JP2004103969A - Method for producing conductive pattern substrate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To solve the drawback that it is difficult to control the shape of a conductive layer of a metal layer, etc., growing by plating, and it is hard to hold constant a sectional shape or a line width, which have been entailed in a full-additive method and a semi-additive method in the prior art. <P>SOLUTION: A recess 2 of a pattern substrate 1 is filled with a resin, and upon removing the resin except the recess with a squeeze, etc., a transfer is made to a substrate 5 to form a projection pattern consisting of a collection of projections 6. A conductive pattern is formed by utilizing the formed projection 6. A metal thin film layer 6 may be in advance provided on the substrate 5. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
According to the present invention, a conductive pattern is formed on a surface of a substrate, and a conductive pattern is selectively formed on the convex portion or between the convex portions by using the convex pattern. The present invention relates to a method for producing a conductive pattern substrate capable of generating a pattern.
[0002]
[Prior art]
As a method of forming a conductive pattern on the surface of a substrate, there is a subtractive method in which a resist pattern is formed on a metal layer, and the etching is performed by etching, but it is common to remove most of the metal layer, There are problems such as recovery of metal and treatment of etching waste liquid.
[0003]
On the other hand, a full-additive method in which a metal pattern is provided by electroless plating, or a plating resist pattern in which a metal layer is provided by electroless plating on the surface of the substrate, after a plating resist pattern is provided on the surface of the substrate. There is also a semi-additive method of providing a metal pattern by electrolytic plating on the exposed portion. In the full-additive method and the semi-additive method, it is possible to provide a metal layer only at a necessary place, and although the disadvantage of the subtractive method is solved, it is difficult to control the shape of the metal layer grown by plating. However, there is a disadvantage that it is difficult to keep the cross-sectional shape and line width constant.
[0004]
Alternatively, a pattern is printed on a transparent substrate with a conductive ink, coated with a negative photoresist layer having a thickness greater than the thickness of the pattern, exposed from the back side of the transparent substrate, developed, and the photoresist layer on the pattern is developed. After the removal, there is a method of forming a metal pattern on the pattern by electrolytic plating (for example, see Patent Document 1).
[0005]
[Patent Document 1]
Japanese Patent Application Laid-Open No. 2000-265087 (Claim 1)
[0006]
However, since the first pattern is formed by printing, it is difficult to ensure high dimensional accuracy and positional accuracy.
[0007]
[Problems to be solved by the invention]
In the present invention, conventionally, the full additive method and the semi-additive method have the disadvantage that it is difficult to control the shape of a conductive layer such as a metal layer grown by plating, and it is difficult to maintain a constant cross-sectional shape and line width. It is an object to solve the problem.
[0008]
[Means to solve the problem]
Instead of forming a plating resist pattern or forming a pattern of a conductive ink in the conventional method, these problems are to form a convex pattern on a substrate using a pattern substrate having a concave portion, and furthermore, to simply form a pattern. According to the method described above, it is difficult to provide only the convex portion on the substrate because the concave portion is also formed in addition to the convex portion. However, the resin is filled only in the concave portion of the pattern substrate, and the resin is transferred to the substrate. The above problem could be solved by forming only the substrate on the substrate.
[0009]
In the first invention, after forming a convex pattern on a substrate and covering the entire surface of the substrate with a conductive thin film layer in random order, the formed convex pattern is utilized by using the formed convex pattern. On the convex pattern, or in a portion other than the convex pattern, to generate a conductive pattern, the formation of the convex pattern, filling the concave portion of the pattern substrate having a concave portion with a resin, after filling, The pattern substrate is brought into close contact with the resin-filled side on the substrate, and after the close contact, the two are peeled off to transfer the resin filled in the concave portions of the pattern substrate onto the substrate. And a method for producing a conductive pattern substrate.
[0010]
According to a second aspect, in the first aspect, the step of filling the concave portion of the pattern substrate with the resin includes applying the resin to the pattern substrate, and a portion other than the concave portion of the pattern substrate after the application. The present invention relates to a method for manufacturing a conductive pattern substrate, which is performed by removing a resin adhered to a substrate.
[0011]
A third invention is the conductive pattern substrate according to the first or second invention, wherein after the conductive pattern is generated, a metal plating pattern is generated by using the conductive pattern. It relates to a manufacturing method.
[0012]
BEST MODE FOR CARRYING OUT THE INVENTION
First, formation of a convex pattern on a substrate, which is a characteristic part of the method for producing a conductive pattern of the present invention, will be described with reference to FIG.
[0013]
There is a pattern substrate 1 to be prepared. As shown in FIG. 1A, the pattern substrate 1 has a structure having a concave portion 2 on one surface of the substrate in a pattern. As shown in FIG. 1A, the cross-sectional shape of the concave portion 2 may be a shape that forms a part of a rectangle, or the cross-sectional area near the entrance of the concave portion is larger than the bottom portion, and the cross-sectional area becomes smaller as approaching the bottom. Shape. Having the latter cross-sectional shape is somewhat advantageous in terms of the transfer of the resin filled in the recess 2. The width of the recess 2 (the dimension in the horizontal direction in the figure) is preferably 10 nm to 1 μm. The depth of the recess 2 is also preferably 10 nm to 1 μm, as is the diameter.
[0014]
After all, there are the resin 3 and the squeegee 4 to be prepared. Also, an appropriate coating means is required. Among them, the resin 3 is filled in the concave portion 2 of the pattern substrate 1 and transferred to the substrate 2 so as to become a resist such as etching, so that the resin 3 can withstand the conditions given in those steps. Is preferred.
[0015]
Specific examples of the resin (in other words, the filling resin composition) 3 are preferably a photosensitive resin composition used as a constituent of a resist, and more broadly, an ionizing radiation-curable resin composition. However, a thermosetting resin composition or a thermoplastic resin composition can also be used. In general, a negative resist material that can be developed by being irradiated with ultraviolet rays, and more broadly, is a negative photosensitive resin composition that can be developed by being irradiated with ultraviolet rays. These are suitable for application, but are preferably adjusted to have a viscosity such that they do not easily flow out after being filled in the concave portions 2 of the pattern substrate 1.
[0016]
The resin 3 is applied to the surface of the pattern substrate 1 on the side having the concave portion 2 by appropriate means. Means for application are well-known means such as pouring, curtain coating, roll coating, coating with a wheeler or spinner, spray coating, or brushing. In thin layer chromatography, an applicator for controlling the thickness of a coating and a coating film can also be used.
[0017]
The applied resin 3 is filled into the recess 2 after or almost simultaneously with the application. Normally, the resin is used to fill the concave portion 2. However, in order to ensure the filling and to remove the excess resin 3 remaining in a portion other than the concave portion 2, FIG. As shown in (1), it is preferable to scrape the resin from one end to the other end of the substrate 1 using a squeegee 4 or the like. Here, the squeegee 4 can be made of metal, plastic, or rubber.
[0018]
In addition to the squeegee 4 described above, the remaining resin is scraped by rubbing the surface having the concave portion 2 with a round bar, a metal doctor blade (a thin blade), or a rotating roller. May be removed.
[0019]
Thus, using the pattern substrate 1 in which the concave portion 2 is filled with the resin, as shown in FIG. 1C, the side of the concave portion 2 in which the resin 3 is filled of the pattern substrate 1 is turned to the substrate 5 side, and The resin 3 filled in the concave portion 2 is transferred to the substrate 5 by bringing the substrate 5 into close contact with the substrate 5 and then peeling off (FIG. 1D), and the convex portion 6 formed of the resin 3 is formed on the substrate 5. Is formed. The shape of the protrusion 6 is an inverted shape of the recess 2 of the pattern substrate 1. When the resin 3 is cured by irradiation with ultraviolet rays and becomes developable, the resin 3 is cured by irradiating ultraviolet rays after the above-mentioned adhesion, and then peeled off. When the resin 3 is thermosetting, the resin 3 is left in close contact or, while being heated and cured, is left in close contact. In addition, if necessary, in order to make the pattern substrate 1 and the substrate 5 more closely contact with each other, pressure may be applied by a flat plate press or a roller press, or may be accompanied by heating.
[0020]
The substrate 5 serves as a base of a final conductive pattern substrate, for example, a circuit board, and may be made of various materials commonly used in this field. As a specific material, an inorganic substrate such as a glass plate, a silicon wafer, or a quartz plate, or an organic substrate as listed below can be used. Depending on the use of the circuit board, it may be preferable that the circuit board is transparent, but it may be opaque in some cases.
[0021]
Examples of the organic base material that can constitute the substrate 5 include polyamide, polyacetal, polybutylene terephthalate, polyethylene terephthalate, polyethylene naphthalate, or syndiotactic polystyrene, polyphenylene sulfide, polyetheretherketone, liquid crystal polymer, fluororesin, or Polyether nitrile, etc., polycarbonate, modified polyphenylene ether, polycyclohexene, or polynorbornene-based resin, or the like, or polysulfone, polyether sulfone, polyarylate, polyamideimide, polyetherimide, or thermoplastic polyimide, etc. However, those made of common plastics can also be used. In particular, when the substrate 5 is an organic base material, it is preferable to use a thin flexible film having a thickness of about 5 μm to 300 μm because the obtained substrate having a conductive pattern can be made flexible.
[0022]
As shown in FIG. 1A, the pattern substrate 1 may be one in which the concave portion 2 is formed directly on a flat substrate, or by forming the convex portion on the flat substrate. It may be one in which the concave portions 2 are formed between the convex portions (not shown).
[0023]
As a material of the substrate itself, which forms the basis of the pattern substrate 1, the same material as the substrate 5 of the conductive pattern substrate described above can be used in principle. The substrate of the pattern substrate 1 may be either transparent or opaque, but the substrate 5 of the conductive pattern substrate is opaque, and the resin 3 to be used is cured by irradiation with ultraviolet rays and becomes developable. In this case, the substrate of the pattern substrate 1 is preferably transparent, that is, at least transparent to ultraviolet rays.
[0024]
The method of forming the concave portion 2 when forming the pattern substrate 1 using the above-described material is as follows. In order to form the concave portion 2 directly on the substrate, a template having a desired convex portion is used. What is necessary is just to carry out the shaping | molding method to a board | substrate, or the shaping | molding method also serving as manufacture of a board | substrate. In addition, in order to form a convex portion different from the substrate on the substrate and form the concave portion 2 between the laminated convex portions, a resist or a photosensitive resin is laminated on the entire surface, and a pattern is formed. It may be formed by exposing and developing.
[0025]
As the resin 3, specifically, for example, unsaturated polyester, melamine, epoxy, polyester (meth) acrylate, urethane (meth) acrylate, epoxy (meth) acrylate, polyether (meth) acrylate, polyol (meth) acrylate , Or a mixture of curable resins such as melamine (meth) acrylate or triazine acrylate. To these curable resin compositions, if necessary, a curing agent, a photopolymerization initiator and the like may be added, and a thermosetting resin composition, or an ionizing radiation-curable resin composition such as an ultraviolet curable resin composition may be used. It can be used as a curable resin composition. The curable resin composition preferably has a viscosity suitable for application, and the viscosity may be adjusted by adding a solvent or a monomer. Usually, as the resin 3, what is called a photosensitive resin (which is an ultraviolet-curable resin composition) that can be cured by irradiation with ultraviolet light may be used.
[0026]
In the above description, it is assumed that the substrate 5 is provided with nothing in advance on the side on which the convex portion 6 is provided, but the substrate 5 may be an element such as a circuit in advance. The substrate may be provided with a substrate or a substrate having a step formed on the surface of the substrate 5. Alternatively, the substrate 5 may be one in which a conductive layer such as a metal thin film layer 7 is laminated on one side on the side where the projections 6 are provided. In this case, FIGS. 1 (a) to 1 (d) Through the steps described and cited, for example, as shown in FIG. 1D, the metal thin film layer 7 is laminated on the substrate 5, and the convex portions 6 made of the resin 3 are formed on the metal thin film layer 7. Of convex portions can be formed.
[0027]
As shown in FIG. 1D or FIG. 1E, a convex pattern is formed on the substrate 5 or a convex portion is formed on the metal thin film layer 7 of the substrate 5 on which the metal thin film layer 7 is laminated. Starting from a pattern-formed substrate or the like, a conductive pattern substrate can be manufactured by various methods as exemplified below.
[0028]
In the first example of the method of manufacturing the conductive pattern, a convex pattern composed of a group of convexes 6 is formed on a substrate 5 as shown in FIG. 2A (same as FIG. 1D). The metal thin film layer 7 is formed on the entire surface on the side where the projection pattern is formed, and after the formation, the surface of the metal thin film layer 7 is polished to selectively remove the metal thin film layer 7 on the projection 6. Thus, a conductive pattern is formed by leaving the metal thin film layer between the protrusions 5. The formation of the metal thin film layer 7 is preferably performed by applying evaporation or sputtering to the top surface of the projections 6 and between the projections 6.
[0029]
The material forming the metal thin film layer 7 is preferably a material having high conductivity such as Fe, Ni, Cr, Cu, Ti, Hf, Zn, Zr, Mo, or Ta, and among them, Cu having high conductivity is preferable, Alternatively, it may be gold or silver. The metal thin film layer 7 may be composed of a single layer made of the same metal, or may be composed of two or more layers composed of different metals. As an example, a thin film of Cr having good adhesion to a resin or the like is formed, and then a thin film of Cu is formed. The thickness of the metal thin film layer 7 composed of these metals is preferably from 10 nm to 10 μm, and more preferably from about 10 nm to 1 μm.
[0030]
The surface of the metal thin film layer 7 can be polished by a chemical polishing method, a mechanical polishing method, or mechanochemical polishing (MCP, also referred to as chemical mechanical polishing (CMP)) using the same. . The chemical polishing method is performed by supplying an etching liquid as an abrasive to a polishing member made of a cloth such as a cloth, a nonwoven fabric, or a polyurethane resin, and the mechanical polishing method is performed by using a cloth, a nonwoven fabric, Alternatively, the polishing is performed by using a foam such as a polyurethane resin as an abrasive member and impregnating fine powder of colloidal silica or cerium oxide as an abrasive, or supplying a dispersion liquid in which colloidal silica or cerium oxide is dispersed. . In each case, the metal thin film layer 7 on the surface, particularly the metal thin film on the convex portion 6, is rotated while rotating a laminate in which the convex portion 6 and the metal thin film layer 7 are sequentially stacked on the substrate 5, which is an object to be polished. The polishing is carried out by bringing an abrasive member into contact with the layer 7 and supplying an abrasive as needed.
[0031]
For polishing, it is sufficient to remove at least only the metal thin film layer 7 on the convex portion 6. However, in addition to the metal thin film layer 7, part of the upper portion of the convex portion 6 is polished and removed. Can be reliably removed. Further, in the polishing, the surface of the metal thin film layer 7 formed between the protrusions 6 and the protrusions 6 ′ whose height has been reduced by polishing most of the height of the protrusions 6 (FIG. 2) In FIG. 3 (c), the surface may be referred to as “polished protrusion”.) The surface (top surface) may be substantially the same height (not shown). A conductive pattern having a metal thin film layer pattern 7 ′ made of the metal thin film layer 7 formed between the convex portions 6 by polishing the upper metal thin film layer 7 and, if necessary, the convex portions 6. The substrate 11 can be obtained.
[0032]
The second example of the method of manufacturing the conductive pattern is such that a convex pattern composed of a group of convex parts 6 is formed on a substrate 5 as shown in FIG. A metal thin film layer (A) 7 is formed (FIG. 3A). After the formation, a resist 8 is provided so as to smooth the generated irregularities on the metal thin film layer (A) 7, and the resist 8 is exposed in a pattern. (FIG. 3B), after the exposure, development is performed to remove the resist 8 between the protrusions 6 or to remove the resist 8 on the protrusions 6, and in any case, the resist 8 is removed. A metal plating pattern composed of another metal thin film layer (B) 10 is generated by using the metal thin film layer (A) 7 exposed at the exposed portion.
[0033]
The method for forming the metal thin film layer (A) 7 in Method Example 2 and the materials to be used are the same as those in Method Method 1 described above.
[0034]
A resist 8 is laminated on one surface so as to smooth out irregularities on the metal thin film layer (A) 7. In order to smooth out the irregularities, the thickness of the resist 8 may be set to be larger than the height of the convex portion 6 (the difference between the height of the convex portion and the portion without the convex portion). Therefore, the thickness of the resist 8 is preferably about 10 nm to 20 μm.
[0035]
As the resist, a positive type resist, for example, a resin mainly composed of a photodecomposable quinonediazide type photosensitive resin or the like, or a negative type resist, for example, a photodegradable crosslinked azide type photosensitive resin Ingredients include resin, photodegradable insoluble diazo photosensitive resin, photodimerized cinnamate photosensitive resin, photopolymerized unsaturated polyester photosensitive resin, photopolymerizable acrylate resin, or cationic polymerizable resin And the following. In addition to these photosensitive resins, a photosensitive resin composition in which a photopolymerization initiator, a sensitizing dye, and the like are blended as necessary can be used as a resist.
[0036]
The laminated resist 8 is exposed through a mask 9 having a light-shielding pattern having the same planar shape as the concave portion 2C of the pattern substrate 1 so that the light-shielding pattern is arranged on the convex portion 6. Exposure is performed using a light source such as an ultra-high pressure mercury lamp, a high pressure mercury lamp, a carbon arc, a xenon arc, or a metal halide lamp, and 0.1 to 10,000 mJ / cm. ² , Preferably 10 to 1,000 mJ / cm ² UV irradiation. It should be noted that the mask 9 may be replaced with a mask having a light-shielding pattern having the same planar shape as the concave portion 2C of the pattern substrate 1 and a mask having a light-shielding pattern having a negative-positive relationship with the pattern. It is possible.
[0037]
When the resist 8 contains a positive photosensitive resin as a main component, the exposed portion is solubilized. Therefore, by developing after exposure, the solubilized resist 8 in a portion other than on the convex portion 6 is exposed to a developer. Thus, the resist 8 on the top surface of the convex portion 6 on which the metal thin film layer 10 is laminated remains, and the resist 8 on the metal thin film layer 8 between the convex portions 6 is removed to form a resist pattern 8 ′. Is formed, and the metal thin film layer 8 is exposed at a portion where the resist pattern layer 8 'is not present.
[0038]
A metal thin film layer 10 is formed on the exposed metal thin film layer 7 between the convex portions 6 by electrolytic plating. For distinction, the one formed earlier is referred to as a metal thin film layer A (symbol: 7), and the one formed later is referred to as a metal thin film layer B (symbol: 10).
[0039]
The metal used for forming the metal thin-film layer B is basically the same as the material used for forming the metal thin-film layer 7, but the metal thin-film layer B is preferably made of highly conductive Cu. Or gold or silver. The thickness of the metal thin film layer B depends on the line width and the required degree of conductivity, but is preferably 100 nm to 20 μm, and more preferably about 1 μm to 10 μm.
[0040]
As shown in FIG. 3D, when the metal thin film layer 7 between the convex portions 6 is plated with metal to form a metal plating pattern composed of the metal thin film layer 10, the top surface of the convex portion 6 Since the metal thin film layer 7 and the unsolubilized resist 8 ′ on the metal thin film layer 7 remain, if these are unnecessary, they are sequentially etched by changing different etchants capable of etching the respective layers, or Both layers may be removed by etching using an etchant capable of removing them (FIG. 3E).
[0041]
When the resist 8 contains a negative photosensitive resin as a main component, the exposed portions are insolubilized. Therefore, by developing after exposure, the resist 8 that is not insolubilized between the convex portions 6 becomes a developing solution. To form a resist pattern 8 ″, and the metal thin film layer 7 formed on the protrusion 6 is exposed (FIG. 4A).
[0042]
The exposed metal thin film layer 8 on the convex portion 6 is similarly plated with a metal by electrolytic plating to form a metal thin film layer 10 (FIG. 4B). Again, the one formed earlier is referred to as metal thin film layer A (symbol: 7), and the one formed later is referred to as metal thin film layer B (symbol: 10).
[0043]
As shown in FIG. 4B, when the metal thin film layer 10 is formed by plating a metal on the metal thin film layer 7 on the convex portion 6, the metal thin film layer 7 Since the resist pattern 8 "is laminated thereon, if these are unnecessary, in order to remove them, first, exposure is performed from the side where the resist pattern 8" is laminated, and the resist pattern 8 "is removed. 8 ″ is solubilized, and then the solubilized resist pattern 8 ″ and the underlying metal thin film layer 7 are successively etched using a different etchant capable of etching each layer, or both layers are etched. It may be removed by etching using a removable etching solution (FIG. 4C).
[0044]
Example 3 of a method for manufacturing a conductive pattern is a method in which a convex pattern formed of a group of convexes 6 is formed on a substrate 5 via a metal thin film layer 7 as shown in FIG. 5 (b)), and then, if necessary, removing the convex portions 6 (FIG. 5 (c)). )). Although the method of this method example 3 looks relatively simple, since the resin filled in the concave portions of the pattern substrate is transferred to form the convex portions 6, the metal thin film layer 7 between the convex portions 6 Since nothing is covered, the etching can be performed smoothly, and the convex pattern serving as the resist is determined by the concave shape of the pattern substrate having the concave, so that its cross-sectional shape and line width are kept constant. As a result, a highly accurate conductive pattern can be obtained.
[0045]
【Example】
(Example 1)
A Cr thin film layer having a thickness of 200 nm is removed on a glass substrate by a photo-etching method in accordance with a pattern, and a Cr pattern in which fine lines having a line width of 500 nm and a pitch of 1 μm are arranged is formed. It was a pattern substrate. An uncured transparent liquid UV-curable resin composition is poured on one end of the pattern substrate on the Cr pattern side, and the UV-curable resin composition is directed toward the other end using a metal blade coated with silicone rubber. Was moved to fill a portion having no Cr pattern, and the ultraviolet curable resin composition on the Cr thin film layer was removed.
[0046]
A 100 μm-thick polycarbonate film is adhered to the side of the pattern substrate to which the ultraviolet-curable resin composition has been applied as described above, on the side to which the ultraviolet-curable resin composition has been applied, and ultraviolet light having a wavelength of 290 nm is applied from the polycarbonate film. , 250mW / cm ² Then, the pattern substrate was peeled off. After peeling, the side of the polycarbonate film that was in intimate contact with the pattern substrate was observed using an atomic force microscope (AFM). As a result, a thin line pattern consisting of a thin line of a cured resin having a height of 200 nm was formed on the polycarbonate film. I was
[0047]
On the fine line pattern on the polycarbonate film on which the fine line pattern was formed, a Cu thin film was formed by sputtering to have a thickness of 100 nm. Further, on the Cu thin film, a positive photosensitive resin composition (manufactured by Tokyo Ohka Kogyo Co., Ltd., product name: "PMER P-LA900") is applied by a spinner, and after application, heated at a temperature of 80C for 30 minutes. Thus, a film of a positive photosensitive resin composition having a thickness of 8 μm and having a flat upper surface was formed.
[0048]
On the film of this positive photosensitive resin composition, the pattern substrate at the time when the fine line pattern was formed was overlapped with the polycarbonate substrate so that the positional relationship with the polycarbonate film was the same as that at the time when the fine line pattern was formed. Then, the substrate was exposed to ultraviolet light from the glass substrate side of the pattern substrate. After the exposure, development is performed using a developer (manufactured by Tokyo Ohka Kogyo Co., Ltd., product name: “PMERDev P-7G”), and the positive photosensitive resin composition on the previously formed fine line, which is an exposed portion, is obtained. The solubilized portion is removed, and a Cu thin film on the convex portion is exposed. Using this thin film, electrolytic plating is performed using a copper sulfate plating bath to form a Cu plating layer having a thickness of 3 μm on the convex portion. did.
[0049]
Thereafter, the side on which the Cu plating layer is formed is exposed to ultraviolet light to solubilize the film of the positive photosensitive resin composition remaining in the concave portions, and a developer (manufactured by Tokyo Ohka Kogyo Co., Ltd., product name; Using “PMER Dev P-7G”), after removing the film of the positive photosensitive resin composition in which the concave portions were solubilized, an aqueous sodium persulfate solution (sodium persulfate; 20 g and HCl; ³ For 3 minutes, and an aqueous solution of potassium permanganate (potassium permanganate; 50 g and NaOH; 30 g in 1000 cm) ³ ) For 4 minutes to remove the Cu thin film on the bottom surface of the concave portion to obtain a conductive pattern substrate.
[0050]
【The invention's effect】
According to the first aspect of the present invention, since the formation of the convex pattern is performed using the pattern substrate having the concave portion, it is easy to make the cross-sectional shape and the line width of the convex pattern constant, and furthermore, the convex portion is formed. Since nothing is formed on the other part, it can be used as a resist or a polishing method using its height, and a conductive pattern substrate that can increase the accuracy of the obtained product Can be provided.
[0051]
According to the invention of claim 2, in addition to the effect of the invention of claim 1, in order to remove the resin adhering to portions other than the concave portions of the pattern substrate, a more reliable convex portion pattern can be formed and, therefore, obtained. It is possible to provide a method of manufacturing a conductive pattern substrate that can increase the accuracy of a product.
[0052]
According to the third aspect of the present invention, in addition to the effects of the first or second aspect of the present invention, a conductive pattern capable of forming a metal plating pattern having higher conductivity by using the obtained conductive pattern. A method for manufacturing a substrate can be provided.
[Brief description of the drawings]
FIG. 1 is a view showing a process of forming a convex pattern.
FIG. 2 is a view showing a method of manufacturing a conductive pattern substrate by using a polishing method.
FIG. 3 is a diagram illustrating a method of manufacturing a conductive pattern substrate using a resist.
FIG. 4 is a diagram showing another method for manufacturing a conductive pattern substrate using a resist.
FIG. 5 is a view showing still another method of manufacturing a conductive pattern substrate using a resist.
[Explanation of symbols]
1 Pattern board
2 recess
3 resin
4 Squeegee
5 Substrate
6 convex
7 Metal thin film layer A
8 Resist
9 Mask
10 Metal thin film layer B
11 Conductive pattern substrate

Claims (3)

On the substrate, after forming a convex pattern, and covering the entire surface of the substrate with a conductive thin film layer in any order, using the formed convex pattern, on the convex pattern, or In the portion other than the convex pattern, a conductive pattern is generated, and the formation of the convex pattern is performed by filling the concave portion of the pattern substrate having the concave portion with resin, and after filling, the pattern substrate is formed. The resin-filled side is brought into close contact with the substrate, and after the close contact, the two are peeled off, whereby the resin filled in the concave portion of the pattern substrate is transferred onto the substrate. Of producing a conductive pattern substrate. Filling the resin in the concave portion of the pattern substrate by applying the resin to the pattern substrate, and removing the resin adhered to a portion other than the concave portion of the pattern substrate after the application. The method for manufacturing a conductive pattern substrate according to claim 1. The method according to claim 1, wherein, after the conductive pattern is generated, a metal plating pattern is generated using the conductive pattern.

Images