JP2004064032A - Hot air heating method and device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method and device for uniformly heating a plurality of winding with hot air in a shortest possible time. <P>SOLUTION: An air passage 40 having a shape corresponding to the winding 10, and a shelf 38 supporting it are provided. Hot air is distributed in a direction perpendicular to the shelf 38, that is, in an axial direction of the winding 10 by a hot air circulation device, that is, a fan 48 and a heater 50, in a state where the body 10 is placed in the air passage 40 in the shelf 38. As a result, not only the amount of time required for temperature rise of the inside of the body 10 is shortened, but also the winding 10 is heat treated comparatively in a short time since solvent included in synthetic resin 22 or the like fixed to the winding 10 is easy to evaporate. Further, by arranging a plurality of the shelves in the axial direction and disposing the windings 10 on the shelves 38, a plurality of winding 10 are heated at the same time. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention is directed to an improvement of a hot-air heating method and apparatus used exclusively for manufacturing a flaky substrate, which is used to heat-treat a wound body in which a strip film in which a number of flaky substrates are connected is spirally wound. About.
[0002]
[Prior art]
For example, a flaky substrate called a TAB (tape automated bonding) substrate or a COF (chip on film) substrate is known. Such a flaky substrate is, for example, one in which a wiring made of copper foil is formed on the surface of a heat-resistant resin film, or one in which a semiconductor chip is fixed together with the wiring, and the wiring and the semiconductor chip are electrically connected. And is incorporated in various electric / electronic devices to function as a predetermined electric / electronic circuit.
[0003]
The flaky substrate is manufactured by forming a plurality of substrate patterns on a belt-like film made of a heat-resistant resin or the like, and then punching out individual flaky substrates. In the manufacturing process, for example, as described in the specification of JP-A-6-302652, when a copper foil is fixed to the above-mentioned strip film with a synthetic resin adhesive or the like, or when the copper foil is fixed to the surface of the strip film. When covering a part of the wiring and the semiconductor chip with the synthetic resin, a heat treatment is performed for the purpose of evaporating a solvent contained in the synthetic resin. Among the heat treatments, in the process in which the heating lead time is relatively long, in a state where the strip-shaped film is wound into a spirally wound form, for example, a batch heat treatment is performed using an infrared radiation heating device or a hot air heating device. Had been done.
[0004]
[Problems to be solved by the invention]
However, in the conventional infrared radiation type heating device or hot air type heating device, in addition to the time required to raise the temperature of the portion inside the spirally wound winding body, that is, the continuous strip film adjacent to both sides, Since the solvent contained in the synthetic resin hardly evaporates, the heat treatment requires a relatively long time, for example, about 3 to 4 hours depending on the process. In addition, since this time is longer when heat treatment is performed simultaneously on a plurality of the above-mentioned winding bodies, heat treatment can normally be performed only on one or two pieces at a time, and there is a limit to improvement in mass productivity.
[0005]
The present invention has been made in view of the above circumstances, and a purpose thereof is to provide a hot-air heating method capable of uniformly performing heat treatment on a plurality of winding bodies in as short a time as possible. And to provide a device.
[0006]
[First means for solving the problem]
In order to achieve such an object, the gist of the first invention is that, when a flaky substrate is manufactured, a strip-shaped film formed by connecting a large number of the flaky substrates is spirally wound. A hot-air heating method used for performing heat treatment, characterized in that hot air is circulated in a direction of a winding axis of the winding body.
[0007]
[Effect of the first invention]
With this configuration, the hot air flows in the winding axis direction of the winding body in which the strip-shaped film in which a number of the flaky substrates are connected is spirally wound, thereby increasing the temperature inside the winding body. In addition to the shortening of the time required, the solvent contained in the synthetic resin or the like fixed to the wound body easily evaporates, so that heat treatment can be performed on the wound body in a relatively short time. Further, by disposing a plurality of the winding bodies in the direction of the winding axis, heat treatment can be performed on the plurality of winding bodies simultaneously. That is, it is possible to provide a hot-air heating method capable of uniformly applying heat treatment to a plurality of winding bodies in a time as short as possible.
[0008]
[Second means for solving the problem]
In order to achieve the above object, the gist of the second invention is that, in the production of a flaky substrate, a winding film in which a plurality of strip-like films connected to the flaky substrate are spirally wound. A hot-air heating device used to heat-treat the body, a ventilation plate is provided at least in a portion corresponding to the winding body, and a shelf plate supporting the winding body, A hot air circulation device for flowing hot air in a vertical direction.
[0009]
[Effect of the second invention]
According to this configuration, at least a portion corresponding to the winding body is provided with a ventilation portion, and the shelf is provided to support the winding body. The winding body is placed on the ventilation portion of the shelf plate. In this state, hot air is circulated in a vertical direction to the shelf by the hot air circulating device, so that the time required for raising the temperature inside the wound body is reduced, and the hot air is fixed to the wound body. Since the solvent contained in the synthetic resin or the like easily evaporates, the rolled body can be subjected to heat treatment in a relatively short time. Further, by providing a plurality of the shelf plates in the winding axis direction, by arranging the winding body on each of the plurality of shelf plates, simultaneously performing heat treatment on the plurality of winding bodies. Can be. That is, it is possible to provide a hot-air heating device capable of uniformly applying heat treatment to a plurality of winding bodies in a time as short as possible.
[0010]
[Another aspect of the second invention]
Here, preferably, the shelf board is provided with a shielding plate so as to surround a ventilation section having a shape corresponding to the winding body. According to this configuration, there is an advantage that more efficient heat treatment can be performed on the wound body by flowing the hot air exclusively through the ventilation portion having a shape corresponding to the wound body.
[0011]
【Example】
Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings.
[0012]
FIG. 1 is a perspective view showing a winding body 10 to be subjected to a heat treatment by a hot-air heating device 30 described later, and FIG. 2 is an enlarged view of a part thereof. As shown in these figures, such a winding body 10 is formed by spirally winding a belt-like film 14 in which a number of flaky substrate patterns 12 are connected. The flaky substrate pattern 12 has a wiring 16 formed of, for example, a copper foil, or a semiconductor chip 18 is fixed together with the wiring 16 as shown by cutting out a part of the upper right substrate in FIG. The semiconductor chip 18 is electrically connected to the semiconductor chip 18 by wires 20, and a part of the wiring 16, the semiconductor chip 18, and the wires 20 are covered with a synthetic resin 22 containing a solvent. Usually, the synthetic resin 22 used for such coating is colored black or a color having a similar saturation to prevent light from shining on the semiconductor chip 18 and the like. The band-shaped film 14 is made of a synthetic resin such as polyimide and has a size of about 300 m × 160 mmw × t 75 μm. The band-shaped film 14 has, for example, about four pieces in the width direction. The flaky substrate patterns 12 are formed continuously. After a series of steps including a heat treatment described later, the flaky substrate pattern 12 is formed into a flaky substrate 24 as a product by punching out a portion indicated by a chain line in the upper left substrate of FIG. .
[0013]
FIG. 3 is a schematic sectional view illustrating the configuration of a hot-air heating device 30 according to one embodiment of the present invention. As shown in the figure, the hot-air heating device 30 has a furnace body 32 having a top opening 34 and a bottom opening 36 provided on a top wall and a bottom wall, respectively, and a shape corresponding to the winding body 10. A plurality of (four in the figure) shelf plates 38 provided with a shielding plate 42 surrounding the ventilation part 40 and supporting the wound body 10, and a filter 44 provided so as to cover the top opening 34 are provided. , A duct 46 connecting the filter 44 and the bottom opening 36, and a fan 48 and a heater 50 provided in the middle of the duct 46.
[0014]
The furnace body 32 is made of, for example, stainless steel and has an outer dimension of about 2000 mm × 1200 mm × 1600 mm, and the top opening 34 and the bottom opening 36 have a circular shape having a diameter of about 800 mmφ, for example. It is a through hole. Here, FIG. 4 is a sectional view taken along line IV-IV of FIG. As shown in this figure, the shelf plate 38 is made of, for example, a stainless steel plate having a circular through hole 52 having a diameter of about 200 mmφ at the center, and is provided on the side wall of the furnace body 32. It is provided with a plate 42 and the above-mentioned ventilation part 40 in which a wire 54 having a predetermined thickness is stretched in a grid pattern of about 10 mm square in its through hole 52. Preferably, the shielding plate 42 is formed with a ridge 56 so as to protrude upward from the through hole 52, and the winding body 10 is fitted inside the ridge 56. Thus, the heat treatment is performed in a state in which the deviation of the winding shaft center is prevented. The filter 44 has, for example, a HEPA filter (high efficiency particulate air filter), that is, has a particle collection rate of 99.97% or more for particles having a particle diameter of 0.3 μm at a rated flow rate and an initial pressure loss of 245 Pa. This is a high-performance air filter having the following performance, and is for purifying gas circulating in the hot-air heating device 30. The fan 48 allows the gas in the furnace body 32 to flow from the top opening 34 to the bottom opening 36 through the duct 46 at a flow rate of, for example, about 0.2 to 1.5 m / s. 50 is for heating the gas so that the gas to be circulated is about 60 to 100 ° C.
[0015]
Usually, when the band-shaped film 14 is wound, a spacer tape (not shown) is brought into contact with both end surfaces of the band-shaped film 14 so that the flaky substrate pattern 12 and the synthetic resin 22 are not crushed. It is wound up. Therefore, as shown in FIG. 1, a slight gap is formed between the adjacent strip films 14 in the spirally wound strip film 14. The gap is, for example, about 2 mm. For example, a gas having a flow velocity of about 0.2 to 0.5 m / s can be passed through the gap with almost no resistance. The hot-air heating device 30 of the present embodiment is configured to allow hot air to flow through the gap by taking advantage of the fact that a gap is inevitably generated in the spirally wound strip-shaped film 14, that is, the winding body 10. The heat treatment is performed on the winding body 10.
[0016]
The arrows in FIG. 3 indicate the circulation of gas in the hot-air heating device 30. The hot air sent out by the fan 48 is heated by the heater 50 and sent into the furnace body 32 from the top opening 34 via the duct 46 and the filter 44. The hot air supplied into the furnace body 32 in this manner passes through a gap between the winding bodies 10 placed on the ventilation portion 40 of the shelf plate 38, and flows in the direction of the axis of its winding, that is, with respect to the shelf plate 38. And is discharged vertically into the duct 46 through the bottom opening 36. Part of the exhausted gas is exhausted, and most of the exhausted gas is sent to the fan 48 through the duct 46. Further, the air is supplied to the duct 46 by the air supply fan 49 via the air supply filter 47. By repeating the above, the heat treatment is applied to the wound body 10.
[0017]
The inventor uses the hot-air heating device 30 of the present embodiment and a conventional hot-air heating device of a type that supplies hot air in a direction perpendicular to the winding axis of the winding body 10 to form the winding body 10. When the heat treatment is performed, the conventional hot air heating device requires about 15 minutes for the temperature raising process and about 220 minutes for the temperature equalizing process. While a temperature distribution of about ± 2.5 ° C. occurred during the temperature treatment, the hot-air heating device 30 of the present embodiment took only about 3 minutes for the temperature increase treatment and about 95 minutes for the temperature equalization treatment. The temperature distribution generated in the winding body 10 was about ± 3 ° C. during the temperature raising process and about ± 1 ° C. during the temperature equalizing process. That is, the hot air heating device 30 of the present embodiment not only has a shorter time required for heat treatment as compared with the conventional hot air heating device, but also performs the heat treatment while keeping the temperature of the winding body 10 as uniform as possible. It was confirmed that it could be performed.
[0018]
As described above, according to the present embodiment, hot air is circulated in the winding axis direction of the winding body 10 in which the strip-shaped film 14 to which the plurality of flaky substrates 24 are connected is spirally wound. In addition to shortening the time required for raising the temperature inside the winding body 10, the solvent contained in the synthetic resin 22 or the like fixed to the winding body 10 is easily evaporated, so that the above-described method is performed in a relatively short time. The winding body 10 can be subjected to a heat treatment. In addition, by disposing a plurality of the winding bodies 10 in the winding axis direction, the plurality of winding bodies 10 can be subjected to heat treatment at the same time. That is, it is possible to provide a hot-air heating method capable of performing heat treatment on the plurality of winding bodies 10 in a time as short as possible.
[0019]
Further, according to the present embodiment, the ventilation portion 40 is provided at least in a portion corresponding to the winding body 10, and the shelf plate 38 that supports the winding body 10 is provided. The hot air circulating device, that is, the fan 48 and the heater 50 circulate hot air in a vertical direction with respect to the shelf plate 38 in a state where the winding body 10 is mounted on 40, thereby increasing the temperature inside the winding body 10. Heat treatment of the winding body 10 in a relatively short time because the solvent contained in the synthetic resin 22 and the like fixed to the winding body 10 easily evaporates in addition to the time required for the winding. Can be. In addition, by providing a plurality of the shelf plates 38 in the winding axis direction, by arranging the winding body 10 on each of the plurality of shelf plates 38, a plurality of the Heat treatment can be performed. That is, it is possible to provide the hot-air heating device 30 that can heat-treat the plurality of winding bodies 10 in as short a time as possible.
[0020]
Further, since the shelf plate 38 is provided with the shielding plate 42 so as to surround the ventilation portion 40 having a shape corresponding to the winding body 10, the hot air is exclusively formed in a shape corresponding to the winding body 10. By flowing through the ventilation part 40, there is an advantage that the heat treatment can be performed more efficiently on the wound body 10.
[0021]
As described above, the preferred embodiments of the present invention have been described in detail with reference to the drawings. However, the present invention is not limited to these embodiments, and may be implemented in other embodiments.
[0022]
For example, in the above-described embodiment, the hot air heating device 30 evaporates the solvent contained in the synthetic resin 22 when the semiconductor chip 18 and the like fixed on the surface of the strip film 14 are coated with the synthetic resin 22. For example, before the semiconductor chip 18 is fixed, when the copper foil is fixed to the strip film 14 with a synthetic resin adhesive or the like, the strip film 14 is preliminarily used. Naturally, it may be used for performing a heat treatment for the purpose of drying it. That is, the hot-air heating method and apparatus of the present invention perform heat treatment on the winding body 10 in which the strip-shaped film 14 in which a number of the flaky substrates 24 are connected is spirally wound when manufacturing the flaky substrate 24. It is widely used for the purpose.
[0023]
Further, the shelf plate 38 is provided with the shielding plate 42 so as to surround the ventilation portion 40 having a shape corresponding to the winding body 10, but the shielding plate 42 is not necessarily provided, and The shelf plate 38 may be composed of only the wires 54 stretched in a grid pattern, for example.
[0024]
Further, the ventilation portion 40 of the shelf plate 38 is formed of the wire 54 stretched in a grid pattern, but the ventilation portion 40 has a diameter of 25 mm on the through hole 52 as shown in FIG. Rollers 58 having a thickness of about 100 mm may be arranged at a pitch of about 100 mm. In this case, the protrusion 56 is not provided. Further, in a shelf made of a flat plate, a large number of ventilation holes may be provided at a portion corresponding to the winding body 10, and the hot wind may be preferably applied in the winding axis direction of the winding body 10. Is not limited as long as it can be distributed.
[0025]
Although not illustrated one by one, the present invention is embodied with various changes without departing from the spirit thereof.
[Brief description of the drawings]
FIG. 1 is a perspective view showing a winding body subjected to a heat treatment by a hot-air heating device of FIG. 3;
FIG. 2 is an enlarged view showing a part of the winding body of FIG. 1;
FIG. 3 is a schematic sectional view illustrating a configuration of a hot-air heating device according to an embodiment of the present invention.
FIG. 4 is a sectional view taken along line IV-IV of FIG. 3;
5 is a cross-sectional view corresponding to FIG. 4 in a hot-air heating device of another embodiment.
[Explanation of symbols]
10: Winding body 14: Strip film 24: Flake substrate 30: Hot air heating device 38: Shelf 40: Vent 42: Shielding plate 48: Fan 50: Heater

Claims (3)

In the production of a flaky substrate, a hot air heating method used to apply heat treatment to a wound body in which a strip-shaped film in which a large number of the flaky substrates are connected is spirally wound,
A hot-air heating method characterized by flowing hot air in the direction of the winding axis of the winding body. In the production of a flaky substrate, a hot-air heating device used to apply heat treatment to a wound body in which a strip-shaped film in which a number of the flaky substrates are connected is spirally wound,
A shelf board provided with a ventilation portion at least in a portion corresponding to the winding body to support the winding body,
A hot air circulation device for flowing hot air in a direction perpendicular to the shelf board. The hot-air heating device according to claim 2, wherein the shelf plate includes a shielding plate so as to surround a ventilation portion having a shape corresponding to the winding body.

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