JP2004048714A - Ceramic lamination device, manufacturing method thereof and communication device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a ceramic lamination device, a communication device, and a manufacturing method of the ceramic lamination device capable of ensuring reliability while retaining high frequency characteristics. <P>SOLUTION: The ceramic lamination device is formed inside of a lamination body 1 having a plurality of ceramic layers 4, a plurality of inner electrodes 2, and a plurality of interbedded via-holes 3 each laminated therein. Further, the device comprises a toughening electrode 40 mechanically connected to the ceramic layers 4, and not electrically connected to the inner electrodes 2 and the interlayer via-holes 3. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a ceramic multilayer device, a communication device, and a method of manufacturing a ceramic multilayer device used for high-frequency wireless devices such as mobile phones.
[0002]
[Prior art]
2. Description of the Related Art In recent years, ceramic laminated devices have attracted much attention as greatly contributing to miniaturization of high-frequency wireless devices such as mobile phones.
[0003]
Here, the configuration of a conventional ceramic laminated device (for example, see Patent Document 1) used in a high-frequency wireless device will be described with reference to FIG.
[0004]
FIG. 13 is a schematic perspective view of a conventional ceramic laminated device.
[0005]
The conventional ceramic laminated device has a structure in which ceramic layers 61 and electrode patterns 62 are alternately laminated.
[0006]
The electrode patterns 62 formed inside the stacked body 63 constitute a high-frequency circuit, and are electrically connected to each other by interlayer via holes 64.
[0007]
Further, on the upper and lower surfaces of the stacked body 63, shield electrodes 65a to 65b for maintaining the shielding property with the outside are formed.
[0008]
Further, on the left and right end surfaces of the laminated body 63, there are provided end surface electrodes 66a to 66b which are electrically connected to the shield electrodes 65a to 65b to form ground terminals, and input / output terminals for inputting and outputting electric signals to and from the outside. The terminal electrodes 67a to 67b to be formed are formed.
[0009]
The conventional ceramic laminated device configured as described above is mounted on a printed circuit board by soldering a ground electrode (not shown) on the printed circuit board to the end surface electrodes 66a to 66b, and routing on the printed circuit board. The soldering is performed using the soldered high frequency signal electrode (not shown) and the terminal electrodes 67a to 67b.
[0010]
[Patent Document 1]
JP-A-10-303068
[0011]
[Problems to be solved by the invention]
However, in such a configuration of the conventional ceramic laminated device, the low-temperature fired ceramic used as the ceramic layer 61 generally has low bending strength. Therefore, for example, the strength of the sintering bond between the ceramic layer 61 and the end electrodes 66a, 66b and the terminal electrodes 67a, 67b may be reduced.
[0012]
As a result, when a reliability test (particularly, a drop test) after mounting on a printed board is performed, (1) the laminate 63 is peeled off from the printed board, or (2) the printed board and the end face electrodes 66a to 66b. In some cases, cracks occurred near the joints with the terminal electrodes 67a to 67b.
[0013]
Further, in the conventional ceramic multilayer device, when a semiconductor element (semiconductor bare chip), a SAW filter, a chip component, or the like is solder-mounted on the shield electrode 65b formed on the multilayer body 63, the solder joint may be weakened. there were.
[0014]
As described above, in the conventional ceramic laminated device, it has been difficult to secure reliability while maintaining good high-frequency characteristics.
[0015]
The present invention has been made in consideration of the above-described conventional problems, and provides a ceramic multilayer device, a communication device, and a method of manufacturing a ceramic multilayer device that can ensure reliability while maintaining good high-frequency characteristics. Aim.
[0016]
[Means for Solving the Problems]
The first aspect of the present invention is formed inside a laminate in which a plurality of ceramic layers and a plurality of electrode layers are stacked, and is not electrically connected to the electrode layers but is mechanically connected to the ceramic layers. It is a ceramic laminated device provided with an internal member.
[0017]
A second aspect of the present invention is the ceramic multilayer device according to the first aspect, wherein the internal member is a single or plural planar internal members provided substantially in parallel with the ceramic layer.
[0018]
The third invention further includes a shield electrode formed on an upper surface and / or a lower surface of the laminate,
The shape of the planar internal member is the same as the shape of the shield electrode in the ceramic multilayer device of the second aspect of the present invention.
[0019]
The fourth invention further includes a shield electrode formed on an upper surface and / or a lower surface of the laminate,
The shape of the planar internal member is a ceramic laminated device according to a second aspect of the present invention, which is different from the shape of the shield electrode.
[0020]
The fifth invention further includes a shield electrode formed on an upper surface and / or a lower surface of the laminate,
The first member is a single or a plurality of three-dimensional internal members provided substantially perpendicular to the ceramic layer on at least a surface of the ceramic layer to which the shield electrode is attached, on a surface of the ceramic layer on the shield electrode side. The ceramic laminated device of the invention.
[0021]
A sixth aspect of the present invention further includes a shield electrode formed on an upper surface and / or a lower surface of the laminate,
The internal member may be (1) a single member provided substantially perpendicular to the ceramic layer on the ceramic layer located between the shield electrode and the flat internal member; It is a ceramic laminated device of the second present invention, which is a plurality of three-dimensional internal members.
[0022]
In a seventh aspect of the present invention, a plurality of the flat inner members are provided,
At least a part of the three-dimensional internal member is a ceramic multilayer device according to a sixth aspect of the present invention, which is provided in the ceramic layer between the planar internal members.
[0023]
An eighth invention is the ceramic multilayer device according to any of the fifth to seventh inventions, wherein the three-dimensional internal member is a via hole filled with a conductive paste or a dielectric paste.
[0024]
A ninth aspect of the present invention is directed to a side electrode formed on a side surface of a multilayer body in which a plurality of ceramic layers and a plurality of electrode layers are stacked;
A ceramic laminated device comprising: an internal member formed inside the laminate, not electrically connected to the electrode layer, but mechanically connected to the side electrode.
[0025]
According to a tenth aspect of the present invention, the side electrode is a terminal electrode formed on an end face of the laminate, for inputting and outputting an electric signal to and from the outside.
The ceramic laminated device according to claim 9, wherein the internal member is a planar internal member that is mechanically connected to all or a part of the terminal electrode and is provided substantially in parallel with the ceramic layer.
[0026]
An eleventh aspect of the present invention further includes an upper shield electrode formed on an upper surface of the laminate, and a lower shield electrode formed on a lower surface of the laminate,
The side surface electrode is an end surface electrode formed on an end surface of the laminate, for electrically connecting the upper surface shield electrode and the lower surface shield electrode,
The ceramic laminated device according to claim 9, wherein the internal member is a planar internal member that is mechanically connected to all or a part of the end face electrode and is provided substantially in parallel with the ceramic layer.
[0027]
The twelfth invention is the ceramic multilayer device according to claim 1 or 9, wherein a semiconductor element and / or a SAW filter are mounted on an upper surface of the multilayer body.
[0028]
A thirteenth aspect of the present invention is the ceramic laminated device according to claim 1 or 9, wherein a filter is built in the laminate.
[0029]
14. The multilayer ceramic device according to claim 13, wherein the filter has a function as a duplexer having a transmission filter function for transmitting a signal and a reception filter function for receiving a signal. It is.
[0030]
A fifteenth aspect of the present invention provides a communication circuit for performing communication using transmission and / or reception of a signal,
A communication device comprising: the ceramic multilayer device according to claim 1, wherein filtering is performed during the communication.
[0031]
A sixteenth invention is a method for manufacturing a ceramic laminated device according to claim 1,
A method for manufacturing a ceramic laminated device, comprising an internal member forming step of forming the internal member inside the laminate so as to be electrically connected to the ceramic layer without being electrically connected to the electrode layer. It is.
[0032]
The seventeenth invention is a method for manufacturing a ceramic laminated device according to claim 9,
A method of manufacturing a ceramic laminated device, comprising an internal member forming step of forming the internal member inside the laminate so as to be electrically connected to the side electrode without being electrically connected to the electrode layer. It is.
[0033]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
[0034]
(Embodiment 1)
The configuration and operation of the ceramic laminated device according to the present embodiment will be described with reference to FIG.
[0035]
In addition, while describing the configuration and operation of the ceramic laminated device of the present embodiment, one embodiment of a method of manufacturing a ceramic laminated device of the present invention will be described (the same applies to other embodiments). .
[0036]
FIG. 1 is a schematic perspective view of the ceramic multilayer device according to Embodiment 1 of the present invention.
[0037]
The ceramic multilayer device of the present embodiment has a multilayer body 1.
[0038]
Inside the laminated body 1, an internal electrode 2 constituting a high-frequency circuit is formed.
[0039]
The internal electrodes 2 are electrically connected to each other through a plurality of interlayer via holes 3.
[0040]
Each layer electrode pattern formed inside the laminate 1 is formed by screen printing or the like using a conductive paste containing silver or copper as a main component.
[0041]
The plurality of interlayer via holes 3 are formed by filling a hole penetrating the ceramic layer 4 constituting the laminate 1 with a conductive paste containing silver or copper as a main component and sintering the hole.
[0042]
Shield electrodes 5a to 5b are formed on the upper and lower surfaces of the multilayer body 1 to maintain the shielding property with the outside.
[0043]
On the left and right end surfaces of the laminate 1, end surface electrodes 6a to 6b which are electrically connected to the shield electrodes 5a to 5b to form ground terminals, and input / output terminals for inputting / outputting electric signals to / from the outside are formed. Terminal electrodes 7a and 7b are formed.
[0044]
The features of the ceramic multilayer device of the present embodiment can be seen in the vicinity of the lowermost portion of the multilayer body 1 in the ceramic layer 4.
[0045]
More specifically, on the upper surface of the lowermost layer of the multilayer body 1 in the ceramic layer 4, a reinforcing electrode 40 for strengthening the adhesion with the layer immediately above the lower layer is arranged.
[0046]
Thus, the adhesive strength of the ceramic layer 4 constituting the laminate 1 was able to be improved, and a reliability test including a drop test showed that the laminate had excellent stress resistance and excellent reliability.
[0047]
{Circle around (1)} As a dielectric material used for the ceramic layer, a low dielectric constant ceramic material such as Al—Mg—Si—Gd—O (relative permittivity = 7.5) or Bi—Ca—Nb—O There are high dielectric constant ceramic materials such as a system (relative dielectric constant = 58) and glass ceramic. However, any ceramic material adapted to the required electrical characteristics may be used, but it is desirable to use a ceramic material having as large a transverse rupture strength as possible.
[0048]
{Circle around (2)} For each ceramic layer, ceramic materials having different dielectric constants may be used. However, when ceramic materials having different dielectric constants are used, a good warpage easily occurs due to a difference in thermal expansion coefficient during sintering. For this reason, it is preferable that the arrangement of the ceramic materials is symmetric with respect to the laminating direction (for example, like material A, material B, material C, material B, material A).
[0049]
The ceramic layer 4 corresponds to the ceramic layer of the present invention, the means including the internal electrodes 2 and the interlayer via holes 3 corresponds to the electrode layer of the present invention, and the laminate 1 corresponds to the laminate of the present invention. Numeral 40 corresponds to the flat internal member of the present invention.
[0050]
(Embodiment 2)
The configuration and operation of the ceramic laminated device according to the present embodiment will be described with reference to FIG.
[0051]
FIG. 2 is an exploded perspective view of the ceramic multilayer device according to Embodiment 2 of the present invention.
[0052]
The ceramic laminated device of the present embodiment has a laminated body in which an electrode pattern 32 is formed on the surface of six ceramic layers 31.
[0053]
The electrode pattern 32 is electrically connected via an interlayer via hole 33.
[0054]
Shield electrodes 34a to 34b are formed on the upper and lower surfaces of the laminate to maintain the shielding property with the outside.
[0055]
On the left and right end faces of the laminate, end face electrodes 35a to 35d, 36a to 36b connected to the shield electrodes 34a to 34b to form ground terminals, and input / output terminals for inputting and outputting electric signals to and from the outside are formed. Terminal electrodes 37a to 37b are formed.
[0056]
The features of the ceramic laminated device of the present embodiment are found in the vicinity of the lowermost portion of the laminated body in the ceramic layer 31.
[0057]
More specifically, on the upper surface of the lowermost layer of the stacked body in the ceramic layer 31, a reinforcing electrode 40a for strengthening the adhesion with the layer immediately above is disposed. The shape of the reinforcing electrode 40a is the same as the shape of the shield electrodes 34a to 34b.
[0058]
Thus, the adhesive strength of the ceramic layer 31 constituting the laminate could be improved, and the reliability test including the drop test showed that the ceramic layer 31 was excellent in stress resistance and excellent in reliability.
[0059]
{Circle around (1)} Similar effects can be obtained for other numbers, shapes and thicknesses of the electrodes.
[0060]
The ceramic layer 31 corresponds to the ceramic layer of the present invention, the means including the electrode pattern 32 and the interlayer via hole 33 corresponds to the electrode layer of the present invention, and the shield electrodes 34a to 34b correspond to the shield electrode of the present invention. The reinforcing electrode 40a corresponds to the planar internal member of the present invention.
[0061]
(Embodiment 3)
The configuration and operation of the ceramic laminated device according to the present embodiment will be described with reference to FIG.
[0062]
FIG. 3 is an exploded perspective view of the ceramic multilayer device according to the third embodiment of the present invention.
[0063]
The feature of the ceramic laminated device of the present embodiment is seen near the lowermost portion of the laminate in the ceramic layer 31 (since the other configuration is the same as the configuration of the ceramic laminated device of the above-described second embodiment, Detailed explanation is omitted).
[0064]
More specifically, reinforcing electrodes 40b to 40c for strengthening adhesion to a layer one layer above are arranged on the upper surface of the lowermost layer of the stacked body in the ceramic layer 31. . The shapes of the reinforcing electrodes 40b to 40c are different from the shapes of the shield electrodes 34a to 34b.
[0065]
Thus, the adhesive strength of the ceramic layer 31 constituting the laminate could be improved, and the reliability test including the drop test showed that the ceramic layer 31 was excellent in stress resistance and excellent in reliability.
[0066]
{Circle around (1)} In the above-described first to third embodiments, the number of ceramic layers on which the reinforcing electrodes are arranged is one, but the number is not limited to this, and the number of such ceramic layers is two or more. (See FIGS. 4 and 5).
[0067]
However, by increasing the number of ceramic layers on which such reinforcing electrodes are arranged, the electrical distance between the upper and lower shield electrodes tends to be shorter.
[0068]
For example, in FIG. 4, the electric distance between the shield electrodes 34a to 34b is the distance X because the reinforcing electrodes 40d to 40e are arranged. In FIG. 5, since the reinforcing electrodes 40f to 40g are arranged, the electrical distance between the shield electrodes 34a to 34b is the distance Y.
[0069]
For this reason, if the number of the ceramic layers on which the reinforcing electrodes are arranged is too large, the characteristics of the high-frequency circuit formed inside the laminate may deteriorate. Therefore, it is preferable that the number of ceramic layers on which the reinforcing electrodes are arranged is not too large.
[0070]
However, when the shape of the reinforcing electrode is different from the shape of the shield electrode as in the above-described third embodiment, a gap (that is, a portion where electrode printing is not performed) is provided in the center of the reinforcing electrode, It is possible to prevent the electrical distance between the upper and lower shield electrodes from becoming short.
[0071]
Of course, when the shape of the reinforcing electrode is the same as the shape of the shield electrode as in the second embodiment, there is an advantage that the manufacturing process is simpler.
[0072]
{Circle over (2)} When the arrangement of the reinforcing electrodes is symmetric with respect to the laminating direction, a favorable effect can be expected because a good warpage does not easily occur due to a difference in the coefficient of thermal expansion during sintering (see FIG. 5). ).
[0073]
The ceramic layer 31 corresponds to the ceramic layer of the present invention, the means including the electrode pattern 32 and the interlayer via hole 33 corresponds to the electrode layer of the present invention, and the shield electrodes 34a to 34b correspond to the shield electrode of the present invention. The reinforcing electrodes 40b to 40c correspond to the flat internal member of the present invention.
[0074]
(Embodiment 4)
The configuration and operation of the ceramic laminated device according to the present embodiment will be described with reference to FIG.
[0075]
FIG. 6 is a schematic perspective view of a ceramic laminated device according to Embodiment 4 of the present invention.
[0076]
The feature of the ceramic laminated device of the present embodiment is seen in the vicinity of the shield electrode 5a formed on the lower side of the laminated body 1 (other configurations are the same as those of the above-described ceramic laminated device of the first embodiment. Detailed description is omitted here).
[0077]
More specifically, one of the ceramic layers 4 located at the bottom of the multilayer body 1 is mechanically connected at one end to a shield electrode 5 a formed on the lower surface of the multilayer body 1. A plurality of via holes 8 whose ends are electrically open are arranged.
[0078]
The via hole 8 is formed by filling a hole penetrating the ceramic layer 4 constituting the multilayer body 1 with a conductive paste (or a dielectric paste) and sintering it. The via hole 8 is a via hole for ensuring adhesion between the ceramic layer 4 and the shield electrode 5a.
[0079]
Thus, the adhesive strength between the ceramic layer 4 constituting the laminate 1 and the shield electrode 5a can be improved, and the reliability test including the drop test is excellent in stress resistance and excellent in reliability. I was able to.
[0080]
More specifically, in such a reliability test, peeling from the printed circuit board, cracks in the end face electrodes 6a to 6b, terminal electrodes 7a to 7b, and cracks in the laminate 1 did not occur. .
[0081]
The actually manufactured laminate 1 of the present embodiment has a size of 8.5 mm in width × 4.5 mm in depth × 2.0 mm in height.
[0082]
In the shield electrode 5a on the lower surface of the laminate 1, fifteen via holes 8 each having a length of 140 μm, one end of which is connected to the shield electrode 5a and the other end of which is open, are arranged at substantially equal intervals.
[0083]
The laminate 1 of the present embodiment and five of the conventional laminates were solder-mounted on a printed circuit board at regular intervals.
[0084]
When a drop test was performed, most of the conventional laminates had a defect of peeling or cracking from the printed circuit board. However, in the laminate 1 of the present embodiment, all of the five laminates showed such a defect. Did not occur.
[0085]
Therefore, it can be seen that the reliability was greatly improved and a sufficient effect was obtained.
[0086]
Note that the ceramic layer 4 corresponds to the ceramic layer of the present invention, the means including the internal electrode 2 and the interlayer via hole 3 corresponds to the electrode layer of the present invention, and the laminate 1 corresponds to the laminate of the present invention. 5a to 5b correspond to the shield electrode of the present invention, and the via hole 8 corresponds to a via hole provided in the ceramic layer to which the shield electrode of the present invention is attached.
[0087]
(Embodiment 5)
The configuration and operation of the ceramic laminated device according to the present embodiment will be described with reference to FIG.
[0088]
FIG. 8 is a cross-sectional view of a ceramic multilayer device according to Embodiment 5 of the present invention.
[0089]
The ceramic multilayer device of the present embodiment has a laminate 11.
[0090]
Internal electrodes 12 that constitute a high-frequency circuit are formed inside the laminate 11.
[0091]
The internal electrodes 12 are electrically connected to each other via an interlayer via hole 13.
[0092]
The interlayer via hole 13 is formed by filling a hole penetrating the ceramic layers 14a to 14g constituting the laminate 11 with a conductive paste containing silver or copper as a main component and sintering the hole.
[0093]
Shield electrodes 15a to 15b are formed on the upper and lower surfaces of the multilayer body 11 to maintain the shielding property with the outside.
[0094]
A terminal electrode (not shown) and an end face electrode (not shown) are formed on the end face of the laminate 11 as in the case of the first embodiment.
[0095]
A planar first via connection electrode 17 that does not function as a circuit element is disposed on the upper surface of the lowermost first ceramic layer 14a.
[0096]
On the upper surface of the second ceramic layer 14b, a planar second via connection electrode 19 that does not function as a circuit element is arranged.
[0097]
The shield electrode 15a formed on the lower surface of the multilayer body 11 and the first via connection electrode 17 are mechanically connected to the first ceramic layer 14a located at the bottom of the multilayer body 11. A plurality of first via holes 16 are arranged.
[0098]
On the second ceramic layer 14b located above the first via connection electrode, a plurality of pieces for mechanically connecting the first via connection electrode 17 and the second via connection electrode 19 are provided. The second via hole 18 is disposed.
[0099]
The first via hole 16 is formed by filling and sintering a conductive paste (or a dielectric paste) into a hole penetrating through the ceramic layers constituting the multilayer body 11. The first via hole 16 is a via hole for ensuring adhesion between the first via connection electrode 17 and the shield electrode 15a.
[0100]
The second via hole 18 is formed by filling a conductive layer (or a dielectric paste) into a hole that penetrates through the ceramic layers constituting the stacked body 11 and sintering the hole. The second via hole 18 is a via hole for ensuring adhesion between the second via connection electrode 19 and the first via connection electrode 17.
[0101]
Thus, the adhesive strength between the ceramic layers 14a to 14b and the shield electrode 15a could be improved, and the reliability test including the drop test showed that it had high stress resistance and was excellent in reliability. .
[0102]
{Circle around (1)} In the present embodiment, the number of via connection electrodes for improving the adhesion strength is two. However, the present invention is not limited to this, and the number of via connection electrodes may be one. Or three (see FIG. 7).
[0103]
However, increasing the number of via connection electrodes tends to shorten the electrical distance between the upper and lower shield electrodes.
[0104]
For example, in FIG. 7, the electrical distance between the shield electrodes 15a to 15b is the distance Z because the via connection electrode 17a is arranged.
[0105]
For this reason, if the number of via connection electrodes is too large, the characteristics of the high-frequency circuit formed inside the laminate may deteriorate. Therefore, it is preferable that the number of via connection electrodes is not too large.
[0106]
{Circle around (2)} When the arrangement of the via connection electrodes is symmetrical with respect to the lamination direction, a favorable effect can be expected because a good warpage is unlikely to occur due to a difference in the coefficient of thermal expansion during sintering.
[0107]
The ceramic layers 14a to 14g correspond to the ceramic layer of the present invention, the means including the internal electrodes 12 and the interlayer via holes 13 corresponds to the electrode layer of the present invention, and the laminate 11 corresponds to the laminate of the present invention. The shield electrodes 15a to 15b correspond to the shield electrode of the present invention, the first via connection electrode 17 and the second via connection electrode 19 correspond to the planar internal member of the present invention, and the first via hole 16 The second via hole 18 corresponds to a via hole provided in the ceramic layer between the shield electrode of the present invention and the planar internal member, and the second via hole 18 is provided in the ceramic layer between the planar internal members of the present invention. (At least a part of the via hole is located between the first via connection electrode 17 and the second via connection electrode 19 in the ceramic layers 14a to 14g. Provided to a ceramic layer 14b).
[0108]
(Embodiment 6)
The configuration and operation of the ceramic laminated device according to the present embodiment will be described with reference to FIG.
[0109]
FIG. 9 is a cross-sectional view of a ceramic multilayer device according to Embodiment 6 of the present invention.
[0110]
The features of the ceramic laminated device of the present embodiment can be seen in the vicinity of the upper part of the laminate 21 (the other configuration is the same as the configuration of the ceramic laminated device of the above-described fifth embodiment, and therefore detailed description is omitted). .
[0111]
More specifically, a planar third via connection electrode 25 that does not function as a circuit element is further disposed on the lower surface of the uppermost ceramic layer 22.
[0112]
A plurality of ceramic layers 22 on the uppermost portion of the multilayer body 21 for mechanically connecting the shield electrode 24 formed on the upper surface of the multilayer body 21 and the third via connection electrode 25 are formed. The third via hole 23 is arranged.
[0113]
The third via hole 23 is formed by filling a conductive layer (or a dielectric paste) into a hole that penetrates the ceramic layer forming the stacked body 21 and sintering the hole. The third via hole 23 is a via hole for ensuring adhesion between the third via connection electrode 25 and the shield electrode 24.
[0114]
Thus, a highly reliable ceramic laminated device can be provided.
[0115]
More specifically, when a semiconductor element, a semiconductor package, a SAW filter, a chip component, or the like is mounted on the upper part of the laminate 21, the adhesive strength between the ceramic layer 22 and the shield electrode 24 above the ceramic layer 22 can be increased. Here, as a mounting method, for example, in the case of a semiconductor element, there is a stack bump bonding (SBB) method or the like.
[0116]
The ceramic layer 22 corresponds to the ceramic layer of the present invention, the laminate 21 corresponds to the laminate of the present invention, the shield electrode 24 corresponds to the shield electrode of the present invention, and the third via connection electrode 25 corresponds to The third via hole 23 corresponds to the via hole provided in the ceramic layer between the shield electrode and the planar internal member of the present invention.
[0117]
(Embodiment 7)
The configuration and operation of the ceramic laminated device according to the present embodiment will be described with reference to FIG.
[0118]
FIG. 10 is an exploded perspective view of a ceramic laminated device according to Embodiment 7 of the present invention.
[0119]
The features of the ceramic laminated device of the present embodiment are found near the surfaces of the plurality of ceramic layers 31 (the other configurations are the same as the configuration of the ceramic laminated device of the above-described second embodiment, and detailed description is omitted. Do).
[0120]
More specifically, on the surface of the plurality of ceramic layers 31, a first internal electrode 38 (encircled by a rounded rectangle for easy understanding) that does not function as a circuit element is arranged. The first internal electrode 38 is provided substantially perpendicular to terminal electrodes 37a to 37b forming input / output terminals for inputting and outputting electric signals to and from the outside, and is mechanically connected to the terminal electrodes 37a to 37b, respectively. It is connected.
[0121]
On the surface of the plurality of ceramic layers 31, a second internal electrode 39 that does not function as a circuit element (enclosed in a rounded rectangle for easy understanding) is arranged. The second internal electrode 39 is provided substantially perpendicular to the end face electrode 36b connecting the shield electrodes 34a to 34b, and is mechanically connected to the end face electrode 36b.
[0122]
As described above, the number of connection points between the first internal electrode 38 and the terminal electrodes 37a to 37b and the number of connection points between the second internal electrode 39 and the electrode such as the end face electrode 36b are greatly increased. Therefore, the adhesion strength between the laminate and the external electrodes including the terminal electrodes 37a to 37b, the end face electrodes 36b, and the like is greatly improved.
[0123]
Thus, it was possible to show that the reliability was excellent in a reliability test including a drop test, and it was possible to provide a ceramic laminated device having good stress resistance.
[0124]
The actually manufactured laminate of the present embodiment has a size of 8.5 mm in width × 4.5 mm in depth × 2.0 mm in height.
[0125]
Eight first internal electrodes 38 are connected to the terminal electrodes 37a to 37b formed on the surface of the multilayer body.
[0126]
When the width of the terminal electrodes 37a to 37b was 1.0 mm and the first internal electrode 38 having a depth of 0.5 mm was connected, defects such as peeling from the printed circuit board and cracks during the drop test were eliminated.
[0127]
Therefore, it can be seen that the reliability was greatly improved and a sufficient effect was obtained.
[0128]
Note that the ceramic layer 31 corresponds to the ceramic layer of the present invention, the means including the electrode pattern 32 and the interlayer via hole 33 corresponds to the electrode layer of the present invention, and the terminal electrodes 37a to 37b correspond to the terminal electrodes of the present invention. The first internal electrode 38 corresponds to the planar internal member connected to the terminal electrode of the present invention, the shield electrode 34b corresponds to the upper shield electrode of the present invention, and the shield electrode 34a corresponds to the lower shield electrode of the present invention. The end electrodes 35a to 35d and 36a to 36b correspond to the end electrodes of the present invention, and the second internal electrode 39 corresponds to the planar internal member connected to the end electrodes of the present invention.
[0129]
(Embodiment 8)
The configuration and operation of the ceramic laminated device according to the present embodiment will be described with reference to FIG.
[0130]
FIG. 11 is a perspective view of a ceramic multilayer device according to Embodiment 8 of the present invention.
[0131]
A semiconductor element 42, a SAW filter 43, a PIN diode 44, a chip capacitor 45, and a chip resistor 46 are mounted on the upper surface of the multilayer body 41 of the ceramic multilayer device of the present embodiment.
[0132]
More specifically, for example, the semiconductor element 42 is a transistor such as a low-noise amplifier circuit mounted on the surface of the stacked body 41, and is connected to the stacked body 41 via a connection electrode formed on the surface of the stacked body 41. Is electrically connected to a high-frequency circuit formed inside. Here, the high-frequency circuit is a laminated filter or the like.
[0133]
Circuit elements such as the semiconductor element 42 can be integrated with circuit elements such as capacitors and inductors formed inside and on the surface of the laminate 41. For this reason, it is expected to contribute to miniaturization and higher functionality of mobile phones and the like.
[0134]
By using the above-described ceramic laminated devices of the first to seventh embodiments as the laminated body 41, a highly reliable ceramic laminated device can be provided. Further, the yield at the time of manufacturing can be improved.
[0135]
Note that the laminate 41 corresponds to the laminate of the present invention, the circuit including the semiconductor element 42 corresponds to the semiconductor element of the present invention, and the SAW filter 43 corresponds to the SAW filter of the present invention.
[0136]
(Embodiment 9)
The configuration and operation of a W-CDMA (Wideband-Code Division Multiplex Access) mobile phone according to the present embodiment will be described with reference to FIG.
[0137]
FIG. 12 is a block diagram of a W-CDMA mobile phone according to Embodiment 9 of the present invention.
[0138]
The W-CDMA mobile phone of the present embodiment uses the ceramic laminated device of the above-described embodiment.
[0139]
The signal output from the baseband unit 51 is input to the transmission circuit unit 52 and output as a signal of the transmission frequency.
[0140]
On the other hand, the signal of the reception frequency guided from the antenna 54 is input to the reception circuit unit 53, and the reception circuit unit 53 converts the signal of the reception frequency into a signal of the frequency of the baseband unit 51 and outputs the signal to the baseband unit 51. Is done.
[0141]
The duplexer 55 has a function of separating a transmission wave and a reception wave.
[0142]
By using the ceramic laminated device of the above-described embodiment, a highly reliable mobile phone can be obtained.
[0143]
(1) Although the duplexer used in the W-CDMA mobile phone is used in the present embodiment, other mobile phone systems such as a GSM (Global System for Mobile Communication) system and a PDC (Personal Digital Cellular) system are used. May be used.
[0144]
{Circle around (2)} The ceramic laminated device may have a function other than the duplexer.
[0145]
Note that the duplexer 55 corresponds to the duplexer of the present invention, and the unit including the baseband unit 51, the transmitting circuit unit 52, and the receiving circuit unit 53 corresponds to the communication circuit of the present invention.
[0146]
In the above, Embodiments 1 to 9 have been described in detail.
[0147]
The ceramic layer to which the shield electrode of the present invention is adhered is provided with a penetrating via hole 8 filled with a conductive paste (or a dielectric paste), for example, in the above-described fourth embodiment. However, the present invention is not limited to this, and a via hole may be provided at least on the surface on the shield electrode side (such a via hole may penetrate the ceramic layer or may not penetrate the ceramic layer). . In short, the ceramic layer to which the shield electrode of the present invention is adhered may be provided with a three-dimensional internal member substantially perpendicular to the ceramic layer on the surface on the shield electrode side.
[0148]
Further, the ceramic layer provided with the via hole according to the present invention is, for example, the shield electrode 5a formed on the lower surface of the laminate in the above-described fourth embodiment, but is not limited thereto. Any ceramic layer to which a shield electrode formed on the upper surface and / or lower surface of the above is adhered may be used.
[0149]
Further, the planar internal member connected to the terminal electrode of the present invention is, for example, the first internal electrode 38 connected to the terminal electrodes 37a to 37b in Embodiment 7 described above. The present invention is not limited to this, and in short, it may be a flat internal member that is mechanically connected to all or a part of the terminal electrode.
[0150]
Further, the planar internal member connected to the end surface electrode of the present invention is, for example, the second internal electrode 39 connected to the end surface electrode 36b in the above-described seventh embodiment, but is not limited thereto. In short, any flat internal member that is mechanically connected to all or a part of the end face electrode may be used.
[0151]
Thus, (1) the electrode, (2) the via hole, and (3) the shield electrode, the terminal electrode, and the end face electrode, which are formed inside the multilayer body constituting the ceramic multilayer device, are directly connected. Thereby, the adhesion strength between the laminate and the external electrode can be improved.
[0152]
Further, it is possible to provide a ceramic laminated device which is excellent in various reliability tests including a drop test, and which does not peel off from a printed circuit board and does not cause cracks in a laminate, and which has ensured reliability.
[0153]
【The invention's effect】
As is apparent from the above description, the present invention has an advantage that the reliability can be ensured in a ceramic laminated device while maintaining good high-frequency characteristics.
[Brief description of the drawings]
FIG. 1 is a schematic perspective view of a ceramic laminated device according to a first embodiment of the present invention.
FIG. 2 is an exploded perspective view of a ceramic multilayer device according to a second embodiment of the present invention.
FIG. 3 is an exploded perspective view of a ceramic multilayer device according to a third embodiment of the present invention.
FIG. 4 is a cross-sectional view of the ceramic laminated device according to the embodiment of the present invention.
FIG. 5 is a sectional view of the ceramic laminated device according to the embodiment of the present invention.
FIG. 6 is a schematic perspective view of a ceramic laminated device according to a fourth embodiment of the present invention.
FIG. 7 is a sectional view of the ceramic laminated device according to the embodiment of the present invention.
FIG. 8 is a sectional view of a ceramic multilayer device according to a fifth embodiment of the present invention.
FIG. 9 is a sectional view of a ceramic multilayer device according to a sixth embodiment of the present invention.
FIG. 10 is an exploded perspective view of a ceramic laminated device according to a seventh embodiment of the present invention.
FIG. 11 is a perspective view of a ceramic laminated device according to an eighth embodiment of the present invention.
FIG. 12 is a block diagram of a W-CDMA mobile phone according to a ninth embodiment of the present invention.
FIG. 13 is a schematic perspective view of a conventional ceramic laminated device.
[Explanation of symbols]
1 laminate
2 Internal electrode
3 interlayer via hole
4 ceramic layer
5a-5b shield electrode
6a-6b End face electrode
7a-7b terminal electrode
8 Beer Hall
11 laminate
12 Internal electrode
13 interlayer via hole
14a-14g ceramic layer
15a-15b Shield electrode
16 1st via hole
17 First Via Connection Electrode
18 Second via hole
19 Second Via Connection Electrode
21 laminate
22 ceramic layer
23 Third Via Hole
24 Shield electrode
25 Third Via Connection Electrode
31 ceramic layer
32 electrode pattern
33 interlayer via hole
34a-34b Shield electrode
35a-35d end face electrode
36a-36b End face electrode
37a-37b terminal electrode
38 First internal electrode
39 Second internal electrode
41 laminate
42 Semiconductor device
43 SAW filter
44 PIN diode
45 Chip Capacitor
46 Chip Resistor
51 Baseband section
52 Transmission circuit section
53 Receiver circuit
54 antenna
55 duplexer
61 ceramic layer
62 electrode pattern
63 laminate
64 interlayer via hole
65a-65b shield electrode
66a-66b end face electrode
67a-67b terminal electrode

Claims (17)

A ceramic laminate including an internal member that is formed inside a laminate in which a plurality of ceramic layers and a plurality of electrode layers are laminated, is not electrically connected to the electrode layers, and is mechanically connected to the ceramic layers. device. The ceramic laminated device according to claim 1, wherein the internal member is one or more planar internal members provided substantially parallel to the ceramic layer. Further comprising a shield electrode formed on an upper surface and / or a lower surface of the laminate,
3. The ceramic multilayer device according to claim 2, wherein the shape of the planar internal member is the same as the shape of the shield electrode. Further comprising a shield electrode formed on an upper surface and / or a lower surface of the laminate,
3. The ceramic multilayer device according to claim 2, wherein the shape of the planar inner member is different from the shape of the shield electrode. Further comprising a shield electrode formed on an upper surface and / or a lower surface of the laminate,
2. The internal member is one or more three-dimensional internal members provided substantially at least vertically on the ceramic layer on at least the surface of the ceramic layer to which the shield electrode is attached, on the shield electrode side. 3. Ceramic laminated device. Further comprising a shield electrode formed on an upper surface and / or a lower surface of the laminate,
The internal member may be (1) a single member provided substantially perpendicular to the ceramic layer on the ceramic layer between the shield electrode and the flat internal member, and The ceramic laminated device according to claim 2, wherein the ceramic laminated device includes a plurality of three-dimensional internal members. A plurality of the flat internal members are provided,
The ceramic laminated device according to claim 6, wherein at least a part of the three-dimensional internal member is provided in the ceramic layer between the planar internal members. The ceramic multilayer device according to claim 5, wherein the three-dimensional internal member is a via hole filled with a conductive paste or a dielectric paste. Side electrodes formed on the side surface of the stacked body in which the plurality of ceramic layers and the plurality of electrode layers are stacked,
A ceramic laminated device comprising: an internal member formed inside the laminate, not electrically connected to the electrode layer, but mechanically connected to the side electrode. The side electrode is a terminal electrode formed on an end face of the laminate, for inputting and outputting an external electrical signal,
The ceramic laminated device according to claim 9, wherein the internal member is a planar internal member that is mechanically connected to all or a part of the terminal electrode and is provided substantially parallel to the ceramic layer. An upper surface shield electrode formed on an upper surface of the laminate, and a lower surface shield electrode formed on a lower surface of the laminate, further comprising:
The side surface electrode is an end surface electrode formed on an end surface of the laminate, for electrically connecting the upper surface shield electrode and the lower surface shield electrode,
The ceramic laminated device according to claim 9, wherein the internal member is a planar internal member that is mechanically connected to all or a part of the end face electrode and is provided substantially parallel to the ceramic layer. 10. The ceramic multilayer device according to claim 1, wherein a semiconductor element and / or a SAW filter are mounted on an upper surface of the multilayer body. The ceramic multilayer device according to claim 1, wherein a filter is built in the multilayer body. 14. The ceramic multilayer device according to claim 13, wherein the filter has a function as a duplexer having a transmission filter function for transmitting a signal and a reception filter function for receiving a signal. A communication circuit that performs communication using transmission and / or reception of a signal;
A communication device comprising: the ceramic multilayer device according to claim 1, wherein filtering is performed at the time of the communication. It is a manufacturing method of the ceramic laminated device of Claim 1, Comprising:
A method of manufacturing a ceramic laminated device, comprising an internal member forming step of forming the internal member inside the laminate so as to be electrically connected to the ceramic layer without being electrically connected to the electrode layer. . It is a manufacturing method of the ceramic laminated device of Claim 9, Comprising:
A method for manufacturing a ceramic laminated device, comprising an internal member forming step of forming the internal member inside the laminate so as to be electrically connected to the side electrode without being electrically connected to the electrode layer. .

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