JP2004079916A5 - - Google Patents
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- JP2004079916A5 JP2004079916A5 JP2002241140A JP2002241140A JP2004079916A5 JP 2004079916 A5 JP2004079916 A5 JP 2004079916A5 JP 2002241140 A JP2002241140 A JP 2002241140A JP 2002241140 A JP2002241140 A JP 2002241140A JP 2004079916 A5 JP2004079916 A5 JP 2004079916A5
- Authority
- JP
- Japan
- Prior art keywords
- mass
- monomer
- acid ester
- methacrylic acid
- multilayer structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Description
本発明で使用する多層構造重合体粒子における層（ＩＩ）は、メタクリル酸エステル４０〜１００質量％、好ましくは６０〜９９質量％、さらに好ましくは８０〜９９質量％、及びそれと共重合可能な他の単量体６０〜０質量％、好ましくは４０〜１質量％、さらに好ましくは２０〜１質量％からなる単量体（ii）の重合によって形成される熱可塑性を有する重合体層である。メタクリル酸エステルの量が４０質量％未満であると多層構造重合体粒子の成形性が不十分となる。 Layer (II) in the multilayer structure polymer particles used in the present invention is 40 to 100% by mass, preferably 60 to 99% by mass, more preferably 80 to 99% by mass of methacrylic acid ester, and others copolymerizable therewith The polymer layer having thermoplasticity formed by polymerization of the monomer (ii) consisting of 60 to 0% by mass, preferably 40 to 1% by mass, and more preferably 20 to 1% by mass of the monomer When the amount of methacrylic acid ester is less than 40% by mass, the moldability of the multilayer structure polymer particles becomes insufficient.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002241140A JP2004079916A (en) | 2002-08-21 | 2002-08-21 | Adhesive sheet for semiconductor wafer dicing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002241140A JP2004079916A (en) | 2002-08-21 | 2002-08-21 | Adhesive sheet for semiconductor wafer dicing |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2004079916A JP2004079916A (en) | 2004-03-11 |
| JP2004079916A5 true JP2004079916A5 (en) | 2005-04-28 |
Family
ID=32023727
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002241140A Pending JP2004079916A (en) | 2002-08-21 | 2002-08-21 | Adhesive sheet for semiconductor wafer dicing |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2004079916A (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4643134B2 (en) * | 2003-09-10 | 2011-03-02 | グンゼ株式会社 | Substrate film for dicing sheet |
| JP4524497B2 (en) * | 2005-05-24 | 2010-08-18 | グンゼ株式会社 | Substrate film for dicing |
| JP2008004679A (en) * | 2006-06-21 | 2008-01-10 | Gunze Ltd | Substrate film for dicing |
| JP4993446B2 (en) * | 2006-09-08 | 2012-08-08 | 日東電工株式会社 | Wafer holding adhesive sheet |
| JP2012094834A (en) * | 2010-09-13 | 2012-05-17 | Sumitomo Bakelite Co Ltd | Dicing film |
-
2002
- 2002-08-21 JP JP2002241140A patent/JP2004079916A/en active Pending
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