JP2004111595A - Wall waterproof structure and waterproof type electronic apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To reduce the number of components, improve assembling property and realize cost reduction by manufacturing a metal mold of a waterproof connector at a low cost within a short period of time required for the delivery. <P>SOLUTION: The waterproof type electronic apparatus comprises a cabinet 1 of the electronic apparatus, a hole 16 for leading a wire 6 into the cabinet 1, a fitting plate 7 for fitting the wire 6 to the cabinet 1, a hot-melt resin 11 to integrally form the fitting plate 7 and wire 6 and to realize waterproof structure of the hole 16, and a pressure-bonding fixing tool 13 for fitting the fitting plate 7 to the cabinet 1. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a waterproof structure for a wall for making an electronic device waterproof, and a waterproof electronic device.
[0002]
2. Description of the Related Art Conventionally, when an electric wire is taken into the housing of an electronic device such as an automobile which requires a waterproof function (for example, a power supply device), an existing connector is attached between the electric wires. However, a packing rubber is attached to the connector and fixed to the housing to have a waterproof function (for example, see Patent Document 1).
[0003]
[Patent Document 1] Japanese Patent Laid-Open No. 11-8909
The above-mentioned prior art has the following problems. In recent years, the size and cost of electronic devices have also been required to be reduced in size, and existing connectors require male and female connectors and associated packing rubber and terminals. Also, in the assembly work, the terminal attachment to the wire and the attachment to the connector must be male and female. In particular, in the case of producing a dedicated connector, the production time of the mold is long and the cost is high. For this reason, there are limits to cost reduction and delivery time reduction due to size reduction and reduction in the number of parts.
[0005]
An object of the present invention is to solve such a conventional problem, to produce a mold at low cost and in a short delivery time, to reduce the number of parts, to improve the assemblability, and to reduce the cost.
[0006]
FIG. 5 is an explanatory view when a hot melt unit of the present invention is fixed to an electronic device. In FIG. 5, reference numeral 1 denotes a housing, in particular, a part of a wall thereof is shown, 6 is a wire having a coating, which is a wire, 7 is a mounting plate (metal fitting), and 11 is a hot plate. Melt resin, 13 is a crimping fixture (screw), 16 is a hole (a long hole), and B is a protrusion.
[0007]
In order to solve the above problems, in the wall waterproofing mechanism according to the present invention, a wall having a hole for taking in a linear body, a mounting plate for mounting the linear body at a fixed position with respect to the wall, and the mounting plate A waterproof structure for a wall having a crimping fixture for crimping and fixing to a wall, wherein the wire and the mounting plate are integrated by filling a hot melt resin between the wire and the mounting plate. When the mounting plate is fixed to the wall with the crimping fixture, the hot melt resin is crimped on the wall to close the hole.
[0008]
This wall may be one surface of the housing. Thereby, a waterproof case in which the linear body is taken in the case is obtained.
[0009]
Further, the hot melt resin may have a structure in which the mounting plate has a protrusion projecting more toward the wall than the wall, and the protrusion surrounds the hole and is pressure-bonded to the wall. . Further, the hot melt resin may have a projecting portion that protrudes around the linear body on the wall side of the mounting plate on the wall side than the surface on the wall side, and the projecting portion may be press-fitted into the hole. good. By employing such a structure, an excellent waterproof structure can be obtained.
[0010]
The wire may be an electric wire coated with a film. By adopting such a structure, when the electric wire is taken in beyond the wall, a waterproof function can be obtained in the hole through which the electric wire passes through the wall.
[0011]
Further, in order to solve the above problem, a waterproof electronic device according to the present invention includes a housing of an electronic device having a hole for taking an electric wire coated with a film, and attaching the electric wire at a fixed position to the housing. An electronic device having a mounting plate and a crimping fixture for pressing and fixing the mounting plate to the housing, wherein the electric wire and the mounting device are filled by filling a hot melt resin between the electric wire and the mounting plate. A plate is integrated, and the hot-melt resin is press-fitted to the housing to close the hole by press-fixing the mounting plate to the housing using the press-fixing fixture.
[0012]
The hot melt resin may be provided with a protruding portion that protrudes toward the housing from the surface of the mounting plate on the housing side, and the protruding portion may be pressure-bonded to the housing by surrounding the hole. Further, the hot melt resin may have a protruding portion protruding around the electric wire on the housing side of the mounting plate on the housing side than the surface on the housing side, and the protruding portion may be press-fitted into the hole. . By employing such a structure, an excellent waterproof structure can be obtained.
[0013]
BEST MODE FOR CARRYING OUT THE INVENTION In the present invention, a metal mold such as iron or aluminum is manufactured at low cost and in a short delivery time, a mounting plate and a plurality of electric wires are attached to the metal mold, and a hot melt resin is injected at a low pressure and integrated. A connector (waterproof connector unit) is produced. This integrated connector is fixed to the housing of the electronic device by screwing or by providing a locking mechanism (for example, fitting of a projection and a concave portion). Then, a waterproof function is provided by providing a protrusion or a protrusion at a portion where the hot melt resin of the integrated connector contacts the housing.
[0014]
(1): Description of Wall Waterproof Structure Having Waterproof Function and Electronic Device FIG. 1 is an explanatory diagram of an electronic device using a waterproof connector according to an embodiment of the present invention. In FIG. 1, a housing 1 of the electronic device is sealed by attaching a lid 2 with a plurality of screws 14. The waterproof connector unit in which the electric wire 6 and the mounting plate 7 are integrated with a hot melt resin is fixed to a wall which is one surface of the housing 1 by screws 13. Here, the housing 1 is made of metal or resin, and the electric wire 6 is a wire having a conductor coated with vinyl chloride or the like.
[0015]
FIG. 2 is an exploded explanatory view of an electronic device using the waterproof connector according to the embodiment. In FIG. 2, the electronic device has a housing 1 and a printed circuit board 4 constituting an electronic circuit unit, various components, and a mechanical unit are built in the housing 1 (here, a printing unit is provided). The substrate 4 is fixed to the housing 1 with a plurality of screws 15).
[0016]
In the electronic device, a lid 2 attached with a packing such as an O-ring 3 made of silicon rubber or the like is fixed to the housing 1 with a plurality of screws 14, and the electric wires 6 are inserted into the holes 16 of the housing 1 from the terminals 5. It has a waterproof structure in which the inserted hot melt unit 12 is fixed to the housing 1 with screws 13. The terminal 5 of the electric wire 6 is connected to a conductor in the housing 1, for example, a conductor of the printed circuit board 4.
[0017]
(2): Description of the method of manufacturing the hot melt unit FIG. 3 is an explanatory diagram of the method of manufacturing the hot melt unit in the embodiment. In FIG. 3A, the electric wire 6 with the terminal 5 is inserted into the mounting plate 7 and then attached to the concave portion of the lower die 8. FIG. 3B shows a state where the electric wire 6 with the terminal 5 is inserted into the mounting plate 7 and then attached to the concave portion of the lower die 8. Thereafter, as shown in FIG. 3 (c), the mold is clamped on the mold 9 and the hot melt resin is injected from the hot melt resin injection port A with a low pressure (lower pressure than ordinary plastic molding). After the injection cooling, the upper mold 9 is removed and the hot melt unit 12 is taken out.
[0018]
(3): Description of the hot melt unit {circle around (1)}: Description of the case where the hot melt unit has projections FIG. 4 is an explanatory diagram of the hot melt unit having projections. FIG. 4 is a perspective view of the configuration of the hot melt unit 12, in which a plurality of electric wires 6 and a mounting plate 7 are integrated with a hot melt resin 11. Further, the hot melt resin 11 is provided with a protruding portion B instead of the waterproof O-ring. The mounting plate 7 is provided with mounting holes 71 at both ends. The hot melt resin 11 is a resin material having adhesiveness (waterproofness) even if it melts and cools when heated, and has elasticity.
[0019]
FIG. 5 is an explanatory diagram when the hot melt unit is fixed to the electronic device. FIG. 5 shows a cross section of a waterproof portion when the hot melt unit 12 is fixed to the housing 1 of the electronic device. In the opening of the mounting plate 7 into which the hot melt resin enters, the opening 7a on the housing side of the mounting plate 7 is a wide opening, and the opening 7b on the opposite side is a narrower opening. The opening 7c between the openings 7a and 7b is a narrower opening, so that even after the hot melt resin 11 and the mounting plate 7 are integrated, they are not easily separated from each other. Even with the mounting plate having such a structure, since the hot melt resin has a low melting point, the mounting plate and the hot melt resin can be easily integrated. The hot melt unit 12 has a waterproof function by inserting the screw 13 into the mounting hole 71 of the mounting plate 7 and fixing the screw 13 to the housing 1 and bringing the protrusion B into contact with the housing 1. Then, the mounting plate 7 is fixed to a wall, which is one surface of the housing 1, by a crimping fixture 13 such as a screw. At this time, the mounting plate 7 and the hot melt resin 11 are integrated, and the protrusion B projects beyond the mounting plate 7, so that a strong pressure is generated between the protrusion B and the wall. Therefore, the housing 1 has a strong waterproofing effect.
[0020]
The hot melt resin 11 is provided with a protrusion C that just enters the hole 16 of the housing 1 and is fitted into the hole 16.
[0021]
{Circle around (2)} Description of the case where a predetermined angle is provided on the protruding portion of the hot melt unit FIG. FIG. 6 is a perspective view of the configuration of the hot melt unit 12, in which a plurality of electric wires 6 and a mounting plate 7 are integrated with a hot melt resin 11. The hot melt resin 11 has a protruding portion C, which is provided at a predetermined angle. The mounting plate 7 is provided with mounting holes 71 at both ends.
[0022]
FIG. 7 is an explanatory diagram when the hot melt unit is fixed to the electronic device. FIG. 7 shows a cross section of a waterproof portion when the hot melt unit 12 is fixed to the housing 1 of the electronic device. To fix the hot melt unit 12 to the housing 1, the screw 13 is inserted into the mounting hole 71 of the mounting plate 7 and tightened to the housing 1 so that the protrusion C provided at a predetermined angle is fixed to the housing 1. The waterproof function is added by crimping to the inner surface of the hole 16. The hot melt resin 11 is formed in a shape D that sandwiches the mounting plate 7 and increases the adhesive strength with the mounting plate 7. By making the inner surface of the hole 16 substantially the same angle as the protruding portion C, a more reliable waterproof function can be added. Further, the hot melt resin 11 may have both the protrusion B and the protrusion C provided with a predetermined angle, so that a more reliable waterproof function can be performed.
[0023]
(4): Description of Other Embodiments The fixing (attachment) of the hot melt unit 12 to the housing 1 of the electronic device can be performed by providing a lock mechanism other than screwing. As the lock mechanism, for example, an attachment means having the configuration shown in FIG. 8 can be used.
[0024]
FIG. 8 is an explanatory view in the case where the mounting projection is provided. In FIG. 8, a plurality of mounting projections 21 are provided around the hole 16 of the housing 1. When the hot melt unit 12 is inserted into the hole 16 from the electric wire 6 as shown by the arrow, the mounting plate 7 enters between the mounting protrusions 21 by the elasticity of the mounting protrusion 21, and the mounting plate 7 is Is fixed so as not to come off.
[0025]
In addition, the hole 16 which is a long hole of the housing 1 is not limited to this, and may be a round shape, a square, a long circle, or the like. Also, the mounting plate 7 may be made of a hard (rigid) material, for example, plastic, instead of metal.
[0026]
As described above, according to the present invention, the following effects can be obtained.
[0027]
The mounting plate is attached to the wall or housing with the crimping fixture that is the mounting means, the mounting plate and the wire are integrally formed with hot melt resin, and the holes are waterproofed. Production can be made on time, the number of parts can be reduced, assemblability can be improved, costs can be reduced, and a waterproof function can be reliably provided with a simple configuration.
[0028]
Further, since the electric wire is directly taken into the housing without passing through the connector, there is no connecting means in the middle, so that the number of parts can be reduced and the cost can be reduced.
[Brief description of the drawings]
FIG. 1 is an explanatory diagram of an electronic device using a waterproof connector according to an embodiment.
FIG. 2 is an exploded explanatory view of an electronic device using the waterproof connector according to the embodiment.
FIG. 3 is an explanatory diagram of a method for manufacturing a hot melt unit in the embodiment.
FIG. 4 is an explanatory diagram of a hot melt unit having projections according to the embodiment.
FIG. 5 is an explanatory diagram when the hot melt unit in the embodiment is fixed to an electronic device.
FIG. 6 is an explanatory diagram of a hot melt unit in which a predetermined angle is provided to a protruding portion in the embodiment.
FIG. 7 is an explanatory diagram when the hot melt unit in the embodiment is fixed to an electronic device.
FIG. 8 is an explanatory diagram in the case where the mounting projection according to the embodiment is provided.
[Explanation of symbols]
1 Housing 6 Electric wire 7 Mounting plate (metal fitting)
11 Hot melt resin 13 Crimping fixture (screw)
16 holes (long holes)
B Projection

Claims (8)

A wall having a hole for taking in the line,
A mounting plate for mounting the wire at a fixed position with respect to a wall,
A waterproof structure of a wall having a crimping fixture for crimping and fixing the mounting plate to the wall,
The wire and the mounting plate are integrated by filling a hot melt resin between the wire and the mounting plate,
A wall waterproof structure, wherein the hot melt resin is pressed against the wall when the mounting plate is fixed to the wall by the pressure fixing tool, thereby closing the hole. The wall waterproof structure according to claim 1, wherein the wall is one surface of a housing. The hot-melt resin has a projection projecting more toward the wall than the wall of the mounting plate, and the projection is pressure-bonded to the wall surrounding the hole. Item 3. The wall waterproof structure according to Item 1 or 2. The hot melt resin has a protruding portion that protrudes around the wire on a wall side of the mounting plate on a side of the wall side, and the protruding portion is press-fitted into the hole. The waterproof structure for a wall according to claim 1. The wall waterproof structure according to any one of claims 1 to 4, wherein the wire is an electric wire provided with a coating. An electronic device housing having a hole for receiving an electric wire on which the coating is applied,
A mounting plate for mounting the electric wire at a fixed position with respect to the housing,
An electronic device having a crimping fixture for crimping and fixing the mounting plate to the housing,
The electric wire and the mounting plate are integrated by being filled with a hot melt resin between the electric wire and the mounting plate,
A waterproof electronic device, wherein the hot-melt resin is pressed against the housing to close the hole by press-fixing the mounting plate to the housing by the pressure-fixing fixture. The hot melt resin is characterized in that a protrusion is provided which protrudes toward the housing from the surface of the mounting plate on the housing side, and the protrusion is pressure-bonded to the housing so as to surround the hole. The waterproof electronic device according to claim 6. The hot melt resin has a protruding portion that protrudes around the electric wire on the housing side of the mounting plate from the surface of the mounting plate on the housing side, and the protruding portion is press-fitted into the hole. Item 8. A waterproof electronic device according to item 6 or 7.

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