JP2004079248A - Plasma display panel and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a plasma display panel having high light transmittance and high withstand voltage. <P>SOLUTION: A front plate 1 is provided with a front substrate 11, a display electrode 12 disposed on the front substrate 11, lower dielectric glass layers 14a disposed on the display electrode 12, and at least one layer of upper dielectric glass layers 14b disposed on the lower dielectric glass layers 14a, and the dielectric constant of a glass material contained in the upper dielectric glass layers 14b is lower than the dielectric constant of a glass material contained in the lower dielectric glass layers 14b. This front plate 1 and a back plate 2 are disposed face to face to form this plasma display panel. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a plasma display panel and a method for manufacturing the same.
[0002]
[Prior art]
In recent years, expectations for large-screen high-quality televisions have increased. CRTs (cathode-ray tubes) conventionally used are superior to plasma displays and liquid crystal displays in terms of resolution and image quality, but are not suitable for large screens of 40 inches or more in terms of depth and weight. Not suitable. In addition, the liquid crystal display has excellent performance such as low power consumption and low driving voltage, but has a limitation in a large screen and a viewing angle. On the other hand, the plasma display can realize a large screen and a small depth, and a 60-inch class product has already been developed.
[0003]
FIG. 5 is a perspective view showing a configuration of a conventional AC (AC) plasma display panel. In order to clearly show the structure of the plasma display panel, FIG. 5 shows the front panel and the rear panel of the plasma display panel separately (in a state where they are not integrated).
[0004]
In FIG. 5, 101 is a front plate, and 102 is a back plate. The front plate 101 is provided with a display electrode 1012 and a black stripe 1013 on a front substrate 1011, further provided with a dielectric glass layer 1014 covering the display electrode 1012 and the black stripe 1013, and further provided with a dielectric protection layer 1015. It is configured. The front substrate 1011 is made of sodium borosilicate glass or lead glass produced by a float method. The display electrode 1012 is a strip-shaped electrode made of an Ag film or a laminated film of Cr—Cu—Cr. The dielectric glass layer 1014 is formed using glass powder having an average particle size of 0.1 μm to 20 μm, and functions as a dielectric layer of a capacitor. The dielectric protection layer 1015 is formed of MgO. On the other hand, on the back plate 102, a plurality of address electrodes 1022 are provided on a back substrate 1021, a dielectric glass layer 1023 covering the address electrodes 1022 is further provided, and a partition 1024 and a phosphor layer 1025 are further provided thereon. Have been. The back substrate 1021 is a substrate made of glass like the front substrate 1011. The address electrode 1022 is a strip-shaped electrode orthogonal to the display electrode 1012 of the front panel 101, and is an electrode made of a laminated film of indium tin oxide (ITO) and an Ag film or Cr—Cu—Cr. The partition 1024 separates each of the address electrodes 1022 provided in a belt shape to form a discharge space. That is, the space between the partitions is a discharge space in which the discharge gas is sealed. The phosphor layer 1025 is provided from above the address electrode 1022 to the side surface of the partition 1024. The phosphor layer 1025 includes three color phosphor layers 1025a, 1025b, and 1025c formed of materials corresponding to red (R), green (G), and blue (B) in order to enable color display. They are arranged in order with the partition wall 1024 interposed therebetween.
[0005]
In such a plasma display panel, the dielectric glass layer 1014 provided on the front plate 101 is required to have high withstand voltage and high light transmittance. The characteristics of the dielectric withstand voltage and the light transmittance of the dielectric glass layer 1014 largely depend on the surface state, film defects, and residual bubbles of the dielectric glass layer 1014.
[0006]
Conventionally, a method for forming such a dielectric glass layer 1014 includes a glass powder, a solvent, a resin that functions as a binder (hereinafter, referred to as a binder resin), a plasticizer, a dispersant, and the like. A method is known in which the paste is applied to the display electrode 1012 of the front plate 101 by using a screen printing method, a spray method, a blade coater method, or a die coating method, and then dried and fired.
[0007]
[Problems to be solved by the invention]
However, in the conventional method and material for forming the dielectric glass layer 1014 covering the display electrode 1012, many bubbles remain in the film, causing a problem such as dielectric breakdown occurring in the dielectric glass layer 1014, resulting in high insulation. It was difficult to form a dielectric glass layer 1014 having a withstand voltage.
[0008]
[Means for Solving the Problems]
The plasma display panel according to the present invention includes: a front substrate; a display electrode disposed on the front substrate; a lower dielectric glass layer including a first glass material disposed on the display electrode; At least one upper dielectric glass layer including a second glass material disposed on the body glass layer, wherein a dielectric constant of the second glass material is a dielectric constant of the first glass material. Lower than
[0009]
According to the method of manufacturing a plasma display panel of the present invention, a lower dielectric glass layer forming film is formed on a front substrate provided with a display electrode using a first glass forming paint including a first glass material. A first step of drying and baking the film for forming a lower dielectric glass layer to form a lower dielectric glass layer, and a second step having a lower dielectric constant than the first glass material. An upper dielectric glass layer forming film is formed using a second glass forming paint containing a glass material, and then the upper dielectric glass layer forming film is dried and fired to form an upper dielectric glass layer. And a second step of forming a layer.
[0010]
BEST MODE FOR CARRYING OUT THE INVENTION
The plasma display panel according to the present invention includes: a front substrate; a display electrode disposed on the front substrate; a lower dielectric glass layer including a first glass material disposed on the display electrode; At least one upper dielectric glass layer including a second glass material disposed on the body glass layer, wherein a dielectric constant of the second glass material is a dielectric constant of the first glass material. Lower than In this plasma display panel, the dielectric glass layer is composed of a plurality of layers (lower dielectric glass layer, upper dielectric glass layer) formed of glass materials having mutually different characteristics. Thereby, defects (for example, pinholes, giant air bubbles, inclusion of foreign matter, etc.) generated in the lower dielectric glass layer disposed immediately above the display electrode can be compensated for by the upper dielectric glass layer. Further, since the second glass material included in the upper dielectric glass layer has a lower dielectric constant than the first glass material included in the lower dielectric glass layer, the withstand voltage between the display electrodes and between the display electrode and the address electrodes is reduced. Can be reduced. For the above reasons, according to the configuration of the present invention, it is possible to provide a plasma display panel with high insulation withstand voltage while suppressing the occurrence of dielectric breakdown.
[0011]
In the plasma display panel of the present invention, it is preferable that the upper dielectric glass layer has a higher light transmittance than the lower dielectric glass layer. Preferably, the thickness of the upper dielectric glass layer is at least twice the thickness of the lower dielectric glass layer. This is for suppressing the deterioration of the optical characteristics due to the multilayer structure of the dielectric glass layer.
[0012]
In the plasma display panel of the present invention, it is preferable that the second glass material is a lead-based glass containing BaO. The lead-based glass in the present invention is a glass that always contains lead as a constituent element. When a lead-based glass containing BaO is used, the bubble removal property at the time of firing is good, and thus the optical characteristics are improved. Therefore, by using such a glass material for the upper dielectric glass layer, it is possible to suppress a decrease in optical characteristics due to the multilayer dielectric glass layer. Also, in the case of lead-based glass, the dielectric constant tends to increase when the softening point is lowered. However, the softening point can be lowered by containing BaO while suppressing the increase in the dielectric constant. Therefore, the firing temperature of the upper dielectric glass layer can be lower than the firing temperature of the lower dielectric glass layer. Further, in the plasma display panel of the present invention, it is more preferable that the lead glass contains BaO in an amount of 15% by weight or more. Strictly speaking, the weight percentage of BaO is a value obtained by converting an oxide of an element into a stoichiometric oxide.
[0013]
In the plasma display panel of the present invention, the display electrode may be formed of an Ag film or a Cr—Cu—Cr laminated film.
[0014]
According to the method of manufacturing a plasma display panel of the present invention, a lower dielectric glass layer forming film is formed on a front substrate provided with a display electrode using a first glass forming paint including a first glass material. A first step of drying and baking the film for forming a lower dielectric glass layer to form a lower dielectric glass layer, and a second step having a lower dielectric constant than the first glass material. An upper dielectric glass layer forming film is formed using a second glass forming paint containing a glass material, and then the upper dielectric glass layer forming film is dried and fired to form an upper dielectric glass layer. And a second step of forming a layer. According to this method, a plasma display panel having a high withstand voltage can be manufactured.
[0015]
In the method for manufacturing a plasma display panel according to the present invention, it is preferable that the firing temperature in the second step is lower than the firing temperature in the first step by 10 ° C. or more. This is because the upper dielectric glass layer is formed without affecting the lower dielectric glass layer (without causing discoloration or the like of the lower dielectric glass layer).
[0016]
In the method of manufacturing a plasma display panel according to the present invention, it is preferable that the first glass forming paint and the second glass forming paint further include a solvent and a binder resin. This is because the lower dielectric glass layer and the upper dielectric glass layer can be formed by a screen printing method, a spray method, a blade coater method, a die coating method, or the like.
[0017]
Hereinafter, an embodiment of the present invention will be described with reference to the drawings.
[0018]
FIG. 1 is a perspective view showing a configuration of an AC type plasma display panel according to an embodiment of the present invention. In order to clearly show the configuration of the plasma display panel, FIG. 1 shows the front panel and the rear panel of the plasma display panel separately (without being integrated).
[0019]
In FIG. 1, 1 is a front plate, and 2 is a back plate. The front plate 1 is provided with a display electrode 12 and a black stripe 13 on a front substrate 11, and further provided with a lower dielectric glass layer 14 a covering the display electrode 12 and the black stripe 13. An upper dielectric glass layer 14b is further provided on the lower dielectric glass layer 14a. Further, a dielectric protection layer 15 is provided. The front substrate 11 is made of sodium borosilicate glass or lead glass manufactured by a float method. The display electrode 12 is a strip-shaped electrode made of an Ag film or a laminated film of Cr—Cu—Cr. The lower dielectric glass layer 14a and the upper dielectric glass layer 14b are layers formed using a glass material, and function as dielectric layers of the capacitor. The dielectric protection layer 15 is formed of an oxide such as MgO.
[0020]
On the other hand, the back plate 2 has a plurality of address electrodes 22 provided on a back substrate 21, a dielectric glass layer 23 covering the address electrodes 22, and a partition 24 and a phosphor layer 25 provided thereon. Have been. The rear substrate 21 is a substrate made of glass, like the front substrate 11. The address electrode 22 is a strip-shaped electrode orthogonal to the display electrode 12 of the front panel 1, and is an electrode made of a laminated film of ITO and an Ag film or Cr—Cu—Cr. The partition wall 24 forms a discharge space by isolating each address electrode 22 provided in a strip shape. That is, the space between the partitions is a discharge space in which the discharge gas is sealed. The phosphor layer 25 is provided from above the address electrode 22 to the side surface of the partition wall 24. The phosphor layer 25 includes three color phosphor layers 25a, 25b, and 25c formed of materials corresponding to red (R), green (G), and blue (B) in order to enable color display. They are arranged in order with the partition wall 24 interposed therebetween.
[0021]
In such a plasma display panel, it is required that the dielectric glass layers (the lower dielectric glass layer 14a and the upper dielectric glass layer 14b) provided on the front panel 1 have high withstand voltage and high light transmittance. Is done. Therefore, in the present embodiment, the upper dielectric glass layer 14b is made of a glass material (second glass material) having a lower dielectric constant than the glass material (first glass material) used for the lower dielectric glass layer 14a. ). In this case, it is preferable that the difference in the dielectric constant between the lower dielectric glass layer 14a and the upper dielectric glass layer 14b is 1 or more. Accordingly, the withstand voltage load between the display electrodes 12 and between the display electrode 12 and the address electrodes 22 can be reduced, and the withstand voltage can be improved.
[0022]
The light transmittance of the upper dielectric glass layer 14b is preferably higher than the light transmittance of the lower dielectric glass layer 14a. More preferably, the light transmittance of the upper dielectric glass layer 14b is set to be lower than that of the lower dielectric glass layer 14a. Is set to be 10% or more higher than the light transmittance. Lead-based glass containing BaO is used as the second glass material so that the light transmittance of the upper dielectric glass layer 14b is higher than the light transmittance of the lower dielectric glass layer 14a. A glass layer formed by using a lead-based glass containing BaO in its composition has a high light transmittance because of good bubble elimination during firing of the glass. In general, when the softening point of lead-based glass is lowered, the dielectric constant increases. However, by including BaO, the softening point can be increased (preferably 10 to 10) without greatly increasing the dielectric constant. 30 ° C.). Therefore, if a lead-based glass containing BaO is used as the second glass material, it is possible to lower the firing temperature. The content of BaO is preferably 15% by weight or more, more preferably 17% by weight or more, and is not particularly limited, but is 25% by weight or less. The content of PbO is preferably 35 to 50% by weight. Strictly speaking, the weight percentage of PbO is a value obtained by converting an oxide of an element into a stoichiometric oxide. Furthermore, in order to prevent a significant decrease in light transmittance due to the multilayer structure of the dielectric glass layer, the entire dielectric glass layer (a layer in which the lower dielectric glass layer 14a and the upper dielectric glass layer 14b are combined) is used. The ratio of the upper dielectric glass layer 14b (the layer with the higher light transmittance) to the total dielectric glass layer 14b may be increased. In the plasma display panel of the present embodiment, the thickness of the upper dielectric glass layer 14b is set to be lower than that of the lower dielectric glass layer 14a in order to realize the same light transmittance as when the dielectric glass layer is formed as a single layer. Is preferably at least twice the thickness of
[0023]
As the first glass material used for the lower dielectric glass layer 14a and the second glass material used for the upper dielectric glass layer 14b, powder of lead-based glass having an average particle diameter of 1 to 8 μm is suitable. As described above, it is preferable to use a lead-based glass containing BaO as the second glass material particularly used for the upper dielectric glass layer 14b.
[0024]
A preferred composition range of the first and second glass materials is as follows: PbO is 35 to 70% by weight; ₂ Is 4 to 30% by weight, B ₂ O ₃ 1-30% by weight, BaO 0-25% by weight, Al ₂ O ₃ 0-10% by weight, CuO 0-1% by weight, CaO 0-10% by weight, TiO ₂ Is 0 to 5% by weight.
[0025]
Next, a method for forming the dielectric glass layers (lower dielectric glass layer 14a and upper dielectric glass layer 14b) of the plasma display panel in the present embodiment will be described.
[0026]
First, a method for producing a glass-forming paint (first glass-forming paint) for forming the lower dielectric glass layer 14a will be described. The first glass-forming paint is prepared by mixing a glass powder made of a first glass material, a solvent, and a binder resin. This paint is applied on the front substrate 11 on which the display electrodes 12 are formed by using a screen printing method, a spray method, a blade coater method, a die coat method, or the like, to form a film for forming a lower dielectric glass layer. After drying the lower dielectric glass layer forming film at 60 to 120 ° C. using a far-infrared ray drying device, a hot plate, or a hot air drying device, the first glass is dried at a temperature of 500 ° C. to 600 ° C. The lower dielectric glass layer 14a is formed by firing at a temperature near the softening point of the material.
[0027]
Next, a method for producing a glass-forming paint (second glass-forming paint) for forming the upper dielectric glass layer 14b will be described. The second glass-forming paint is prepared by mixing a glass powder made of a second glass material, a solvent, and a binder resin. Using this paint, a film for forming an upper dielectric glass layer is formed on the lower dielectric glass layer 14a by using a screen printing method, a spray method, a blade coater method, a die coating method, or the like. After drying the film for forming the upper dielectric glass layer at 60 to 120 ° C. using a far-infrared ray drying device, a hot plate, or a hot air drying device, the second glass having a temperature in the range of 500 ° C. to 600 ° C. The upper dielectric glass layer 14b is formed by firing at a temperature near the softening point of the material. The second glass material is a lead-based glass containing 15% by weight or more of BaO, and such a lead-based glass can lower the softening point while suppressing an increase in the dielectric constant. Therefore, a second glass material having a lower dielectric constant and a lower softening point than the first glass material can be realized. When such a second glass material is used, the firing temperature can be set lower than when the lower dielectric glass layer 14a is formed, so that the lower dielectric glass layer is fired when the upper dielectric glass layer 14b is formed. There is no risk that the first glass material contained in the body glass layer 14a will melt and react with Ag or the like constituting the display electrode. Therefore, even when the Ag film is used for the display electrode, problems such as coloring of the lower dielectric glass layer 14a hardly occur.
[0028]
Solvents for the first and second glass-forming paints include terpenes such as α-, β-, and γ-terpineol, ethylene glycol monoalkyl ethers, ethylene glycol dialkyl ethers, diethylene glycol monoalkyl ethers, and diethylene glycol. Dialkyl ethers, ethylene glycol monoalkyl ether acetates, ethylene glycol dialkyl ether acetates, diethylene glycol monoalkyl ether acetates, diethylene glycol dialkyl ether acetates, propylene glycol monoalkyl ethers, propylene glycol dialkyl ethers, propylene glycol monoalkyl ether Acetates, propylene glycol dialkyl ether acetates, meta Lumpur, ethanol, isopropanol, one selected from alcohols such as such as 1-butanol, or it is possible to use a mixture of two or more.
[0029]
Examples of the binder resin for the first and second glass-forming paints include cellulose resins such as nitrocellulose, ethylcellulose, and hydroxyethylcellulose; acrylic resins and copolymers such as polybutyl acrylate and polymethacrylate; and polyvinyl alcohol. , Polyvinyl butyral, etc., or a combination of two or more thereof.
[0030]
Further, if necessary, a dispersant, a plasticizer, and the like can be added to these glass-forming paints.
[0031]
As described above, the dielectric glass layer formed of two layers can have a high dielectric strength while maintaining the same light transmittance as the dielectric glass layer formed of a single layer. Thus, a plasma display panel having high light transmittance (high transparency) and high withstand voltage can be realized.
[0032]
In the present embodiment, a plasma display including a two-layer dielectric glass layer including one lower dielectric glass layer and one upper dielectric glass layer has been described. May be composed of two or more layers, and three or more dielectric glass layers composed of one lower dielectric glass layer and multiple upper dielectric glass layers. In this case, the glass material included in each upper dielectric glass layer only needs to have a lower dielectric constant than the glass material included in the lower dielectric glass layer.
[0033]
In the present embodiment, when forming the lower dielectric glass layer and the upper dielectric glass layer, a method of directly applying a glass forming paint by a screen printing method, a spray method, a blade coater method, a die coat method, or the like. However, the present invention is not limited to this. The coating material for glass formation is processed into a sheet in advance, and the sheet is transferred onto the glass substrate or the lower dielectric glass layer by an indirect method such as transfer. Can be used.
[0034]
【Example】
Hereinafter, the present invention will be described specifically with reference to Examples.
[0035]
(Example 1)
In the present embodiment, the composition of the first glass material used for the first glass-forming paint for forming the lower dielectric glass layer is as follows. Strictly speaking, the weight% of each composition is a value obtained by converting an oxide of each element into a stoichiometric oxide. The dielectric constant of the first glass material was 12, and the softening point was 585 ° C.
[0036]
PbO: 62% by weight
SiO ₂ : 26% by weight
B ₂ O ₃ : 6% by weight
CaO: 6% by weight
On the other hand, the composition of the second glass material used for the second glass forming paint for forming the upper dielectric glass layer is as follows. The dielectric constant of the second glass material was 10, and the softening point was 570 ° C.
[0037]
PbO: 41% by weight
SiO ₂ : 10% by weight
B ₂ O ₃ : 27.5% by weight
BaO: 16% by weight
Al ₂ O ₃ : 5% by weight
CuO: 0.5% by weight
Ethyl cellulose was used as a binder resin for the first and second glass forming paints, and a mixture of α-terpineol and butyl carbitol acetate (BCA) (mixing ratio 1: 1) was used as a solvent.
[0038]
The first and second glass-forming paints each contain 65% by weight of glass powder made of the above glass material, 2% by weight of ethyl cellulose, and 33% by weight of a mixture of α-terpineol and BCA, and are dispersed by three rollers. It was produced by uniformly mixing and dispersing various components by a machine.
[0039]
First, a first glass-forming coating material is applied by a die coating method on a 42-inch glass substrate on which an Ag electrode is formed to form a 34 μm-thick film for a lower dielectric glass layer. The film for a glass layer was dried at 90 ° C. and fired at 590 ° C. to produce a lower dielectric glass layer having a thickness of 12 μm. Next, the second glass forming paint is applied on the lower dielectric glass layer by a die coating method to form an upper dielectric glass layer film having a thickness of 80 μm, and then the upper dielectric glass layer film is formed. After drying at 90 ° C. and firing at 580 ° C., an upper dielectric glass layer having a thickness of 28 μm was prepared.
[0040]
(Example 2)
In this example, the same first glass-forming paint as used in Example 1 was used to form the lower dielectric glass layer. Naturally, the dielectric constant and softening point of the first glass material were also the same.
[0041]
On the other hand, the upper dielectric glass layer of this example was produced using a second glass-forming paint containing a second glass material having the following composition. The dielectric constant of the second glass material was 10, and the softening point was 560 ° C.
[0042]
PbO: 45% by weight
SiO ₂ : 10% by weight
B ₂ O ₃ : 22.5% by weight
BaO: 18% by weight
Al ₂ O ₃ : 4% by weight
CuO: 0.5% by weight
The solvent and binder resin used were the same as in Example 1, and the method for producing the second glass-forming paint was also the same as in Example 1.
[0043]
First, a first glass-forming coating material is applied by a die coating method on a 42-inch glass substrate on which an Ag electrode is formed to form a 34 μm-thick film for a lower dielectric glass layer. The film for a glass layer was dried at 90 ° C. and fired at 590 ° C. to produce a lower dielectric glass layer having a thickness of 12 μm. Next, a second glass-forming paint is applied on the lower dielectric glass layer by a die coating method to form a film for the upper dielectric glass layer having a thickness of 74 μm, and thereafter, the film for the upper dielectric glass layer is formed. After drying at 90 ° C. and firing at 570 ° C., an upper dielectric glass layer having a thickness of 28 μm was prepared.
[0044]
(Comparative Example 1)
In the same manner as in Examples 1 and 2, the second glass-forming paint used for forming the upper dielectric glass layer in Example 1 was used for both the lower dielectric glass layer and the upper dielectric glass layer. A dielectric glass layer was formed on a 42-inch glass substrate. That is, since two dielectric glass layers were produced using glass materials having the same dielectric constant, a panel having a single dielectric glass layer having a thickness of substantially 40 μm was obtained. The drying temperature was 90 ° C. for both the upper and lower layers, and the firing temperature was 580 ° C. for both the upper and lower layers.
[0045]
(Comparative Example 2)
In the same manner as in Examples 1 and 2, the second glass forming paint used for forming the upper dielectric glass layer in Example 2 was used for both the lower dielectric glass layer and the upper dielectric glass layer. A dielectric glass layer was formed on a 42-inch glass substrate. That is, since two dielectric glass layers were produced using glass materials having the same dielectric constant, a panel having a single dielectric glass layer having a thickness of substantially 40 μm was obtained. The drying temperature was 90 ° C. for both the upper and lower layers, and the firing temperature was 570 ° C. for both the upper and lower layers.
[0046]
(Comparative Example 3)
The same as in Examples 1 and 2, except that the first glass forming paint used for forming the lower dielectric glass layer in Examples 1 and 2 was used for both the lower dielectric glass layer and the upper dielectric glass layer. A dielectric glass layer was formed on a 42-inch glass substrate by the method. That is, since two dielectric glass layers were produced using glass materials having the same dielectric constant, a panel having a single dielectric glass layer having a thickness of substantially 40 μm was obtained. The drying temperature was 90 ° C. for both the upper and lower layers, and the firing temperature was 590 ° C. for both the upper and lower layers.
[0047]
(Comparative Example 4)
The first glass forming paint used for forming the lower dielectric glass in Example 1 was used for the upper dielectric glass layer, and the second glass forming paint used for forming the upper dielectric glass was used for the lower dielectric glass. A dielectric glass layer was formed on a 42-inch glass substrate in the same manner as in Example 1 by using the layer. The thickness of the lower dielectric glass layer was 12 μm, and the thickness of the upper dielectric glass layer was 28 μm.
[0048]
A dielectric breakdown test (dielectric withstand voltage test) was performed on the 42-inch panels of Examples 1 and 2 and Comparative Examples 1 to 4 formed as described above. In the dielectric breakdown test, before sealing the panel, the front plate was removed and placed on a metal plate (here, aluminum was used as a metal), and a rare gas (here, helium was used here) was placed between the front plate and the metal plate. And a neon mixed gas in a ratio of 1: 1 was used.), And an AC voltage of up to 500 V was applied with the display electrode being positive and the metal plate being negative. Such a dielectric breakdown test was performed on ten samples of the panels of Examples 1 and 2 and Comparative Examples 1 to 4. FIG. 2 shows the number of dielectric breakdowns among the ten samples. According to the results of the dielectric breakdown test, when the voltage of about 200 V was applied, the panels of Comparative Examples 1 to 4 having the single-layer dielectric glass layer caused the dielectric breakdown. It was confirmed that dielectric breakdown did not occur in the panel No.
[0049]
The total light transmittance was also measured. For the measurement of the total light transmittance, the dielectric glass layers of Examples 1 and 2 and Comparative Examples 1 to 4 were prepared on a glass substrate on which no Ag electrode was provided. Was measured at a wavelength of 550 nm using a haze meter HM-150 (manufactured by Murakami Color Research Laboratory). FIG. 3 shows the measurement result of the total light transmittance performed on the dielectric glass layer in which the total thickness of the upper dielectric glass layer and the lower dielectric glass layer is 40 μm. From these results, the two-layered dielectric glass layers of Examples 1 and 2 have almost the same total light transmittance as the single-layered dielectric glass layers of Comparative Examples 1 to 3, and Comparative Example 4 It was confirmed that it had a better light transmittance than the two-layer dielectric glass layer.
[0050]
Further, the relationship between the change in the thickness of the lower dielectric glass layer and the thickness of the upper dielectric glass layer and the light transmittance was also measured. The result is shown in FIG. Here, the total thickness of the lower dielectric glass layer, the upper dielectric glass layer and the thickness is fixed at 40 μm, the thickness of the upper dielectric glass layer is 0 to 40 μm, and the thickness of the lower dielectric glass layer is 40 to 0 μm. And the measurement was performed. The lower dielectric glass layer and the upper dielectric glass layer were produced in the same manner as in Example 1, and the glass materials, solvents, and binder resins used were the same as in Example 1. From this result, it was found that when the thickness of the upper dielectric glass layer was about twice or more as large as the thickness of the lower dielectric glass layer, a light transmittance as high as about 85% could be realized. Thus, if the thickness of the upper dielectric glass layer having good optical properties and made using lead-based glass containing BaO is about twice or more as large as that of the lower dielectric glass layer, two dielectric glass layers can be formed. It was confirmed that good optical characteristics could be obtained as a structure.
[0051]
From the above results, it was confirmed that the plasma display panel having the dielectric glass layer as in the present invention can improve the dielectric strength voltage while maintaining a sufficient light transmittance.
[0052]
【The invention's effect】
As described above, according to the plasma display panel and the method of manufacturing the same of the present invention, it is possible to provide a plasma display panel having an improved dielectric strength voltage while maintaining a sufficient light transmittance.
[Brief description of the drawings]
FIG. 1 is a perspective view illustrating a configuration of a plasma display panel according to an embodiment of the present invention.
FIG. 2 is a graph showing the results of a dielectric breakdown test performed on the plasma display panels of Examples and Comparative Examples of the present invention.
FIG. 3 is a graph showing the results of the total light transmittance measurement performed on the plasma display panels of the example of the present invention and the comparative example.
FIG. 4 is a graph showing a relationship between a change in thickness of a lower dielectric glass layer and an upper dielectric glass layer and light transmittance.
FIG. 5 is a perspective view showing a configuration of a conventional plasma display panel.
[Explanation of symbols]
1 Front panel
2 Back plate
11 Front board
12 Display electrode
13 Black Stripe
14a Lower dielectric glass layer
14b Upper dielectric glass layer
15 Dielectric protection layer
21 Back substrate
22 address electrode
23 Dielectric glass layer
24 partition
25 phosphor layer

Claims (9)

A front substrate,
A display electrode disposed on the front substrate,
A lower dielectric glass layer including a first glass material disposed on the display electrode;
And at least one upper dielectric glass layer including a second glass material disposed on the lower dielectric glass layer,
The dielectric constant of the second glass material is lower than the dielectric constant of the first glass material. The plasma display panel according to claim 1, wherein the upper dielectric glass layer has a higher light transmittance than the lower dielectric glass layer. 2. The plasma display panel according to claim 1, wherein the thickness of the upper dielectric glass layer is at least twice the thickness of the lower dielectric glass layer. The plasma display panel according to claim 1, wherein the second glass material is a lead-based glass containing BaO. The plasma display panel according to claim 4, wherein the lead-based glass contains BaO in an amount of 15% by weight or more. The plasma display panel according to claim 1, wherein the display electrode includes an Ag film or a Cr—Cu—Cr laminated film. A lower dielectric glass layer forming film is formed on a front substrate provided with a display electrode by using a first glass forming paint including a first glass material, and thereafter, the lower dielectric glass layer forming film is formed. A first step of drying and firing the film to form a lower dielectric glass layer;
Forming an upper dielectric glass layer forming film using a second glass forming paint including a second glass material having a lower dielectric constant than the first glass material, and then forming the upper dielectric glass layer forming film; Drying and baking the film for use to form an upper dielectric glass layer. 8. The method according to claim 7, wherein the firing temperature in the second step is lower than the firing temperature in the first step by 10 ° C. or more. The method according to claim 7, wherein the first glass-forming paint and the second glass-forming paint further include a solvent and a binder resin.

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