JP2004101224A - Terminal connection member and method for manufacturing the same, and inspection device of electronic component - Google Patents

Terminal connection member and method for manufacturing the same, and inspection device of electronic component Download PDF

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Publication number
JP2004101224A
JP2004101224A JP2002259857A JP2002259857A JP2004101224A JP 2004101224 A JP2004101224 A JP 2004101224A JP 2002259857 A JP2002259857 A JP 2002259857A JP 2002259857 A JP2002259857 A JP 2002259857A JP 2004101224 A JP2004101224 A JP 2004101224A
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Japan
Prior art keywords
electronic component
arm
terminal
shaped portion
metal plate
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JP2002259857A
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Japanese (ja)
Inventor
Myotan Seki
関 妙旦
Masahiro Kyozuka
経塚 正宏
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Shinko Electric Industries Co Ltd
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Shinko Electric Industries Co Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a terminal connection member for electrically connecting an external connection terminal provided on an electronic component to an inspection device or the like to electrically inspect the electronic component which is adaptable to a narrow pitch between the external connection terminals of the electronic components and capable of reducing the pressure to press the electronic component as much as possible so as to absorb the difference in level between the external connection terminals of the electronic components. <P>SOLUTION: In a terminal connection member 10 for electrically connecting solder balls 30 and 30 or the like provided on an electronic component to an inspection device or the like to electrically inspect the electronic component, abutting portions corresponding to the solder balls 30 and 30 or the like are formed on a tip part cut-erected from a metal plate 28 and located above a rear end of an arm-shaped portion 16 of spring property. The rear end side of the arm-shaped part 16 is joined with a pad 18 formed on one surface side of a resin circuit substrate 14 electrically connected to the inspection device or the like. <P>COPYRIGHT: (C)2004,JPO

Description

【0001】
【発明の属する技術分野】
本発明は端子接続部材及びその製造方法、電子部品の検査装置に関し、更に詳細には電子部品に設けられた外部接続端子と、前記電子部品の電気的検査を行う電子部品の検査装置等とを、電気的に接続する端子接続部材及びその製造方法、前記端子接続部材を具備する検査装置に関する。
【0002】
【従来の技術】
通常、製造された半導体装置等の電子部品については、内部の電気的な接続等が完全か否かの検査が行われている。かかる検査には、検査装置本体と電子部品の外部接続端子とを電気的に接続することを要する。このため、従来は、図9に示す端子接続部材100が用いられている。
この端子接続部材100は、基板102に複数個のソケット104,104・・が装着され、ソケット104には、電子部品106が蓋体108によって押圧されつつ装着される。
かかるソケット104には、図10に示す様に、電子部品106に装着された外部接続端子としてのはんだボール114,114・・の各々に対応するロッド112が付勢部材としてのバネ110に付勢されて設けられている。
この図9及び図10に示す端子接続部材100によれば、ソケット104に装着される電子部品106のはんだボール114,114・・の高さが多少不揃でも、バネ110によって付勢された対応するロッド112と確実に当接できる。
【0003】
しかし、近年、半導体装置等の電子部品106では、小型化や集積度の向上に伴なって、外部接続端子としてのはんだボール114,114・・のピッチ間隔が狭ピッチ化されつつある。
この様に、狭ピッチ化されたはんだボール114,114・・を外部接続端子として具備する電子部品106の検査装置では、その端子接続部材100のソケット104に設けられたロッド112,112・・のピッチ間隔も狭ピッチ化することを要する。
しかしながら、ロッド112はバネ110によって付勢されているため、そのピッチ間隙を狭めるにも限界が存在する。
このため、特開2002−151558号公報には、ベース基板の表面にゴム等の弾性材料から成る弾性層を形成した後、この弾性層の上層側に配線層と、この配線層に接続される接触子を設けた端子接続部材を具備する検査装置が提案されている。
【0004】
【発明が解決しようとする課題】
前掲の公開公報で提案された端子接続部材には、付勢部材としてバネに代えてゴム等から成る弾性層を採用したことによって、接触子間のピッチを電子部品の外部接続端子間の狭ピッチ化に対応して容易に狭ピッチ化でき、且つ電子部品の外部接続端子の間における高低差は、弾性層によって吸収可能である。
しかしながら、かかる弾性層で電子部品の外部接続端子の間における高低差を吸収し、対応する接触子と外部接続端子とを確実に当接するためには、電子部品を接触子の方向に押圧する押圧力を高めることが必要である。
この様に、電子部品を押圧する押圧力を高めることは、電子部品を変形或いは破損させるおそれがある。
そこで、本発明の課題は、電子部品に設けられた外部接続端子と、電子部品の電気的検査を行う検査装置等とを電気的に接続する端子接続部材であって、電子部品の外部接続端子間の狭ピッチ化に対応でき、且つ電子部品の外部接続端子間の高低差を吸収すべく、電子部品を押圧する押圧力を可及的に低下し得る端子接続部材及びその製造方法、及びこの端子接続部材を具備する電子部品の検査装置を提供することにある。
【0005】
【課題を解決するための手段】
本発明者等は、前記課題を解決すべく検討を重ねた結果、金属板を切り起こして形成されたバネ性を呈する腕状部の後端部よりも上方に位置する先端部に、電子部品の外部接続端子と当接する当接部を形成することによって、別部材として形成したバネを用いることなくバネに近似した付勢力を得ることが可能であることを見出し、本発明に到達した。
すなわち、本発明は、電子部品に設けられた外部接続端子と、前記電子部品の電気的検査を行う検査装置等とを、電気的に接続する端子接続部材において、該電子部品の外部接続端子と当接する当接部が、金属板を切り起こして形成されたバネ性を呈する腕状部の後端部よりも上方に位置する先端部に形成され、且つ前記後端部側は、前記検査装置等に電気的に接続された樹脂回路基板の一面側に形成されたパッドに接合されていることを特徴とする端子接続部材にある。
【0006】
また、本発明は、電子部品に設けられた外部接続端子と、前記電子部品の電気的検査を行う電子部品の検査装置等とを、電気的に接続する端子接続部材を、金属板から製造する際に、該金属板に接続された箇所を除いてスリットによって囲まれた舌片状部を形成した後、前記舌片状部にプレス加工を施し、前記舌片状部を曲折して形成した腕状部の後端部よりも上方に位置する先端部に電子部品の外部接続端子と当接する当接部を形成し、次いで、バネ性を呈する前記腕状部の後端部側を、前記検査装置等に電気的に接続された樹脂回路基板の一面側に形成したパッドに電気的に接続することを特徴とする端子接続部材の製造方法にある。更に、本発明は、前述した端子接続部材を具備することを特徴とする電子部品の検査装置でもある。
【0007】
かかる本発明において、舌片状部及びその近傍を除いて金属板の両面にレジストを塗布した後、前記舌片状部にプレス加工を施し、前記舌片状部を曲折して形成した腕状部の先端部に電子部品の外部接続端子と当接する当接部を形成し、次いで、前記腕状部にバネ性を付与すべく、前記金属板を給電層とする電解めっきによって前記腕状部に金属めっきを施した後、前記レジストを剥離してから前記腕状部の後端部側を樹脂回路基板のパッドに接合することによって、曲折して形成した腕状部及びその他の所定箇所に金属めっきを容易に施すことができる。
また、腕状部の先端部に形成した電子部品の外部接続端子と当接する当接部を、その当接面に1個又は複数個の凸部を形成すること、或いは平坦面に形成することにより、電子部品の外部接続端子との当接を更に確実とすることができる。更に、腕状部を形成する金属板として、バネ鋼材から成る金属板を用いることにより、形成された腕状部は充分なバネ性を呈することができる。
【0008】
本発明によれば、金属板を切り起こして形成されたバネ性を呈する腕状部の後端部よりも上方に位置する先端部に、電子部品の外部接続端子と当接する当接部を形成することによって、別部材として形成したバネを用いることなくバネに近似した付勢力を得ることができる。
この様に、別部材のバネを用いることがないため、別部材のバネを用いる従来の端子接続部材に比較して、バネ性を呈する腕状部間のピッチ間隔を狭く形成できる。
更に、かかるバネ性を呈する腕状部は、金属板に形成した舌片状部にプレス加工を施して形成でき、腕状部の形成も容易である。
【0009】
【発明の実施の形態】
本発明に係る端子接続部材の一例を図1に示す。図1に示す端子接続部材10は、検査装置等に電気的に接続される樹脂回路基板14と腕状部16,16・・とから構成される。
樹脂回路基板14には、その一面側にパッド18,18・・が形成され、他面側には、検査装置等に設けられた外部パッドに接続される接続端子としてのはんだボール12,12・・が装着されている。
このパッド18,18・・とはんだボール12,12・・とは、樹脂板20を貫通するヴィア22及び導体パターン24を介して電気的に接続されている。
更に、導体パターン24は、はんだボール12が装着されるパッドを除いてソルダーレジスト26によって覆われている。
この様な、樹脂回路基板14の一面側に形成されたパッド18,18・・の各々に後端部が接合された腕状部16は、金属板28を切り起こして形成された帯状の舌片状部28aが、その後端部から先端部の方向に湾曲状に曲がって形成されている。このため、腕状部16の先端部は、その後端部よりも上方に位置する。
かかる腕状部16の先端部は、折り曲げられて凸部に形成されており、凸部の先端は、図1に示す様に、半導体装置の外部接続端子であるはんだボール30に当接する。従って、腕状部16の先端部は、電子部品の外部接続端子と当接する当接部である。
【0010】
かかる腕状部16は、後端部から先端部の方向に湾曲状に曲がって形成された帯状の舌片状部28aの周囲に、所定厚さの金属めっき32が形成され、バネ性を呈する。
このため、腕状部16の凸部の先端にはんだボール30が当接した状態で電子部品を端子接続部材10の方向に押圧すると、はんだボール30は腕状部16のバネ性に因って電子部品の押圧方向と逆方向の押圧力を受ける。従って、はんだボール30と腕状部16の凸部とは、当接しつつ電子部品は端子接続部材10の方向に沈み込む。この電子部品に加える押圧力は、前掲の公開公報で提案されているゴム等の弾性層に比較して小さくてすみ、電子部品を変形させたり破壊するおそれを解消できる。
したがって、電子部品を端子接続部材10の方向に所定量沈み込ませることによって、電子部品のはんだボール30,30・・の各々に多少の高低差が存在しても、対応する腕状部16の凸部に当接させることができる。
【0011】
かかる腕状部16の舌片状部28a等を形成する金属板28としては、銅材であってもよいが、リン青銅やベリリウム銅等のバネ鋼材を用いることによって、腕状部16の呈するバネ性を更に向上できる。
また、舌片状部28a等の周囲に形成する所定厚さの金属めっき32としては、ニッケル合金めっき、特にニッケル(Ni)ーコバルト(Co)めっきとすることが、腕状部16の呈するバネ性を向上できるうえで好ましい。この様な、腕状部16にバネ性を付与する金属めっき32の保護層として、金属めっき32上に金めっき層を形成してもよい。
【0012】
図1に示す端子接続部材10を形成するには、先ず、図2に示す様に、銅から成る金属板28に接続された箇所を除いてスリット34によって囲まれた帯状の舌片状部28aを形成する。かかる舌片状部28aは、スリット34をプレス加工又はエッチング加工によって金属板28に穿設することにより形成できる。この舌片状部28aは、通常、一枚の金属板28に複数個が形成される。
舌片状部28aが形成された金属板28は、図3に示す様に、一対のプレス金型36,36内に挿入して舌片状部28aにプレス加工を施し、舌片状部28aの先端部を引き起こしつつ、その先端部に曲げ加工を施す。このプレス加工によって、舌片状部28aは、1個の凸部が形成された先端部が上方に持ち上げられた状態で後端部方向に湾曲する形状に形成される。
この様に、プレス加工を施して舌片状部28aを所定形状に形成した後には、金属板28の所定箇所にレジストを塗布することは困難である。このため、図3に示す様に、舌片状部28aが形成された金属板28の所定箇所、例えば舌片状部28a及びスリット34の外周縁近傍を除いて金属板28の両面にレジストを塗布してレジスト層38を形成しておくことが好ましい。
【0013】
プレス加工終了後に、金属板28が露出している舌片状部28a及びスリット34の外周縁近傍に、金属板28を給電板とする電解めっきを施す。かかる電解めっきによって、舌片状部28a及びスリット34の外周縁近傍の外周面に金属めっき32が形成され、バネ性を呈する腕状部16を形成できる。この電解めっきとしては、ニッケル(Ni)ーコバルト(Co)めっきを採用することが好ましい。
電解めっき終了後、レジスト層38を剥離することによって、図4に示す様に、一枚の金属板28に、先端部が上方に持ち上げられた状態で後端部方向に湾曲する複数個の腕状部16,16・・が形成されている。かかる腕状部16の後端部は、金属板28から延出されている。
更に、必要に応じて腕状部16,16・・に熱処理を施すことによって、腕状部16,16・・のバネ性を更に向上できる。
複数個の腕状部16,16・・が形成されている金属板28は、樹脂回路基板14に搭載される。この際に、腕状部16,16・・の各後端部側は、樹脂回路基板14のパッド18に接合される。かかる接合は、導電性接着剤、超音波接続或いは熱圧着等によって行うことができる。
その後、金属板28が露出している部分をエッチングによって除去し、腕状部16,16・・の相互間を電気的に絶縁する。
尚、樹脂回路基板14のランド12a,12a・・の各々には、金属板28が露出している部分をエッチングした後、検査装置等に設けられた外部パッドに接続される接続端子としてのはんだボール12を装着する。
【0014】
図4に示す樹脂回路基板14では、その一面側に形成されたパッド18,18・・と、その他面側に形成された、はんだボール12が装着されるランド12aとは、樹脂板20を貫通するヴィア22及び導体パターン24を介して電気的に接続されている。
かかる樹脂回路基板14は、公知の製造方法で形成できる。例えば、樹脂板20の所定箇所にレーザ等によって貫通孔を形成した後、この貫通孔の内壁面を含む樹脂板20の全面に無電解めっきによって形成した薄膜状の金属層を給電層とする電解めっきにより所定厚さの金属層とする。この電解めっきによって、貫通孔内を金属によって充填しヴィア22を形成できる。
次いで、形成した金属層の表面に形成したレジスト層にパターニングを施し、形成予定のパッド18、導体パターン24及びランド12aの部分にレジスト層を残留させた後、金属層の表面が露出する部分をエッチングして除去することにより、図4に示す樹脂回路基板14を得ることができる。
また、図4に示す金属板28としては、リン青銅やベリリウム銅等のバネ鋼材を好適に用いることができる。
【0015】
図2〜図4に示す工程で形成された図1に示す端子接続部材10は、その接続端子としてのはんだボール12,12・・は、電子部品の検査装置に設けられた外部パッドに接続され、図1に示す様に、腕状部16,16・・の各先端部が、検査対象の電子部品の対応するはんだボール30と当接する。このため、検査対象の電子部品と検査装置とを電気的に接続できる。
この様に、検査装置に装着された端子接続部材10の腕状部16,16・・の各先端部と、検査対象の電子部品の対応するはんだボール30とを当接する際に、電子部品を軽く押圧することによって、電子部品のはんだボール30,30・・の各々に多少の高低差が存在しても、対応する腕状部16の先端部に容易に当接させることができる。その結果、電子部品の電気的な検査を容易に行うことができる。
【0016】
図4では、プレス加工によって舌片状部28aの先端部に1個の凸部を形成したが、図5(a)(b)に示す様に、舌片状部28aの先端部に2個の凸部を形成してもよい。
図5(a)に示す2個の凸部は略同一高さである。このため、電子部品のはんだボール30が腕状部16の先端部に形成された2個の凸部に当接する際には、2個の凸部の先端が略同時に当接する。
一方、図5(b)に示す2個の凸部は、その高さが異なる。このため、電子部品のはんだボール30が腕状部16の先端部に形成された2個の凸部と当接する際には、先ず、先端方向に形成された凸部の先端に当接した後、更に電子部品を押圧すると、後端方向に形成された凸部の先端に当接する。この様に、電子部品のはんだボール30と凸部の先端が当接する時間的な遅れが存在すると、先に当接した凸部の先端がはんだボール30の表面を擦り、はんだボール30の表面に形成された酸化膜等を削り取ることも期待できる。
【0017】
また、図5(c)に示す様に、プレス加工によって舌片状部28aの先端部を平坦面に形成してもよい。かかる舌片状部28aから形成した腕状部16では、電子部品のはんだボール30と当接する当接面が平坦面に形成される。この様に、はんだボール30と当接する当接面を平坦面に形成することにより、腕状部16の先端部を凸部に形成した場合に比較して、はんだボール30と当接する当接面を広く形成できる。
はんだボール30と当接する当接面を平坦面に形成する場合には、図6に示す様に、舌片状部28aの先端部を円形状とし、その中心近傍に平坦部を形成するようにプレス加工を施してもよい。
更に、金属板28に形成する舌片状部28aとしては、図7(a)に示す様に、先端が尖っている舌片状部28aを形成してもよい。この場合には、プレス加工を施した舌片状部28aは、図7(b)に示す様に、尖った先端が上方を向く先端部から後端部方向に湾曲状に曲折されている。
この先端が尖っている舌片状部28aとしては、図8(a)に示す様に、三角形状としてもよく、図8(b)に示す様に、舌片状部28aの先端形状を三山状としてもよい。
【0018】
【発明の効果】
本発明に係る端子接続部材によれば、電子部品を軽く押圧することによって、電子部品の外部接続端子の各々に多少の高低差が存在しても、対応する腕状部の先端部に容易に当接させることができる。
このため、この端子接続部材を検査装置に装着することによって、検査対象の電子部品に設けられた外部接続端子の各々と検査装置とを、端子接続部材によって容易に電気的に接続することができる。その結果、電子部品の電気的な検査を充分に行うことができ、信頼性の高い電子部品を供給できる。
【図面の簡単な説明】
【図1】本発明に係る端子接続部材の一例を説明するための部分断面図である。
【図2】図1に示す端子接続部材を製造する工程の一部を説明するための部分正面図である。
【図3】図1に示す端子接続部材を製造する工程の一部を説明するための概略断面図である。
【図4】図1に示す端子接続部材を製造する工程の一部を説明するための部分断面図である。
【図5】プレス加工を施した舌片状部の他の例を示す部分断面図である。
【図6】金属板に形成した舌片状部の他の例を示す部分正面図である。
【図7】金属板に形成した舌片状部の他の例を示す部分正面図である。
【図8】金属板に形成した舌片状部の他の例を示す部分正面図である。
【図9】従来の端子接続部材の概略正面図である。
【図10】従来の端子接続部材の部分断面図である。
【符号の説明】
10 端子接続部材
12 接続端子(はんだボール)
12a ランド
14 樹脂回路基板
16 腕状部
18 パッド
20 樹脂板
22 ヴィア
24 導体パターン
26 ソルダーレジスト
28 金属板
28a 舌片状部
30 外部接続端子(はんだボール)
34 スリット
36 プレス金型
38 レジスト層
[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a terminal connection member, a method of manufacturing the same, and an electronic component inspection device. The present invention relates to a terminal connecting member for electrical connection, a method of manufacturing the same, and an inspection apparatus including the terminal connecting member.
[0002]
[Prior art]
Normally, electronic components such as manufactured semiconductor devices are inspected to determine whether or not internal electrical connections are complete. For such inspection, it is necessary to electrically connect the inspection apparatus main body and the external connection terminal of the electronic component. For this reason, conventionally, a terminal connecting member 100 shown in FIG. 9 is used.
The terminal connection member 100 has a plurality of sockets 104 mounted on a substrate 102, and an electronic component 106 is mounted on the socket 104 while being pressed by a lid 108.
As shown in FIG. 10, in the socket 104, rods 112 corresponding to solder balls 114, 114,... As external connection terminals mounted on the electronic component 106 are urged against springs 110 as urging members. It is provided.
According to the terminal connecting member 100 shown in FIGS. 9 and 10, even if the height of the solder balls 114, 114... Can reliably contact the rod 112 to be moved.
[0003]
However, in recent years, in the electronic component 106 such as a semiconductor device, the pitch interval between the solder balls 114, 114,.
In the inspection device for the electronic component 106 having the narrow pitch solder balls 114, 114,... As external connection terminals, the rods 112, 112,. The pitch interval also needs to be reduced.
However, since the rod 112 is urged by the spring 110, there is a limit in reducing the pitch gap.
For this reason, Japanese Patent Application Laid-Open No. 2002-151558 discloses that after an elastic layer made of an elastic material such as rubber is formed on the surface of a base substrate, a wiring layer is formed on the upper side of the elastic layer, and the wiring layer is connected to the wiring layer. An inspection device including a terminal connection member provided with a contact has been proposed.
[0004]
[Problems to be solved by the invention]
In the terminal connection member proposed in the above-mentioned publication, an elastic layer made of rubber or the like is employed as a biasing member instead of a spring, so that the pitch between the contacts is reduced to the narrow pitch between the external connection terminals of the electronic component. The pitch can be easily narrowed in accordance with the increase in the height, and the height difference between the external connection terminals of the electronic component can be absorbed by the elastic layer.
However, in order to absorb the height difference between the external connection terminals of the electronic component by such an elastic layer and securely contact the corresponding contact and the external connection terminal, a push for pressing the electronic component in the direction of the contact. It is necessary to increase the pressure.
As described above, increasing the pressing force for pressing the electronic component may deform or break the electronic component.
Therefore, an object of the present invention is to provide a terminal connection member that electrically connects an external connection terminal provided on an electronic component to an inspection device or the like that performs an electrical inspection of the electronic component. A terminal connecting member capable of coping with a narrow pitch between the terminals, and capable of reducing the pressing force for pressing the electronic component as much as possible in order to absorb a height difference between external connection terminals of the electronic component, and a method of manufacturing the same, and An object of the present invention is to provide an electronic component inspection device including a terminal connection member.
[0005]
[Means for Solving the Problems]
As a result of repeated studies to solve the above-described problems, the inventors of the present invention have found that electronic components are provided at the front end located above the rear end of a spring-like arm formed by cutting and raising a metal plate. The present inventors have found that it is possible to obtain a biasing force similar to that of a spring without using a spring formed as a separate member by forming a contact portion that comes into contact with the external connection terminal.
That is, the present invention provides an external connection terminal provided on an electronic component, an inspection device for performing an electrical inspection of the electronic component, and the like, a terminal connection member for electrically connecting the external connection terminal of the electronic component. An abutting portion is formed at a tip end located above a rear end of a spring-like arm-shaped portion formed by cutting and erecting a metal plate, and the rear end side is the inspection device. A terminal connecting member which is joined to a pad formed on one side of the resin circuit board electrically connected to the terminal connecting member.
[0006]
Further, according to the present invention, a terminal connection member for electrically connecting an external connection terminal provided on an electronic component and an electronic component inspection device for performing an electrical inspection of the electronic component is manufactured from a metal plate. At this time, after forming a tongue-shaped portion surrounded by a slit except for a portion connected to the metal plate, the tongue-shaped portion was subjected to press working, and the tongue-shaped portion was formed by bending. A contact portion that contacts an external connection terminal of an electronic component is formed at a tip portion located above a rear end portion of the arm portion, and then, a rear end portion of the arm portion having a spring property is formed. A method of manufacturing a terminal connection member, wherein the terminal connection member is electrically connected to a pad formed on one surface side of a resin circuit board electrically connected to an inspection device or the like. Furthermore, the present invention is also an electronic component inspection device including the above-described terminal connection member.
[0007]
In the present invention, after applying a resist to both surfaces of the metal plate except for the tongue-shaped portion and the vicinity thereof, the tongue-shaped portion is subjected to press processing, and the tongue-shaped portion is formed by bending the arm-shaped portion. A contact portion that contacts the external connection terminal of the electronic component is formed at the tip of the portion, and then the arm portion is formed by electrolytic plating using the metal plate as a power supply layer so as to impart spring properties to the arm portion. After metal plating is applied, the rear end of the arm is peeled off and the rear end of the arm is joined to a pad of a resin circuit board to form a bent arm and other predetermined portions. Metal plating can be easily applied.
In addition, one or a plurality of convex portions may be formed on the contact surface of the contact portion, which is formed at the distal end portion of the arm portion and contacts the external connection terminal of the electronic component, or may be formed on a flat surface. Thereby, the contact of the electronic component with the external connection terminal can be further ensured. Further, by using a metal plate made of a spring steel material as the metal plate forming the arm portion, the formed arm portion can exhibit sufficient spring properties.
[0008]
According to the present invention, a contact portion for contacting an external connection terminal of an electronic component is formed at a distal end located above a rear end of a spring-like arm-shaped portion formed by cutting and raising a metal plate. By doing so, a biasing force similar to a spring can be obtained without using a spring formed as a separate member.
In this manner, since a separate member spring is not used, the pitch interval between the arm-shaped portions having spring properties can be formed narrower than a conventional terminal connection member using a separate member spring.
Further, the arm-shaped portion exhibiting such a spring property can be formed by pressing a tongue-shaped portion formed on a metal plate, and the formation of the arm-shaped portion is easy.
[0009]
BEST MODE FOR CARRYING OUT THE INVENTION
FIG. 1 shows an example of the terminal connection member according to the present invention. The terminal connection member 10 shown in FIG. 1 is composed of a resin circuit board 14 electrically connected to an inspection device or the like and arm-shaped portions 16, 16,.
.. Are formed on one side of the resin circuit board 14, and solder balls 12, 12,... As connection terminals connected to external pads provided on an inspection device or the like on the other side.・ Attached.
The pads 18, 18,... And the solder balls 12, 12,... Are electrically connected via vias 22 penetrating the resin plate 20 and conductive patterns 24.
Further, the conductor pattern 24 is covered with a solder resist 26 except for a pad on which the solder ball 12 is mounted.
The arm-shaped portion 16 whose rear end is joined to each of the pads 18, 18... Formed on one surface side of the resin circuit board 14 has a strip-shaped tongue formed by cutting and raising a metal plate 28. The piece-like portion 28a is formed to bend from the rear end to the front end in a curved shape. For this reason, the tip of the arm 16 is located above the rear end.
The distal end of the arm-shaped portion 16 is bent to form a convex portion, and the distal end of the convex portion contacts the solder ball 30 as an external connection terminal of the semiconductor device as shown in FIG. Therefore, the tip of the arm 16 is a contact portion that contacts the external connection terminal of the electronic component.
[0010]
The arm-shaped portion 16 has a metal plating 32 of a predetermined thickness formed around a band-shaped tongue-shaped portion 28a which is bent in a direction from the rear end to the front end, and exhibits a spring property. .
For this reason, when the electronic component is pressed in the direction of the terminal connecting member 10 in a state where the solder ball 30 is in contact with the tip of the convex portion of the arm 16, the solder ball 30 is caused by the spring property of the arm 16. It receives a pressing force in the direction opposite to the pressing direction of the electronic component. Therefore, the electronic component sinks in the direction of the terminal connecting member 10 while the solder ball 30 and the convex portion of the arm-shaped portion 16 are in contact with each other. The pressing force applied to the electronic component can be smaller than that of the elastic layer made of rubber or the like proposed in the above-mentioned publication, and the possibility of deforming or breaking the electronic component can be eliminated.
Therefore, by sinking the electronic component in the direction of the terminal connection member 10 by a predetermined amount, even if each of the solder balls 30, 30,. It can be brought into contact with the projection.
[0011]
The metal plate 28 forming the tongue-like portion 28a and the like of the arm-like portion 16 may be a copper material, but is formed by using a spring steel material such as phosphor bronze or beryllium copper. Spring property can be further improved.
The metal plating 32 having a predetermined thickness formed around the tongue-like portion 28a or the like may be nickel alloy plating, particularly nickel (Ni) -cobalt (Co) plating. It is preferable in that it can improve. A gold plating layer may be formed on the metal plating 32 as a protective layer for the metal plating 32 that imparts spring properties to the arm 16 as described above.
[0012]
In order to form the terminal connecting member 10 shown in FIG. 1, first, as shown in FIG. 2, a strip-like tongue-like portion 28a surrounded by a slit 34 except for a portion connected to a metal plate 28 made of copper. To form The tongue-like portion 28a can be formed by piercing the slit 34 in the metal plate 28 by press working or etching. Usually, a plurality of the tongue-like portions 28a are formed on one metal plate 28.
As shown in FIG. 3, the metal plate 28 on which the tongue-shaped portion 28a is formed is inserted into a pair of press dies 36, 36 to press the tongue-shaped portion 28a, and the tongue-shaped portion 28a is pressed. The tip is bent while raising the tip. By this press working, the tongue-shaped portion 28a is formed in a shape curved toward the rear end portion in a state where the tip portion having one convex portion is lifted upward.
As described above, it is difficult to apply a resist to a predetermined portion of the metal plate 28 after the tongue-shaped portion 28a is formed into a predetermined shape by performing the press working. For this reason, as shown in FIG. 3, a resist is applied to both surfaces of the metal plate 28 except for a predetermined portion of the metal plate 28 on which the tongue-like portion 28a is formed, for example, near the outer periphery of the tongue-like portion 28a and the slit 34. It is preferable to form a resist layer 38 by coating.
[0013]
After the press working, electrolytic plating using the metal plate 28 as a power supply plate is applied to the vicinity of the outer periphery of the tongue-shaped portion 28a and the slit 34 where the metal plate 28 is exposed. By such electrolytic plating, the metal plating 32 is formed on the outer peripheral surface near the outer peripheral edge of the tongue-like portion 28a and the slit 34, and the arm-like portion 16 exhibiting spring properties can be formed. As this electrolytic plating, it is preferable to adopt nickel (Ni) -cobalt (Co) plating.
After the electrolytic plating is completed, the resist layer 38 is peeled off, and as shown in FIG. 4, a plurality of arms curving toward the rear end with the front end raised upward as shown in FIG. Are formed. The rear end of the arm 16 extends from the metal plate 28.
Further, by subjecting the arms 16, 16,... To heat treatment as needed, the spring properties of the arms 16, 16,.
The metal plate 28 on which the plurality of arms 16 are formed is mounted on the resin circuit board 14. At this time, the rear ends of the arms 16 are joined to the pads 18 of the resin circuit board 14. Such bonding can be performed by a conductive adhesive, ultrasonic connection, thermocompression bonding, or the like.
Thereafter, the portion where the metal plate 28 is exposed is removed by etching, and the arms 16 are electrically insulated from each other.
In each of the lands 12a of the resin circuit board 14, after the portions where the metal plate 28 is exposed are etched, solder as connection terminals to be connected to external pads provided in an inspection device or the like is provided. The ball 12 is mounted.
[0014]
In the resin circuit board 14 shown in FIG. 4, the pads 18, 18... Formed on one surface side and the lands 12 a on the other surface side on which the solder balls 12 are mounted penetrate the resin plate 20. Vias 22 and conductive patterns 24.
Such a resin circuit board 14 can be formed by a known manufacturing method. For example, after a through hole is formed at a predetermined portion of the resin plate 20 by a laser or the like, a thin metal layer formed by electroless plating over the entire surface of the resin plate 20 including the inner wall surface of the through hole is used as a power supply layer. A metal layer having a predetermined thickness is formed by plating. By this electrolytic plating, the via 22 can be formed by filling the inside of the through hole with metal.
Next, the resist layer formed on the surface of the formed metal layer is patterned, and the resist layer is left on the pad 18, the conductor pattern 24 and the land 12a to be formed. By removing by etching, the resin circuit board 14 shown in FIG. 4 can be obtained.
Further, as the metal plate 28 shown in FIG. 4, a spring steel material such as phosphor bronze or beryllium copper can be suitably used.
[0015]
The terminal connection member 10 shown in FIG. 1 formed in the steps shown in FIGS. 2 to 4 has solder balls 12, 12,... As connection terminals connected to external pads provided in an electronic component inspection device. As shown in FIG. 1, each of the tips of the arms 16, 16,... Comes into contact with the corresponding solder ball 30 of the electronic component to be inspected. Therefore, the electronic component to be inspected can be electrically connected to the inspection device.
In this manner, when the distal ends of the arms 16, 16,... Of the terminal connection member 10 mounted on the inspection device are brought into contact with the corresponding solder balls 30 of the electronic component to be inspected, the electronic component is removed. By lightly pressing, even if there is a slight difference in height between each of the solder balls 30, 30,... Of the electronic component, the solder balls 30, 30,... As a result, electrical inspection of the electronic component can be easily performed.
[0016]
In FIG. 4, one projection is formed at the tip of the tongue-shaped portion 28a by pressing, but as shown in FIGS. 5A and 5B, two projections are formed at the tip of the tongue-shaped portion 28a. May be formed.
The two protrusions shown in FIG. 5A have substantially the same height. Therefore, when the solder ball 30 of the electronic component comes into contact with the two convex portions formed at the distal end of the arm 16, the distal ends of the two convex portions come into contact almost simultaneously.
On the other hand, the two convex portions shown in FIG. 5B have different heights. For this reason, when the solder ball 30 of the electronic component comes into contact with the two protrusions formed at the tip of the arm 16, first, after contacting the tip of the protrusion formed in the tip direction, When the electronic component is further pressed, the electronic component comes into contact with the front end of the projection formed in the rear end direction. As described above, if there is a time delay in which the solder ball 30 of the electronic component comes into contact with the tip of the convex portion, the tip of the convex portion that contacts first rubs the surface of the solder ball 30, and the surface of the solder ball 30 It can be expected that the formed oxide film or the like is scraped off.
[0017]
Further, as shown in FIG. 5C, the tip of the tongue-like portion 28a may be formed into a flat surface by press working. In the arm 16 formed from the tongue-like portion 28a, the contact surface that contacts the solder ball 30 of the electronic component is formed as a flat surface. In this manner, by forming the contact surface in contact with the solder ball 30 with a flat surface, the contact surface in contact with the solder ball 30 is compared with a case where the tip of the arm-shaped portion 16 is formed in a convex portion. Can be formed widely.
When the contact surface that contacts the solder ball 30 is formed as a flat surface, as shown in FIG. 6, the tip of the tongue-like portion 28a is formed in a circular shape, and a flat portion is formed near the center thereof. Press working may be performed.
Further, as the tongue-shaped portion 28a formed on the metal plate 28, as shown in FIG. 7A, a tongue-shaped portion 28a having a sharp tip may be formed. In this case, as shown in FIG. 7B, the tongue-shaped portion 28a that has been subjected to the press working is bent in a curved shape from the front end portion with the sharp front end facing upward to the rear end portion.
As shown in FIG. 8A, the tongue-shaped portion 28a having a sharp tip may be formed in a triangular shape. As shown in FIG. It is good also as a shape.
[0018]
【The invention's effect】
ADVANTAGE OF THE INVENTION According to the terminal connection member which concerns on this invention, even if there exists a slight level difference in each of the external connection terminals of an electronic component by lightly pressing an electronic component, it can be easily attached to the front-end | tip part of a corresponding arm-shaped part. Can be abutted.
For this reason, by attaching this terminal connection member to the inspection device, each of the external connection terminals provided on the electronic component to be inspected and the inspection device can be easily electrically connected by the terminal connection member. . As a result, the electrical inspection of the electronic component can be sufficiently performed, and a highly reliable electronic component can be supplied.
[Brief description of the drawings]
FIG. 1 is a partial cross-sectional view for explaining an example of a terminal connection member according to the present invention.
FIG. 2 is a partial front view for explaining a part of a process of manufacturing the terminal connecting member shown in FIG.
FIG. 3 is a schematic cross-sectional view for explaining a part of a step of manufacturing the terminal connecting member shown in FIG.
FIG. 4 is a partial cross-sectional view for explaining a part of a step of manufacturing the terminal connecting member shown in FIG.
FIG. 5 is a partial cross-sectional view showing another example of a tongue-shaped portion subjected to press working.
FIG. 6 is a partial front view showing another example of a tongue-shaped portion formed on a metal plate.
FIG. 7 is a partial front view showing another example of a tongue-shaped portion formed on a metal plate.
FIG. 8 is a partial front view showing another example of a tongue-shaped portion formed on a metal plate.
FIG. 9 is a schematic front view of a conventional terminal connection member.
FIG. 10 is a partial sectional view of a conventional terminal connection member.
[Explanation of symbols]
10 terminal connection member 12 connection terminal (solder ball)
12a Land 14 Resin circuit board 16 Arm 18 Pad 20 Resin plate 22 Via 24 Conductive pattern 26 Solder resist 28 Metal plate 28a Tongue-shaped portion 30 External connection terminal (solder ball)
34 slit 36 press die 38 resist layer

Claims (11)

電子部品に設けられた外部接続端子と、前記電子部品の電気的検査を行う検査装置等とを、電気的に接続する端子接続部材において、
該電子部品の外部接続端子と当接する当接部が、金属板を切り起こして形成されたバネ性を呈する腕状部の後端部よりも上方に位置する先端部に形成され、
且つ前記後端部側は、前記検査装置等に電気的に接続された樹脂回路基板の一面側に形成されたパッドに接合されていることを特徴とする端子接続部材。
An external connection terminal provided on the electronic component, an inspection device for performing an electrical inspection of the electronic component, and the like, a terminal connection member for electrically connecting,
A contact portion that contacts the external connection terminal of the electronic component is formed at a tip end located above a rear end of a spring-like arm-shaped portion formed by cutting and raising a metal plate,
A terminal connecting member, wherein the rear end side is joined to a pad formed on one surface side of a resin circuit board electrically connected to the inspection device or the like.
腕状部が、金属板を切り起こして形成された腕状部にバネ性が付与されるように、その外周面に金属めっきが施されている請求項1記載の端子接続部材。The terminal connecting member according to claim 1, wherein the arm-shaped portion is provided with metal plating on an outer peripheral surface thereof so that a spring property is imparted to the arm-shaped portion formed by cutting and raising a metal plate. 腕状部の先端部に形成された電子部品の外部接続端子と当接する当接部が、その当接面に1個又は複数個の凸部が形成されている請求項1又は請求項2記載の端子接続部材。3. The contact portion which is formed at the tip of the arm and which contacts the external connection terminal of the electronic component, has one or a plurality of protrusions formed on the contact surface. Terminal connection member. 腕状部の先端部に形成された電子部品の外部接続端子と当接する当接部の当接面が、平坦面に形成されている請求項1〜3のいずれか一項記載の端子接続部材。The terminal connection member according to any one of claims 1 to 3, wherein a contact surface of a contact portion that contacts an external connection terminal of the electronic component formed at a tip portion of the arm-shaped portion is formed as a flat surface. . 腕状部を切り起こす金属板が、バネ鋼材から成る金属板である請求項1〜4のいずれか一項記載の端子接続部材。The terminal connection member according to any one of claims 1 to 4, wherein the metal plate that cuts the arm portion is a metal plate made of a spring steel material. 電子部品に設けられた外部接続端子と、前記電子部品の電気的検査を行う電子部品の検査装置等とを、電気的に接続する端子接続部材を、金属板から製造する際に、
該金属板に接続された箇所を除いてスリットによって囲まれた舌片状部を形成した後、
前記舌片状部にプレス加工を施し、前記舌片状部を曲折して形成した腕状部の後端部よりも上方に位置する先端部に電子部品の外部接続端子と当接する当接部を形成し、
次いで、バネ性を呈する前記腕状部の後端部側を、前記検査装置等に電気的に接続された樹脂回路基板の一面側に形成したパッドに電気的に接続することを特徴とする端子接続部材の製造方法。
When manufacturing an external connection terminal provided on an electronic component and an electronic component inspection device or the like that performs an electrical inspection of the electronic component, a terminal connection member that electrically connects the metal component to a metal plate,
After forming a tongue-shaped portion surrounded by slits except for the portion connected to the metal plate,
An abutting portion that contacts the external connection terminal of the electronic component at a tip located above a rear end of the arm-shaped portion formed by pressing the tongue-shaped portion and bending the tongue-shaped portion. Form
Next, a terminal formed by electrically connecting a rear end portion of the arm-shaped portion exhibiting a spring property to a pad formed on one surface side of the resin circuit board electrically connected to the inspection device or the like. A method for manufacturing a connection member.
舌片状部及びスリットの外周縁近傍を除いて金属板の両面にレジスト層を形成した後、
前記舌片状部にプレス加工を施し、前記舌片状部を曲折して形成した腕状部の先端部に電子部品の外部接続端子と当接する当接部を形成し、
次いで、前記腕状部にバネ性を付与すべく、前記金属板を給電層とする電解めっきによって前記腕状部に金属めっきを施した後、
前記レジスト層を剥離してから前記腕状部の後端部を樹脂回路基板のパッドに接合する請求項6記載の端子接続部材の製造方法。
After forming the resist layer on both sides of the metal plate except for the vicinity of the outer edge of the tongue-shaped part and the slit,
Pressing the tongue-shaped portion, forming a contact portion to be in contact with the external connection terminal of the electronic component at the tip of the arm-shaped portion formed by bending the tongue-shaped portion,
Then, after applying metal plating to the arm portion by electrolytic plating using the metal plate as a power supply layer in order to impart a spring property to the arm portion,
7. The method for manufacturing a terminal connecting member according to claim 6, wherein after the resist layer is peeled off, a rear end of the arm-shaped portion is joined to a pad of a resin circuit board.
腕状部の先端部に形成した電子部品の外部接続端子と当接する当接部を、その当接面に1個又は複数個の凸部を形成する請求項6又は請求項7記載の端子接続部材の製造方法。8. The terminal connection according to claim 6, wherein one or a plurality of protrusions are formed on the contact surface of the contact portion which is formed at the tip of the arm portion and contacts the external connection terminal of the electronic component. Manufacturing method of the member. 腕状部の先端部に形成した電子部品の外部接続端子と当接する当接部の当接面を、平坦面に形成する請求項6又は請求項7記載の端子接続部材の製造方法。8. The method for manufacturing a terminal connecting member according to claim 6, wherein the contact surface of the contact portion that contacts the external connection terminal of the electronic component formed at the tip of the arm portion is formed as a flat surface. 腕状部を形成する金属板として、バネ鋼材から成る金属板を用いる請求項6〜9のいずれか一項記載の端子接続部材の製造方法。The method for manufacturing a terminal connecting member according to claim 6, wherein a metal plate made of a spring steel material is used as the metal plate forming the arm portion. 請求項1〜5のいずれか一項記載の端子接続部材を具備することを特徴とする電子部品の検査装置。An electronic component inspection apparatus comprising the terminal connection member according to claim 1.
JP2002259857A 2002-09-05 2002-09-05 Terminal connection member and method for manufacturing the same, and inspection device of electronic component Pending JP2004101224A (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008533441A (en) * 2005-02-08 2008-08-21 ナノネクサス インク High density interconnect system for IC packages and interconnect assemblies
JP2010042500A (en) * 2008-08-12 2010-02-25 Samsung Electro-Mechanics Co Ltd Method of manufacturing microelectromechanical parts

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008533441A (en) * 2005-02-08 2008-08-21 ナノネクサス インク High density interconnect system for IC packages and interconnect assemblies
JP2010042500A (en) * 2008-08-12 2010-02-25 Samsung Electro-Mechanics Co Ltd Method of manufacturing microelectromechanical parts

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