JP2004031653A - Package and optical semiconductor element fixed module - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To solder lead wires to metal wiring parts on an insulating terminal easily and inexpensively while preventing electrical short circuit, etc. <P>SOLUTION: This package comprises a metal bottom plate 1 for fixing a conductive component for electrical input or output through electrical wiring, a metal frame 2 arranged on the metal bottom plate 1, an insulating terminal 3 having the metal wiring parts 7 which penetrates a sidewall of the metal frame 2 at least to the inside of the frame 2 so as to conduct between the inside and outside of the frame 2, and metal members 8 which are adhered and fixed to the metal wiring parts 7 on the insulating terminal 3 for fixing the electrical wiring. Consequently, since any process such as notching is not needed for the insulating terminal 3 which is composed of a relatively brittle material such as ceramic, the insulating terminal 3 can be prevented from damages such as crack. Moreover, since the metal members 8 are protruded from the insulating terminal 3 even if the wet spread or detouring of solder is caused when the lead wires are fixed by solder, the solder is stayed around the metal members 8. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a package for housing and fixing an optical component, an optical semiconductor element, a current-carrying part, and the like, and an optical semiconductor element fixing module.
[0002]
[Prior art]
2. Description of the Related Art Conventionally, a package for fixing an optical semiconductor element or the like has a metal bottom plate 1 and a metal frame 2 for fixing current-carrying components such as a thermoelectric cooler 10 and other components therein as shown in FIG. An insulating terminal 3 made of a material such as ceramic is protruded on both sides of a side wall of a metal frame 2 formed on the bottom plate 1. At a predetermined position of a metal wiring portion 7 that electrically connects the inside and outside of a package provided at the insulating terminal 3, a lead insulating terminal or lead wire 9 (hereinafter referred to as a lead portion) of a current-carrying component or other component, a current-carrying component, Conventionally, as shown in, for example, Japanese Patent Application Laid-Open No. 8-37247, the wiring shown in FIGS. 17 to 19 is conventionally used to fix wiring such as gold wires connecting to other components (hereinafter, electric wiring including a lead portion). Notch 3d or through hole 3c is formed in insulating terminal 3 as described above, and a part of the lead portion is fixed to metal wiring portion 7 by soldering or YAG laser welding.
[0003]
[Problems to be solved by the invention]
By the way, when forming the notch 3d or the through hole 3c in the insulating terminal 3, the insulating terminal 3, which is a relatively brittle material, is susceptible to damages such as cracks and chips, and is difficult to manufacture. There is also a problem that it takes extra time.
[0004]
Further, since the solder 11 is close to the side wall 2 of the package and the adjacent metal wiring portion 7, when the lead wire 9 is fixed to the insulating terminal 3 by the solder 11, for example, as shown in FIG. The solder 11 spreads to the portion 7. Alternatively, for example, as shown in FIG. 21, the solder 11 goes down. For this reason, the upper and lower surfaces of the insulating terminal 3 come into contact with the side wall 2 and the adjacent metal wiring portion 7, and electrical characteristics with a desired wiring pattern formed on the metal wiring portion 7 cannot be obtained. In such a case, for example, there is a problem that an electric short circuit occurs.
[0005]
The present invention solves the above-mentioned problems, and a package and an optical semiconductor that can be easily and inexpensively soldered so that the lead wire 9 does not lead to an electrical short circuit or the like to the metal wiring portion 7 of the insulating terminal 3. It is an object to provide an element fixing module.
[0006]
[Means for Solving the Problems]
The package according to the first aspect of the present invention includes a metal bottom plate for fixing a current-carrying component or the like that performs an electrical input or output via an electrical wiring, a metal frame that stands on the metal bottom plate, An insulating terminal having a metal wiring portion projecting through at least the inner side of the side wall of the frame body and conducting between the inside and the outside of the metal frame body, and being adhered and fixed to the metal wiring portion of the insulating terminal; and It has a metal member to be fixed.
[0007]
The package according to the second aspect of the present invention is characterized in that the insulating terminal is a straight member.
[0008]
The package according to the third aspect of the present invention is characterized in that the metal member is attached and fixed so as to protrude from the insulating terminal.
[0009]
The package according to the invention of claim 4 of the present application is characterized in that the metal member has at least one of a cutout for fixing the electric wiring and a through hole.
[0010]
The package according to the invention of claim 5 of the present application is characterized in that a linear expansion coefficient of the metal member is equal to a linear expansion coefficient of the insulating terminal.
[0011]
The package according to the invention of claim 6 of the present application is characterized in that the metal wiring portion is provided on at least a part of a protruding surface of the insulating terminal.
[0012]
An optical semiconductor element fixing module according to the invention of claim 7 of the present application includes the package according to any one of claims 1 to 6, the current-carrying component, and the optical semiconductor element fixed inside the module. An optical semiconductor element fixing module, wherein at least the electric wiring of the current-carrying component is joined to the metal member.
[0013]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, a package and an optical semiconductor element fixing module according to an embodiment of the present invention will be described with reference to the drawings.
[0014]
(Embodiment 1)
FIG. 1 is a perspective view showing a configuration of a package according to a first embodiment of the present invention. In FIG. 1, this package has a metal bottom plate 1 and a metal frame 2, and has an insulating terminal 3 made of an insulating material realized by a ceramic or the like penetrating into and out of the side walls of the metal frame 2. . The insulating terminal 3 has a metal wiring portion 7 that conducts inside and outside the metal frame 2. The lead terminal 5 is attached and fixed to the metal wiring portion 7 outside the metal frame 2.
[0015]
Here, the metal wiring portion 7 inside the metal frame 2 is used for electrical connection with components, members, elements, current-carrying components, and the like constituting the inside, and a lead wire 9 is fixed to the metal wiring portion 7. The metal member 8 is adhered and fixed by solder or the like (not shown). The metal member 8 is formed of a material having good workability and electrical conductivity, such as copper, nickel, and an iron-nickel alloy. Therefore, for example, a notch 8 a is formed in the metal member 8, and the lead wire 9 can be fixed by the solder 11 as shown in FIG. 5, and the notch or the like is formed in the insulating terminal 3. No need to do. Therefore, damage such as cracking or chipping does not easily occur in the insulating terminal 3 which is a relatively brittle material, so that the manufacturing becomes easy. Further, a package and an optical semiconductor element fixing module that can reduce the manufacturing cost can be realized.
[0016]
(Embodiment 2)
Next, a second embodiment of the present invention will be described. FIG. 2 is a perspective view showing a configuration of an insulating element used in the package according to the second embodiment of the present invention. In FIG. 2, the insulating terminal 3 is a straight member having a prism shape with a “convex” cross section. The insulating element 3 has a protruding portion 33 a protruding in a direction perpendicular to the side wall of the metal frame 2. Other configurations are the same as those of the first embodiment, and the same components are denoted by the same reference numerals.
[0017]
As described above, since the insulating element 3 is formed by a straight member having a flat surface, notches or the like are not formed on the insulating terminal 3 by cutting or the like, so that the insulating terminal 3 is a relatively brittle material. Damage such as cracking and chipping is less likely to occur, which facilitates manufacturing. Further, a package and an optical semiconductor element fixing module that can reduce the manufacturing cost can be realized.
[0018]
(Embodiment 3)
Next, a third embodiment of the present invention will be described. FIGS. 3 to 5 are perspective views showing a bonding relationship between an insulating terminal and a metal member in the package according to the fourth embodiment of the present invention. Other configurations of the package are the same as those shown in the first embodiment, and the same components are denoted by the same reference numerals. 3 to 5, the metal member 8 is attached and fixed to the insulating terminal 3 so as to further protrude from the protruding portion 3a of the insulating terminal 3. As a result, for example, even if the solder 11 spreads wet as shown in FIG. 20, or if the solder 11 goes down as shown in FIG. 21, the side wall of the metal frame 2 or the adjacent metal wiring portion 7 Since the distance from the metal member 8 is long, the metal member 8 does not easily come into contact with the side wall of the metal frame 2 or the adjacent metal wiring portion 7. Therefore, it is possible to realize a package and an optical semiconductor element fixing module in which a desired wiring pattern and electrical characteristics are easily obtained.
[0019]
(Embodiment 4)
Next, a fourth embodiment of the present invention will be described. 6 to 10 are perspective views showing the configuration of the metal member used for the package according to the fourth embodiment of the present invention. Other configurations of the package are the same as those of the first embodiment, and the same components are denoted by the same reference numerals.
[0020]
The metal member 8 shown in FIGS. 6 to 10 has a notch 8a or a through hole 8b. In particular, in FIGS. 9 and 10, the shape of the metal member 8 itself is a shape other than a rectangle. Further, the metal member 8 may have both the notch 8a and the through hole 8b. Further, the shapes of the notch 8a and the through hole 8b are arbitrary, and are not limited to the shapes shown in FIGS. In addition, since the material is metal, cutting, plating, and the like can be relatively easily manufactured.
[0021]
(Embodiment 5)
Next, a fifth embodiment of the present invention will be described. In the fifth embodiment, the material of the metal member 8 used for the package shown in the above-described first to fourth embodiments is changed to a material having the same linear expansion coefficient as the linear expansion coefficient of the insulating terminal 3, such as tungsten or copper. The alloy is arbitrarily selected from a tungsten alloy, an iron-nickel alloy, an iron-nickel-cobalt alloy (trademark, Kovar) and the like. Thereby, it is possible to suppress the occurrence of distortion due to a difference in linear expansion coefficient between the metal member 8 and the insulating terminal 3 due to thermal deformation, so that problems such as the metal member 8 being peeled off are less likely to occur, A highly reliable package and an optical semiconductor element fixed module can be realized.
[0022]
(Embodiment 6)
Next, a sixth embodiment of the present invention will be described. FIG. 11 is a perspective view showing the configuration of the insulating element 3 and the metal member 8 used in the package according to the sixth embodiment of the present invention. FIG. 12 is a cross-sectional view showing a bonding relationship between the insulating element 3 and the metal member 8 shown in FIG. Other configurations of the package are the same as those of the first embodiment, and the same components are denoted by the same reference numerals.
[0023]
11 and 12, the metal wiring portion 7 is also provided on at least a part of the protruding surface 3a of the insulating terminal 3. In this case, for example, as shown in FIG. 12, since the metal member 8 can be stuck and fixed with the solder 11 so as to form a cheek stick, the package and the optical semiconductor can further firmly fix the metal member 8 and the metal wiring portion 7. An element fixing module can be realized.
[0024]
(Embodiment 7)
Next, a seventh embodiment of the present invention will be described. FIG. 13 is a sectional view showing a configuration of an optical semiconductor element fixing module according to Embodiment 7 of the present invention. The package shown in FIG. 13 is the package shown in the first embodiment, and is a current-carrying component housed and fixed inside the package, for example, a thermoelectric cooler (also referred to as a thermo module) 10, an optical semiconductor element, and other component members. And the lead wire 9 of the current-carrying part is joined to the metal member 8.
[0025]
In FIG. 13, this optical semiconductor element fixing module is such that a metal frame 2 is erected on a metal bottom plate 1, a thermo module 10 is arranged at the lowermost portion inside, and a laser diode is mounted on a fixing member 15 on the upper side. A heat sink on which a thermistor 14 for detecting the temperature of the laser diode 12 and the laser diode 12 is disposed, and a fixed base on which a photodiode 13 for monitoring the output of laser light is disposed, and near the laser diode 12, The optical lens 19a is fixed by the lens fixing member 18. On the other hand, in order to guide the laser light emitted from the laser diode 12 to the outside, a lead portion 6 is provided on a side wall of the metal frame 2, and the window 20, the optical lens 19 b, and the ferrule part 21 are sequentially provided on the lead portion 6. Laser light is guided from the optical fiber 22 arranged and connected to the ferrule part 21 to the outside. Thereafter, for example, nitrogen or the like is sealed in the package, and the package is sealed by the lid member 17.
[0026]
The current-carrying component may be, for example, a resistor, a capacitor, a coil, or the like, or an electric circuit combining them, or an IC, a circuit mounting board, or the like. Electrical connection.
[0027]
In addition, the optical semiconductor element realizes a package such as a laser diode 12 that emits laser light or a photodiode 13 that receives light, and an optical semiconductor element fixing module.
[0028]
(Embodiment 8)
Next, an eighth embodiment of the present invention will be described. In the eighth embodiment, the insulating material of the insulating terminal 3 shown in the first to seventh embodiments is specifically formed of a resin such as ceramic, glass, engineering plastic, or epoxy. I have.
[0029]
(Embodiment 9)
Next, a ninth embodiment of the present invention will be described. In the ninth embodiment, at least the entire surface layer or a desired portion of the metal member 8 shown in the first to eighth embodiments is replaced with a metal having good solderability, for example, Sn, Zn, Au, Ni. Etc. are applied by plating or vapor deposition.
[0030]
In addition, solder, for example, Pb-Sn, Zn-Sn, Au-Sn, Au-Si, or the like is pasted on the surface of the metal member 8 and heated to a predetermined temperature to melt the solder on the surface. It is fixed or attached and fixed while supplementing new solder.
[0031]
(Embodiment 10)
Next, a tenth embodiment of the present invention will be described. FIG. 14 is a diagram showing a bonding state between an insulating element and a metal member used in the package according to the tenth embodiment of the present invention. In Embodiment 10, in Embodiments 1 to 9 described above, the lead wire 9 is attached to the metal member 8 using laser welding. In FIG. 14, the lead wire 9 and the metal member 8 are adhered by the welding point 16. Alternatively, after the lead wire 9 is fixed by laser welding so as not to move during soldering, the lead wire 9 is attached and fixed by the solder 11.
[0032]
(Embodiment 11)
Next, an eleventh embodiment of the present invention will be described. FIG. 15 is a diagram showing a bonding state between the insulated terminal 3 and the lead wire in the package according to the eleventh embodiment of the present invention. Other configurations are the same as those of the first embodiment, and the same components are denoted by the same reference numerals.
[0033]
As shown in FIG. 15, in the eleventh embodiment, the solder 11 is applied through the notch 8 a of the metal member 8 protruding from the insulating terminal 3 and fixedly attached thereto, or through the upper and lower portions of the through hole 8 b. I have to.
[0034]
【The invention's effect】
As described above, according to the package and the optical semiconductor element fixing module of the present invention, there is no need to provide a cutout or the like for fixing the lead wire to the insulated terminal, so that the package is damaged by cracking or chipping. Can be prevented.
[0035]
Then, by fixing a part of the lead wire to the metal member by soldering, the solder material easily stays on the metal member. Since the distance to the metal wiring portion can be increased to some extent, contact becomes difficult. As a result, a desired wiring pattern and electrical characteristics formed on the metal wiring portion can be obtained, and for example, it is possible to effectively prevent, for example, the worst case electrical short circuit from occurring.
[Brief description of the drawings]
FIG. 1 is a perspective view showing a schematic configuration of a package according to a first embodiment of the present invention. FIG. 3 is a diagram of an optical semiconductor element fixed module.
FIG. 2 is a perspective view showing a configuration of an insulating terminal in a package according to a second embodiment of the present invention;
FIG. 3 is a diagram showing a bonding state between an insulating terminal and a metal member in a package according to a third embodiment of the present invention;
FIG. 4 is a view showing a state where lead wires are arranged in the bonding state shown in FIG. 3;
FIG. 5 is a view showing a state in which the lead wire is fixed by solder in the bonding state shown in FIG. 4;
FIG. 6 is a perspective view showing an example of a configuration of a metal member used for a package according to a fourth embodiment of the present invention.
FIG. 7 is a perspective view showing an example of a configuration of a metal member used for a package according to a fourth embodiment of the present invention.
FIG. 8 is a perspective view showing an example of a configuration of a metal member used for a package according to a fourth embodiment of the present invention.
FIG. 9 is a perspective view showing an example of a configuration of a metal member used for a package according to a fourth embodiment of the present invention.
FIG. 10 is a perspective view showing an example of a configuration of a metal member used for a package according to a fourth embodiment of the present invention.
FIG. 11 is a perspective view showing a configuration of an insulating terminal and a metal member in a package according to a sixth embodiment of the present invention.
FIG. 12 is a cross-sectional view showing a bonding state between an insulating terminal and a metal member in a package according to a sixth embodiment of the present invention.
FIG. 13 is a sectional view showing a configuration of an optical semiconductor element fixing module according to a seventh embodiment of the present invention.
FIG. 14 is a diagram showing a joint state between an insulating terminal and a metal member in a package according to a tenth embodiment of the present invention.
FIG. 15 is a diagram showing a bonding state of an insulating terminal, a metal member, and a lead wire in a package according to an eleventh embodiment of the present invention.
FIG. 16 is a perspective view showing a configuration of a conventional package.
FIG. 17 is a perspective view and a front view of an insulating element used in a conventional package.
18A and 18B are a perspective view and a front view showing a state where lead wires are arranged on the insulating element in FIG.
19 is a perspective view and a front view showing a state in which the insulating element and the lead wire in FIG. 18 are fixed by soldering.
20 is a front view showing an example in which the solder spreads to the adjacent metal wiring portion in the solder fixing in FIG. 19;
21 is a front view showing an example in which the solder wraps downward in the solder fixing in FIG. 19;
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Metal bottom plate 2 Metal frame 3 Insulating terminal 3a, 3b Projecting part 3d, 8a Notch 3c, 3e, 8b Through hole 4 Sealing member 5 Lead terminal 6 Leading part 7 Metal wiring part 8 Metal member 9 Lead wire 10 Thermoelectric cooler (Thermo module)
Reference Signs List 11 solder 12 laser diode 13 photodiode 14 thermistor 15 fixing member 16 welding point 17 lid member 18 lens fixing members 19a, 19b optical lens 20 window 21 ferrule part 22 optical fiber

Claims (7)

A metal bottom plate for fixing a current-carrying component that performs electrical input or output via electrical wiring,
A metal frame erected on the metal bottom plate,
An insulating terminal having a metal wiring portion projecting through at least the inside of the side wall of the metal frame and conducting between the inside and the outside of the metal frame;
A metal member attached and fixed to the metal wiring portion of the insulating terminal, and fixing the electric wiring,
A package comprising: The package according to claim 1, wherein the insulating terminal is a straight member. The package according to claim 1, wherein the metal member is attached and fixed so as to protrude from the insulating terminal. The package according to any one of claims 1 to 3, wherein the metal member has at least one of a cutout for fixing the electric wiring and a through hole. The package according to any one of claims 1 to 4, wherein a linear expansion coefficient of the metal member is equal to a linear expansion coefficient of the insulating terminal. The package according to claim 1, wherein the metal wiring portion is provided on at least a part of a protruding surface of the insulating terminal. An optical semiconductor element fixing module comprising the package according to any one of claims 1 to 6, the current-carrying component, and an optical semiconductor element fixed inside the module.
At least the electrical wiring of the current-carrying part is joined to the metal member.

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