth step of installing the IC module;
A fifth step of pressing and joining the surface of the member manufactured by the first to fourth steps to a holding sheet having an adhesive layer;
A method for manufacturing an IC card, comprising:

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