JP2004047508A - Circuit unit - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a circuit unit in which ion migration resulting from a high-voltage conductor being applied with a high voltage can be suppressed by covering the high-voltage conductor with an insulating material. <P>SOLUTION: A connecting case 15 is made of synthetic resin. An arrangement pattern 37 is embedded in the bottom part 30a of the connecting case 15. The arrangement pattern 37 is applied with a voltage of 42V from a battery via an external connection terminal T1 and that voltage is applied via a high-voltage connection terminal T2 to a motor drive circuit section 38 and a step-down circuit section 39. The step-down circuit section 39 steps down the voltage of 42V to 5V, which is applied via a male connection terminal 40 and a female connection terminal 28 to the printed wiring 24 on a printed board 14. Since the arrangement pattern 37 is covered with the bottom part 30a and insulated, ion migration resulting from the arrangement pattern 37 can be suppressed. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a circuit unit in which electronic components are arranged, and more particularly, to a circuit unit in which high-voltage electronic components and low-voltage electronic components are arranged.
[0002]
[Prior art]
Generally, a power window device is used to automatically open and close a side door glass or the like of a vehicle. This power window device is configured to drive a drive motor with electric power supplied from a battery (usually 14 V for an automobile) to move up and down the side door glass.
[0003]
The power window device includes an ECU (door electronic control device) mounted on a printed circuit board. The printed circuit board includes, in addition to the ECU, peripheral circuits such as a step-down circuit for supplying power to the ECU and a stabilized power supply circuit. Further, the printed circuit board is configured as a circuit unit including switches, such as a down switch knob that can be operated externally, a down switch operated by an up switch knob, and an up switch, and a motor drive circuit for driving the drive motor. I have.
[0004]
The step-down circuit reduces the voltage of 14V applied from the battery to 5V, and applies the voltage of 5V to the ECU. The ECU outputs a control signal to the motor drive circuit based on the down signal or the up signal input from the down switch or the up switch.
[0005]
The motor drive circuit receives a voltage of 14 V from a battery and controls the drive of the drive motor based on a control signal from an ECU.
By the way, in recent years, the development of a hybrid vehicle equipped with an engine and an electric motor and a fuel cell vehicle has been advanced, and therefore, a battery mounted on the vehicle is not a low voltage battery (14V) but a high voltage battery (for example, 42V). It has been proposed to be mounted. Therefore, it is desired that the circuit unit mounted on the vehicle has specifications that function using a high voltage applied from the high-voltage battery.
[0006]
[Problems to be solved by the invention]
However, when a high voltage is applied to a printed wiring on a printed circuit board in a conventional low-voltage power window device, a sufficient space is provided between conductors in the printed wiring in consideration of the application of the high voltage. Therefore, the ion migration phenomenon may occur rapidly between the conductors.
[0007]
In addition, ion migration means that when a voltage is applied to a conductor, metal ions generated under high temperature and high humidity are deposited on the cathode side, and the metal ions grow in a dendritic manner on the anode side, resulting in good electrical characteristics. This is a phenomenon that cannot be obtained.
[0008]
For this reason, it is necessary to make it difficult for the ion migration phenomenon caused by the conductor to which a high voltage is applied to occur.
The present invention has been made in view of the above circumstances, and has as its object to cover the high-voltage conductor to which a high voltage is applied by covering the insulating member with an ion-migration phenomenon caused by the high-voltage conductor. It is to provide a circuit unit capable of suppressing the above.
[0009]
[Means for Solving the Problems]
In order to achieve the above object, the invention according to claim 1 is directed to a high-voltage electronic component, a printed circuit board separately arranged with respect to the high-voltage electronic component and having a printed wiring, and the high-voltage electronic component. And a low-voltage electronic component connected to the printed wiring and a high-voltage component placement section for placing the high-voltage electronic component and a printed board placement section for placing the printed board. A high-voltage conductor connected to the high-voltage electronic component and to which a high voltage is applied, and a low-voltage conductor connected to the printed wiring and to which a low voltage is applied; The gist is that the conductor for use is insulated by being covered with the insulating member.
[0010]
According to a second aspect of the present invention, in the circuit unit according to the first aspect, the high-voltage electronic component includes a step-down unit that steps down a high voltage to a low voltage and applies the low voltage to a low-voltage conductor. The gist is to have prepared.
[0011]
According to a third aspect of the present invention, in the circuit unit according to the first or second aspect, the insulating member includes a plate portion, and a high-voltage electronic component and a low-voltage electronic component are provided on both sides of the plate portion. Are arranged separately.
[0012]
BEST MODE FOR CARRYING OUT THE INVENTION
An embodiment in which the present invention is embodied in a circuit unit U used in the power window device 11 will be described below with reference to FIGS. FIG. 1 is an exploded view of a power window device 11 including a circuit unit U.
[0013]
In addition, the upper side in FIG. 1 is called an upper side, and the lower side is called a lower side.
As shown in FIG. 1, the power window device 11 of the present embodiment includes a switch knob case 12, a rubber contact 13, a printed circuit board 14, and a connection case 15 as an insulating member.
[0014]
On the upper surface of the switch knob case 12, a plurality of switch knobs 21 for raising and lowering a side door glass of a driver seat and other side door glasses are operably arranged.
[0015]
A printed circuit board 14 is disposed below the switch knob case 12 via a rubber contact 13 made of synthetic resin. The rubber contact 13 is provided with first and second flexible portions 13a and 13b that can be flexed downward corresponding to the switch knobs 21. First and second movable contacts 22 and 23 made of a conductive metal are formed on lower surfaces of the first and second flexible portions 13a and 13b, respectively.
[0016]
On the upper surface of the printed circuit board 14, a printed wiring 24 made of a conductive metal is formed. In the printed wiring 24, a pair of fixed contacts 25 and 26 are formed at portions facing the first and second movable contacts 22 and 23, respectively. The printed wiring 24 is composed of a plurality of conductors 24a. The first movable contact 22 and the fixed contact 25 for raising and lowering the side door glass of the driver's seat constitute a down switch S1 as a switch, and the second movable contact 23 and the fixed contact 26 as an up switch as a switch. A switch S2 is configured.
[0017]
The first movable contact 22 and the fixed contact 25 for raising and lowering the side door glass other than the driver's seat constitute a down switch S11 as a switch, and the second movable contact 23 and the fixed contact 26 serve as a switch. As a rising switch S12. The switches S11 and S12 are remote control switches for moving up and down the side door glass other than the driver's seat.
[0018]
Further, low voltage electronic components, a door electronic control device (hereinafter, referred to as “ECU”) 27 as drive control means, and various electronic components constituting a peripheral circuit are fixed to the printed wiring 24. A female connection terminal 28 is formed on the printed circuit board 14 as a low-voltage conductor protruding downward from the lower surface of the printed circuit board 14. The base end of the female connection terminal 28 is connected to the printed wiring 24. Have been.
[0019]
The connection case 15 is formed of a synthetic resin and has an insulating property. The connection case 15 is a box formed in a substantially flat shape, and includes a board storage portion 30 that can store the printed board 14. The substrate storage section 30 is open upward, and the printed circuit board 14 is stored in the substrate storage section 30 from above (see FIG. 2). In the present embodiment, the inside of the board storage section 30 is a printed board placement space K1 as a printed board placement section.
[0020]
A box-shaped connection member storage section 31 having an open end is formed at one end (right side in FIG. 1) of the lower surface of the substrate storage section 30. In addition, on the lower surface of the substrate storage section 30, on the other end side (left side in FIG. 1) of the connection member storage section 31, a motor drive circuit section 38 as a motor drive section and a step-down circuit section 39 as a step-down section. Fixed. The motor drive circuit section 38 and the step-down circuit section 39 correspond to high-voltage electronic components.
[0021]
In the present embodiment, a portion where the motor drive circuit section 38 and the step-down circuit section 39 are arranged on the lower surface of the bottom 30a of the board storage section 30 is defined as a high-voltage component arrangement space K2 as a high-voltage component arrangement section. The bottom 30a corresponds to a plate.
[0022]
That is, the ECU 27 which is a low-voltage electronic component, and the motor drive circuit unit 38 and the step-down circuit unit 39 which are high-voltage electronic components are separately arranged on both upper and lower sides of the bottom 30a made of synthetic resin.
[0023]
By the way, the bottom 30a of the substrate storage 30 and the bottom 31a of the connection member storage 31 are integrally connected.
As shown in FIGS. 1, 2, and 4, an arrangement pattern 37 as a high-voltage conductor is embedded in the bottom portions 30a and 31a. The arrangement pattern 37 is composed of a plurality of conductors 37a (see FIG. 4) made of a conductive plate, and the conductors 37a are buried in the bottom portions 30a and 31a independently of each other. That is, the conductors 37a are insulated from the outside by being buried in the bottom portions 30a and 31a, respectively.
[0024]
One end of the arrangement pattern 37 is integrally connected to an external connection terminal T1 formed of a conductive plate protruding from the inside of the bottom portion 31a into the opening space of the connection member storage portion 31. The other end of the arrangement pattern 37 is integrally connected to a plurality of high voltage connection terminals T2 made of a conductive plate protruding downward from inside the bottom 30a. Each high voltage connection terminal T2 is connected to the motor drive circuit section 38 and the step-down circuit section 39. The high-voltage connection terminal T2 corresponds to a “connection portion between a high-voltage electronic component and a high-voltage conductor”.
[0025]
As shown in FIG. 1, a male connection terminal 40 as a low-voltage conductor penetrating from the lower surface to the upper surface of the substrate housing portion 30 is formed in a portion of the bottom portion 30a corresponding to the step-down circuit portion 39. The base end of the male connection terminal 40 is connected to the step-down circuit section 39. The male connection terminals 40 are spaced apart from the arrangement pattern 37 by such a distance that an ion migration phenomenon does not occur.
[0026]
Further, the entirety of the motor drive circuit section 38 and the step-down circuit section 39 and the front end side of the high voltage connection terminal T2 are sealed with a potting resin 41. In addition, the front end side of the high-voltage connection terminal T2 refers to a portion of the high-voltage connection terminal T2 located below the lower surface of the bottom portion 30a. The potting resin 41 is, for example, an epoxy-based or urethane-based two-component mixed-curable resin, and has insulating properties.
[0027]
A circuit unit including the printed board 14, the connection case 15, the printed wiring 24, the ECU 27, the female connection terminal 28, the arrangement pattern 37, the motor drive circuit section 38, the step-down circuit section 39, the male connection terminal 40, and the potting resin 41. U is configured.
[0028]
Next, the electrical configuration of the power window device 11 will be described with reference to FIG.
As shown in FIG. 3, the arrangement pattern 37 is connected to the battery B via the external connection terminal T1, and is electrically connected to the motor drive circuit section 38 and the step-down circuit section 39 via the high voltage connection terminal T2. ing. Since the female connection terminal 28 and the male connection terminal 40 are connected, the step-down circuit section 39 lowers the battery voltage and supplies the ECU 27 with low-voltage power. In the present embodiment, the battery voltage is set to 42V, and the step-down circuit section 39 applies a voltage of 5V to the ECU 27.
[0029]
The ECU 27 is connected to fixed contacts 25 and 26 of both switches S1 and S2 via conductors 24a of the printed wiring 24. The fixed contacts 25 and 26 of the switches S11 and S12 for raising and lowering the side door glass other than the driver's seat are also connected to the ECU 27 via the conductors 24a in the same manner. 3, the illustration is omitted. A known auto switch (not shown) is also connected to the ECU 27, but is omitted for convenience of explanation.
[0030]
When the switch knob 21 is further pressed down to lower the side door glass of the driver's seat, the first flexible portion 13a bends downward, so that the first movable contact 22 and the fixed contact 25 are connected to the switch knob. The connection is made only while the button 21 is being pressed. At this time, a down signal is input to the ECU 27.
[0031]
Further, when the switch knob 21 is pressed one step further upward to raise the side door glass of the driver's seat, the second movable portion 23 and the fixed contact 26 are bent by bending the second flexible portion 13b downward. The connection is made only while the switch knob 21 is being pressed. At this time, an up signal is input to the ECU 27.
[0032]
The motor drive circuit section 38 is connected to the ECU 27. That is, the output port of the ECU 27 is spaced apart from the conductor 24 a of the printed wiring 24 and the female connection terminal 28, and is connected to the motor drive circuit 38 via a control conductor (not shown) connected to the motor drive circuit 38. A down control signal or an up control signal is output to 38. The down control signal and the up control signal are 5V voltage signals. The motor drive circuit unit 38 drives the drive motor M based on a down control signal or an up control signal from the ECU 27 to open and close a side door glass (not shown).
[0033]
Next, the characteristic operation of the circuit unit U of the power window device 11 will be described.
In the circuit unit U of the present embodiment, the conductors 37a are buried independently in the bottom 30a of the board housing 30 and the bottom 31a of the connection member housing 31, respectively. Therefore, since each conductor 37a is in a state where the insulation treatment has been performed, the ion migration phenomenon does not occur regardless of the distance between the adjacent conductors 37a.
[0034]
In the printed circuit board 14 of the present embodiment, only a voltage of 5 V is applied to each conductor 24a of the printed wiring 24. Therefore, for example, the power window device 11 of the present embodiment has a longer migration life than a power window device in which a voltage of 42 V is applied to the printed wiring 24.
[0035]
Therefore, according to the power window device 11 of the present embodiment, the following effects can be obtained.
(1) In the present embodiment, the insulation processing is performed by embedding the arrangement pattern 37 for applying a high voltage (42 V) to the motor drive circuit section 38 and the step-down circuit section 39 in the connection case 15. Therefore, by embedding the arrangement pattern 37 to which the high voltage is applied in the connection case 15, the ion migration phenomenon caused by the arrangement pattern 37 can be suppressed.
[0036]
(2) In the present embodiment, the entire motor drive circuit section 38 and the step-down circuit section 39 and the front end side of the high-voltage connection terminal T2 are sealed with the potting resin 41. Therefore, the ion migration phenomenon caused by the high voltage connection terminal T2 can be suppressed.
[0037]
(3) In the present embodiment, the bottom portion 30a of the substrate storage unit 30 has a function of insulating the arrangement pattern 37, and a function as a partition for separately arranging the motor drive circuit unit 38, the step-down circuit unit 39, and the ECU 27. Was. Accordingly, one function of the bottom portion 30a can be provided.
[0038]
The above embodiment may be embodied by being changed to another embodiment as described below.
In the above-described embodiment, the entirety of the motor drive circuit section 38 and the step-down circuit section 39 and the front end side of the high-voltage connection terminal T2 are sealed with the potting resin 41. The present invention is not limited to this, and only the tip side of the high voltage connection terminal T2 may be sealed with the potting resin 41.
[0039]
In the above-described embodiment, the bottom portion 30a of the board storage unit 30 has a function of insulating the arrangement pattern 37 and a function as a partition wall for separately arranging the motor drive circuit unit 38, the step-down circuit unit 39, and the ECU 27. I was letting it. The present invention is not limited to this, and the circuit unit U may be changed as follows, as shown in FIG. That is, the circuit unit 51 forms the partition wall 52 as a plate portion on the upper surface of the substrate storage unit 30, and a part of the partition wall 52 and the bottom 30 a and the right end side end wall in FIG. A high voltage component placement space K2 surrounded by a pair of connecting side walls is formed. Then, the motor drive circuit section 38 and the step-down circuit section 39 may be housed in the high-voltage component arrangement space K2.
[0040]
In the above-described embodiment, the step-down circuit unit 39 is configured to step down the voltage of 42V to 5V. However, the voltage applied to the step-down circuit unit 39 is not limited to 42V. The step-down voltage is not limited to 5V. In short, the circuit unit U may be configured so that the voltage applied to the printed wiring 24 and the ECU 27 is lower than the voltage applied to the motor drive circuit unit 38 and the step-down circuit unit 39.
[0041]
Next, technical ideas that can be grasped from the above embodiment and other embodiments will be additionally described below.
(B) The circuit unit according to any one of claims 1 to 3, wherein the high-voltage conductor is embedded in the insulating plate portion.
[0042]
(B) The connecting portion between the high-voltage electronic component and the high-voltage conductor is sealed with a potting resin, according to any one of claims 1 to 3, and (b). The described circuit unit.
[0043]
(C) In a power window device having a high-voltage electronic component and a low-voltage electronic component, the high-voltage electronic component and the low-voltage electronic component are described in claims 1 to 3, (a), and (b). A power window device configured as the circuit unit according to any one of the preceding claims.
[0044]
【The invention's effect】
As described in detail above, according to the present invention, by covering the high-voltage conductor to which a high voltage is applied with the insulating member, the ion migration phenomenon caused by the high-voltage conductor can be suppressed.
[Brief description of the drawings]
FIG. 1 is an exploded front view of a power window device according to an embodiment.
FIG. 2 is a partial cross-sectional front view of the circuit unit according to the embodiment.
FIG. 3 is a circuit diagram of a power window device according to the embodiment.
FIG. 4 is a partial cross-sectional plan view showing each high-voltage conductor in the embodiment.
FIG. 5 is a front sectional view showing a part of a power window device according to another embodiment.
[Explanation of symbols]
14 ... printed circuit board, 15 ... connection case as insulating member,
24: printed wiring; 27: ECU as low-voltage electronic components;
28: female connection terminal as a conductor for low voltage; 30a: bottom portion as a plate portion;
37 ... Arrangement pattern as conductor for high voltage,
38 ... motor drive circuit part as high voltage electronic parts,
39 high voltage electronic components and step-down circuit section as step-down means;
40 ... male connection terminal as conductor for low voltage,
K1: printed circuit board arrangement space as a printed circuit board arrangement section;
K2: a high-voltage component placement space as a high-voltage component placement unit; U: a circuit unit.

Claims (3)

High voltage electronic components,
A printed circuit board having a printed wiring and arranged separately for the high-voltage electronic component,
A low-voltage electronic component that is arranged separately from the high-voltage electronic component and connected to the printed wiring;
An insulating member including a high-voltage component placement section for placing the high-voltage electronic component and a printed board placement section for placing the printed board;
A high-voltage conductor connected to the high-voltage electronic component and applied with a high voltage, and a low-voltage conductor connected to the printed wiring and applied with a low voltage,
The circuit unit according to claim 1, wherein the high-voltage conductor is covered with the insulating member to be insulated. 2. The circuit unit according to claim 1, wherein the high-voltage electronic component includes a step-down unit that steps down a high voltage to a low voltage and applies the low voltage to a low-voltage conductor. The said insulating member is provided with a plate part, The high voltage electronic component and the low voltage electronic component are each arrange | positioned separately on both sides of the said plate part, The said, The Claim 1 or Claim 2 characterized by the above-mentioned. Circuit unit.

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