JP2004093158A - Piezoelectric vibration type inertia sensor element and its manufacturing method, and laser machining apparatus - Google Patents

Piezoelectric vibration type inertia sensor element and its manufacturing method, and laser machining apparatus Download PDF

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Publication number
JP2004093158A
JP2004093158A JP2002250810A JP2002250810A JP2004093158A JP 2004093158 A JP2004093158 A JP 2004093158A JP 2002250810 A JP2002250810 A JP 2002250810A JP 2002250810 A JP2002250810 A JP 2002250810A JP 2004093158 A JP2004093158 A JP 2004093158A
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JP
Japan
Prior art keywords
laser
piezoelectric vibration
vibration type
inertial sensor
tuning fork
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2002250810A
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Japanese (ja)
Inventor
Motoyasu Hanji
Katsuhide Ibusuki
Ryota Kawai
Shuichi Kono
Shigeyuki Miyazaki
判治 元康
宮崎 茂行
指宿 克英
河合 良太
河野 修一
Original Assignee
Kinseki Ltd
キンセキ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kinseki Ltd, キンセキ株式会社 filed Critical Kinseki Ltd
Priority to JP2002250810A priority Critical patent/JP2004093158A/en
Publication of JP2004093158A publication Critical patent/JP2004093158A/en
Pending legal-status Critical Current

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Abstract

<P>PROBLEM TO BE SOLVED: To provide a piezoelectric vibration type inertia sensor element in which the mass balance of leg sections is adjusted by applying a mass change to at least one corner section at least at two leg sections of the piezoelectric vibration type inertia sensor element to remove unneeded vibration components, to provide a manufacturing method of the piezoelectric vibration type inertia sensor element for removing, with laser beams, at least one corner section of respective leg sections of the piezoelectric vibration type inertia sensor element simultaneously, and to provide a laser machining apparatus for removing minute sections by simultaneously irradiating the minute section of electronic components with a plurality of laser beams from different angles. <P>SOLUTION: The method is characterized in that, to achieve the purpose, the corner sections of respective leg sections of the piezoelectric vibration type inertia sensor element using a tuning fork type vibrator are removed, the corner sections of respective leg sections in the vibrator are removed with laser beams, and a plurality of laser beams are applied from different angles to remove the minute section. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a piezoelectric vibration type inertial sensor element using a tuning fork type vibrator, a method for manufacturing a piezoelectric vibration type inertial sensor element, and a laser processing apparatus therefor.
[0002]
[Prior art]
In a piezoelectric vibration type inertial sensor element using a tuning fork type vibrator processed by a wet etching method, as shown in FIG. 8, the thickness direction of the piezoelectric vibration type inertial sensor element, that is, the Z-axis direction, due to the etching anisotropy of the quartz crystal. As a result, an asymmetrical etching residue appears, so that two limbs protruding from the base in the Y-axis direction are not symmetrical to each other. Therefore, as shown in FIG. 8, an unnecessary vibration component is not detected in the piezoelectric vibration type inertial sensor element using the tuning fork vibrator due to the asymmetry of the shape of each leg in the thickness direction, that is, the Z axis direction. , Which is output as an unnecessary signal to the detection electrode of the piezoelectric vibration type inertial sensor element as shown in FIG.
[0003]
Due to the asymmetry of the shape of the legs as shown in FIG. 8, an unnecessary vibration component is generated from the detection unit in the piezoelectric vibration type inertial sensor element using the tuning fork type vibrator, and the unnecessary vibration component is generated as an unnecessary signal. In the present invention, in order to prevent the output from being performed, the two legs of the piezoelectric vibration type inertial sensor element are subjected to removal processing on the asymmetrical portions of the legs formed by the etching anisotropy of the quartz crystal. It has been found that by balancing the masses of the legs of the piezoelectric vibration type inertial sensor element, unnecessary signals can be prevented from being output from the detection electrodes.
[0004]
[Problems to be solved by the invention]
However, the distance between the two legs of the piezoelectric vibratory inertial sensor element is very narrow, for example, about 0.5 mm. For this reason, the processing of the two legs of the piezoelectric vibratory inertial sensor element is performed separately. The work of balancing the masses of the legs of the piezoelectric vibration type inertial sensor element is extremely fine work, and there is a problem that a lot of man-hours are required.
[0005]
The reason is that once the two legs of the piezoelectric vibrating inertial sensor element are manually processed into the asymmetrical portions of the legs formed by the anisotropic etching of the quartz crystal, the electrical output is measured. This is because it is necessary to alternately perform the processing and the measurement until an acceptable electrical output is obtained, while repeating the operation of confirming by measurement whether unnecessary vibration components are sufficiently suppressed.
[0006]
In addition, when using a single laser beam to process the two legs of the piezoelectric vibration type inertial sensor element into the asymmetrical parts of the legs formed by the etching anisotropy of the quartz crystal, use one laser beam. When the laser beam is irradiated, the laser beam hits the electric parts on the extension of the minute part to be processed, which is the laser irradiation, and the electric parts other than the object to be processed are damaged by the laser light and the characteristics are changed. There was a problem that would.
[0007]
The present invention has been made in view of the above technical background, and accordingly, the object thereof is to provide at least two legs of a piezoelectric vibration type inertial sensor element at least in order to eliminate unnecessary vibration components. An object of the present invention is to provide a piezoelectric vibrating inertial sensor element in which the balance of the legs is mutually adjusted by removing one corner.
[0008]
Further, the present invention provides a method for manufacturing a piezoelectric vibration type inertial sensor element, wherein at least one corner of each leg of the piezoelectric vibration type inertial sensor element is removed by using a laser beam. The purpose is to:
[0009]
Further, in a laser processing apparatus that removes a minute portion of an electronic component by irradiating a laser beam, the minute portion of the electronic component is irradiated with a plurality of laser lights from different angles to remove the minute portion of the preceding electronic component. An object of the present invention is to provide a laser processing apparatus characterized by the following. Here, a plurality of laser beams is originally a single laser beam optically separated.
[0010]
It is another object of the present invention to provide a laser processing apparatus in which each of the plurality of laser beams has insufficient energy for processing, and processing can be performed in a portion where the plurality of laser beams are simultaneously irradiated.
[0011]
[Means for Solving the Problems]
In order to achieve the above object, the present invention provides a piezoelectric vibrating inertial sensor element using a tuning fork type vibrator having at least two legs protruding from a base parallel to the Y axis. At least one corner of each leg is removed.
[0012]
Further, in the method of manufacturing a piezoelectric vibration type inertial sensor element using a tuning fork type vibrator having at least two legs protruding from a base parallel to the Y axis, at least one of the legs of each of the preceding tuning fork type vibrators is provided. The method is characterized in that corners of a portion are removed by using a laser beam.
[0013]
Further, in a laser processing apparatus which removes a minute portion of an electronic component by irradiating a laser beam, the minute portion of the electronic component is removed by simultaneously irradiating a plurality of laser beams to the aforementioned minute portion from different angles. .
[0014]
Further, the plurality of laser beams applied to the minute portion are formed by optically separating one laser beam.
[0015]
In addition, each of the plurality of laser beams has insufficient energy for processing, and processing can be performed in a portion to which the plurality of laser beams are simultaneously irradiated.
[0016]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, an embodiment of the present invention will be described with reference to the drawings.
Note that the same reference numerals in each drawing indicate the same objects.
[0017]
FIG. 1 is a schematic perspective view of a piezoelectric vibration type inertial sensor element according to the present invention from which corners have been removed. In a piezoelectric vibration type inertial sensor element using a tuning fork type vibrator, as shown in FIG. Two limbs protruding in the Y-axis direction from the base were not symmetrical to each other. Therefore, in a piezoelectric vibration type inertial sensor element using a tuning fork type vibrator due to the asymmetry of the shape of the legs as shown in FIG. There is a problem that an unnecessary signal is output to the detection electrode of the vibrating inertial sensor element.
[0018]
Therefore, as shown in FIGS. 1 and 2, in order to eliminate unnecessary vibration components, at least one partial removal is added to each of the two legs of the piezoelectric vibration type inertial sensor element to balance the mass of each leg. And adjust each other to be a pure vibration mode.
[0019]
Electrodes are formed on the two legs of the piezoelectric vibration type inertial sensor element as shown in FIG. 7, and the electric output of the electrodes is measured and removed to balance the mass of each leg. They are mutually adjusted to be in a pure vibration mode.
[0020]
FIG. 3 is a schematic perspective view of the piezoelectric vibratory inertial sensor element showing the manner in which the corners of the legs of the piezoelectric vibratory inertial sensor element of the present invention are removed using laser light. FIG. 4 is a schematic side view of a piezoelectric vibrating inertial sensor element according to the present invention in which a corner is removed using a laser beam, as viewed from the Y-axis direction. As shown in FIGS. 3 and 4, at least one of the corners of each leg is irradiated with laser light to remove while measuring the electrical output of the electrodes formed on the two legs. .
[0021]
In the embodiment, the example of the two-leg tuning fork vibrator has been described. However, the same effect can be obtained not only for the two legs but also for the case of three or four legs or the case where the legs are not parallel.
[0022]
FIG. 5 is a schematic block circuit diagram of an apparatus for removing the corners of each leg of the tuning fork vibrator of the present invention using laser light. The output of the electrode of the detection system is led to a synchronous detection circuit through a charge amplifier and an operation amplifier. On the other hand, the electrode output of the drive system is led to the above-mentioned synchronous detection circuit through an I / V conversion circuit and a 90 ° phase shifter. On the other hand, the output of the I / V conversion circuit is led to the control circuit, and the amplification of the I / V conversion circuit is controlled by the AGC circuit. After the outputs of both the working amplifier and the 90 ° phase shifter are synchronously detected, they pass through a smoothing circuit and are inverted in phase to become an output A. The output A is input to the CPU as a digital signal through a digital voltmeter, and the CPU controls the multi-beam scanner and the laser irradiation unit. Using the configuration of this block circuit diagram, at least one of the corners of each leg is irradiated with a laser beam, and the necessary removal is performed while measuring the electrical output of the electrodes formed on the two legs. Can be added.
[0023]
FIG. 6 is a schematic view showing the configuration of an apparatus for removing a corner of each leg of a tuning fork vibrator of the present invention by simultaneously using a plurality of laser beams separated from one laser beam. A piezoelectric vibrating inertial sensor element on which a tuning fork vibrator to be removed is mounted is mounted on an XY stage. The XY stage and the laser irradiation unit are controlled by the above-described multi-beam scanner.
[0024]
As shown in FIG. 6, one laser beam emitted from the laser irradiation unit is separated by a half mirror into a plurality of laser beams each having energy that is not enough for processing, and each of them is finely removed through a condenser lens. The parts are irradiated simultaneously. At the same time, a dichroic mirror having a function of reflecting only a specific wavelength and transmitting the other wavelengths is provided in the optical path of the laser light, and a portion to be removed can be monitored by a camera. Since the piezoelectric vibrating inertial sensor element is mounted on the XY stage, it is possible to change the position of the piezoelectric vibrating inertial sensor element and perform laser trimming on a portion to be removed so as to scan with laser light.
[0025]
Similarly, as shown in FIG. 6, one laser beam emitted from the laser irradiator is split into a plurality of laser beams by a half mirror, and irradiates the portions to be minutely removed through condensing lenses at different angles, respectively. Each of the separated laser beams is a laser beam having energy that is not enough to perform processing, so the tuning fork vibrator that performs laser irradiation, which is the object of processing the piezoelectric vibration type inertial sensor element, is removed. Even when the laser beam hits an electrical component on the extension of a minute part, the irradiation energy of each separated laser beam is small enough to damage the laser beam and change its characteristics. Absent.
[0026]
【The invention's effect】
According to the present invention, unnecessary vibration components output from the detection electrodes of the piezoelectric vibration type inertial sensor element can be eliminated.
[0027]
Further, according to the present invention, the man-hour for processing the tuning fork type vibrator of the piezoelectric vibration type inertial sensor element can be significantly reduced, and the yield can be increased.
[0028]
[Brief description of the drawings]
FIG. 1 is a schematic perspective view of a piezoelectric vibrating inertial sensor element with a corner removed according to the present invention.
FIG. 2 is a schematic side view of a piezoelectric vibration type inertial sensor element according to the present invention from which corners have been removed, as viewed from the Y-axis direction.
FIG. 3 is a schematic perspective view of a piezoelectric vibrating inertial sensor element according to the present invention in which a corner portion is removed by using a laser beam.
FIG. 4 is a schematic side view of a piezoelectric vibrating inertial sensor element according to the present invention in which a corner is removed by using a laser beam, as viewed from a Y-axis direction.
FIG. 5 is a schematic block circuit diagram of an apparatus for removing a corner of each leg of a tuning fork vibrator using laser light according to the present invention.
FIG. 6 is a schematic view showing a configuration of an apparatus for removing a corner of each leg of a tuning fork vibrator using a plurality of laser beams obtained by separating one laser beam according to the present invention.
FIG. 7 is a schematic diagram showing an electrode structure of a conventional piezoelectric vibration type inertial sensor element.
FIG. 8 is a schematic side view of a conventional piezoelectric vibration type inertial sensor element viewed from a Y-axis direction.
FIG. 9 is a schematic perspective view of a conventional piezoelectric vibration type inertial sensor element.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Base part 2 Leg part 3 Piezoelectric vibration type inertial sensor element 4 Corner part 5 Laser beam 6 Small part of electronic parts 7 Multiple laser beams

Claims (5)

  1. In a piezoelectric vibration type inertial sensor element using a tuning fork type vibrator having at least two legs protruding from a base parallel to the Y axis,
    A piezoelectric vibratory inertial sensor element wherein a mass balance is adjusted by applying a mass change to at least one corner of each leg of the tuning fork vibrator to eliminate unnecessary vibration components.
  2. In a method of manufacturing a piezoelectric vibration type inertial sensor element using a tuning fork vibrator having at least two legs protruding from a base parallel to a Y axis,
    A method for manufacturing a piezoelectric vibration type inertial sensor element, wherein at least one corner of each leg of the tuning fork vibrator is removed using a laser beam.
  3. In laser processing equipment that removes small parts of electronic components by irradiating laser light,
    A laser processing apparatus, wherein the minute portion of the electronic component is simultaneously irradiated with a plurality of laser beams from different angles to remove the minute portion of the electronic component.
  4. The laser processing apparatus according to claim 3,
    A plurality of laser beams applied to the minute portion are obtained by separating one laser beam.
  5. The laser processing apparatus according to claim 3, wherein each of the plurality of laser beams has insufficient energy for processing, and processing can be performed in a portion irradiated with the plurality of laser beams simultaneously.
JP2002250810A 2002-08-29 2002-08-29 Piezoelectric vibration type inertia sensor element and its manufacturing method, and laser machining apparatus Pending JP2004093158A (en)

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Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005096493A1 (en) * 2004-03-30 2005-10-13 Citizen Watch Co., Ltd. Quartz oscillator manufacturing method and quartz oscillator
WO2007117008A1 (en) 2006-04-12 2007-10-18 Panasonic Corporation Inertial force sensor
JP2008131062A (en) * 2006-11-16 2008-06-05 Nippon Dempa Kogyo Co Ltd Piezoelectric vibrator and manufacturing method thereof, and piezoelectric device
US7637159B2 (en) 2006-03-14 2009-12-29 Citizen Holdings Co., Ltd. Vibration gyro and the process of producing the same
WO2010050967A1 (en) * 2008-10-31 2010-05-06 Hewlett-Packard Development Company, L.P. Compensating frequency mismatch in gyroscopes
US8225663B2 (en) 2008-09-02 2012-07-24 Murata Manufacturing Co., Ltd. Tuning fork-type vibrator, tuning fork-type vibrator manufacturing method, and angular velocity sensor
US20130255379A1 (en) * 2012-03-29 2013-10-03 Seiko Epson Corporation Vibrating element, sensor unit, electronic apparatus, and method for manufacturing vibrating element
JP2013205027A (en) * 2012-03-27 2013-10-07 Tdk Corp Laser trimming method for gyro element

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2005096493A1 (en) * 2004-03-30 2008-02-21 シチズンホールディングス株式会社 Quartz crystal manufacturing method and crystal resonator
JP4658925B2 (en) * 2004-03-30 2011-03-23 シチズンホールディングス株式会社 Manufacturing method of crystal unit
US7394326B2 (en) 2004-03-30 2008-07-01 Citizen Holdings Co., Ltd. Quartz oscillator manufacturing method and quartz oscillator
WO2005096493A1 (en) * 2004-03-30 2005-10-13 Citizen Watch Co., Ltd. Quartz oscillator manufacturing method and quartz oscillator
US7637159B2 (en) 2006-03-14 2009-12-29 Citizen Holdings Co., Ltd. Vibration gyro and the process of producing the same
JP2007279001A (en) * 2006-04-12 2007-10-25 Matsushita Electric Ind Co Ltd Inertial force sensor
US8590403B2 (en) 2006-04-12 2013-11-26 Panasonic Corporation Inertial force sensor
WO2007117008A1 (en) 2006-04-12 2007-10-18 Panasonic Corporation Inertial force sensor
US8215190B2 (en) 2006-04-12 2012-07-10 Panasonic Corporation Inertial force sensor
JP2008131062A (en) * 2006-11-16 2008-06-05 Nippon Dempa Kogyo Co Ltd Piezoelectric vibrator and manufacturing method thereof, and piezoelectric device
US8225663B2 (en) 2008-09-02 2012-07-24 Murata Manufacturing Co., Ltd. Tuning fork-type vibrator, tuning fork-type vibrator manufacturing method, and angular velocity sensor
WO2010050967A1 (en) * 2008-10-31 2010-05-06 Hewlett-Packard Development Company, L.P. Compensating frequency mismatch in gyroscopes
US8733171B2 (en) 2008-10-31 2014-05-27 Hewlett-Packard Development Company, L.P. Compensating frequency mismatch in gyroscopes
JP2013205027A (en) * 2012-03-27 2013-10-07 Tdk Corp Laser trimming method for gyro element
US20130255379A1 (en) * 2012-03-29 2013-10-03 Seiko Epson Corporation Vibrating element, sensor unit, electronic apparatus, and method for manufacturing vibrating element
US9696156B2 (en) * 2012-03-29 2017-07-04 Seiko Epson Corporation Vibrating element, sensor unit, electronic apparatus, and method for manufacturing vibrating element

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