JP2004031869A - Near-field optical element - Google Patents

Near-field optical element Download PDF

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Publication number
JP2004031869A
JP2004031869A JP2002189643A JP2002189643A JP2004031869A JP 2004031869 A JP2004031869 A JP 2004031869A JP 2002189643 A JP2002189643 A JP 2002189643A JP 2002189643 A JP2002189643 A JP 2002189643A JP 2004031869 A JP2004031869 A JP 2004031869A
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JP
Japan
Prior art keywords
light
field
field light
shielding film
wavelength
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2002189643A
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Japanese (ja)
Inventor
Masanobu Ando
安藤 雅信
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyoda Gosei Co Ltd
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Toyoda Gosei Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyoda Gosei Co Ltd filed Critical Toyoda Gosei Co Ltd
Priority to JP2002189643A priority Critical patent/JP2004031869A/en
Publication of JP2004031869A publication Critical patent/JP2004031869A/en
Pending legal-status Critical Current

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Abstract

<P>PROBLEM TO BE SOLVED: To provide a near-field optical element provided with a light emitting part formed on the surface of a transparent substrate and a light shielding film having the fine opening part of the half wavelength or less of a wavelength emitted by the light emitting part on the back surface, which emits near-field light from the fine opening part. <P>SOLUTION: The near-field optical element 100 is composed of a transparent sapphire substrate 1, the laminated structure 2 of a group 3 nitride compound semiconductor having the light emitting part formed on the surface, the light shielding film 3 formed on the back surface of the sapphire substrate 1 and the fine opening part 4 of the light shielding film 3. A spindle-shaped projection part 10 is formed on the back surface of the sapphire substrate 1 and the fine opening part 4 is formed by removing the light shielding film 3 only at the tip part 11. The size d of the tip part 11 of the projection part 10 where the light shielding film 3 is removed is turned to be about 1/2 or less of an emitted light wavelength. Such a near-field optical element 100 can emit the near-field light at the fine opening part 4 having a diameter d of about 1/2 or less of the emitted light wavelength of the laminated structure 2 of the group 3 nitride compound semiconductor. <P>COPYRIGHT: (C)2004,JPO

Description

【0001】
【発明の属する技術分野】
本発明は近接場光、即ち物体表面上にのみ発生する表面電場を発する近接場光素子の発明である。
【0002】
【従来の技術】
波長以下の分解能を有する近接場光を用いる測定装置について、最近関心が高まっている(例えば、応用物理第71巻(2002年)第653乃至663頁及び第700乃至704頁)。この際、近接場光の発生には、レーザー光をパターン発生装置を通してパターン光としたのち、その先端部分のみ微小開口部としてその他の表面を金属被覆された光ファイバーに出力し、当該微小開口部で近接場光を発するものが知られている(同第701頁の図1)。
【0003】
【発明が解決しようとする課題】
レーザー光発生装置と、先端部分のみ微小開口部としてその他の表面を金属被覆された光ファイバーとの組合せは、装置としては大がかりであり、且つ当該光ファイバーの製造は必ずしも簡易ではない。
【0004】
本発明は全く新しい近接場光素子を提供することで、極めて小型の近接場光利用装置に供することを目的とする。
【0005】
【課題を解決するための手段】
上記の課題を解決するため、請求項1に記載の手段によれば、透明基板と、透明基板表面上に形成された発光部と、透明基板裏面に、発光部の発する波長の半波長以下の微小開口部を少なくとも1個有する光遮断膜を有し、当該微小開口部から近接場光を発することを特徴とする近接場光素子である。
【0006】
また、請求項2に記載の手段によれば、透明基板はサファイアであり、発光部はサファイア基板上に形成された3族窒化物系化合物半導体発光素子であることを特徴とする。
【0007】
【作用及び発明の効果】
透明基板の表面側に発光部を設け、裏面に発光部の発する波長の半波長以下の微小開口部を少なくとも1個有する光遮断膜を形成すれば、微小開口部から近接場光を発することが可能である。このような新規な構成の近接場光素子は、従来のレーザー光発生装置と、先端部分のみ微小開口部としてその他の表面を金属被覆された光ファイバーとの組合せを代替し、他の器具と組み合わせた所望の測定装置全体の構成を小さくすることが可能である(請求項1)。
【0008】
サファイア基板とその上に形成された3族窒化物系化合物半導体発光素子の組合せとすれば、サファイア基板は絶縁性であるので、3族窒化物系化合物半導体発光素子に必要な電極等は表面側に形成することとなり、裏面を自由に加工できる(請求項2)。
【0009】
【発明の実施の形態】
以下、図を用いて本発明の望ましい実施の形態を説明する。尚、本発明は添付図面や以下の説明により限定を受けるものではない。
【0010】
〔第1実施例〕
図1は、本発明の具体的な第1の実施例に係る近接場光素子100の構成を示す断面図である。近接場光素子100は、透明なサファイア基板1とその表面に形成された発光部を有する3族窒化物系化合物半導体の積層構造2、サファイア基板1の裏面に形成された光遮断膜3、光遮断膜3の微小開口部4から成る。図1の近接場光素子100においては、サファイア基板1裏面に錘状の突起部分10を形成し、その先端部分11のみ光遮断膜3を除いて微小開口部4を形成する構成である。光遮断膜3を除いた突起部分10の先端部分11の大きさ(直径)dは発光波長の1/2程度以下とすると良い。尚、サファイア基板1裏面の錘状の突起部分10の形成には、エッチング並びに機械的研磨等とエッチングとの組合せなどが利用できる。また、光遮断膜3は、金属蒸着膜、不透明性樹脂硬化物、その他任意のものが利用できる。突起部分10の先端部分11のみ微小開口部4とする方法としては、一旦突起部分10を有するサファイア基板1の裏面を全て光遮断膜3で覆い、先端部分11のみ光遮断膜3をフォトリソマスクを利用して除去しても良い。図1の近接場光素子100は、発光波長の1/2程度以下の直径dを有する微小開口部4において近接場光を発することができる。よって、図1の近接場光素子100は、従来のレーザ装置と、先端を加工した光ファイバとの組合せになる近接場光発生装置を代替し、且つ所望のプローブ等と組み合わせた測定装置等の全体の装置構成を小さくすることができる。
【0011】
当該発光素子がレーザダイオードであれば、コヒーレント光を用いることができるので、他の器具と組み合わせた所望の測定装置の分解能を更に向上させることが可能となる。レーザ光は図1において上下方向に発振させるものが好ましい。
【0012】
〔第2実施例〕
図2は、本発明の具体的な第2の実施例に係る近接場光素子200の構成を示す断面図である。近接場光素子200は、図1の近接場光素子100の微小開口部4を多数設けた構造である。図2の近接場光素子200は、1個の素子で近接した領域に多数個の近接場光を発することのできる近接場光素子であり、所望のプローブ等と組み合わせることにより種々の測定を可能とすることができる。
【0013】
〔第3実施例〕
図3は、本発明の具体的な第3の実施例に係る近接場光素子300の構成を示す断面図である。近接場光素子300は、図1の近接場光素子100の発光部を有する3族窒化物系化合物半導体の積層構造2をレーザダイオード部20とした場合であって、微小開口部4を多数設けた構造であり、更に共振ミラー21、23を明示した。レーザー共振用ミラーにはさまれた部分は3族窒化物系化合物半導体の積層構造から成るレーザダイオード発光部22である。図3の近接場光素子300は、図2の近接場光素子200と同様に、1個の素子で近接した領域に多数個の近接場光を発することのできる近接場光素子であり、所望のプローブ等と組み合わせることにより種々の測定を可能とすることができる。レーザ光は図3において上下方向に発振させる、面発光レーザダイオードとする。
【0014】
図1乃至図3においては、本願発明の本質のみを示すため、電極その他の構成を省略したが、例えば電極形成の後、当該電極と微小開口部4とを除いてその他の全ての表面を光遮断膜3で覆っても良い。当該光遮断膜として光を反射する反射膜を用いたり、更には電極も反射率の高い金属を最上層とするならば、光の漏れを抑えることができ、極めて少量の電力で、熱放射を少なくして近接場光素子を駆動させることが可能となる。
【図面の簡単な説明】
【図1】本発明の具体的な第1の実施例に係る近接場光素子の構成を示す断面図。
【図2】本発明の具体的な第2の実施例に係る近接場光素子の構成を示す断面図。
【図3】本発明の具体的な第3の実施例に係る近接場光素子の構成を示す断面図。
【符号の説明】
1 サファイア基板
2 発光部を有する3族窒化物系化合物半導体の積層構造
20 3族窒化物系化合物半導体の積層構造から成るレーザダイオード部
22 3族窒化物系化合物半導体の積層構造から成るレーザダイオード発光部
21、23 レーザー共振用ミラー
3 光遮断膜
10 錘状の突起部分
11 突起部分の先端部分
4 微小開口部
100、200、300 近接場光素子
[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention is an invention of a near-field light element that emits near-field light, that is, a surface electric field generated only on the surface of an object.
[0002]
[Prior art]
There has recently been a growing interest in measuring devices that use near-field light with sub-wavelength resolution (eg, Applied Physics Vol. 71 (2002), pp. 653-663 and 700-704). At this time, in order to generate near-field light, laser light is converted into pattern light through a pattern generator, and then only the distal end portion is output as a fine aperture to an optical fiber whose other surface is coated with a metal. One that emits near-field light is known (FIG. 1 on page 701 of the same).
[0003]
[Problems to be solved by the invention]
The combination of a laser light generating device and an optical fiber whose other surface is covered with metal only with a fine opening at the tip is a large-scale device, and the manufacturing of the optical fiber is not always simple.
[0004]
An object of the present invention is to provide an extremely small near-field light utilization device by providing a completely new near-field light element.
[0005]
[Means for Solving the Problems]
In order to solve the above problems, according to the means of claim 1, the transparent substrate, the light emitting portion formed on the transparent substrate surface, and the transparent substrate back surface, the half wavelength or less of the wavelength emitted by the light emitting portion. A near-field light element having a light blocking film having at least one minute opening and emitting near-field light from the minute opening.
[0006]
According to a second aspect of the present invention, the transparent substrate is sapphire, and the light emitting portion is a group III nitride compound semiconductor light emitting device formed on the sapphire substrate.
[0007]
[Action and effect of the invention]
If a light-emitting portion is provided on the front surface side of the transparent substrate and a light-blocking film having at least one minute opening of a half wavelength or less of the wavelength emitted by the light-emitting portion is formed on the back surface, near-field light can be emitted from the minute opening. It is possible. The near-field optical element having such a novel configuration replaces the combination of the conventional laser light generating device and the optical fiber whose other surface is metal-coated as a minute opening only at the tip, and is combined with other equipment. It is possible to reduce the configuration of a desired measuring device as a whole (claim 1).
[0008]
If a combination of a sapphire substrate and a group III nitride compound semiconductor light emitting device formed thereon is used, the sapphire substrate is insulative, and the electrodes and the like required for the group III nitride compound semiconductor light emitting device are on the front side. And the back surface can be processed freely (claim 2).
[0009]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings. The present invention is not limited by the attached drawings and the following description.
[0010]
[First embodiment]
FIG. 1 is a cross-sectional view illustrating a configuration of a near-field light element 100 according to a first specific example of the present invention. The near-field light element 100 includes a transparent sapphire substrate 1, a laminated structure 2 of a group III nitride compound semiconductor having a light emitting portion formed on the surface thereof, a light blocking film 3 formed on the back surface of the sapphire substrate 1, It consists of minute openings 4 in the blocking film 3. The near-field light element 100 shown in FIG. 1 has a configuration in which a weight-shaped protruding portion 10 is formed on the back surface of the sapphire substrate 1, and the minute opening 4 is formed only in the tip portion 11 except for the light blocking film 3. The size (diameter) d of the tip portion 11 of the protruding portion 10 excluding the light blocking film 3 is preferably set to be about 2 or less of the emission wavelength. In addition, for forming the protruding portion 10 in the shape of a cone on the back surface of the sapphire substrate 1, etching, a combination of mechanical polishing or the like and etching can be used. Further, as the light shielding film 3, a metal vapor-deposited film, a cured opaque resin, or any other material can be used. As a method of forming the small opening 4 only at the tip portion 11 of the projecting portion 10, the entire back surface of the sapphire substrate 1 having the projecting portion 10 is once covered with the light blocking film 3, and only the tip portion 11 is covered with a photolithographic mask. It may be removed by using. The near-field light element 100 in FIG. 1 can emit near-field light in the minute opening 4 having a diameter d of about の or less of the emission wavelength. Therefore, the near-field light element 100 of FIG. 1 replaces a conventional laser device and a near-field light generation device that is a combination of an optical fiber with a processed tip, and a measuring device or the like combined with a desired probe or the like. The overall device configuration can be reduced.
[0011]
If the light emitting element is a laser diode, coherent light can be used, so that it is possible to further improve the resolution of a desired measuring device combined with another instrument. Preferably, the laser light oscillates in the vertical direction in FIG.
[0012]
[Second embodiment]
FIG. 2 is a cross-sectional view illustrating a configuration of a near-field light element 200 according to a second specific example of the present invention. The near-field light element 200 has a structure in which many small openings 4 of the near-field light element 100 of FIG. 1 are provided. The near-field light element 200 shown in FIG. 2 is a near-field light element that can emit a large number of near-field lights to a region close to one element, and can perform various measurements by combining with a desired probe or the like. It can be.
[0013]
[Third embodiment]
FIG. 3 is a sectional view showing a configuration of a near-field light element 300 according to a third specific example of the present invention. The near-field light element 300 is a case where the laminated structure 2 of the group III nitride compound semiconductor having the light-emitting part of the near-field light element 100 of FIG. In addition, the resonance mirrors 21 and 23 are clearly shown. The portion sandwiched between the laser resonance mirrors is a laser diode light emitting section 22 having a laminated structure of a group III nitride compound semiconductor. The near-field light element 300 in FIG. 3 is a near-field light element capable of emitting a large number of near-field lights to a region in close proximity with one element, similarly to the near-field light element 200 in FIG. Various measurements can be made possible by combining with the above-mentioned probe and the like. The laser light is a surface emitting laser diode that oscillates in the vertical direction in FIG.
[0014]
1 to 3, only the essence of the present invention is shown, so that the electrodes and other components are omitted. For example, after the electrodes are formed, all the surfaces except the electrodes and the minute openings 4 are coated with light. It may be covered with a blocking film 3. If a light-reflecting film is used as the light-shielding film, or if the electrode is made of a metal with high reflectivity as the uppermost layer, light leakage can be suppressed, and heat radiation can be performed with a very small amount of power. It is possible to drive the near-field light element with less.
[Brief description of the drawings]
FIG. 1 is a sectional view showing a configuration of a near-field light element according to a first specific example of the present invention.
FIG. 2 is a sectional view showing a configuration of a near-field light element according to a second specific example of the present invention.
FIG. 3 is a sectional view showing a configuration of a near-field light element according to a third specific example of the present invention.
[Explanation of symbols]
REFERENCE SIGNS LIST 1 Sapphire substrate 2 Group III nitride compound semiconductor laminated structure having light emitting part 20 Laser diode part 22 composed of group III nitride compound semiconductor laminated structure 22 Laser diode light emission composed of group III nitride compound semiconductor laminated structure Units 21 and 23 Laser resonance mirror 3 Light blocking film 10 Conical projection 11 Protrusion tip 4 Micro aperture 100, 200, 300 Near-field optical element

Claims (2)

透明基板と、
透明基板表面上に形成された発光部と、
透明基板裏面に、発光部の発する波長の半波長以下の微小開口部を少なくとも1個有する光遮断膜を有し、
当該微小開口部から近接場光を発することを特徴とする近接場光素子。
A transparent substrate,
A light emitting unit formed on the surface of the transparent substrate,
On the back surface of the transparent substrate, having a light blocking film having at least one minute opening of a half wavelength or less of the wavelength emitted by the light emitting unit,
A near-field light element that emits near-field light from the minute opening.
前記透明基板はサファイアであり、
前記発光部はサファイア基板上に形成された3族窒化物系化合物半導体発光素子であることを特徴とする請求項1に記載の近接場光素子。
The transparent substrate is sapphire,
The near-field light device according to claim 1, wherein the light-emitting portion is a group III nitride compound semiconductor light-emitting device formed on a sapphire substrate.
JP2002189643A 2002-06-28 2002-06-28 Near-field optical element Pending JP2004031869A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
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Application Number Priority Date Filing Date Title
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Publications (1)

Publication Number Publication Date
JP2004031869A true JP2004031869A (en) 2004-01-29

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Country Status (1)

Country Link
JP (1) JP2004031869A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006196538A (en) * 2005-01-11 2006-07-27 Matsushita Electric Ind Co Ltd Semiconductor light emitting device
EP1700889A1 (en) 2005-03-11 2006-09-13 Seiko Epson Corporation Ink composition, ink cartridge, inkjet recording method, and recorded matter
CN110907071A (en) * 2019-10-28 2020-03-24 华南师范大学 Nano-level near-field thermal radiation high-precision measuring device and measuring method

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006196538A (en) * 2005-01-11 2006-07-27 Matsushita Electric Ind Co Ltd Semiconductor light emitting device
JP4614773B2 (en) * 2005-01-11 2011-01-19 パナソニック株式会社 Semiconductor light emitting device
EP1700889A1 (en) 2005-03-11 2006-09-13 Seiko Epson Corporation Ink composition, ink cartridge, inkjet recording method, and recorded matter
US7279034B2 (en) 2005-03-11 2007-10-09 Seiko Epson Corporation Ink composition, ink cartridge, inkjet recording method, and recorded matter
EP2053098A1 (en) 2005-03-11 2009-04-29 Seiko Epson Corporation Ink composition, ink cartridge, inkjet recording method, and recorded matter
CN110907071A (en) * 2019-10-28 2020-03-24 华南师范大学 Nano-level near-field thermal radiation high-precision measuring device and measuring method
CN110907071B (en) * 2019-10-28 2021-02-19 华南师范大学 Nano-level near-field thermal radiation high-precision measuring device and measuring method

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