JP2004117788A - Lens with vertex indication marker and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To solve problems in which it is difficult to align an optical fiber core center axis with a lens vertex in an assembly of the optical fiber and lens and a method for assembly which finds the lens vertex while passing light through the optical fiber has assembly precision, but not only requires a long time, but also hardly performs automatic assembly. <P>SOLUTION: A vertex indication marker which makes it easy to find an X axis and a Y axis crossing each other at the lens vertex is added to a lens collar part to easily find the lens vertex, greatly shorten the assembly time while maintaining assembly precision, and also enabling automatic assembly. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a lens used for an optical fiber / lens assembly mainly in the optical field.
[0002]
[Prior art]
If the light coming out of the optical fiber into the air is re-entered into the optical fiber, the light coming out of the optical fiber will be scattered due to the difference in the refractive index and the diffraction, so when the light is taken into the optical fiber again, the intensity of the light will be greatly increased. Will decrease. Therefore, in order to prevent light scattering, a minute lens is attached to the tip of the optical fiber on the output side and the input side.
[0003]
In recent years, with the spread of the Internet and the like, the amount of communication has been dramatically increased, and the laying of optical fibers capable of high-capacity, high-speed communication from metal wires is being advanced at a rapid pace. Although a mechanical optical switch is used for switching the optical fiber, it is difficult to increase the number of channels of the optical switch. Therefore, conventionally, a method of converting light into electricity and returning the light to light has also been adopted. In such a system, there is a problem that the system becomes large-scale and costly, and a multi-channel optical switch using the MEMS technology is being studied. FIG. 13 shows an example of the MEMS optical switch. A lens 83 is attached to the output optical fiber 81. The drive mirror assembly 85 is provided with a number of mirrors 86 that move up and down. The light emitted from the output optical fiber 81 passes through the lens 83 and is redirected by the mirror 86, passes through the lens 84, enters the input optical fiber 82, and the optical path switching is completed. By operating any of the mirrors 86 arranged in a matrix, a 4 × 4 optical switch can be realized.
[0004]
However, even if the optical path is slightly deviated, the light emitted from the output optical fiber 81 does not accurately enter the input optical fiber 82, so that the insertion loss increases significantly. Causes of the deviation of the optical path include the angle of the mirror 86 that moves up and down, the displacement of the input and output optical fibers, and the like. Even if these positional relationships are accurately maintained, if the vertices of the input and output optical fibers and the lens are misaligned, the angle of the light changes and the insertion loss increases significantly.
[0005]
[Problems to be solved by the invention]
The outer diameter of the cladding of a general optical fiber is ± 0.5 μm or less, and the concentricity of the core and the cladding is also ± 0.5 μm or less, so when assembling the optical fiber and lens, the optical fiber is based on the outer diameter. Can be assembled. It is difficult to mechanically determine the vertex of the lens, and a method of assembling based on a part of the outer diameter of the lens or a method of assembling the vertex while actually passing light is used. However, when the outer diameter of the lens is used as a reference, there is a problem that assembling accuracy is poor, and when assembling through light, not only the equipment becomes large but also the number of assembling steps increases. In addition, assembling a lens array provided with a plurality of lenses and a plurality of optical fibers requires a large number of man-hours.
[0006]
The small lenses 83 and 84 used in FIG. 13 are often made of a silicon substrate by photolithography. A large number of lenses are formed on a silicon substrate, and the substrate is cut to obtain a single lens or lens array. In order to cut the substrate, the substrate is provided with a cutting margin, and the shape is such that a convex lens is mounted on a square plate. Therefore, it is difficult to visually recognize the periphery of the lens, and it is difficult to accurately determine the vertex from the periphery of the lens. In order to determine the lens vertex based on the side of the square plate, not only the parallelism and squareness of the square side but also the distance between the vertex and the side are important, and the cost of cutting processing will increase significantly, so adopt it. Was difficult. Hereinafter, the square brim-shaped part of the lens is called a lens brim part, and the part that functions as a convex lens is called a lens part. However, the lens part and the lens may be used in synonyms.
[0007]
In view of the above, an object of the present invention is to provide a lens that can easily determine the vertex of a lens and that can be assembled with an optical fiber with high accuracy and at low cost.
[0008]
[Means for Solving the Problems]
The lens with a vertex indicating marker of the present invention is characterized in that at least one surface of a substrate material has at least one curved lens made of the same material as the substrate material, and the substrate material has a marker indicating the vertex of the curved lens. .
[0009]
It is desirable that the markers indicating the vertices (hereinafter, referred to as markers) are arranged around the lens unit at 90-degree intervals. The marker is provided on the lens flange on the X axis and the Y axis orthogonal to the vertex of the lens. The marker may be provided over the lens portion and the lens flange portion, or may be provided at the boundary between the lens portion and the lens collar portion. However, since it is difficult to focus on the marker with a microscope or the like, it is difficult to focus on the lens portion. It is more preferable that a marker is provided on a flat lens brim portion while avoiding a boundary between the lens portion and the lens brim portion.
[0010]
The marker surface may be the same as the lens flange portion surface, or may be protruding or concave. For example, when forming a diamond-shaped marker, if a part of the surface of the lens collar is carved into a diamond, the marker surface will be recessed from the lens collar surface. By engraving a rhombus on the lens collar surface, the marker surface can be made the same as the lens collar surface. After providing a resist for marker formation at the time of manufacturing the lens part, forming metal or the like on the lens by vapor deposition or sputtering, removing the metal etc. other than the part to be the marker by etching, the upper surface of the marker protrudes from the lens collar part State can be formed.
[0011]
It is desirable that the marker has a shape having a corner. It is desirable to arrange the markers so that the axis line bisects the corner on the X axis and the Y axis orthogonal to the lens vertex. The marker may be a polygon, but is preferably a triangle or a quadrangle having an angle of 90 degrees or less at which corners are easily visible.
[0012]
The lens is desirably made of transparent glass, transparent quartz, or silicon. Silicon is opaque in the visible light region, but can be used as a lens in the wavelength region of light used for optical communication (1280 to 1610 nm) because silicon has light transmission performance. Since semiconductor integrated circuit manufacturing equipment can be used, it is more preferable to use silicon.
[0013]
The lens portion may be formed on one side (hereinafter, referred to as a single-sided lens) or on both sides (hereinafter, referred to as a double-sided lens) with respect to the lens brim portion. For a double-sided lens, the front and rear lens vertices must match. The marker provided on the single-sided lens can be formed on the surface of the lens flange where the lens portion is formed or on the opposite surface. It can be selected according to the system and structure of the device for assembling the optical fiber and the lens. The markers provided on the double-sided lens may be provided on both sides or on one side.
[0014]
The lens with a vertex marker of the present invention is characterized in that the marker indicating the vertex is made of the same material as the substrate material and is formed integrally with the substrate material.
[0015]
When a lens is formed on a transparent glass, transparent quartz, or silicon substrate, a marker can be formed in the same step, and a lens with a marker can be obtained at low cost. However, since the lens collar and the marker are made of the same material, there is a disadvantage that it is difficult to recognize the corner of the marker. However, the marker can be easily recognized by using a polarizing microscope or the like.
[0016]
The lens with a vertex marker of the present invention is characterized in that the marker indicating the vertex is formed of a metal or metal oxide having a thickness of 2 μm or less.
[0017]
When the lens is formed of a transparent material, the marker can be easily identified by using an opaque metal or metal oxide for the marker. In a lens formed of silicon close to black, the marker can be easily identified by using a metal or metal oxide of white to gray. By using a combination of transparent and opaque or a combination of different colors, the marker can be easily identified and the assembling work can be easily automated.
[0018]
The thickness of the metal or metal oxide film is desirably 2 μm or less. The film is preferably formed by vacuum evaporation or sputtering. Although it is possible to attach by plating, there is a limitation in the material to be formed, so that vacuum film formation is advantageous in manufacturing. Since the formed metal or metal oxide film forms a marker by chemical etching or dry etching, an excessively thick film is not preferable. When a marker is formed by chemical etching, aluminum, iron, nickel, chromium, cobalt, copper, tin, and the like, which can easily obtain a selective etching solution for only a film, can be used. When a marker is formed by dry etching, there is no particular limitation on the material of metal or oxide.
[0019]
The X-axis and Y-axis of the optical fiber are determined based on the marker formed on the X-axis and the Y-axis orthogonal to the vertex of the lens, and the X-axis and Y-axis of the optical fiber are determined based on the outer diameter of the optical fiber. By matching the axes, the center point of the core of the optical fiber and the vertex of the lens can be easily matched.
[0020]
The method of manufacturing a lens with a vertex marker of the present invention includes the steps of applying a photoresist to at least one surface of a substrate material, exposing and developing to form a photoresist pattern, heating the photoresist pattern to a curved surface, Forming a photoresist pattern for use, and etching the substrate material and the photoresist by dry etching to transfer the photoresist pattern to the substrate material.
[0021]
The diameter of the photoresist pattern determines the lens diameter, and the volume of the photoresist (the product of the thickness and the bottom area) determines the lens volume. Assuming that the bottom area of the photoresist is constant, the radius of curvature of the lens decreases as the thickness of the photoresist increases. It is desirable to use a novolak type positive resist as the photoresist.
[0022]
An additional exposure step may be performed before the step of heating the patterned photoresist to form a curved surface. By performing the additional exposure, the photosensitizer in the photoresist can be photoreacted to increase the fluidity of the photoresist during baking. It is desirable to add an additional exposure step in view of the lens shape stability, lens yield, and the like.
[0023]
The additional exposure time is obtained as a product of the exposure illuminance. Whether or not the photosensitizer reacts with light can be determined by measuring the light transmittance of the photoresist. If not completely exposed, light absorption is large in the wavelength region near the wavelength of the light used for exposure. Therefore, by measuring the light transmittance of the photoresist, the necessary exposure energy (product of illuminance and exposure time) can be reduced. You can ask.
[0024]
The photoresist pattern is heated to form a disc-shaped photoresist pattern having the same shape as the lens using the surface tension of the photoresist. If the baking temperature is low, the desired lens shape cannot be obtained because the fluidity of the photoresist is poor. It is desirable to carry out at a temperature of 180 ° C. or higher at which the fluidity becomes high. If an additional exposure step is performed before heating, the fluidity of the photoresist is improved, and it is possible to work at a temperature lower by about 5 ° C. to 10 ° C. than a photoresist without additional exposure.
[0025]
After forming the lens-shaped photoresist, a resist pattern for a marker can be formed. It is sufficient that the thickness of the photoresist pattern for the marker is about 1/5 of the lens height, but the thickness can be determined depending on whether the marker is convex or concave or the same surface as the lens flange. For the alignment of the marker resist pattern, it is preferable to use the alignment mark used when preparing the lens resist pattern. Alignment marks are not provided at several places on the substrate. By using alignment marks provided for each shot of the stepper-exposure machine, the effects of substrate warpage and the like can be eliminated. Accuracy can be greatly improved.
[0026]
When forming a double-sided lens, after forming a single-sided lens, a lens-shaped photoresist is formed again on the back surface, and the lens is formed by dry etching. Although lens-shaped photoresists can be simultaneously formed on both surfaces, the number of man-hours increases in consideration of work stability in the dry etching process, but it is desirable to form the front and back lenses individually.
[0027]
In the dry etching, a photoresist shape is transferred by etching a substrate material. In order to accurately transfer the photoresist shape, it is important that the dry etching rates of the photoresist and the substrate material completely match. The etching reaction in dry etching includes a) physical etching by ion bombardment, b) chemical etching by a chemical reaction between active neutral particles and a material to be etched, and c) etching by a combined action of physical etching and chemical etching. Divided. In general, physical etching has a small selectivity to a material (the difference in etching rate between materials is small), and chemical etching has a large selectivity to a material. Therefore, it is preferable to use a method mainly using physical etching instead of etching mainly using a chemical etching rate, and it is preferable to use an inductively coupled etching apparatus, an ion milling apparatus, or the like.
[0028]
The method for producing a lens with a vertex marker of the present invention includes a step of applying a photoresist to at least one surface of a substrate material, exposing and developing to form a photoresist pattern, a step of heating the photoresist pattern to a curved surface, and a step of dry etching. A step of transferring a photoresist pattern to a base material by etching a substrate material and a photoresist, a step of adding a metal or metal oxide film, and a step of forming a vertex marker by etching a metal or metal oxide film. And
[0029]
The metal or metal oxide film for the marker is formed using vacuum evaporation and sputtering. After forming a photoresist pattern on the film, dry etching or chemical etching is performed to remove unnecessary portions of the metal or metal oxide film to form a marker. After forming the resist pattern, a metal or metal oxide film is formed, and a method called lift-off for removing the metal or metal oxide film other than the marker portion by dissolving the photoresist with a solvent can be used. It is needless to say that it is important that the lens portion and the lens collar portion are not etched when the marker is formed by dry etching or chemical etching.
[0030]
BEST MODE FOR CARRYING OUT THE INVENTION
An embodiment of the present invention is shown in FIGS. FIG. 1 shows a single-sided lens having one lens, and FIG. 2 shows a lens array having a plurality of single-sided lenses. The single-sided lens 5 includes a lens portion 1 and a lens brim portion 2, a marker 3 indicating the X axis, and a marker 4 indicating the Y axis. The intersection of the X axis and the Y axis is the lens vertex. The single-sided lens array 6 has a marker indicating the X axis common to the plurality of lens units and the Y axis for each lens unit, and the intersection of the common X axis and the Y axis of each lens unit is the vertex of each lens. . For easy understanding, the same reference numerals are used for the same parts.
[0031]
Lenses and markers were formed on a 6-inch diameter silicon wafer using photolithography and etching techniques. After forming about 30,000 lens portions on a 6-inch silicon wafer, the silicon wafer was cut to obtain a single-sided lens of FIG. 1 and a single-sided lens array of FIG.
[0032]
The manufacturing process will be described in detail with reference to FIG. The bottom diameter of the lens unit 1 was 225 μm, and the radius of curvature of the lens was 550 μm. Photoresist 11 was applied to a silicon wafer 10 by 7 μm, and prebaked at 90 ° C. for 2 hours (step 1). After exposing for 1 second through the photomask 12 using an i-line stepper having a wavelength of 365 nm (step 2), development was performed for 3 minutes to obtain a disk-shaped photoresist pattern 13 (step 3). The disk-shaped photoresist pattern 13 was irradiated with i-rays over the entire surface for 2 seconds to completely react the photosensitizer in the photoresist with light (step 4). In order to make the disk-shaped photoresist pattern 13 into a lens shape, heating baking was performed at 210 ° C. for 1 hour to form a lens-shaped photoresist pattern 14 having a bottom diameter of 225 μm and a radius of curvature of 550 μm (Step 5). Photoresist 15 was applied at 3 μm and prebaked at 90 ° C. for 2 hours (step 6). Exposure and development were performed using a photomask 16 for the marker to produce a photoresist marker 17 (steps 7 and 8). The silicon substrate was etched using an inductively coupled plasma (ICP) dry etching apparatus using a chlorine gas and dry etching (step 9). When the photoresist pattern was removed, the dry etching was terminated, the photoresist pattern was transferred to a silicon substrate, and a silicon lens with a marker was obtained (Step 10). The silicon substrate on which the lens was formed was cut and separated by a dicer to obtain a single-sided lens 5 and a single-sided lens array 6 shown in FIGS.
[0033]
4a) to 4) show the marker shapes and positions. In a) to d), the marker is provided apart from the lens unit, and e) is provided in contact with the lens unit. f) shows a case where a part of the marker overlaps the curved surface of the lens unit. Shapes and positions can be freely combined. In FIG. 5A, the marker is convex from the lens flange, b) is the same surface, and c) is concave. In the present embodiment, a combination of the markers shown in FIGS. 4A and 5A was used to indicate the lens apex.
[0034]
The important photoresist thickness, exposure time, and bake temperature which determine the radius of curvature of the photoresist in producing a lens-shaped photoresist pattern will be described based on data.
[0035]
FIG. 6 shows the relationship between the photoresist thickness and the radius of curvature of the photoresist. As the photoresist thickness increases, the radius of curvature of the photoresist decreases, resulting in a rounded shape. The relationship between the thickness of the photoresist and the radius of curvature was almost linear. FIG. 7 shows the relationship between the time for additionally exposing the disk-shaped photoresist pattern and the radius of curvature. It can be seen that a stable radius of curvature can be obtained by setting the additional exposure time to 1 second or longer. The illuminance at this time is 500 mW / cm ² It is. FIG. 8 shows the relationship between the baking temperature and the radius of curvature for making the disc-shaped photoresist pattern after additional exposure into a lens shape. It can be seen that there is a stable region around 200 ° C. From these data, the photoresist thickness was 7 μm, the overall exposure time was 2 seconds, and the bake temperature was 210 ° C.
[0036]
The conditions for ICP dry etching were such that the etching rates of silicon and photoresist were the same by using chlorine as an etching gas and setting the flow rate to 5 sccm.
[0037]
The silicon lens obtained in this example had a bottom diameter of 225 μm and a radius of curvature of 550 μm. An error (correlation coefficient) between the radius of curvature and the spherical approximation curve was 0.9995. The intersection between the X axis and the Y axis of the marker was defined as a mechanical vertex, and the vertex obtained through light was defined as an optical vertex, and the difference was calculated. The difference between the mechanical vertex and the optical vertex was 0.15 μm or less in both the X and Y axis directions.
[0038]
A second embodiment of the present invention will be described with reference to FIG. In this embodiment, a lens vertex indicating marker is provided on the surface opposite to the lens portion. Steps up to step 5 are the same as the steps described in FIG. 3 of the first embodiment of the present invention, so that detailed description will be omitted. The lens-shaped photoresist on silicon and the silicon substrate were dry-etched to transfer the photoresist pattern to the silicon substrate (step 6). A photoresist 18 was applied to the back surface of the silicon substrate, exposed through a photomask 19, and developed to form a marker photoresist pattern 20 (steps 7 to 9). The marker 21 was prepared by etching the silicon substrate using an ion milling apparatus (step 10). The photoresist was removed to obtain a lens having a marker attached to the back surface (step 11).
[0039]
The marker used was a combination of FIG. 4c) and FIG. 5b). The obtained silicon lens had a bottom diameter of 225 μm and a radius of curvature of 549 μm. An error of 0.9994 from the spherical approximation curve of the radius of curvature was obtained. The intersection between the X axis and the Y axis of the marker was defined as a mechanical vertex, and the vertex obtained through light was defined as an optical vertex, and the difference was calculated. The difference between the mechanical vertex and the optical vertex was 0.17 μm or less in both the X and Y axis directions.
[0040]
A third embodiment of the present invention will be described with reference to FIG. In this embodiment, a double-sided lens is used, and a marker is provided on one lens portion surface. The fabrication of the lens and the marker on one side is the same as the process described with reference to FIG. 3 of the first embodiment of the present invention, so that the detailed description will be omitted and the drawings will be referred to. The thickness of the silicon substrate used is different from that of the first embodiment. In step 10 of FIG. 3, the silicon substrate 22 on which the lens portion and the marker are formed on one side is inverted, a photoresist 23 is applied, exposed through a photomask 24, developed, and additionally exposed to obtain a disk-shaped photoresist pattern 25, which is baked. To form a lenticular photoresist pattern 26 (steps 11 to 16). A lens portion was formed by dry etching (step 17), and a double-sided lens 27 was obtained (step 18). The manufacturing conditions were the same as in Example 1.
[0041]
The marker used was a combination of FIG. 4a) and FIG. 5c). The obtained silicon lens had a bottom diameter of 224 μm and a radius of curvature of 552 μm. An error of 0.9993 from the spherical approximation curve of the radius of curvature was obtained. The intersection between the X axis and the Y axis of the marker was defined as a mechanical vertex, and the vertex obtained through light was defined as an optical vertex, and the difference was calculated. The difference between the mechanical vertex and the optical vertex was 0.15 μm or less in both the X and Y axis directions.
[0042]
A fourth embodiment of the present invention will be described with reference to FIG. This is a single-sided lens with a metal marker provided on the lens unit side. Chromium was used as a marker. Photoresist coating, exposure, development, additional exposure, baking, and dry etching were performed on the silicon substrate to obtain a single-sided lens 28 without a marker (steps 1 to 7). Chromium 29 was formed to a thickness of 0.2 μm by sputtering (step 8). The resist was applied, exposed, and developed to form a photoresist pattern 30 for a marker on the chromium film (steps 9 to 10). The chromium film was chemically etched and the photoresist was removed to form a marker 31 (step 11). The chromium etchant used was one obtained by adding ceric ammonium nitrate (weight: 360 g) to pure water (weight: 2040 g).
[0043]
The marker used was a combination of FIG. 4c) and FIG. 5a). The obtained silicon lens had a bottom diameter of 225 μm and a radius of curvature of 550 μm. An error of 0.9996 from the spherical approximation curve of the radius of curvature was obtained. The intersection between the X axis and the Y axis of the marker was defined as a mechanical vertex, and the vertex obtained through light was defined as an optical vertex, and the difference was calculated. The difference between the mechanical vertex and the optical vertex was 0.10 μm or less in both the X and Y axis directions. Since the chromium film has a light gray color and a different color from silicon, it is easy to find a mechanical vertex, so that the difference from the optical vertex could be reduced.
[0044]
In the fifth embodiment of the present invention, the substrate material of the fourth embodiment is changed from silicon to glass, and the steps are the same as in FIG. 11, so that the illustration is omitted. The dry etching of step 6 is different only in that ion milling is used. The obtained glass lens had a bottom diameter of 225 μm and a radius of curvature of 548 μm. An error of 0.9994 from the spherical approximation curve of the radius of curvature was obtained. The intersection between the X-axis and the Y-axis of the marker was defined as a mechanical vertex, and the vertex determined through light was defined as an optical vertex, and the difference was determined. The difference between the mechanical vertex and the optical vertex was 0.16 μm or less in both the X and Y axis directions.
[0045]
The lens with the vertex indicating marker obtained by the present invention and the optical fiber were assembled, and the shift amount between the core center of the optical fiber and the lens vertex and the assembling time were obtained. For comparison, a method of assembling while passing light through an optical fiber and a method of assembling using a boundary of a lens were also performed. The amount of deviation between the center of the optical fiber core and the vertex of the lens is determined in the X-axis direction and the Y-axis direction at the intersection between the X axis XL and the Y axis YL of the lens and the intersection between the X axis XF and the Y axis YF of the optical fiber shown in FIG. , And a value having a large displacement was used. Assuming that the shift amount and the assembling time of the method of assembling while passing light through the optical fiber is 1, the shift amount of the lens with marker is equal to 1 and the assembling time is １ ／ or less. In the case of a lens without a marker, the amount of displacement was three times, and the assembling time could only be reduced to about 2/3.
[0046]
【The invention's effect】
By providing the vertex indicating marker on the lens, the vertex of the lens can be easily obtained, and the assembly time can be greatly reduced with the same accuracy as the method of assembling the optical fiber and the lens while passing the light, and it is inexpensive The optical fiber and lens assembly can be provided. Also, automatic assembly became possible by using the outer periphery of the optical fiber and the marker as a reference.
[Brief description of the drawings]
FIG. 1 is a perspective view of a lens with a vertex indicating marker of the present invention.
FIG. 2 is a perspective view of a lens array with a vertex indicating marker of the present invention.
FIG. 3 is a diagram illustrating a manufacturing process of the present invention.
FIG. 4 is a plan view showing an example of the shape and position of a marker according to the present invention.
FIG. 5 is a perspective view showing a marker of the present invention.
FIG. 6 is a diagram showing a relationship between a photoresist thickness and a photoresist curvature radius.
FIG. 7 is a diagram showing the relationship between the overall exposure time and the radius of curvature of the photoresist.
FIG. 8 is a diagram showing a relationship between a baking temperature and a radius of curvature of a photoresist.
FIG. 9 is a diagram illustrating a manufacturing process according to another embodiment of the present invention.
FIG. 10 is a diagram illustrating a manufacturing process according to another embodiment of the present invention.
FIG. 11 is a diagram illustrating a manufacturing process according to another embodiment of the present invention.
FIG. 12 is a perspective view illustrating assembly accuracy of the lens and the optical fiber according to the present invention.
FIG. 13 is a diagram illustrating the structure of a MEMS optical switch.
[Explanation of symbols]
1 lens part, 2 lens brim part, 3 X axis marker,
4 Y axis marker, 5 lenses, 6 lens array,
10,22 silicon substrate, 11,15,18,23 photoresist,
12,16,19,24 Photomask,
13,25 disc-shaped photoresist pattern,
14,26 lenticular photoresist pattern,
17, 20, 30 Photoresist pattern for marker,
21, 31 marker, 27 double-sided lens, 28 single-sided lens without marker, 29 chrome, 32 optical fiber, 81 output optical fiber,
82 input optical fiber, 83, 84 lens, 85 drive mirror assembly,
86 mirror.

Claims (5)

A lens with a vertex indicating marker, comprising: at least one surface of a substrate material, at least one curved lens made of the same material as the substrate material, and a base material having a marker indicating a vertex of the curved lens. The vertex indicating marker-equipped lens according to claim 1, wherein the marker indicating the vertex is made of the same material as the substrate material, and is formed integrally with the substrate material. The vertex indicating marker-equipped lens according to claim 1, wherein the marker indicating the vertex is formed of a metal or metal oxide having a thickness of 2 µm or less. A step of applying a photoresist to at least one surface of the substrate material, exposing and developing to form a photoresist pattern, a step of heating the photoresist pattern to a curved surface, a step of forming a photoresist pattern for a vertex marker, and dry etching. A method of manufacturing a lens with a vertex indicating marker, comprising a step of transferring a photoresist pattern to a substrate material by etching a substrate and a photoresist. A step of applying a photoresist to at least one surface of the substrate material, exposing and developing to form a photoresist pattern, a step of heating the photoresist pattern to a curved surface, and etching the base material and the photoresist by dry etching to the substrate material. A method of manufacturing a lens with a vertex indicating marker, comprising the steps of transferring a photoresist pattern, adding a metal or metal oxide film, and forming a vertex marker by etching the metal or metal oxide film.

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