JP2004087545A - Spool for gold bonding wire - Google Patents

Spool for gold bonding wire Download PDF

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JP2004087545A
JP2004087545A JP2002242929A JP2002242929A JP2004087545A JP 2004087545 A JP2004087545 A JP 2004087545A JP 2002242929 A JP2002242929 A JP 2002242929A JP 2002242929 A JP2002242929 A JP 2002242929A JP 2004087545 A JP2004087545 A JP 2004087545A
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Prior art keywords
spool
wire
gold bonding
bonding wire
product
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Takayuki Ueda
上田　登侑
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Nippon Micrometal Corp
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Nippon Micrometal Corp
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    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/4501—Shape
    • H01L2224/45012—Cross-sectional shape
    • H01L2224/45015—Cross-sectional shape being circular
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/786—Means for supplying the connector to be connected in the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01088—Radium [Ra]

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To decrease flaws that a gold bonding wire has when the wire is manufactured. <P>SOLUTION: The roughness Ra of the body surface of a spool for the gold bonding wire is ≤0.2 μm and the hardness of the drum surface of the spool is ≥Hv450. The roughness Ra of the drum surface of the spool for the gold bonding wire is ≤0.2 μm and the hardness is ≥Hv450. The spool is made of aluminum as its raw material and the drum surface is alumite-treated. An alumina oxide coating on the drum surface is ≥20 μm. <P>COPYRIGHT: (C)2004,JPO

Description

【０００１】
【発明の属する技術分野】
本発明は、金ボンディングワイヤ製造時にワイヤ巻き取りに用いられる金ボンディングワイヤ用スプールに関するものである。
【０００２】
【従来の技術】
半導体の内部配線に用いられる金ボンディングワイヤは、金インゴットを伸線加工し、焼鈍を行い、最終的に製品スプールに巻き取られて出荷製品となる。伸線加工は一次伸線後に二次伸線を行う。一次伸線後のワイヤはいったん作業用スプールに巻き取られ、その後二次伸線（最終伸線）に供される。二次伸線においては、図１に示すとおり、ワイヤ１がキャプスタン（２Ｒ、２Ｌ）を周回しつつダイス（３ａ〜３ｅ）を通過することで伸線がなされ、最終的に作業用スプール４に巻き取られる。さらにこの作業用スプールから巻き戻されつつ連続的に焼鈍を行い、また別の作業用スプールに巻き取られる。最後に、作業用スプールから巻き戻されて製品スプールに巻き取られる。ここで用いられる作業用スプール及び製品スプールを、ここでは金ボンディングワイヤ用スプールとよぶ。
【０００３】
一次伸線終了後に作業用スプールに巻き取られ、二次伸線のために巻き戻られる際にワイヤにキズが付くと、二次伸線時のキズの原因となる。また、二次伸線終了後から製品スプールに巻き取るまでの間にワイヤにキズが付くと、製品欠陥となり、この金ボンディングワイヤを用いて半導体配線のボンディングを行う際の作業トラブルの原因となる。そのため、金ボンディングワイヤの製造時において、作業用スプールへの巻き取り、作業用スプールからの巻き戻し時に、ワイヤ表面のキズ発生を極力低減することが重要である。
【０００４】
金ボンディングワイヤ製造時の作業用スプールは、アルミニウムを素材として製造され、その表面を膜厚数μｍの酸化膜を形成するアルマイト処理がなされ、染色工程で色を付け、封孔処理によって被膜を溶かし、染料を封じ込めることによって製造される。これらの従来工程によって製造されたスプールは、胴表面の粗度がＲａで１．６μｍ程度、硬度はＨｖ３５０程度であった。
【０００５】
【発明が解決しようとする課題】
金ボンディングワイヤの製造において、最終製品を検査する過程においてワイヤのキズが発見される頻度をより一層低減することが求められている。本発明は、金ボンディングワイヤに発生するキズを低減することを目的とする。
【０００６】
【課題を解決するための手段】
即ち、本発明の要旨とするところは以下のとおりである。
（１）スプールの胴表面の粗度Ｒａが０．２μｍ以下であることを特徴とする金ボンディングワイヤ用スプール。
（２）スプールの胴表面の硬度がＨｖ４５０以上であることを特徴とする金ボンディングワイヤ用スプール。
（３）スプールの胴表面の粗度Ｒａが０．２μｍ以下であり、硬度がＨｖ４５０以上であることを特徴とする金ボンディングワイヤ用スプール。
（４）前記スプールはアルミニウムを素材とし、胴表面がアルマイト処理されてなることを特徴とする上記（１）乃至（３）のいずれかに記載の金ボンディングワイヤ用スプール。
（５）胴表面のアルミナ酸化物被膜厚さが２０μｍ以上であることを特徴とする上記（４）に記載の金ボンディングワイヤ用スプール。
【０００７】
【発明の実施の形態】
製品径が２５μｍの金ボンディングワイヤの製造においては、ワイヤ長さ２００００ｍ程度を１ロットとし、作業用スプールに巻き取られる。作業用スプールに巻かれたワイヤを巻き戻して最終的に製品スプールにワイヤを巻き取る。製品スプールには２０００ｍ程度の長さのワイヤが巻き取られるので、１ロットの作業用スプールから１０巻程度の製品が製造されることとなる。この１ロットのワイヤについて製品キズの発生状況を調査したところ、製品スプールに巻き取った製品のうち必ず最終製品（作業用スプールの胴表面に直接接して巻き取られた１巻き目の部分）に集中して発生していることが判明した。この事実から、金ボンディングワイヤ製品の表面に発生するキズは、作業用スプールに巻き取られたワイヤを巻き戻す際において、１巻き目のワイヤが作業用スプール胴面への巻取り時あるいは胴面からくり出されるときに胴面のキズ等に接触して発生するものと推定された。
【０００８】
別のキズ発生調査結果によると、作業用スプールの胴径が大きいとキズ発生が多い傾向を示した。また、作業用スプールの胴表面が痛んでいるものにキズ発生が多い傾向を示した。これらの事実からも、金ボンディングワイヤ製品の表面に発生するキズは、１巻き目のワイヤが作業用スプール胴面への巻取り時あるいは胴面からくり出されるときに胴面のキズ等に接触して発生するものとの推定が裏付けられる。
【０００９】
以上の知見に基づき、図２に示す金ボンディングワイヤ用スプール５の胴表面６の粗さと硬度を種々に変更してワイヤ１表面のキズ発生状況を調査したところ、スプール５の胴表面６の粗度Ｒａが０．２μｍ以下であり、硬度がＨｖ４５０以上である場合にワイヤ表面のキズ発生が減少することが明らかになった。胴表面６の粗度Ｒａを０．２μｍ以下とすることによって胴表面６を滑らかにし、さらに胴表面６の硬度をＨｖ４５０以上と硬くすることによって胴表面６におけるキズの発生が起きづらくなり、その結果として金ボンディングワイヤ用スプール５に巻き取られたワイヤ１表面へのキズ発生が防止できたものと推定される。ここにおいて、Ｒａは中心線平均粗さ、Ｈｖはビッカース硬度を意味する。スプールの胴表面６の粗度Ｒａは０．１５μｍ以下であるとより好ましい。また、スプールの胴表面６の硬度はＨｖ４８０以上であるとより好ましい。
【００１０】
前述のごとく、金ボンディングワイヤ用スプールは素材をアルミニウムとして製造され、表面にアルマイト処理が施される。従来のアルマイト処理においては酸化膜厚が数μｍであったが、本発明においては、酸化膜厚を２０μｍ以上とすることにより、胴表面の硬度をＨｖ４５０以上とすることができる。また、胴表面の切削に当たり、切削マークの残らない切削工具を使用することにより、胴表面の粗度Ｒａを０．２μｍ以下とすることができる。最終仕上げを切削ではなく研削とすることによっても、表面粗度Ｒａを０．２μｍ以下とすることもできる。
【００１１】
以上のとおり、本発明の金ボンディングワイヤ用スプールは、金ボンディングワイヤ製造時の作業用スプールとして使用したときに効果を発揮することはもちろん、金ボンディングワイヤの製品スプールとして使用したときにも同様に効果を発揮することができる。
【００１２】
【実施例】
製品線径２５μｍの金ボンディングワイヤの製造に際し、作業用スプールとして本発明の金ボンディングワイヤ用スプールを用いた。最終仕上伸線が完了した金ボンディングワイヤは、長さ２００００ｍ単位で作業用スプールに巻き取られる。この作業用スプールに巻かれた金ボンディングワイヤを巻き戻し、製品スプールに長さ２０００ｍづつ巻き取られて製品としての金ボンディングワイヤが完成する。１巻の作業用スプールに巻かれたワイヤから、１０巻の製品スプールに巻かれたワイヤが製造できる。
【００１３】
製品スプールに巻かれた金ボンディングワイヤを１巻づつ実体顕微鏡を用いてワイヤの外観検査を行い、製品スプール単位でワイヤのキズ有無を確認し、キズの発生した製品スプール数を検査したスプール数で除した値を％表示したのがキズ発生率である。
【００１４】
【表１】

Figure 2004087545
【００１５】
表１に示す実施例のうち、比較例Ｎｏ．４、５については、作業用スプールの胴表面粗度Ｒａが１．６μｍ、胴表面の硬度がＨｖ３５０であった。それに対し、本発明例Ｎｏ．１〜３は、胴表面粗度Ｒａを０．２μｍ（Ｎｏ．２、３）とし、あるいは、胴表面の硬度をＨｖ４８０（Ｎｏ．１、３）と改良したものである。
【００１６】
本発明例、比較例とも、ワイヤにキズが発生していたのは、作業用スプールの最も下層に巻かれたワイヤ部分、即ち１０巻の製品スプールのうちの最終巻に巻かれたワイヤに発生していた。そして、全体としての製品スプール単位でのキズ発生率は、比較例４、５が０．３〜０．５％であったのに対し、本発明例Ｎｏ．１、２は０．１％、表面粗度と表面硬度の両方を改善したＮｏ．３に至ってはキズ発生が皆無であった。
【００１７】
【発明の効果】
金ボンディングワイヤ製造時にワイヤ巻き取りに用いられる金ボンディングワイヤ用スプールにおいて、スプールの胴表面の粗度Ｒａを０．２μｍ以下とし、及び／又は硬度をＨｖ４５０以上とすることにより、最終製品の金ボンディングワイヤにおけるキズ発生率を大幅に低減することが可能になる。
【図面の簡単な説明】
【図１】金ボンディングワイヤの二次伸線実施状況を示す図である。
【図２】金ボンディングワイヤ用スプールを示す斜視図である。
【符号の説明】
１　ワイヤ
２　キャプスタン
３　ダイス
４　作業用スプール
５　金ボンディングワイヤ用スプール
６　胴表面[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a gold bonding wire spool used for winding a wire when manufacturing a gold bonding wire.
[0002]
[Prior art]
A gold bonding wire used for semiconductor internal wiring is obtained by drawing a gold ingot, performing annealing, and finally being wound on a product spool to become a shipped product. For wire drawing, secondary wire drawing is performed after primary wire drawing. The wire after the primary wire drawing is once wound on a working spool and then used for secondary wire drawing (final wire drawing). In the secondary wire drawing, as shown in FIG. 1, the wire 1 is drawn by passing through the dies (3a to 3e) while circling the capstan (2R, 2L), and finally the working spool 4 Rolled up. Furthermore, annealing is continuously performed while being rewound from the work spool, and the work spool is wound around another work spool. Finally, it is unwound from the working spool and wound onto the product spool. The working spool and product spool used here are referred to herein as gold bonding wire spools.
[0003]
If the wire is scratched when it is wound on the working spool after the completion of the primary wire drawing and rewinded for the secondary wire drawing, it causes a scratch at the time of the secondary wire drawing. In addition, if the wire is scratched between the end of secondary wire drawing and winding on the product spool, it becomes a product defect and causes work trouble when bonding semiconductor wiring using this gold bonding wire. . For this reason, when manufacturing a gold bonding wire, it is important to reduce the occurrence of scratches on the wire surface as much as possible when winding onto the working spool and when rewinding from the working spool.
[0004]
The working spools used in the production of gold bonding wires are manufactured from aluminum, and the surface is anodized to form an oxide film with a thickness of several μm, colored in the dyeing process, and melted by sealing. Manufactured by containing the dye. The spool manufactured by these conventional processes had a surface roughness of Ra of about 1.6 μm and a hardness of about Hv350.
[0005]
[Problems to be solved by the invention]
In the manufacture of gold bonding wires, there is a need to further reduce the frequency with which wire flaws are found in the process of inspecting the final product. An object of the present invention is to reduce scratches generated in a gold bonding wire.
[0006]
[Means for Solving the Problems]
That is, the gist of the present invention is as follows.
(1) A spool for gold bonding wire, wherein the roughness Ra of the body surface of the spool is 0.2 μm or less.
(2) The spool for the gold bonding wire is characterized in that the hardness of the body surface of the spool is Hv450 or more.
(3) A spool for gold bonding wire, wherein the roughness Ra of the body surface of the spool is 0.2 μm or less and the hardness is Hv450 or more.
(4) The spool for gold bonding wires according to any one of (1) to (3) above, wherein the spool is made of aluminum and the body surface is anodized.
(5) The spool for gold bonding wires according to (4) above, wherein the film thickness of the alumina oxide on the cylinder surface is 20 μm or more.
[0007]
DETAILED DESCRIPTION OF THE INVENTION
In the production of a gold bonding wire having a product diameter of 25 μm, a wire length of about 20000 m is taken as one lot and wound on a working spool. The wire wound on the working spool is rewound and finally the wire is wound on the product spool. Since a wire having a length of about 2000 m is wound on the product spool, a product of about 10 turns is manufactured from one lot of working spool. As a result of investigating the occurrence of product scratches on this one lot of wire, the product wound on the product spool must be the final product (the first roll wound directly in contact with the cylinder surface of the working spool). It turned out to be concentrated. From this fact, the scratches generated on the surface of the gold bonding wire product are such that when the wire wound on the work spool is rewound, the first wire is wound on the work spool body surface or the body surface. It was presumed that it was generated by touching the surface of the body surface when it was pulled out.
[0008]
According to another flaw occurrence investigation result, there was a tendency for flaws to occur when the cylinder diameter of the working spool was large. In addition, there was a tendency for many scratches to occur on the surface of the work spool that was damaged. From these facts as well, scratches generated on the surface of the gold bonding wire product come into contact with the scratches on the body surface when the first wire is wound on the surface of the work spool body or pulled out from the body surface. This is supported by the assumption that it will occur.
[0009]
Based on the above knowledge, the roughness and hardness of the barrel surface 6 of the gold bonding wire spool 5 shown in FIG. It has been clarified that when the degree Ra is 0.2 μm or less and the hardness is Hv450 or more, generation of scratches on the wire surface is reduced. By making the roughness Ra of the body surface 6 0.2 μm or less, the body surface 6 is made smooth, and by further increasing the hardness of the body surface 6 to be Hv450 or more, it becomes difficult for scratches to occur on the body surface 6. As a result, it is estimated that scratches on the surface of the wire 1 wound around the gold bonding wire spool 5 could be prevented. Here, Ra means center line average roughness, and Hv means Vickers hardness. The roughness Ra of the spool body surface 6 is more preferably 0.15 μm or less. Further, the hardness of the trunk surface 6 of the spool is more preferably Hv480 or higher.
[0010]
As described above, the gold bonding wire spool is manufactured using aluminum as the material and anodized on the surface. In the conventional alumite treatment, the oxide film thickness is several μm. However, in the present invention, the hardness of the cylinder surface can be set to Hv450 or more by setting the oxide film thickness to 20 μm or more. Further, when cutting the cylinder surface, the roughness Ra of the cylinder surface can be set to 0.2 μm or less by using a cutting tool in which no cutting mark remains. The surface roughness Ra can be set to 0.2 μm or less also by grinding the final finish instead of cutting.
[0011]
As described above, the gold bonding wire spool of the present invention is not only effective when used as a working spool when manufacturing gold bonding wires, but also when used as a product spool of gold bonding wires. The effect can be demonstrated.
[0012]
【Example】
When manufacturing a gold bonding wire having a product wire diameter of 25 μm, the gold bonding wire spool of the present invention was used as a working spool. The gold bonding wire that has been subjected to the final finish drawing is wound on a working spool in units of 20000 m. The gold bonding wire wound around the working spool is rewound and wound up by a length of 2000 m on the product spool to complete a gold bonding wire as a product. A wire wound on 10 product spools can be produced from a wire wound on one work spool.
[0013]
Using a stereomicroscope, the wire bonding wire wound around the product spool is inspected using a stereomicroscope, the wire spool is checked for product spools, and the number of product spools with scratches is inspected. The value obtained by dividing the value is displayed as a percentage of scratches.
[0014]
[Table 1]
Figure 2004087545
[0015]
Among the examples shown in Table 1, Comparative Example No. Regarding Nos. 4 and 5, the cylinder surface roughness Ra of the working spool was 1.6 μm, and the cylinder surface hardness was Hv350. On the other hand, the present invention example No. Nos. 1 to 3 are those in which the cylinder surface roughness Ra is 0.2 μm (No. 2, 3), or the hardness of the cylinder surface is improved to Hv 480 (No. 1, 3).
[0016]
In both the inventive example and the comparative example, the flaw was generated in the wire portion wound in the lowermost layer of the working spool, that is, in the wire wound in the final winding of the ten product spools. Was. And as for the flaw occurrence rate in the product spool unit as a whole, Comparative Examples 4 and 5 were 0.3 to 0.5%, whereas Example No. of the present invention. Nos. 1 and 2 were 0.1% and No. 1 improved both surface roughness and surface hardness. No. 3 was found to be scratched.
[0017]
【The invention's effect】
In a gold bonding wire spool used for winding a gold bonding wire, the roughness Ra of the spool body surface is set to 0.2 μm or less and / or the hardness is set to Hv 450 or more, whereby gold bonding of the final product is performed. It becomes possible to greatly reduce the rate of occurrence of scratches on the wire.
[Brief description of the drawings]
BRIEF DESCRIPTION OF DRAWINGS FIG. 1 is a diagram showing a state of secondary drawing of a gold bonding wire.
FIG. 2 is a perspective view showing a gold bonding wire spool.
[Explanation of symbols]
1 Wire 2 Capstan 3 Die 4 Work Spool 5 Gold Bonding Wire Spool 6 Body Surface

Claims (5)

スプールの胴表面の粗度Ｒａが０．２μｍ以下であることを特徴とする金ボンディングワイヤ用スプール。A spool for gold bonding wire, wherein the roughness Ra of the body surface of the spool is 0.2 μm or less. スプールの胴表面の硬度がＨｖ４５０以上であることを特徴とする金ボンディングワイヤ用スプール。A spool for a gold bonding wire, characterized in that the hardness of the body surface of the spool is Hv450 or more. スプールの胴表面の粗度Ｒａが０．２μｍ以下であり、硬度がＨｖ４５０以上であることを特徴とする金ボンディングワイヤ用スプール。A spool for gold bonding wire, wherein the roughness Ra of the body surface of the spool is 0.2 μm or less and the hardness is Hv450 or more. 前記スプールはアルミニウムを素材とし、胴表面がアルマイト処理されてなることを特徴とする請求項１乃至３のいずれかに記載の金ボンディングワイヤ用スプール。The gold bonding wire spool according to any one of claims 1 to 3, wherein the spool is made of aluminum and has a body surface anodized. 胴表面のアルミナ酸化物被膜厚さが２０μｍ以上であることを特徴とする請求項４に記載の金ボンディングワイヤ用スプール。The spool for gold bonding wires according to claim 4, wherein the film thickness of the alumina oxide on the cylinder surface is 20 µm or more.
JP2002242929A 2002-08-23 2002-08-23 Spool for gold bonding wire Withdrawn JP2004087545A (en)

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Country Status (1)

Country Link
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2039641A3 (en) * 2007-09-18 2009-10-14 W.C. Heraeus GmbH Spool winded with a gold alloy wire used for a bonding process

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2039641A3 (en) * 2007-09-18 2009-10-14 W.C. Heraeus GmbH Spool winded with a gold alloy wire used for a bonding process
US7766212B2 (en) 2007-09-18 2010-08-03 W.C. Heraeus Gmbh Spool wound with a gold alloy wire used for a bonding process

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