JP2004063998A - Device and method for mounting electronic part - Google Patents

Device and method for mounting electronic part Download PDF

Info

Publication number
JP2004063998A
JP2004063998A JP2002223493A JP2002223493A JP2004063998A JP 2004063998 A JP2004063998 A JP 2004063998A JP 2002223493 A JP2002223493 A JP 2002223493A JP 2002223493 A JP2002223493 A JP 2002223493A JP 2004063998 A JP2004063998 A JP 2004063998A
Authority
JP
Japan
Prior art keywords
electronic component
substrate
chamber
light
component mounting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2002223493A
Other languages
Japanese (ja)
Other versions
JP4048087B2 (en
Inventor
Tadatomo Suga
須賀　唯知
Hisahiro Ito
伊藤　寿浩
Kazuji Azuma
東　和司
Takahiro Yonezawa
米沢　隆弘
Shinzo Eguchi
江口　信三
Yoshihisa Oido
大井戸　良久
Kazuyuki Tomita
富田　和之
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP2002223493A priority Critical patent/JP4048087B2/en
Publication of JP2004063998A publication Critical patent/JP2004063998A/en
Application granted granted Critical
Publication of JP4048087B2 publication Critical patent/JP4048087B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7525—Means for applying energy, e.g. heating means
    • H01L2224/75261—Laser
    • H01L2224/75263—Laser in the upper part of the bonding apparatus, e.g. in the bonding head
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/81053—Bonding environment
    • H01L2224/81054—Composition of the atmosphere
    • H01L2224/81065—Composition of the atmosphere being reducing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/812—Applying energy for connecting
    • H01L2224/8122—Applying energy for connecting with energy being in the form of electromagnetic radiation
    • H01L2224/81224—Applying energy for connecting with energy being in the form of electromagnetic radiation using a laser
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/818—Bonding techniques
    • H01L2224/81801—Soldering or alloying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
    • H01L2924/15787—Ceramics, e.g. crystalline carbides, nitrides or oxides

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To enable a board to be properly heated when an electronic part is mounted on the board in a reduced-pressure environment. <P>SOLUTION: An electronic part mounting apparatus is equipped with a chamber 11 where the board 91 and the electronic part 92 are loaded, and FAB irradiation devices 161 and 164 which irradiate the board 91 on a stage and the electronic part 92 held by a mounting head 14 with a fast atom beam. Furthermore, a laser unit 162 irradiating the board 91 with a laser beam is additionally provided. The laser beam emitted from the laser unit 162 irradiates the board 91 while the board 91 and the electronic part 92 are irradiated with the fast atom beam. By this setup, the board 91 can be sufficiently and quickly heated in a decompressed environment. <P>COPYRIGHT: (C)2004,JPO

Description

【０００１】
【発明の属する技術分野】
本発明は、減圧環境下にて電子部品を基板に装着する技術に関する。
【０００２】
【従来の技術】
従来より、プリント配線基板に電子部品を実装する際には、基板にペースト状のはんだが塗布されて電子部品が装着され、その後、基板を加熱および冷却することにより電子部品が基板に固着される。近年では、電子部品の電極ピッチの微細化に伴い、電子部品を基板に接着するために導電性の樹脂を利用する手法も提案されている。
【０００３】
【発明が解決しようとする課題】
ところが、携帯型の情報端末に代表されるように情報機器のさらなる小型化が進むと、従来の実装手法では電子部品や基板の電極のピッチの微細化に対応することが困難となり、新たな実装手法が必要となる。新たな実装手法には減圧環境あるいは高真空環境下にて行われるものも想定され、このような手法では常圧下における実装とは異なる装置構造が必要となる。
【０００４】
例えば、装着前に基板や電子部品を減圧環境下にて加熱しようとした場合、従来のように基板や電子部品を加熱された部材に当接させるのみでは十分な加熱を行うことができない。なぜならば、加熱された部材と加熱対象とが実際に当接する面積は微小であり、両者の間には熱を伝達する空気も存在しないからである。
【０００５】
本発明は、上記課題に鑑みなされたものであり、減圧環境下にて電子部品を基板に装着する際に基板または電子部品を適切に加熱する手法を提供することを目的としている。
【０００６】
【課題を解決するための手段】
請求項１に記載の発明は、電子部品を基板に装着する電子部品装着装置であって、基板が載置される内部空間が減圧可能なチャンバと、前記チャンバ内にて電子部品を保持するとともに前記電子部品を基板に装着する装着部と、前記チャンバ内の基板または電子部品に向けて光を照射する光照射部とを備える。
【０００７】
請求項２に記載の発明は、請求項１に記載の電子部品装着装置であって、前記チャンバ内の基板または電子部品に対してプラズマ洗浄を行う洗浄部をさらに備える。
【０００８】
請求項３に記載の発明は、請求項２に記載の電子部品装着装置であって、前記洗浄部が、高速原子ビームを基板または電子部品に照射する。
【０００９】
請求項４に記載の発明は、請求項２または３に記載の電子部品装着装置であって、前記洗浄部により洗浄が行われる際の基板または電子部品の配置位置と光が照射される位置とが一致する。
【００１０】
請求項５に記載の発明は、請求項２ないし４のいずれかに記載の電子部品装着装置であって、前記洗浄部が基板および電子部品を洗浄する２つの洗浄ユニットを有し、前記光照射部が前記基板に光を照射する。
【００１１】
請求項６に記載の発明は、請求項５に記載の電子部品装着装置であって、電子部品を洗浄する洗浄ユニットに向かって前記装着部を移動させる移動機構をさらに備える。
【００１２】
請求項７に記載の発明は、請求項１ないし６のいずれかに記載の電子部品装着装置であって、前記光照射部が前記チャンバ外に位置し、前記チャンバが前記光照射部からの光を透過する透光部材を有する。
【００１３】
請求項８に記載の発明は、電子部品を基板に装着する電子部品装着方法であって、チャンバに基板および電子部品を搬入する工程と、前記チャンバの内部空間を減圧する工程と、前記基板または前記電子部品に向けて光を照射する工程と、前記基板に前記電子部品を装着する工程とを有する。
【００１４】
請求項９に記載の発明は、請求項８に記載の電子部品装着方法であって、前記光を照射する工程と並行して前記基板または前記電子部品にプラズマ洗浄を行う工程をさらに有する。
【００１５】
【発明の実施の形態】
図１は電子部品装着装置１の構成を示す正面図であり、図２は図１中の矢印Ａ−Ａにおける横断面図である。図１では構成の一部を断面にて図示している。電子部品装着装置１は、減圧下にてセラミックの基板にＩＣベアチップである電子部品を装着する装置であり、中央にチャンバ１１を有する。チャンバ１１は図１に示す排気管１１１を介してロータリーポンプ１１２およびターボ分子ポンプ１１３に接続され、ロータリーポンプ１１２にて急速排気を行った後にターボ分子ポンプ１１３によりチャンバ１１の内部空間を高真空の状態とすることが可能となっている。
【００１６】
図１および図２に示すように、チャンバ１１内の下部には基板が載置されるステージ１２が配置され、ステージ１２は、ステージ移動機構１３により水平面内で移動可能とされる。チャンバ１１内の上部には図１に示すように電子部品を保持する装着ヘッド１４が配置され、装着ヘッド１４はチャンバ１１の挿入口に挿入されるシャフト１４１に取り付けられ、シャフト１４１はヘッド回動機構１４３に接続される。シャフト１４１はチャンバ１１外において、一端がシャフト１４１側に、他端がチャンバ１１側に取り付けられたベローズ１４２に覆われ、シャフト１４１が挿入される挿入口が外部から隔離される。ヘッド回動機構１４３はヘッド昇降機構１４４により昇降し、ヘッド回動機構１４３およびヘッド昇降機構１４４により、装着ヘッド１４はシャフト１４１を中心とする回動および昇降を行う。
【００１７】
チャンバ１１内の側方には、カメラユニット１５１が配置され、カメラユニット１５１はチャンバ１１の側壁の開口に挿入されるハウジング１５２に収納される。カメラユニット１５１およびハウジング１５２はチャンバ１１の外部にてカメラ移動機構１５３に接続され、チャンバ１１の中央へ向かう方向に対して進退可能とされる。ハウジング１５２はチャンバ１１外においてベローズ１５４に覆われ、チャンバ１１の側壁の開口が外部から隔離される。
【００１８】
チャンバ１１の上部には、チャンバ１１内へとアルゴンの高速原子ビーム（Ｆａｓｔ　Ａｔｏｍ　Ｂｅａｍ、以下「ＦＡＢ」という。）を基板に向けて照射するＦＡＢ照射装置１６１が取り付けられ、チャンバ１１の外部にはＦＡＢ照射装置１６１に隣接してレーザユニット１６２が配置される。レーザユニット１６２の光源としては、ＣＯ２レーザ、エキシマレーザ等が用いられる。
【００１９】
チャンバ１１の上面にはレーザユニット１６２からのレーザ光を透過する石英の透光部材１６３が取り付けられ、レーザユニット１６２からのレーザ光は透光部材１６３を透過してチャンバ１１内の基板へと照射される。チャンバ１１の下部にも装着ヘッド１４に保持された電子部品に向けてＦＡＢを照射するＦＡＢ照射装置１６４が設けられる。
【００２０】
図２に示すようにチャンバ１１の側面には開閉自在なゲート１１５が設けられており、基板９１および電子部品９２はそれぞれアーム９５１，９５２により保持されてチャンバ１１内へと搬入される。基板９１はアーム９５１の下面に吸引吸着され、電子部品９２はアーム９５２の上面に吸引吸着される。
【００２１】
図３はチャンバ１１の内部を拡大して示す図である。ステージ移動機構１３は、２つの移動テーブル１３１１，１３１２を有し、両移動テーブル１３１１，１３１２はモータ１３２１（図２参照）、ガイドレールおよびボールネジ機構により図３において紙面に垂直な方向に移動する。また、上側の移動テーブル１３１２は、モータ１３２２、ガイドレールおよびボールネジ機構により左右方向に移動する。ステージ移動機構１３によりステージ１２が水平面内にて自在に移動可能とされる。なお、上側の移動テーブル１３１２には開口１３３が形成されており、図３に示す状態において装着ヘッド１４とＦＡＢ照射装置１６４とが開口１３３を介して対向する。
【００２２】
図４は電子部品装着装置１の動作の流れを示す図である。電子部品装着装置１では、まず、図５に示すようにチャンバ１１のゲート１１５から開かれ、アーム９５１，９５２により基板９１および電子部品９２がチャンバ１１内へと搬入される。このとき、図３に示すように、基板９１はステージ１２と対向するように上方に位置し、電子部品９２は装着ヘッド１４と対向するように下方に位置する。
【００２３】
その後、図６に示すようにアーム９５１が下降して基板９１をステージ１２に当接させる。ステージ１２は静電チャックとなっており、ステージ１２が基板９１を静電吸着により保持するとアーム９５１が吸引吸着を解除してチャンバ１１外へと待避する。一方、アーム９５２は上昇して電子部品９２を装着ヘッド１４近傍まで移動し、装着ヘッド１４がヘッド昇降機構１４４により下降するとともに電子部品９２を吸引吸着する（ステップＳ１１）。
【００２４】
ここで、装着ヘッド１４は吸着保持およびメカニカルチャックによる保持が可能とされており、アーム９５２が電子部品９２の吸着を解除してチャンバ１１外へと待避する際に、装着ヘッド１４では電子部品９２の保持が吸引吸着からメカニカルチャックによる保持へと切り替えられる（ステップＳ１２）。
【００２５】
基板９１および電子部品９２がチャンバ１１内に保持されると、ゲート１１５が閉じられ、ロータリーポンプ１１２によりチャンバ１１内が減圧され、ターボ分子ポンプ１１３によりチャンバ１１内（すなわち、電子部品９２の周囲）が高真空状態とされる（ステップＳ１３、図１参照）。その後、装着ヘッド１４が下降し、図７に示すように電子部品９２とＦＡＢ照射装置１６４との間の距離が基板９１とＦＡＢ照射装置１６１との間の距離におよそ等しくされる（ステップＳ１４）。これにより、構造上の理由によりＦＡＢ照射装置１６４が装着ヘッド１４の近くに配置することができない場合であっても、電子部品９２にＦＡＢを十分照射することができる。
【００２６】
図７に示す状態において、ＦＡＢ照射装置１６１から基板９１に向けてＦＡＢが照射され、ＦＡＢ照射装置１６４から電子部品９２に向けてＦＡＢが照射される。これにより、基板９１および電子部品９２の電極の表面が洗浄される（すなわち、表面の不要な物質の除去および表面の活性化が行われる）。なお、ＦＡＢ照射装置１６４からのＦＡＢは、図３に示す移動テーブル１３１２の開口１３３を介して行われる。
【００２７】
レーザユニット１６２は洗浄が行われる際の基板９１の配置位置とレーザ光の照射位置とが一致するように配置されており、ＦＡＢの照射と並行してレーザユニット１６２からのレーザ光が透光部材１６３を介して基板９１に照射され、基板９１が１５０〜２００℃まで加熱される（ステップＳ１５）。
【００２８】
ＦＡＢおよびレーザ光の照射が完了すると、図８に示すように装着ヘッド１４が上昇し、ステージ１２が装着ヘッド１４の下方へと移動する。さらに、カメラ移動機構１５３によりカメラユニット１５１がハウジング１５２と共に装着ヘッド１４とステージ１２との間へと進入し、電子部品９２および基板９１を撮像する位置へと移動する（ステップＳ１６）。
【００２９】
カメラユニット１５１は２つの撮像デバイスと、ハウジング１５２の上方および下方からの光をそれぞれ撮像デバイスへと導く光学系とを有し、図８に示す状態でカメラユニット１５１は上方の電子部品９２の画像および下方の基板９１の画像を同時に取得する。なお、カメラユニット１５１には別途設けられた光源ユニットから照明光が導入される。そして、取得された両画像に基づいて、ヘッド回動機構１４３が電子部品９２の向きを調整し、ステージ移動機構１３が電子部品９２の中心と基板９１上の装着位置の中心とを合わせる。これにより、電子部品９２と基板９１とのアライメント（位置合わせ）が完了する（ステップＳ１７）。
【００３０】
アライメントが完了すると図９に示すようにカメラユニット１５１がチャンバ１１の側壁へと待避し（ステップＳ１８）、ヘッド昇降機構１４４が装着ヘッド１４を下降させて電子部品９２を基板９１に装着する（ステップＳ１９）。これにより、電子部品９２の電極と基板９１の電極とが原子間の強い結合力により結合し、電子部品９２が基板９１上に固着する。なお、高真空中に基板９１が配置されるため、レーザ光により加熱された基板９１は電子部品９２の装着時においても高温状態が維持される。また、装着ヘッド１４の平行度は装着ヘッド１４の上方に設けられた調整機構１４５により予め調整されており、電子部品９２が基板９１に装着される際には電子部品９２を基板９１へと付勢する力が制御される。
【００３１】
装着が完了すると装着ヘッド１４が上昇し、チャンバ１１内が大気圧に戻され、ゲート１１５が開放される。装着済みの基板９１は他のアームによりチャンバ１１外へと搬出される（ステップＳ２０）。
【００３２】
以上のように、電子部品装着装置１では高真空中において装着が行われ、接着材料を用いることなく電子部品９２が基板９１に実装される。その結果、微細電極同士の接合の信頼性が高められる。
【００３３】
また、装着の際にレーザ光により基板９１の加熱を行うことにより、減圧環境下であっても基板９１の加熱を適切に（すなわち、十分かつ速やかに）行うことが実現される。さらに、基板９１のみが加熱されることから、装置に熱歪みがほとんど生じず、電子部品９２と基板９１との位置合わせ精度も向上される。
【００３４】
なお、レーザ光の照射は基板９１へのＦＡＢの照射と並行して行われるため、レーザ光を照射するために基板９１を別途移動する必要がなく、レーザ光を照射するために電子部品装着装置１の生産能力が低下することもない。
【００３５】
以上、本発明の一の実施の形態について説明したが、本発明は上記実施の形態に限定されるものではなく、様々な変形が可能である。
【００３６】
上記実施の形態では、基板９１はセラミック基板であるが、半導体基板やフィルム基板等の他の基板に電子部品９２を装着する際にも上記電子部品装着装置１を利用することができる。
【００３７】
上記実施の形態では基板９１にレーザ光が照射されるが、基板９１を加熱するために用いられる光はレーザ光には限定されない。例えば、ハロゲンランプからの光が基板９１に照射されてもよい。なお、基板９１全体に光が照射されてもよく、スポットとして光が照射されてもよい。スポットとして光を照射することにより、電子部品９２の装着領域のみを効率よく加熱することができる。
【００３８】
また、上記実施の形態のように基板９１を加熱する場合は加熱温度を正確に制御する必要はないが、耐熱性に優れた電子部品９２の場合には、電子部品９２（または、基板９１および電子部品９２）に光を照射して加熱が行われてもよい。
【００３９】
上記実施の形態では、ＦＡＢにより基板９１および電子部品９２の洗浄が行われるが、ＦＡＢによる洗浄はプラズマ洗浄の一種であり、他の種類のプラズマ洗浄が電子部品装着装置１に利用されてもよい。また、洗浄は基板９１および電子部品９２のいずれか一方のみに行われてもよい。
【００４０】
上記実施の形態ではレーザユニット１６２の取扱を容易とするためにチャンバ１１外にレーザユニット１６２が設けられるが、チャンバ１１内にレーザユニット１６２が配置され、透光部材１６３が省かれてもよい。
【００４１】
【発明の効果】
本発明によれば、減圧環境下にて基板または電子部品を適切に加熱することができる。
【図面の簡単な説明】
【図１】電子部品装着装置の構成を示す正面図。
【図２】電子部品装着装置の構成を示す横断面図。
【図３】チャンバの内部を拡大して示す図。
【図４】電子部品装着装置の動作の流れを示す図。
【図５】動作途上の電子部品装着装置を示す図。
【図６】動作途上の電子部品装着装置を示す図。
【図７】動作途上の電子部品装着装置を示す図。
【図８】動作途上の電子部品装着装置を示す図。
【図９】動作途上の電子部品装着装置を示す図。
【符号の説明】
１　電子部品装着装置
１１　チャンバ
１４　装着部
９１　基板
９２　電子部品
１４４　ヘッド昇降機構
１６１，１６４　ＦＡＢ照射装置
１６２　レーザユニット
１６３　透光部材
Ｓ１１，Ｓ１３，Ｓ１５，Ｓ１９　ステップ。[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a technique for mounting an electronic component on a substrate under a reduced pressure environment.
[0002]
[Prior art]
Conventionally, when mounting an electronic component on a printed wiring board, paste-type solder is applied to the substrate, the electronic component is mounted, and then the electronic component is fixed to the substrate by heating and cooling the substrate. . In recent years, with the miniaturization of the electrode pitch of electronic components, a method of using a conductive resin to bond the electronic component to a substrate has been proposed.
[0003]
[Problems to be solved by the invention]
However, as information devices are further downsized, as represented by portable information terminals, it is difficult for conventional mounting methods to respond to finer pitches of electrodes on electronic components and substrates, and new mounting methods A method is needed. It is assumed that a new mounting method is performed in a reduced pressure environment or a high vacuum environment, and such a method requires a device structure different from mounting under normal pressure.
[0004]
For example, when the substrate or the electronic component is to be heated under a reduced pressure environment before mounting, sufficient heating cannot be performed only by bringing the substrate or the electronic component into contact with the heated member as in the related art. This is because the area where the heated member and the object to be heated actually come into contact with each other is very small, and there is no air that transmits heat between the two.
[0005]
The present invention has been made in view of the above problems, and has as its object to provide a method of appropriately heating a substrate or an electronic component when the electronic component is mounted on the substrate under a reduced pressure environment.
[0006]
[Means for Solving the Problems]
The invention according to claim 1 is an electronic component mounting apparatus for mounting an electronic component on a substrate, wherein the chamber in which the substrate is mounted can be decompressed, and the electronic component is held in the chamber. A mounting unit configured to mount the electronic component on a substrate; and a light irradiating unit configured to irradiate light to the substrate or the electronic component in the chamber.
[0007]
According to a second aspect of the present invention, there is provided the electronic component mounting apparatus according to the first aspect, further comprising a cleaning unit that performs plasma cleaning on the substrate or the electronic component in the chamber.
[0008]
The invention according to claim 3 is the electronic component mounting apparatus according to claim 2, wherein the cleaning unit irradiates the substrate or the electronic component with a high-speed atomic beam.
[0009]
According to a fourth aspect of the present invention, there is provided the electronic component mounting apparatus according to the second or third aspect, wherein the arrangement position of the substrate or the electronic component and the position to which light is irradiated when the cleaning is performed by the cleaning unit. Matches.
[0010]
The invention according to claim 5 is the electronic component mounting apparatus according to any one of claims 2 to 4, wherein the cleaning unit has two cleaning units for cleaning a substrate and an electronic component, and the light irradiation. The unit irradiates the substrate with light.
[0011]
The invention according to claim 6 is the electronic component mounting device according to claim 5, further comprising a moving mechanism that moves the mounting portion toward a cleaning unit that cleans the electronic component.
[0012]
According to a seventh aspect of the present invention, in the electronic component mounting apparatus according to any one of the first to sixth aspects, the light irradiation unit is located outside the chamber, and the chamber includes light from the light irradiation unit. A light transmitting member that transmits light.
[0013]
The invention according to claim 8 is an electronic component mounting method for mounting an electronic component on a substrate, comprising: loading a substrate and an electronic component into a chamber; depressurizing an internal space of the chamber; Irradiating the electronic component with light; and mounting the electronic component on the substrate.
[0014]
The invention according to claim 9 is the electronic component mounting method according to claim 8, further comprising a step of performing plasma cleaning on the substrate or the electronic component in parallel with the step of irradiating the light.
[0015]
BEST MODE FOR CARRYING OUT THE INVENTION
FIG. 1 is a front view showing the configuration of the electronic component mounting apparatus 1, and FIG. 2 is a cross-sectional view taken along the arrow AA in FIG. FIG. 1 illustrates a part of the configuration in a cross section. The electronic component mounting device 1 is a device for mounting an electronic component as an IC bare chip on a ceramic substrate under reduced pressure, and has a chamber 11 at the center. The chamber 11 is connected to a rotary pump 112 and a turbo-molecular pump 113 via an exhaust pipe 111 shown in FIG. It is possible to be in a state.
[0016]
As shown in FIGS. 1 and 2, a stage 12 on which a substrate is placed is disposed in a lower part of the chamber 11, and the stage 12 is movable in a horizontal plane by a stage moving mechanism 13. As shown in FIG. 1, a mounting head 14 for holding an electronic component is disposed in an upper portion of the chamber 11, and the mounting head 14 is attached to a shaft 141 inserted into an insertion port of the chamber 11, and the shaft 141 rotates the head. Connected to mechanism 143. Outside the chamber 11, the shaft 141 is covered at one end with the shaft 141 side and at the other end with a bellows 142 attached to the chamber 11 side, so that an insertion opening into which the shaft 141 is inserted is isolated from the outside. The head rotating mechanism 143 is moved up and down by a head elevating mechanism 144, and the mounting head 14 is rotated around a shaft 141 and moved up and down by the head rotating mechanism 143 and the head elevating mechanism 144.
[0017]
A camera unit 151 is arranged on the side inside the chamber 11, and the camera unit 151 is housed in a housing 152 inserted into an opening in a side wall of the chamber 11. The camera unit 151 and the housing 152 are connected to a camera moving mechanism 153 outside the chamber 11 and can move forward and backward in a direction toward the center of the chamber 11. The housing 152 is covered with the bellows 154 outside the chamber 11, and an opening in a side wall of the chamber 11 is isolated from the outside.
[0018]
An FAB irradiation device 161 that irradiates a fast atom beam of argon (Fast Atom Beam, hereinafter referred to as “FAB”) toward a substrate is attached to an upper portion of the chamber 11. A laser unit 162 is arranged adjacent to the FAB irradiation device 161. As a light source of the laser unit 162, a CO 2 laser, an excimer laser, or the like is used.
[0019]
A quartz light transmitting member 163 that transmits laser light from the laser unit 162 is attached to the upper surface of the chamber 11, and the laser light from the laser unit 162 transmits through the light transmitting member 163 and irradiates the substrate in the chamber 11. Is done. A FAB irradiator 164 that irradiates the electronic components held by the mounting head 14 with FAB is provided below the chamber 11.
[0020]
As shown in FIG. 2, a gate 115 that can be opened and closed is provided on the side surface of the chamber 11, and the substrate 91 and the electronic component 92 are carried into the chamber 11 while being held by arms 951 and 952, respectively. The substrate 91 is suction-adsorbed to the lower surface of the arm 951, and the electronic component 92 is suction-adsorbed to the upper surface of the arm 952.
[0021]
FIG. 3 is an enlarged view showing the inside of the chamber 11. The stage moving mechanism 13 has two moving tables 1311 and 1312, and the two moving tables 1311 and 1312 move in a direction perpendicular to the plane of FIG. 3 by a motor 1321 (see FIG. 2), a guide rail, and a ball screw mechanism. The upper moving table 1312 is moved in the left-right direction by a motor 1322, a guide rail, and a ball screw mechanism. The stage 12 can be freely moved in a horizontal plane by the stage moving mechanism 13. An opening 133 is formed in the upper moving table 1312, and the mounting head 14 and the FAB irradiation device 164 face each other via the opening 133 in the state shown in FIG.
[0022]
FIG. 4 is a diagram showing a flow of the operation of the electronic component mounting apparatus 1. In the electronic component mounting apparatus 1, first, as shown in FIG. 5, the substrate 91 is opened from the gate 115 of the chamber 11, and the substrate 91 and the electronic component 92 are carried into the chamber 11 by the arms 951 and 952. At this time, as shown in FIG. 3, the substrate 91 is located above so as to face the stage 12, and the electronic component 92 is located below so as to face the mounting head 14.
[0023]
Thereafter, as shown in FIG. 6, the arm 951 descends to bring the substrate 91 into contact with the stage 12. The stage 12 is an electrostatic chuck. When the stage 12 holds the substrate 91 by electrostatic attraction, the arm 951 releases the attraction and retracts to the outside of the chamber 11. On the other hand, the arm 952 moves up to move the electronic component 92 to the vicinity of the mounting head 14, and the mounting head 14 is lowered by the head lifting / lowering mechanism 144, and the electronic component 92 is sucked and sucked (step S11).
[0024]
Here, the mounting head 14 can be held by suction and held by a mechanical chuck. When the arm 952 releases the suction of the electronic component 92 and retreats to the outside of the chamber 11, the mounting head 14 uses the electronic component 92. Is switched from suction to suction to holding by the mechanical chuck (step S12).
[0025]
When the substrate 91 and the electronic component 92 are held in the chamber 11, the gate 115 is closed, the pressure in the chamber 11 is reduced by the rotary pump 112, and the inside of the chamber 11 is reduced by the turbo molecular pump 113 (that is, around the electronic component 92). Are brought into a high vacuum state (step S13, see FIG. 1). Thereafter, the mounting head 14 is lowered, and as shown in FIG. 7, the distance between the electronic component 92 and the FAB irradiation device 164 is made substantially equal to the distance between the substrate 91 and the FAB irradiation device 161 (step S14). . Thus, even when the FAB irradiation device 164 cannot be disposed near the mounting head 14 due to structural reasons, the electronic component 92 can be sufficiently irradiated with the FAB.
[0026]
In the state shown in FIG. 7, the FAB is irradiated from the FAB irradiation device 161 toward the substrate 91, and the FAB is irradiated from the FAB irradiation device 164 toward the electronic component 92. Thereby, the surfaces of the electrodes of the substrate 91 and the electronic component 92 are cleaned (that is, unnecessary substances on the surface are removed and the surface is activated). The FAB from the FAB irradiation device 164 is performed via the opening 133 of the moving table 1312 shown in FIG.
[0027]
The laser unit 162 is disposed so that the position of the substrate 91 at the time of cleaning and the irradiation position of the laser light coincide with each other, and the laser light from the laser unit 162 transmits the light transmitting member in parallel with the irradiation of the FAB. Irradiation is performed on the substrate 91 via 163, and the substrate 91 is heated to 150 to 200 ° C. (Step S15).
[0028]
When the irradiation of the FAB and the laser beam is completed, the mounting head 14 moves up as shown in FIG. 8, and the stage 12 moves below the mounting head 14. Further, the camera unit 151 enters between the mounting head 14 and the stage 12 together with the housing 152 by the camera moving mechanism 153, and moves to a position where the electronic component 92 and the substrate 91 are imaged (step S16).
[0029]
The camera unit 151 has two imaging devices and an optical system for guiding light from above and below the housing 152 to the imaging devices, respectively. In the state shown in FIG. And an image of the lower substrate 91 are simultaneously obtained. The camera unit 151 receives illumination light from a separately provided light source unit. Then, the head rotating mechanism 143 adjusts the direction of the electronic component 92 based on both the acquired images, and the stage moving mechanism 13 aligns the center of the electronic component 92 with the center of the mounting position on the substrate 91. Thus, the alignment (alignment) between the electronic component 92 and the substrate 91 is completed (Step S17).
[0030]
When the alignment is completed, the camera unit 151 retreats to the side wall of the chamber 11 as shown in FIG. 9 (step S18), and the head lifting / lowering mechanism 144 lowers the mounting head 14 to mount the electronic component 92 on the substrate 91 (step S18). S19). As a result, the electrodes of the electronic component 92 and the electrodes of the substrate 91 are bonded by a strong bonding force between the atoms, and the electronic component 92 is fixed on the substrate 91. Since the substrate 91 is placed in a high vacuum, the substrate 91 heated by the laser beam is maintained at a high temperature even when the electronic component 92 is mounted. The parallelism of the mounting head 14 is adjusted in advance by an adjusting mechanism 145 provided above the mounting head 14, and when the electronic component 92 is mounted on the substrate 91, the electronic component 92 is attached to the substrate 91. The controlling force is controlled.
[0031]
When the mounting is completed, the mounting head 14 is raised, the inside of the chamber 11 is returned to the atmospheric pressure, and the gate 115 is opened. The mounted substrate 91 is carried out of the chamber 11 by another arm (step S20).
[0032]
As described above, in the electronic component mounting apparatus 1, mounting is performed in a high vacuum, and the electronic component 92 is mounted on the substrate 91 without using an adhesive material. As a result, the reliability of bonding between the fine electrodes is improved.
[0033]
In addition, by heating the substrate 91 with a laser beam at the time of mounting, it is possible to appropriately (ie, sufficiently and quickly) heat the substrate 91 even under a reduced pressure environment. Furthermore, since only the substrate 91 is heated, almost no thermal distortion occurs in the device, and the positioning accuracy between the electronic component 92 and the substrate 91 is improved.
[0034]
Since the laser light irradiation is performed in parallel with the irradiation of the FAB on the substrate 91, the substrate 91 does not need to be moved separately to irradiate the laser light. The production capacity of No. 1 does not decrease.
[0035]
As mentioned above, although one Embodiment of this invention was described, this invention is not limited to the said Embodiment, A various deformation | transformation is possible.
[0036]
In the above embodiment, the substrate 91 is a ceramic substrate. However, the electronic component mounting apparatus 1 can be used to mount the electronic component 92 on another substrate such as a semiconductor substrate or a film substrate.
[0037]
In the above embodiment, the substrate 91 is irradiated with laser light; however, light used to heat the substrate 91 is not limited to laser light. For example, light from a halogen lamp may be applied to the substrate 91. Note that the entire substrate 91 may be irradiated with light, or the light may be irradiated as a spot. By irradiating light as a spot, only the mounting area of the electronic component 92 can be efficiently heated.
[0038]
When the substrate 91 is heated as in the above embodiment, it is not necessary to control the heating temperature accurately. However, in the case of the electronic component 92 having excellent heat resistance, the electronic component 92 (or the substrate 91 and The heating may be performed by irradiating the electronic component 92) with light.
[0039]
In the above embodiment, the substrate 91 and the electronic component 92 are cleaned by the FAB. However, the cleaning by the FAB is a type of plasma cleaning, and another type of plasma cleaning may be used in the electronic component mounting apparatus 1. . The cleaning may be performed on only one of the substrate 91 and the electronic component 92.
[0040]
In the above embodiment, the laser unit 162 is provided outside the chamber 11 to facilitate the handling of the laser unit 162. However, the laser unit 162 may be disposed inside the chamber 11 and the light transmitting member 163 may be omitted.
[0041]
【The invention's effect】
According to the present invention, a substrate or an electronic component can be appropriately heated under a reduced pressure environment.
[Brief description of the drawings]
FIG. 1 is a front view showing the configuration of an electronic component mounting apparatus.
FIG. 2 is a cross-sectional view showing the configuration of the electronic component mounting apparatus.
FIG. 3 is an enlarged view showing the inside of a chamber.
FIG. 4 is a diagram showing a flow of operation of the electronic component mounting apparatus.
FIG. 5 is a diagram showing the electronic component mounting device in operation.
FIG. 6 is a diagram showing the electronic component mounting apparatus in operation.
FIG. 7 is a diagram showing the electronic component mounting apparatus in operation.
FIG. 8 is a diagram showing the electronic component mounting apparatus in the course of operation.
FIG. 9 is a diagram showing the electronic component mounting apparatus in operation.
[Explanation of symbols]
1 Electronic component mounting device 11 Chamber 14 Mounting portion 91 Substrate 92 Electronic component 144 Head lifting mechanism 161, 164 FAB irradiation device 162 Laser unit 163 Translucent members S11, S13, S15, S19 Step.

Claims (9)

電子部品を基板に装着する電子部品装着装置であって、
基板が載置される内部空間が減圧可能なチャンバと、
前記チャンバ内にて電子部品を保持するとともに前記電子部品を基板に装着する装着部と、
前記チャンバ内の基板または電子部品に向けて光を照射する光照射部と、
を備えることを特徴とする電子部品装着装置。An electronic component mounting device for mounting an electronic component on a substrate,
A chamber in which the internal space in which the substrate is placed can be decompressed,
A mounting unit that holds the electronic component in the chamber and mounts the electronic component on a substrate;
A light irradiating unit that irradiates light toward the substrate or the electronic component in the chamber,
An electronic component mounting apparatus comprising: 請求項１に記載の電子部品装着装置であって、
前記チャンバ内の基板または電子部品に対してプラズマ洗浄を行う洗浄部をさらに備えることを特徴とする電子部品装着装置。The electronic component mounting device according to claim 1,
The electronic component mounting apparatus further includes a cleaning unit that performs plasma cleaning on the substrate or the electronic component in the chamber. 請求項２に記載の電子部品装着装置であって、
前記洗浄部が、高速原子ビームを基板または電子部品に照射することを特徴とする電子部品装着装置。The electronic component mounting device according to claim 2,
The cleaning device irradiates a substrate or an electronic component with a high-speed atomic beam. 請求項２または３に記載の電子部品装着装置であって、
前記洗浄部により洗浄が行われる際の基板または電子部品の配置位置と光が照射される位置とが一致することを特徴とする電子部品装着装置。The electronic component mounting device according to claim 2 or 3,
An electronic component mounting apparatus, wherein a position where a substrate or an electronic component is arranged when cleaning is performed by the cleaning unit coincides with a position where light is irradiated. 請求項２ないし４のいずれかに記載の電子部品装着装置であって、
前記洗浄部が基板および電子部品を洗浄する２つの洗浄ユニットを有し、前記光照射部が前記基板に光を照射することを特徴とする電子部品装着装置。The electronic component mounting device according to any one of claims 2 to 4,
The electronic component mounting device, wherein the cleaning unit has two cleaning units for cleaning the substrate and the electronic component, and the light irradiation unit irradiates the substrate with light. 請求項５に記載の電子部品装着装置であって、
電子部品を洗浄する洗浄ユニットに向かって前記装着部を移動させる移動機構をさらに備えることを特徴とする電子部品装着装置。The electronic component mounting device according to claim 5,
An electronic component mounting apparatus, further comprising a moving mechanism for moving the mounting portion toward a cleaning unit for cleaning the electronic component. 請求項１ないし６のいずれかに記載の電子部品装着装置であって、前記光照射部が前記チャンバ外に位置し、
前記チャンバが前記光照射部からの光を透過する透光部材を有することを特徴とする電子部品装着装置。The electronic component mounting device according to any one of claims 1 to 6, wherein the light irradiation unit is located outside the chamber,
The electronic component mounting apparatus, wherein the chamber has a light transmitting member that transmits light from the light irradiation unit. 電子部品を基板に装着する電子部品装着方法であって、
チャンバに基板および電子部品を搬入する工程と、
前記チャンバの内部空間を減圧する工程と、
前記基板または前記電子部品に向けて光を照射する工程と、
前記基板に前記電子部品を装着する工程と、
を有することを特徴とする電子部品装着方法。An electronic component mounting method for mounting an electronic component on a board,
Loading a substrate and electronic components into the chamber;
Depressurizing the internal space of the chamber;
Irradiating the substrate or the electronic component with light,
Mounting the electronic component on the board;
An electronic component mounting method, comprising: 請求項８に記載の電子部品装着方法であって、
前記光を照射する工程と並行して前記基板または前記電子部品にプラズマ洗浄を行う工程をさらに有することを特徴とする電子部品装着方法。An electronic component mounting method according to claim 8, wherein
An electronic component mounting method, further comprising a step of performing plasma cleaning on the substrate or the electronic component in parallel with the step of irradiating the light.
JP2002223493A 2002-07-31 2002-07-31 Electronic component mounting apparatus and electronic component mounting method Expired - Fee Related JP4048087B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002223493A JP4048087B2 (en) 2002-07-31 2002-07-31 Electronic component mounting apparatus and electronic component mounting method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002223493A JP4048087B2 (en) 2002-07-31 2002-07-31 Electronic component mounting apparatus and electronic component mounting method

Publications (2)

Publication Number Publication Date
JP2004063998A true JP2004063998A (en) 2004-02-26
JP4048087B2 JP4048087B2 (en) 2008-02-13

Family

ID=31943228

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002223493A Expired - Fee Related JP4048087B2 (en) 2002-07-31 2002-07-31 Electronic component mounting apparatus and electronic component mounting method

Country Status (1)

Country Link
JP (1) JP4048087B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8112721B2 (en) 2006-12-01 2012-02-07 Fujifilm Corporation Image reproduction device and method thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8112721B2 (en) 2006-12-01 2012-02-07 Fujifilm Corporation Image reproduction device and method thereof

Also Published As

Publication number Publication date
JP4048087B2 (en) 2008-02-13

Similar Documents

Publication Publication Date Title
WO2018147147A1 (en) Component mounting system, resin shaping device, resin placing device, component mounting method, and resin shaping method
JP6232667B2 (en) Substrate bonding method
TWI445067B (en) The method of expansion of the workpiece
WO2020044580A1 (en) Component mounting system and component mounting method
US9960069B2 (en) Joining device and joining system
JP7542885B2 (en) Bonding method and bonding device
US20150017782A1 (en) Bonding device and bonding method
JP2002261491A (en) Component holding head, component mounter and mounting method using it
JP2014113633A (en) Bonding method and bonding device
KR102361309B1 (en) Apparatus and method for removing mini led chip, and system and method for repairing mini led display module using the same
JP5008952B2 (en) Die bonder and die bonding method
US20160001543A1 (en) Bonding device, bonding system, and bonding method
JP2009182213A (en) Fpc crimping device
JP4048087B2 (en) Electronic component mounting apparatus and electronic component mounting method
JP2005251978A (en) Electronic component mounting apparatus and method therefor
JP4077681B2 (en) Holding method and electronic component mounting method
JP2011216616A (en) Component mounting apparatus and component mounting method
JP2006007321A (en) Equipment and method for joining
JP2003303854A (en) Chip mounting method and apparatus using it
JP3882710B2 (en) Electronic component mounting device
JP3876200B2 (en) Electronic component mounting method, electronic component mounting device, position detection method, and positioning device
JP3773201B2 (en) Delivery method and apparatus for workpieces
JP4046076B2 (en) Electronic component mounting device
JPH04192554A (en) Method and apparatus for assembly of electronic component
JP3868865B2 (en) Electronic component mounting device, electronic component mounting method, pressing device, and pressing method

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20050609

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20070424

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20070501

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20070625

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20070724

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20070913

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20071030

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20071126

FPAY Renewal fee payment (prs date is renewal date of database)

Free format text: PAYMENT UNTIL: 20101130

Year of fee payment: 3

R150 Certificate of patent (=grant) or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (prs date is renewal date of database)

Free format text: PAYMENT UNTIL: 20111130

Year of fee payment: 4

FPAY Renewal fee payment (prs date is renewal date of database)

Free format text: PAYMENT UNTIL: 20111130

Year of fee payment: 4

FPAY Renewal fee payment (prs date is renewal date of database)

Free format text: PAYMENT UNTIL: 20121130

Year of fee payment: 5

LAPS Cancellation because of no payment of annual fees