JP2004093645A

JP2004093645A - Electrooptical device unit, method for manufacturing electrooptical device unit, and electrooptical device

Info

Publication number: JP2004093645A
Application number: JP2002251124A
Authority: JP
Inventors: Takashi Fukagawa; 深川　剛史
Original assignee: Seiko Epson Corp
Current assignee: Seiko Epson Corp
Priority date: 2002-08-29
Filing date: 2002-08-29
Publication date: 2004-03-25

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electrooptical device unit for easily manufacturing an electrooptical device which hardly has a position shift between substrates in a process of hardening a sealing material and has a uniform cell gap. <P>SOLUTION: The liquid crystal device unit 300 has the sealing material 50 for charging an electrooptical material and a 1st temporary fixer 55 formed outside it and spacers formed on the sealing material 50 and 1st temporary fixer 55 are such constituted that the particle size of the spacer formed on the side of the 1st temporary fixer is made relatively larger than the particle size of the spacer formed on the side of the sealing material 50, and therefore the respective spacers can be made to effectively function as a means for holding the gap between substrates 100 and 200 uniform in a plane. <P>COPYRIGHT: (C)2004,JPO

Description

【０００１】
【発明の属する技術分野】
本発明は、電気光学装置ユニットとその製造方法、及び電気光学装置に関し、特にセルギャップの均一性を向上させる技術に関するものである。
【０００２】
【従来の技術】
携帯電話等の電子機器に搭載される直視型表示装置等として用いられる液晶装置は、液晶層を挟持して対向配置された一対の基板がシール材を介して貼着された液晶セルを主体として構成されている。一般に、複数の液晶装置を同時に製造し、製造プロセスの簡略化を図るために、液晶装置は複数の液晶セルを含むユニット（液晶装置ユニット）を用いて製造されている。
【０００３】
以下、従来の液晶装置の製造方法の一例として、一対の基板の双方が、ストライプ状に形成された複数の電極を具備するパッシブマトリクス型液晶装置の製造方法について簡単に説明する。はじめに、一対の基板母材（第１の基板母材、第２の基板母材）の各液晶セル形成領域に、電極や配向膜等の必要な要素を形成する。次いで、各液晶セル形成領域毎に額縁状の未硬化シール材を塗布し、さらに第１の基板母材と、第２の基板母材とを該シール材を介して貼着し、複数の液晶セルが一体化された液晶装置ユニットを形成する。なお、この工程において、シール材の一部には、液晶を注入するための液晶注入部が形成される。次に、液晶装置ユニットの一対の基板母材を圧着しながら、未硬化のシール材を硬化する。
【０００４】
次に、液晶装置ユニットを、すべての液晶注入部が最端部に位置するように切断し、複数の液晶セルが一方向に配列した短冊状の液晶装置ユニットに分割する。次に、短冊状の液晶装置ユニットの各液晶セルに、真空注入法等により、液晶を注入し、液晶層を形成した後、液晶注入部を封止材により封止する。そして最後に、短冊状の液晶装置ユニットを切断し、複数の液晶セルに分割した後、各液晶セルの外側に偏光子、位相差板等の光学素子を貼着することにより、複数のパッシブマトリクス型液晶装置を同時に製造することができる。
【０００５】
【発明が解決しようとする課題】
ここで、シール材としては熱硬化型のものが広く用いられているが、加熱により未硬化のシール材を硬化する際に、基板母材の熱膨張等に起因して、液晶装置ユニットを構成する一対の基板母材の位置ズレが発生する恐れがあった。そこで、かかる問題を解決するために、熱硬化型のシール材を用いる場合には、一方の基板母材の周縁部に未硬化の仮固定材を塗布し、未硬化のシール材とこの未硬化の仮固定材を介して、一対の基板母材を貼着し、液晶装置ユニットを形成した後、未硬化の仮固定材を硬化し仮固定してから、未硬化のシール材を硬化している。このような、仮固定材を用いたパネルの組み立て方法については、例えば特開平０５−２３２４２２号公報に記載された技術が知られている。しかしながら、このような仮固定材を用いても個々の液晶セルにおいて、位置ズレが発生する恐れがあり、更なる改善が望まれている。
【０００６】
一方、一対の基板母材は、各基板間隔が面内で均一になるように、ギャップ材を介して貼り合わされている。しかしながら、複数の液晶セルを備えた液晶装置ユニットにおいて、基板母材の内面側には電極や回路素子等が所定領域毎に形成されているため、領域毎に各基板母材の内面間距離が異なる構成となっている。したがって、領域毎に異なる径を具備したギャップ材を用いることで、基板間隔を一層均一化することが可能となるが、領域毎に異なる粒径のギャップ材を配設する方法は手間が掛かる場合が多かった。
【０００７】
そこで、本発明はかかる事情に鑑みてなされたものであり、シール材の硬化工程において基板間の位置ズレが発生し難く、また均一なセルギャップを有する電気光学装置を簡便に製造するための電気光学装置ユニットを提供することを目的とする。
【０００８】
【課題を解決するための手段】
上記課題を解決するために、本発明の電気光学装置ユニットは、一対の基板がギャップ材を介して対向配置した構成を備え、該基板面内に複数の電気光学セルを含んでなる電気光学装置ユニットであって、前記電気光学セルは、各々額縁状に形成され電気光学材料を封入するためのシール部を備えてなり、前記一対の基板は、前記シール部と、該シール部の外側に形成された第１仮止め部と、第２仮止め部とにより貼着され、前記第２仮止め部は光硬化性樹脂にて構成される一方、前記シール部と第１仮止め部は熱硬化性樹脂にて構成され、前記シール部が前記第１仮止め部よりも相対的に硬化温度の高い樹脂材料を主体として構成されるとともに、前記シール部及び第１仮止め部にはギャップ材がそれぞれ形成され、前記第１仮止め部に形成されたギャップ材の粒径が、前記シール部に形成されたギャップ材の粒径よりも大きいことを特徴とする。
【０００９】
このような電気光学装置ユニットでは、電気光学材料を封入する部分（シール部形成領域）には回路素子等が形成され、その外側の部分（第１仮止め部形成領域）には該回路素子等が形成されないため、各領域毎に、各基板の内面側間隔に違いが生じる。本発明では、これらシール部と第１仮止め部とにおいて、第１仮止め部側に形成したギャップ材の粒径を相対的に大きく構成したため、各領域におけるギャップ材を、基板間隔を面内で均一に保持するための手段として有効に機能させることが可能となる。すなわち、基板内面間隔が大きい領域には相対的に大きい粒径のギャップ材を、基板内面間隔が小さい領域には相対的に小さい粒径のギャップ材をそれぞれ形成したため、一対の基板間隔を面内で一層均一化することが可能となり、ひいては電気光学装置の特性向上に寄与することが可能となる。
また、本発明では、製造時において、第２仮止め部を光硬化させることにより、シール部及び第１仮止め部の硬化を伴わずに一対の基板を仮固定して、各基板の位置ズレ防止を図るとともに、各電気光学セルのシール部外側に形成された第１仮止め部を低温で硬化することにより、シール部の硬化を伴わずに各電気光学セル毎に位置ズレ防止を図り、そして最後にシール部を高温で硬化させて各基板を確実に貼り合わせることができる。このように２種類の熱硬化性樹脂を用いて、２段階の加熱により基板の貼合せを行うことが可能なため、特に信頼性の高いシール材を高温で硬化する場合にも、第１仮止め材による仮固定により、基板が膨張して各基板間の位置ズレが生じるのを防止ないし抑制可能となり、ひいては各基板の組みズレの発生を一層確実に防止ないし抑制することが可能となる。さらに、電気光学材料を各電気光学セル内に封入するためのシール部を高温硬化型の樹脂材料で構成できるため、そのシールの信頼性が高いものとなる。
このように本発明では、シール部と、これよりも硬化温度の低い第１仮止め部とを設けたため、シール部の気密性等の信頼性を維持しつつ、製造時に基板の変形等を伴わないものとなる上、さらにこれらシール材と第１仮止め材とを塗布形成する際に上記各ギャップをそれぞれ混入させることで、別途ギャップ材を配設する工程を必要とせず非常に簡便な方法にてシール材の信頼性確保、各基板間の組みズレ防止、及び基板間隔の面内均一性の確保を実現したのである。
なお、このような本発明の電気光学装置ユニットについて、各電気光学セル毎に切り出して、該電気光学セルを備えた電気光学装置を提供することが可能で、該電気光学装置は、基板間の組みズレ等が少なく信頼性の高いものとなる。
【００１０】
本発明の電気光学装置ユニットにおいて、前記第１仮止め部は、前記シール部よりも相対的に硬化速度の速い樹脂材料を主体として構成されているものとすることができる。この場合、１段階目の第１仮止め部の硬化速度が速いため、当該電気光学装置ユニットの製造効率が向上することとなる。すなわち、本発明の電気光学装置ユニットにおいて、電気光学セル内に電気光学材料を封入する役割を担うのはシール材であって、第１仮止め材は密封性等の信頼性は要求されていないため、低温速硬型の熱硬化性樹脂を用いるのが製造効率上好適である。
【００１１】
なお、本発明の電気光学装置ユニットにおいて、シール部は額縁状に形成することができ、該額縁状のシール部の周縁に前記第１仮止め部を形成することができる。また、該額縁状のシール部に概略沿って前記第１仮止め部を形成することもできる。
【００１２】
次に、本発明の電気光学装置ユニットの製造方法は、一対の基板がギャップ材を介して対向配置した構成を備え、該基板面内に複数の電気光学セルを含んでなる電気光学装置ユニットの製造方法であって、一方の基板上に熱硬化性のシール材をシール材側ギャップ材とともに塗布する工程と、前記シール材の外側に、熱硬化性であって前記シール材よりも相対的に硬化温度の低い第１仮止め材を、第１仮止め材側ギャップ材とともに塗布する工程と、光硬化性の第２仮止め材を塗布する工程と、前記シール材及び各仮止め材を介して他方の基板を貼り合わせる工程と、前記第２仮止め材を硬化する光硬化工程と、前記第１仮止め材を硬化させる第１熱硬化工程と、前記第１熱硬化工程の後に、該第１熱硬化工程よりも低温条件にて前記シール材を硬化させる第２熱硬化工程とを含むことを特徴とする。
なお、この場合において、シール材を塗布する工程と、第１仮止め材を塗布する工程と、第２仮止め材を塗布する工程とはそれぞれ順序を問わず、また、シール材、第１仮止め材、第２仮止め材は、一対の基板のうち、同一の基板上に塗布したり、異なる基板上にそれぞれ組み合わせて塗布することもできる。
【００１３】
このような製造方法により、対向する基板同士の組みズレが少なく、また基板間隔が均一な電気光学装置ユニットを提供可能となる。すなわち、第２仮止め材により仮止めを行った後に、第１仮止め材を低温にて硬化させて１段階目の貼合せを行い、次にシール材を高温にて硬化させて２段階目の貼合せを行うため、特に１段階目の固定により、２段階目の高温硬化条件における基板間の位置ズレ等が生じ難く、基板貼合せの際の組みズレが極めて生じ難いものとなる。さらに、シール材とともにシール材側ギャップ材を塗布し、第１仮止め材とともに第１仮止め材側ギャップ材を塗布するものとしたため、別途ギャップ材配設工程を設けずとも、基板の面内均一化を一層可能とし、上述した本発明の電気光学装置ユニットに係る構成を簡便に提供することが可能となる。
【００１４】
なお、前記第１仮止め材を、前記シール材よりも相対的に硬化速度の速い樹脂材料を主体として構成することができ、この場合、第１硬化工程の施行時間が短縮化され、製造効率が向上する。すなわち、本発明の電気光学装置ユニットにおいて、電気光学セル内に電気光学材料を封入する役割を担うのはシール材であって、第１仮止め材は密封性等の信頼性は要求されていないため、低温速硬型の熱硬化性樹脂を用いるのが好適である。
【００１５】
また本発明では、第１仮止め材側ギャップ材の粒径を、シール材側ギャップ材の粒径よりも大きくすることが好ましい。これは、シール材を形成する領域には、基板上に電極駆動用の素子（回路素子）等が配設される一方、第１仮止め材を形成する領域には該回路素子等が形成されないため、該第１仮止め材形成領域では基板内面側の間隔が大きくなるが、そこで第１仮止め材のギャップ材径を大きくすることで、基板間隔の面内均一化を図ることを目的としたものである。
【００１６】
なお、本発明の製造方法においては、シール材の塗布工程において該シール材を額縁状に塗布形成し、さらに第１仮止め材の塗布工程において該第１仮止め材を前記額縁状シール材の周縁に塗布形成するものとすることができる。また、シール材の塗布工程において該シール材を額縁状に塗布形成し、さらに第１仮止め材の塗布工程において該第１仮止め材を額縁状シール材に概略沿って塗布形成するものとすることができる。
【００１７】
次に、本発明の電気光学装置は、上記電気光学装置ユニットから分割された電気光学セルを含むことを特徴とする。このような電気光学装置は、上記組みズレ等の発生が極めて少ない電気光学セルを備えてなるため、非常に信頼性の高い装置となる。
【００１８】
【発明の実施の形態】
次に、本発明に係る実施形態について詳細に説明する。以下、図面を参照しながら説明するが、各図において、各層や各部材を図面上で認識可能な程度の大きさとするため、各層や各部材毎に縮尺を異ならせてある。
【００１９】
［電気光学装置］
はじめに、図１、図２に基づいて、電気光学装置の一実施形態たる液晶装置の構成例として、スイッチング素子としてＴＦＴ（薄膜トランジスタ）を用いたアクティブマトリクス型の透過型液晶装置を取り上げて説明する。図１は、液晶装置に備えられた液晶セルの全体構成を示す斜視図（透視図）であり、図２は、図１に示す液晶セルのＡ−Ａ’線の断面を部分的に示す断面図である。
【００２０】
図１、図２に示す液晶装置１は、ＴＦＴが形成された側の素子基板（第１の基板）１０と、これに対向する対向基板（第２の基板）２０と、これら一対の基板に挟持された液晶層３０とからなる液晶セル４０と、液晶セル４０の下方に配置されたバックライト（図示略）とを主体として構成されている。素子基板１０と対向基板２０とは、各々の基板の周縁部に沿って略環状に形成されたシール材５０を介して貼着されており、素子基板１０と対向基板２０との間であって、シール材５０に囲まれた領域に液晶層３０が封入されている。また、シール材５０の一部には、液晶を注入するための液晶注入部５２が形成されており、この液晶注入部５２は封止材（図示略）により封止されている。
【００２１】
素子基板１０の内面（液晶層側表面）には、多数のデータ線１１および多数の走査線１２が互いに交差するように格子状に設けられている。そして、各データ線１１と各走査線１２の交差点の近傍にはＴＦＴ１３が形成されており、各ＴＦＴ１３を介して画素電極１４が接続されている。また、これらのデータ線１１、走査線１２、ＴＦＴ１３、画素電極１４の液晶層３０側には配向膜１５が形成されている。一方、対向基板２０の内面（液晶層側表面）には、共通電極２１と配向膜２２とが順次積層形成されている。また、素子基板１０と対向基板２０の外面（液晶層と反対側）には、偏光子、位相差板等の光学素子（図示略）が貼着されている。
【００２２】
また、セルギャップを均一化することを目的として、液晶層３０内には、シリカ球等の球状のスペーサ３１が多数配置されている。また、シール材５０内にも、シリカ球やグラスファイバ等のスペーサ５１が配置されている。以下、液晶層３０内のスペーサのことを「面内スペーサ」、シール材５０内のスペーサのことを「シール内スペーサ」と称す。
【００２３】
図示するように、面内スペーサ３１の径はセルギャップ（液晶層の厚み）Ｇ１に略等しく設定されるのに対し、シール内スペーサ５１の径は画素電極１４及び共通電極２１が形成されていない領域のシール部間隔Ｇ２に略等しく設定されている。ここで、シール部間隔Ｇ２は、「シール部形成領域において、基板間隔Ｇ３から基板上に形成された回路素子５３等の厚みを減じた厚み」に相当する。なお、図面上はセルギャップＧ１やシール部間隔Ｇ２、さらには基板間隔Ｇ３を誇張して図示しているが、実際にはμｍオーダーと非常に微小なものである。
【００２４】
［電気光学装置の製造方法］
次に、上述した電気光学装置たる液晶装置を製造する場合を例として、図３、図４に基づいて、本発明に係る実施形態の液晶装置の製造方法、特に図１及び図２に示す構成の液晶セル４０を複数個備えてなる液晶装置ユニット（電気光学装置ユニット）の製造方法について説明する。図３、図４は、液晶装置ユニットの構造を示す図であって、図３は、液晶装置ユニットを後述する第２の基板母材側から見た時の平面図、図４は、液晶装置ユニットの部分断面図であり、図２に対応する図である。
【００２５】
はじめに、図３に示すように、最終的に切り出されて素子基板１０となる素子基板形成領域１０Ａを複数個有する第１の基板母材１００と、最終的に切り出されて対向基板２０となる対向基板形成領域２０Ａを複数個有する第２の基板母材２００とを用意し、各基板母材の各基板形成領域に必要な要素を形成する。すなわち、第１の基板母材１００の各基板形成領域１０Ａに、データ線１１、走査線１２、ＴＦＴ１３、画素電極１４、配向膜１５を形成し、第２の基板母材２００の各基板形成領域２０Ａに、共通電極２１、配向膜２２を形成する。
【００２６】
次に、これら一対の基板母材のうち、一方の基板母材の各基板形成領域の周縁部に、図４に示すようなシール内スペーサ５１が混入された未硬化の熱硬化型のシール材５０を額縁状に塗布し、次いで、同じ基板母材であって、シール材５０の周縁に概略沿って、同じく図４に示すような第１仮止め内スペーサー５６が混入された未硬化の熱硬化型の第１仮止め材５５を塗布する。
【００２７】
この場合、例えば多ヘッドタイプのシールディスペンサにより、シール材５０と第１仮止め材５５とをそれぞれ塗布可能である。また、このとき使用する材料は、シール材５０としては信頼性（気密性）が高く、硬化温度の高い熱硬化性樹脂を用い、一方、第１仮止め材５５としては、硬化温度が低く、速硬化型熱硬化性樹脂を使用する。具体的には、シール材５０として硬化温度１５０℃の熱硬化性樹脂を、第１仮止め材５５として硬化温度１２０℃程度の熱硬化性樹脂を用いることができる。
【００２８】
さらに、シール材５０と第１仮止め材５５とにおいて異なる粒径のスペーサー（ギャップ材）を混入している。図４に示すように、シール内スペーサー５１は、回路素子５３等が形成された領域の基板間隔（シール部間隔）Ｇ２と略同じ大きさの粒径とされ、第１仮止め内スペーサー５６は、基板内面に回路素子５３等が形成されていない領域の基板間隔Ｇ３と略同じ大きさの粒径とされている。このようなシール材及び第１仮止め材の塗布後、図３に示すように、同じ基板母材の基板形成領域が形成されていない領域に、未硬化の光硬化型の第２仮止め材６０をディスペンス法により塗布する。また、第２仮止め材６０の塗布後、他方の基板母材上に面内スペーサ３１を散布する。
【００２９】
なお、未硬化のシール材５０を塗布する基板母材、未硬化の第１仮止め材５５を塗布する基板母材、未硬化の第２仮止め材６０を塗布する基板母材、面内スペーサ３１を散布する基板母材については、それぞれ第１及び第２の基板母材のうちのいずれかを適宜選択することができる。また、未硬化のシール材５０、未硬化の第１仮止め材５５、未硬化の第２仮止め材６０の塗布順序についても、適宜設計することができる。本実施形態では、第２仮止め材６０として、シリカ球やグラスファイバ等のスペーサが混入されたものを用いている。第２仮止め材６０に混入するスペーサの径は、特に限定されるものではないが、最終的に製造する液晶セル４０の基板間隔Ｇ３以上とすることが好ましく、例えば基板間隔Ｇ３より数１００ｎｍ程度大きい値とすることがより好ましい。
【００３０】
次に、第１の基板母材１００と第２の基板母材２００とを、未硬化のシール材５０と、未硬化の第１仮止め材５５と、未硬化の第２仮止め材６０とを介して貼着することにより、複数の液晶セル４０が一体化された図３に示す液晶装置ユニット３００を形成する。なお、図３では、第１仮止め材５５をシール材５０の周縁に概略沿って塗布した場合について図示しているが、該第１仮止め材５５の塗布箇所や塗布形状については、図示するものに限定されるものではなく、適宜設計することができる。また、同じく図３では、第２仮止め材６０を左端部と右端部に３箇所ずつ塗布した場合について図示しているが、第２仮止め材６０の塗布箇所や塗布形状については、図示するものに限定されるものではなく、適宜設計することができる。また、形成する液晶セル４０の個数や形成パターンについても適宜設計することができる。
【００３１】
次に、液晶装置ユニット３００において、未硬化の第２仮止め材６０が塗布された領域にのみ紫外線等の活性エネルギー線を照射し、未硬化の第２仮止め材６０を硬化し、第１の基板母材１００と第２の基板母材２００とを硬化した第２仮止め材６０を介して第１の仮固定を行う。次いで、減圧プレス法により液晶装置ユニット３００を圧着しながら１２０℃程度に加熱し、未硬化の第１仮止め材５５を硬化して第２の仮固定を行う。さらに、同じく減圧プレス法により液晶装置ユニット３００を圧着しながら１５０℃程度に加熱し、未硬化のシール材５０を硬化する。そして、未硬化のシール材５０を硬化した後の液晶装置ユニット３００の断面構造は図４に示すものとなる。なお、図４では、第２仮止め材６０については図示していない。
【００３２】
以上のようにして、減圧プレス法により、液晶装置ユニット３００を圧着しながら、未硬化のシール材５０を硬化した後、液晶装置ユニット３００を、液晶注入部５２が端部に位置するように切断し、複数の液晶セル４０が一列に配列された短冊状の液晶装置ユニットに分割する。次に、この分割した短冊状の液晶装置ユニットの各液晶セル４０内に液晶を注入し、液晶層３０を形成した後、液晶注入部５２を封止材により封止する。さらに、各素子基板形成領域１０Ａから素子基板１０を切り出し、各対向基板形成領域２０Ａから対向基板２０を切り出して、短冊状の液晶装置ユニットを各液晶セル４０に分割する。この分割の際には、第１仮止め材５５が各液晶セル４０に組み込まれないように切り出しを行う。そして最後に、素子基板１０、対向基板２０の外面に偏光子、位相差板等の光学素子を取り付けることにより、上記の液晶装置１が製造される。
【００３３】
本実施形態では、第１仮止め材５５に低温速硬化型のシール材を適用し、シール材５０に高温硬化型のシール材を適用したため、硬化時の加熱による基板膨張に基づく基板の組みズレ等が生じ難くなっている。すなわち、まず１段階目の加熱（１２０℃程度）で基板に熱変形が生じる前に各基板を仮固定し、さらに仮固定した状態で２段階目の加熱（１５０℃）により各基板を本固定するものとしているため、基板が変形し易い高温下（２段階目の加熱条件下）では、既に１段階目において仮固定されているため、各基板が組みズレ等を起こし難くなっている。
【００３４】
従来、シール材は液晶を基板面内に封入するために密閉性の高い高温硬化タイプのものを用いていた。しかしながら、これを硬化して各基板を貼着するには、高温に加熱する必要があり、この加熱が基板を大きく膨張させる要因の一つとなっていた。製造プロセスにおいて、このような基板膨張が生じると、各基板の組みズレ等が生じ、製造される液晶装置において不良発生の原因となる場合があった。すなわち、シールの密閉性を向上させるために、硬化温度の高いシール材を適用した場合には、硬化条件が高温となり、基板間の組みズレが大きくなる惧れがある。そこで本実施形態のように、低温速硬化タイプの第１仮止め材５５をシール材５０の外側に塗布して、硬化条件を２段階化することで、上述の通りシールの密閉性を確保しつつ基板組みズレを防止することを達成することができたのである。
【００３５】
また、本実施形態では、シール材５０と第１仮止め材５５とを別々に塗布する工程を備えるため、それぞれの塗布工程においてシール内スペーサー５１と第１仮止め内スペーサー５６とを分けて配設することができる。しかも、各スペーサー５１，５６をそれぞれシール材５０，第１仮止め材５５とともに塗布するものとしているため、工程数を増やすことなく簡便に各スペーサー５１，５６を分配できる。特に、シール材５０と第１仮止め材５５の形成領域は、それぞれ基板の内面間隔が異なるため、異なるスペーサーを配設することで、基板間隔の面内均一性を図ることが可能となる。例えば、基板上に回路素子が形成されるシール材の形成領域においては、相対的に小径のスペーサーを配設し、基板上にそのような素子等が形成されない第１仮止め材の形成領域においては、相対的に大径のスペーサーを配設することで、基板間隔の均一性を確保することが可能となる。
【００３６】
なお、本実施形態では、熱硬化型のシール材及び第１仮止め材を用いているため、熱硬化型とは異なる光硬化型の仮固定材を用いた。これにより、未硬化のシール材を硬化することなく、あらかじめ未硬化の仮固定材のみを光照射により選択的に硬化することができ好適である。また、本発明はＴＦＴを用いたアクティブマトリクス型液晶装置に限らず、ＴＦＤ（薄膜ダイオード）を用いたアクティブマトリクス型液晶装置やパッシブマトリクス型液晶装置など、いかなる構造の液晶装置にも適用可能である。また、本発明は透過型の液晶装置に限らず、反射型液晶装置或いは半透過反射型液晶装置に適用することが可能である。さらに、本発明は液晶装置に限らず、例えば電気光学材料として有機ＥＬを用いたＥＬ表示装置等、その他の電気光学装置にも適用することが可能である。
【００３７】
【発明の効果】
以上説明したように、本発明の電気光学装置ユニットは、電気光学材料を封入するためのシール部と、その外側に形成された第１仮止め部とを備え、該シール部及び第１仮止め部に形成されたギャップ材について、第１仮止め部側に形成したギャップ材の粒径を、シール部側に形成したギャップ材の粒径よりも相対的に大きく構成したため、各領域におけるギャップ材を、基板間隔を面内で均一に保持するための手段として有効に機能させることが可能となる。すなわち、電気光学材料を封入するためのシール部形成領域には基板内面側に回路素子等が形成される一方、そのシール部形成領域の外側に形成された第１仮止め部形成領域には基板内面に該回路素子等が形成されないため、本発明のように、領域毎にギャップ材粒径を異ならせることで、各基板の間隔を面内で一層均一化することが可能となり、ひいては電気光学装置の特性向上に寄与することが可能となる。
【図面の簡単な説明】
【図１】本発明に係る実施形態の透過型液晶装置の構成例を示す斜視図（透視図）。
【図２】図１に示す液晶セルのＡ−Ａ’線の部分断面図。
【図３】本発明に係る実施形態の液晶装置の製造工程において製造される液晶装置ユニットの構造を示す平面図。
【図４】本発明に係る実施形態の液晶装置の製造工程において製造される液晶装置ユニットの構造を示す部分断面図。
【符号の説明】
１　液晶装置、１０　素子基板、２０　対向基板、３０　液晶層、３１　面内スペーサ、４０　液晶セル、５０　シール材、５１　シール内スペーサ（シール材側ギャップ材）、５５　第１仮止め材、５６　第１仮止め内スペーサ（第１仮止め材側ギャップ材）、１００　第１の基板母材、２００　第２の基板母材、６０
第２仮止め材、３００　液晶装置ユニット[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to an electro-optical device unit, a method for manufacturing the same, and an electro-optical device, and more particularly to a technique for improving the uniformity of a cell gap.
[0002]
[Prior art]
2. Description of the Related Art A liquid crystal device used as a direct-view display device or the like mounted on an electronic device such as a mobile phone mainly includes a liquid crystal cell in which a pair of substrates opposed to each other with a liquid crystal layer interposed therebetween is adhered via a sealing material. It is configured. Generally, in order to simultaneously manufacture a plurality of liquid crystal devices and simplify the manufacturing process, the liquid crystal device is manufactured using a unit including a plurality of liquid crystal cells (liquid crystal device unit).
[0003]
Hereinafter, as an example of a conventional method for manufacturing a liquid crystal device, a method for manufacturing a passive matrix liquid crystal device in which both of a pair of substrates include a plurality of electrodes formed in a stripe shape will be briefly described. First, necessary elements such as electrodes and an alignment film are formed in each liquid crystal cell forming region of a pair of substrate base materials (a first substrate base material and a second substrate base material). Next, a frame-shaped uncured sealing material is applied to each of the liquid crystal cell forming regions, and a first substrate base material and a second substrate base material are adhered to each other through the sealing material. A liquid crystal device unit in which cells are integrated is formed. In this step, a liquid crystal injection portion for injecting liquid crystal is formed in a part of the sealing material. Next, the uncured sealing material is cured while pressing the pair of substrate base materials of the liquid crystal device unit.
[0004]
Next, the liquid crystal device unit is cut so that all the liquid crystal injection portions are located at the end portions, and divided into strip-shaped liquid crystal device units in which a plurality of liquid crystal cells are arranged in one direction. Next, liquid crystal is injected into each liquid crystal cell of the strip-shaped liquid crystal device unit by a vacuum injection method or the like to form a liquid crystal layer, and then the liquid crystal injection portion is sealed with a sealing material. Finally, the strip-shaped liquid crystal device unit is cut and divided into a plurality of liquid crystal cells, and then an optical element such as a polarizer and a retardation plate is attached to the outside of each liquid crystal cell, thereby forming a plurality of passive matrices. Type liquid crystal device can be manufactured at the same time.
[0005]
[Problems to be solved by the invention]
Here, a thermosetting type sealing material is widely used, but when the uncured sealing material is cured by heating, a liquid crystal device unit is formed due to thermal expansion of a substrate base material or the like. There is a possibility that the positional displacement of the pair of substrate base materials may occur. Therefore, in order to solve such a problem, when a thermosetting sealing material is used, an uncured temporary fixing material is applied to a peripheral portion of one substrate base material, and the uncured sealing material and the uncured sealing material are applied. After pasting a pair of substrate base materials through the temporary fixing material and forming a liquid crystal device unit, the uncured temporary fixing material is cured and temporarily fixed, and then the uncured sealing material is cured. I have. As a method of assembling a panel using such a temporary fixing material, for example, a technique described in Japanese Patent Application Laid-Open No. 05-232422 is known. However, even if such a temporary fixing material is used, there is a possibility that positional shift may occur in each liquid crystal cell, and further improvement is desired.
[0006]
On the other hand, the pair of substrate base materials are bonded via a gap material such that the distance between the substrates is uniform in the plane. However, in a liquid crystal device unit including a plurality of liquid crystal cells, since electrodes, circuit elements, and the like are formed in predetermined regions on the inner surface side of the substrate base material, the distance between the inner surfaces of each substrate base material is different for each region. It has a different configuration. Therefore, by using a gap material having a different diameter for each region, it is possible to further uniform the substrate spacing, but it is troublesome to dispose a gap material having a different particle size for each region. There were many.
[0007]
Accordingly, the present invention has been made in view of such circumstances, and it is difficult to generate a positional displacement between substrates in a curing process of a sealing material, and to easily manufacture an electro-optical device having a uniform cell gap. It is an object to provide an optical device unit.
[0008]
[Means for Solving the Problems]
In order to solve the above-described problems, an electro-optical device unit according to the present invention includes a configuration in which a pair of substrates are arranged to face each other with a gap material interposed therebetween, and includes an electro-optical device including a plurality of electro-optical cells in the substrate surface. A unit, wherein each of the electro-optical cells includes a seal portion formed in a frame shape and enclosing an electro-optical material, and the pair of substrates are formed outside the seal portion and the seal portion. The first temporary fixing portion and the second temporary fixing portion are adhered to each other, and the second temporary fixing portion is made of a photocurable resin, while the seal portion and the first temporary fixing portion are thermoset. The sealing portion is mainly made of a resin material having a higher curing temperature than the first temporary fixing portion, and a gap material is provided in the sealing portion and the first temporary fixing portion. Respectively formed and formed on the first temporary fixing portion. It has been the particle size of the gap material, being larger than the particle diameter of the sealing portion formed gap material.
[0009]
In such an electro-optical device unit, a circuit element or the like is formed in a portion (sealing portion forming region) for enclosing the electro-optical material, and the circuit element or the like is formed in an outer portion (first temporary fixing portion forming region). Is not formed, the difference in the distance between the inner surfaces of the substrates occurs in each region. In the present invention, in the seal portion and the first temporary fixing portion, the gap material formed on the first temporary fixing portion side has a relatively large particle diameter. Thus, it can be made to function effectively as a means for holding uniformly. That is, a gap material having a relatively large particle size is formed in a region where the substrate inner surface distance is large, and a gap material having a relatively small particle size is formed in a region where the substrate inner surface distance is small. Thus, the uniformity can be further improved, and the characteristics of the electro-optical device can be further improved.
Further, in the present invention, at the time of manufacturing, the pair of substrates is temporarily fixed without curing the seal portion and the first temporary fixing portion by light-curing the second temporary fixing portion, thereby displacing the positions of the respective substrates. Along with the prevention, the first temporary fixing portion formed outside the seal portion of each electro-optical cell is cured at a low temperature, thereby preventing displacement of each electro-optical cell without curing the seal portion, Finally, the sealing portion is cured at a high temperature, so that the substrates can be securely bonded. As described above, the two types of thermosetting resins can be used to bond the substrates by two-stage heating. Therefore, even when a highly reliable sealing material is cured at a high temperature, the first temporary bonding can be performed. By the temporary fixing with the stopper, it is possible to prevent or suppress the occurrence of positional displacement between the substrates due to the expansion of the substrates, and it is thus possible to more reliably prevent or suppress the occurrence of the displacement of the substrates. Further, since a seal portion for enclosing the electro-optical material in each electro-optical cell can be made of a high-temperature curing type resin material, the reliability of the seal is high.
As described above, in the present invention, since the seal portion and the first temporary fixing portion having a lower curing temperature than the seal portion are provided, the reliability of the seal portion such as airtightness is maintained, and the deformation and the like of the substrate are accompanied during the manufacturing. In addition, the above gaps are mixed when the sealing material and the first temporary fixing material are formed by applying the sealing material and the first temporary fixing material, so that a step of separately arranging the gap material is not required, which is a very simple method. As a result, the reliability of the sealing material, the prevention of misalignment between the substrates, and the in-plane uniformity of the substrate spacing were realized.
The electro-optical device unit of the present invention can be cut out for each electro-optical cell to provide an electro-optical device having the electro-optical cell. There is little misalignment and the reliability is high.
[0010]
In the electro-optical device unit according to the aspect of the invention, the first temporary fixing portion may mainly include a resin material having a higher curing speed than the sealing portion. In this case, since the curing speed of the first temporary fixing portion in the first stage is high, the manufacturing efficiency of the electro-optical device unit is improved. That is, in the electro-optical device unit of the present invention, it is the sealing material that plays a role of enclosing the electro-optical material in the electro-optical cell, and the first temporary fixing material does not require reliability such as sealing performance. Therefore, it is preferable to use a low-temperature quick-setting type thermosetting resin in terms of production efficiency.
[0011]
In the electro-optical device unit of the present invention, the seal portion can be formed in a frame shape, and the first temporary fixing portion can be formed on the periphery of the frame-shaped seal portion. Further, the first temporary fixing portion can be formed substantially along the frame-shaped seal portion.
[0012]
Next, a method of manufacturing an electro-optical device unit according to the present invention includes a configuration in which a pair of substrates are arranged to face each other with a gap material interposed therebetween, and the electro-optical device unit includes a plurality of electro-optical cells in the substrate surface. A manufacturing method, wherein a step of applying a thermosetting sealing material on one substrate together with a sealing material side gap material, and a step of applying a thermosetting sealing material relative to the sealing material outside the sealing material. A step of applying a first temporary fixing material having a low curing temperature together with a first temporary fixing material side gap material, a step of applying a photo-curable second temporary fixing material, and a step of applying the sealing material and each temporary fixing material. After the step of bonding the other substrate, the light curing step of curing the second temporary fixing material, the first heat curing step of curing the first temporary fixing material, and the first heat curing step. The seal at a lower temperature than the first thermosetting step Characterized in that it comprises a second heat curing step of curing the.
In this case, the step of applying the sealing material, the step of applying the first temporary fixing material, and the step of applying the second temporary fixing material may be performed in any order. The stopper and the second temporary stopper may be applied on the same substrate of the pair of substrates, or may be applied in combination on different substrates.
[0013]
According to such a manufacturing method, it is possible to provide an electro-optical device unit in which the dislocation of the opposing substrates is small and the distance between the substrates is uniform. That is, after the temporary fixing is performed by the second temporary fixing material, the first temporary fixing material is cured at a low temperature and the first bonding is performed, and then the sealing material is cured at a high temperature and the second bonding is performed. In particular, the first-stage fixing makes it difficult for the second-stage high-temperature curing conditions to cause positional displacement between the substrates and the like, and it is extremely unlikely that the substrates will be misaligned during laminating. Furthermore, since the sealing material-side gap material is applied together with the sealing material, and the first temporary fixing material-side gap material is applied together with the first temporary fixing material, the in-plane surface of the substrate can be provided without a separate gap material arranging step. The uniformization can be further achieved, and the configuration according to the above-described electro-optical device unit of the present invention can be easily provided.
[0014]
In addition, the first temporary fixing member can be mainly composed of a resin material having a relatively higher curing speed than the sealing material. In this case, the execution time of the first curing step is shortened, and the manufacturing efficiency is reduced. Is improved. That is, in the electro-optical device unit of the present invention, it is the sealing material that plays a role of enclosing the electro-optical material in the electro-optical cell, and the first temporary fixing material does not require reliability such as sealing performance. Therefore, it is preferable to use a low-temperature quick-setting thermosetting resin.
[0015]
Further, in the present invention, it is preferable that the particle size of the first temporary fixing material-side gap material is larger than the particle size of the sealing material-side gap material. This is because an electrode driving element (circuit element) or the like is provided on the substrate in the area where the seal material is formed, but the circuit element or the like is not formed in the area where the first temporary fixing material is formed. Therefore, in the first temporary fixing material forming region, the interval on the inner surface side of the substrate is increased. However, the purpose is to increase the diameter of the gap material of the first temporary fixing material so as to make the in-plane uniformity of the substrate interval. It was done.
[0016]
In the manufacturing method of the present invention, the sealing material is applied in a frame shape in a sealing material applying step, and the first temporary fixing material is applied to the frame-shaped sealing material in a first temporary fixing material applying step. It can be formed by coating on the periphery. In addition, the sealing material is applied and formed in a frame shape in a sealing material applying step, and the first temporary fixing material is applied and formed substantially along the frame-shaped sealing material in a first temporary fixing material applying step. be able to.
[0017]
Next, an electro-optical device according to the invention includes an electro-optical cell divided from the electro-optical device unit. Such an electro-optical device is provided with an electro-optical cell in which occurrence of the above-described misalignment and the like is extremely small, so that the device is highly reliable.
[0018]
BEST MODE FOR CARRYING OUT THE INVENTION
Next, an embodiment according to the present invention will be described in detail. Hereinafter, description will be made with reference to the drawings. In each drawing, the scale of each layer and each member is made different in order to make each layer and each member have a size recognizable in the drawings.
[0019]
[Electro-optical device]
First, based on FIGS. 1 and 2, an active matrix transmission type liquid crystal device using a TFT (thin film transistor) as a switching element will be described as a configuration example of a liquid crystal device as an embodiment of an electro-optical device. FIG. 1 is a perspective view (perspective view) showing the entire configuration of a liquid crystal cell provided in a liquid crystal device, and FIG. 2 is a cross-sectional view partially showing a cross section taken along line AA ′ of the liquid crystal cell shown in FIG. FIG.
[0020]
The liquid crystal device 1 shown in FIGS. 1 and 2 includes an element substrate (first substrate) 10 on which a TFT is formed, an opposing substrate (second substrate) 20 facing the element substrate, and a pair of these substrates. The liquid crystal cell 40 is composed mainly of a liquid crystal layer 30 sandwiched therebetween, and a backlight (not shown) disposed below the liquid crystal cell 40. The element substrate 10 and the opposing substrate 20 are adhered to each other via a sealing member 50 formed in a substantially annular shape along the peripheral edge of each substrate, and between the element substrate 10 and the opposing substrate 20. The liquid crystal layer 30 is sealed in a region surrounded by the sealing material 50. Further, a liquid crystal injection part 52 for injecting liquid crystal is formed in a part of the sealing material 50, and the liquid crystal injection part 52 is sealed with a sealing material (not shown).
[0021]
A large number of data lines 11 and a large number of scanning lines 12 are provided in a grid pattern on the inner surface (the liquid crystal layer side surface) of the element substrate 10 so as to cross each other. A TFT 13 is formed near an intersection of each data line 11 and each scanning line 12, and a pixel electrode 14 is connected through each TFT 13. Further, an alignment film 15 is formed on the liquid crystal layer 30 side of the data line 11, the scanning line 12, the TFT 13, and the pixel electrode 14. On the other hand, a common electrode 21 and an alignment film 22 are sequentially laminated on the inner surface (the liquid crystal layer side surface) of the counter substrate 20. Optical elements (not shown) such as a polarizer and a retardation plate are adhered to the outer surfaces of the element substrate 10 and the opposing substrate 20 (the side opposite to the liquid crystal layer).
[0022]
Further, for the purpose of making the cell gap uniform, a large number of spherical spacers 31 such as silica spheres are arranged in the liquid crystal layer 30. Further, a spacer 51 such as a silica sphere or a glass fiber is also arranged in the sealing material 50. Hereinafter, the spacer in the liquid crystal layer 30 is referred to as “in-plane spacer”, and the spacer in the sealing material 50 is referred to as “in-seal spacer”.
[0023]
As shown, the diameter of the in-plane spacer 31 is set substantially equal to the cell gap (the thickness of the liquid crystal layer) G1, while the diameter of the in-seal spacer 51 is such that the pixel electrode 14 and the common electrode 21 are not formed. It is set substantially equal to the seal portion interval G2 of the area. Here, the seal portion interval G2 corresponds to “the thickness obtained by subtracting the thickness of the circuit element 53 and the like formed on the substrate from the substrate interval G3 in the seal portion formation region”. Although the cell gap G1, the gap G2 between the seal portions, and the gap G3 between the substrates are exaggerated in the drawings, they are actually very small, on the order of μm.
[0024]
[Method of Manufacturing Electro-Optical Device]
Next, a method for manufacturing a liquid crystal device according to an embodiment of the present invention will be described with reference to FIGS. 3 and 4, taking the case of manufacturing the above-described liquid crystal device as an electro-optical device as an example, and particularly the configuration shown in FIGS. A method of manufacturing a liquid crystal device unit (electro-optical device unit) including a plurality of liquid crystal cells 40 will be described. 3 and 4 are views showing the structure of the liquid crystal device unit. FIG. 3 is a plan view of the liquid crystal device unit when viewed from a second substrate base material described later. FIG. 3 is a partial sectional view of the unit, corresponding to FIG. 2.
[0025]
First, as shown in FIG. 3, a first substrate preform 100 having a plurality of element substrate forming regions 10 </ b> A which are finally cut out to become the element substrate 10 and an opposing substrate which is finally cut out to become the opposing substrate 20. A second substrate preform 200 having a plurality of substrate formation regions 20A is prepared, and necessary elements are formed in each substrate formation region of each substrate preform. That is, a data line 11, a scanning line 12, a TFT 13, a pixel electrode 14, and an alignment film 15 are formed in each substrate formation region 10A of the first substrate base material 100, and each substrate formation region of the second substrate base material 200 is formed. A common electrode 21 and an alignment film 22 are formed on 20A.
[0026]
Next, an uncured thermosetting sealing material in which a spacer 51 as shown in FIG. 4 is mixed into the periphery of each substrate forming region of one of the pair of substrate preforms. 50 is applied in a frame shape, and then the uncured heat is mixed with the first temporarily fixed spacer 56 as shown in FIG. A first hardening material 55 is applied.
[0027]
In this case, for example, the seal material 50 and the first temporary fixing material 55 can be applied by a multi-head type seal dispenser. The material used at this time is a thermosetting resin having high reliability (airtightness) and a high curing temperature as the sealing material 50, while a curing temperature is low as the first temporary fixing material 55, Use a fast-curing thermosetting resin. Specifically, a thermosetting resin having a curing temperature of 150 ° C. can be used as the sealing material 50, and a thermosetting resin having a curing temperature of about 120 ° C. can be used as the first temporary fixing member 55.
[0028]
Further, spacers (gap materials) having different particle diameters are mixed in the sealing material 50 and the first temporary fixing material 55. As shown in FIG. 4, the spacer 51 in the seal has a particle size substantially the same as the substrate gap (seal portion interval) G2 in the region where the circuit element 53 and the like are formed. The grain size is substantially the same as the substrate gap G3 in a region where the circuit elements 53 and the like are not formed on the inner surface of the substrate. After the application of the sealing material and the first temporary fixing material, as shown in FIG. 3, an uncured light-curing type second temporary fixing material is applied to an area where the substrate forming area of the same substrate base material is not formed. 60 is applied by a dispense method. After the application of the second temporary fixing member 60, the in-plane spacer 31 is sprayed on the other substrate base material.
[0029]
In addition, the substrate base material on which the uncured sealing material 50 is applied, the substrate base material on which the uncured first temporary fixing material 55 is applied, the substrate base material on which the uncured second temporary fixing material 60 is applied, and the in-plane spacer Regarding the substrate base material on which 31 is sprayed, any one of the first and second substrate base materials can be appropriately selected. In addition, the order of applying the uncured sealing material 50, the uncured first temporary fixing material 55, and the uncured second temporary fixing material 60 can be appropriately designed. In the present embodiment, a material in which a spacer such as a silica sphere or glass fiber is mixed is used as the second temporary fixing member 60. The diameter of the spacer mixed into the second temporary fixing member 60 is not particularly limited, but is preferably not less than the substrate interval G3 of the liquid crystal cell 40 to be finally manufactured, for example, about several hundred nm from the substrate interval G3. It is more preferable to set it to a large value.
[0030]
Next, the first substrate preform 100 and the second substrate preform 200 are combined with an uncured sealing material 50, an uncured first temporary fixing material 55, and an uncured second temporary fixing material 60. 3 to form the liquid crystal device unit 300 shown in FIG. 3 in which the plurality of liquid crystal cells 40 are integrated. Although FIG. 3 shows a case where the first temporary fixing material 55 is applied substantially along the periphery of the sealing material 50, the application location and the application shape of the first temporary fixing material 55 are shown. The present invention is not limited to this, and can be appropriately designed. FIG. 3 also shows a case where the second temporary fixing member 60 is applied to the left end portion and the right end portion at three locations, respectively. However, the application location and the application shape of the second temporary fixing member 60 are illustrated. The present invention is not limited to this, and can be appropriately designed. Further, the number and the pattern of the liquid crystal cells 40 to be formed can be appropriately designed.
[0031]
Next, in the liquid crystal device unit 300, active energy rays such as ultraviolet rays are irradiated only to the region where the uncured second temporary fixing material 60 is applied, and the uncured second temporary fixing material 60 is cured. The first temporary fixing is performed via the second temporary fixing member 60 obtained by curing the substrate preform 100 and the second substrate preform 200. Next, the liquid crystal device unit 300 is heated to about 120 ° C. while being pressed by a reduced pressure method, and the uncured first temporary fixing member 55 is cured to perform the second temporary fixing. Further, the uncured sealing material 50 is cured by heating the liquid crystal device unit 300 to about 150 ° C. while pressing the same by a reduced pressure method. Then, the cross-sectional structure of the liquid crystal device unit 300 after the uncured sealing material 50 is cured is as shown in FIG. In FIG. 4, the second temporary fixing member 60 is not shown.
[0032]
As described above, after the uncured sealing material 50 is cured while the liquid crystal device unit 300 is pressed by the reduced pressure press method, the liquid crystal device unit 300 is cut so that the liquid crystal injection part 52 is positioned at the end. Then, the plurality of liquid crystal cells 40 are divided into strip-shaped liquid crystal device units arranged in a line. Next, liquid crystal is injected into each liquid crystal cell 40 of the divided strip-shaped liquid crystal device unit to form the liquid crystal layer 30, and then the liquid crystal injection part 52 is sealed with a sealing material. Further, the element substrate 10 is cut out from each element substrate formation region 10A, and the counter substrate 20 is cut out from each counter substrate formation region 20A, and the strip-shaped liquid crystal device unit is divided into the liquid crystal cells 40. At the time of this division, the first temporary fixing member 55 is cut out so as not to be incorporated in each liquid crystal cell 40. Finally, the liquid crystal device 1 is manufactured by attaching optical elements such as polarizers and retardation plates to the outer surfaces of the element substrate 10 and the counter substrate 20.
[0033]
In the present embodiment, a low-temperature and fast-curing sealing material is applied to the first temporary fixing member 55, and a high-temperature curing type sealing material is applied to the sealing material 50. Etc. are unlikely to occur. That is, first, each substrate is temporarily fixed before the substrate is thermally deformed by the first stage heating (about 120 ° C.), and further, each substrate is permanently fixed by the second stage heating (150 ° C.) in the temporarily fixed state. Under a high temperature at which the substrate is likely to be deformed (the second stage heating condition), the substrates are already temporarily fixed in the first stage, so that each substrate is unlikely to be displaced.
[0034]
Conventionally, as a sealing material, a high-temperature-curing type material having high hermeticity has been used in order to enclose liquid crystal in a substrate surface. However, in order to cure and adhere each substrate, it is necessary to heat the substrate to a high temperature, and this heating is one of the factors that greatly expand the substrate. In the manufacturing process, when such substrate expansion occurs, there is a case where a misalignment or the like of each substrate occurs, which may cause a defect in a manufactured liquid crystal device. That is, when a sealing material having a high curing temperature is applied in order to improve the sealing property of the seal, the curing condition becomes high, and there is a concern that the misalignment between the substrates may increase. Thus, as in the present embodiment, the first temporary fixing member 55 of a low-temperature and fast-curing type is applied to the outside of the sealing material 50, and the curing conditions are made into two stages, so that the sealability of the seal is secured as described above. In addition, it was possible to prevent the displacement of the substrate assembly.
[0035]
Further, in the present embodiment, since a step of separately applying the sealing material 50 and the first temporary fixing material 55 is provided, the spacer 51 in the seal and the spacer 56 in the first temporary fixing are separately arranged in each application step. Can be set up. In addition, since the spacers 51 and 56 are applied together with the sealing material 50 and the first temporary fixing material 55, the spacers 51 and 56 can be easily distributed without increasing the number of processes. In particular, in the formation regions of the sealing material 50 and the first temporary fixing material 55, the inner surface intervals of the substrate are different from each other. Therefore, by disposing different spacers, the in-plane uniformity of the substrate interval can be achieved. For example, in the formation region of the seal material where the circuit element is formed on the substrate, a spacer having a relatively small diameter is provided, and in the formation region of the first temporary fixing material where such an element or the like is not formed on the substrate. By disposing a spacer having a relatively large diameter, it is possible to ensure uniformity of the substrate spacing.
[0036]
In this embodiment, since a thermosetting sealing material and a first temporary fixing material are used, a photosetting temporary fixing material different from the thermosetting type is used. This is preferable because only the uncured temporary fixing material can be selectively cured by light irradiation without curing the uncured sealing material. Further, the present invention is not limited to an active matrix type liquid crystal device using a TFT, but can be applied to a liquid crystal device having any structure, such as an active matrix type liquid crystal device using a TFD (thin film diode) or a passive matrix type liquid crystal device. . Further, the present invention is not limited to a transmissive liquid crystal device, but can be applied to a reflective liquid crystal device or a transflective liquid crystal device. Further, the present invention is not limited to a liquid crystal device, and can be applied to other electro-optical devices such as an EL display device using an organic EL as an electro-optical material.
[0037]
【The invention's effect】
As described above, the electro-optical device unit of the present invention includes the seal portion for enclosing the electro-optical material and the first temporary fixing portion formed outside the seal portion, and includes the seal portion and the first temporary fixing portion. The gap material formed on the first temporary fixing portion side has a larger diameter than the gap material formed on the seal portion side of the gap material formed on the sealing portion. Can be effectively functioned as a means for maintaining a uniform substrate spacing in a plane. That is, a circuit element and the like are formed on the inner surface side of the substrate in the seal portion forming region for enclosing the electro-optical material, while the substrate is formed in the first temporary fixing portion forming region formed outside the seal portion forming region. Since the circuit elements and the like are not formed on the inner surface, the gap between the substrates can be made more uniform in the plane by making the gap material particle diameter different from region to region as in the present invention, and thus electro-optic It is possible to contribute to improving the characteristics of the device.
[Brief description of the drawings]
FIG. 1 is a perspective view (perspective view) showing a configuration example of a transmissive liquid crystal device according to an embodiment of the present invention.
FIG. 2 is a partial cross-sectional view taken along line AA ′ of the liquid crystal cell shown in FIG.
FIG. 3 is a plan view illustrating a structure of a liquid crystal device unit manufactured in a manufacturing process of the liquid crystal device according to the embodiment of the present invention.
FIG. 4 is a partial cross-sectional view illustrating a structure of a liquid crystal device unit manufactured in a manufacturing process of the liquid crystal device according to the embodiment of the present invention.
[Explanation of symbols]
REFERENCE SIGNS LIST 1 liquid crystal device, 10 element substrate, 20 counter substrate, 30 liquid crystal layer, 31 in-plane spacer, 40 liquid crystal cell, 50 sealing material, 51 spacer in sealing (seal material side gap material), 55 first temporary fixing material, 56th 1 spacer in temporary fixing (gap material on first temporary fixing material side), 100 first substrate preform, 200 second substrate preform, 60
2nd temporary fixing material, 300 liquid crystal device unit

Claims

An electro-optical device unit including a configuration in which a pair of substrates are arranged to face each other with a gap material interposed therebetween, and including a plurality of electro-optical cells in the substrate surface,
The electro-optical cell is provided with a sealing portion for enclosing the electro-optical material is formed in a frame shape,
The pair of substrates are adhered by the seal portion, a first temporary fixing portion formed outside the seal portion, and a second temporary fixing portion,
The second temporary fixing portion is made of a light-curing resin, while the seal portion and the first temporary fixing portion are made of a thermosetting resin, and the sealing portion is more relatively than the first temporary fixing portion. In addition to being composed mainly of a resin material with a high curing temperature,
A gap material is formed in each of the seal portion and the first temporary fixing portion, and a particle size of the gap material formed in the first temporary fixing portion is larger than a particle size of the gap material formed in the seal portion. An electro-optical device unit, characterized in that:

2. The electro-optical device unit according to claim 1, wherein the first temporary fixing portion is mainly formed of a resin material having a higher curing speed than the sealing portion. 3.

The electro-optical device unit according to claim 1, wherein the seal portion is formed in a frame shape, and the first temporary fixing portion is formed on a periphery of the frame-shaped seal portion.

A method for manufacturing an electro-optical device unit including a configuration in which a pair of substrates are arranged to face each other with a gap material interposed therebetween, the electro-optical device unit including a plurality of electro-optical cells in the substrate surface,
A step of applying a thermosetting sealing material on one substrate together with a sealing material side gap material,
A step of applying a first temporary fixing material that is thermosetting and has a relatively lower curing temperature than the sealing material, together with the first temporary fixing material-side gap material, outside the sealing material,
A step of applying a light-curable second temporary fixing material;
Bonding the other substrate via the sealing material and each temporary fixing material,
A light curing step of curing the second temporary fixing material;
A first heat curing step of curing the first temporary fixing material,
A method of manufacturing the electro-optical device unit, comprising: after the first heat curing step, a second heat curing step of curing the sealing material under a lower temperature condition than the first heat curing step.

The method of manufacturing an electro-optical device unit according to claim 4, wherein the first temporary fixing member is mainly composed of a resin material having a higher curing speed than the sealing material.

The method of manufacturing an electro-optical device unit according to claim 4, wherein a particle size of the first temporary fixing member-side gap material is larger than a particle size of the sealing material-side gap material.

In the step of applying the sealing material, the sealing material is applied and formed in a frame shape, and in the application step of the first temporary fixing material, the first temporary fixing material is applied and formed on the periphery of the frame-shaped sealing material. The method for manufacturing an electro-optical device unit according to claim 4.

An electro-optical device comprising an electro-optical cell obtained by dividing the electro-optical device unit according to claim 1.