JP2004031530A - Integrated circuit device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an integrated circuit device which transmits a signal at a long distance when the high-frequency signal is used with high reliability. <P>SOLUTION: A first signal conductor 7 through an insulator layer 6 and second wirings 8, 10 and 12 covering the first signal conductor 7 through insulating layers 9 and 10 are formed on a conductor layer (a ground plane) 5. Accordingly, the attenuation of the high-frequency component of a signal conductor 1 can be inhibited by making the differential signal of the first signal conductor flow through the second wiring or treating the second wiring as a ground. The attenuation of the high-frequency signal can also be inhibited by transmitting a low-frequency signal to the first signal conductor and transmitting the high-frequency signal to the second wiring with a cross section having a long perimeter. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to wiring of an integrated circuit device.
[0002]
[Prior art]
The frequency used in integrated circuits such as LSIs, IC packages, and printed wiring boards is increasing year by year. Since the high-frequency component is more easily attenuated than the low-frequency component, when the integrated circuit transmits a high-frequency signal, the attenuation of the high-frequency component of the signal appears remarkably. For this reason, necessary information may not be transmitted accurately.
[0003]
In order to prevent this, as shown in FIG. 1, a microstrip line in which a ground plane (conductor layer) 1 is provided below the signal line 3 to enhance the electromagnetic coupling between the signal line 3 and the ground plane 1 is used in an integrated circuit. In addition to providing a ground plane below the signal line and providing ground lines on both sides of the signal line, the transmission wave can be made more stable in the TEM mode (the electric and magnetic fields do not change in the signal transmission direction). It is trying to suppress the attenuation of the high-frequency component by making the microstrip line closer to (state) coplanar.
[0004]
[Problems to be solved by the invention]
Even if the above-mentioned microstrip line or microstrip line is coplanarized, the conductor that receives the electromagnetic radiation from the signal line does not cover the circumference, so that the high-frequency component is attenuated with the transmission, and the long-range of the high-frequency signal Cannot transmit.
[0005]
Therefore, an object of the present invention is to provide a highly reliable integrated circuit device that can transmit a signal over a long distance when a high-frequency signal is used.
[0006]
[Means for Solving the Problems]
In order to achieve the above object in the present invention, according to the first aspect of the present invention, a first signal line on a conductor layer (ground plane) via an insulator layer and the first signal line are connected to an insulating layer. And a second wiring that covers the semiconductor device via an interposer.
[0007]
According to a second aspect of the present invention, there is provided the integrated circuit device according to the first aspect, further comprising a conductor layer (ground plane) on the second wiring via an insulating layer. .
[0008]
According to a third aspect of the present invention, there is provided an integrated circuit comprising: a first signal line; and a second wiring which covers the first signal line via an insulating layer, and has no conductor layer (ground plane). It is a circuit device.
[0009]
According to a fourth aspect of the present invention, there is provided the integrated circuit device according to any one of the first to third aspects, wherein the second wiring completely surrounds the first signal line.
[0010]
According to a fifth aspect of the present invention, there is provided the integrated circuit device according to any one of the first to fourth aspects, wherein a ground line covers the second wiring.
[0011]
BEST MODE FOR CARRYING OUT THE INVENTION
According to the present invention, for example, a microstrip line is formed by providing a dielectric layer on a ground plane (conductor layer) and providing a first signal line on the dielectric layer, and forms a microstrip line so as to surround the first signal line. 2 are formed (see FIG. 2).
[0012]
Thus, the dielectric layer is provided on the ground plane (conductor layer), and the first signal line is provided on the dielectric layer to form a microstrip line, and the second wiring is formed so as to surround the first signal line. In the case where it is necessary to transmit a high-frequency signal for a long time in the integrated circuit device, the attenuation of the signal can be suppressed, so that accurate data transmission becomes possible.
[0013]
【Example】
Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings.
[0014]
2 and 3 schematically show an embodiment of the integrated circuit according to the present invention. FIG. 2 shows a sectional element structure of the integrated circuit, and FIG. 3 shows a signal line extracting mechanism. 3A is a cross-sectional view of the side surface, and FIG. 3B is a cross-sectional view of the wiring 12 at a height that is horizontal to the ground plane 5.
[0015]
That is, the integrated circuit includes a ground plane 5 formed on a semiconductor substrate using a high-frequency signal, a dielectric layer 6 formed on the ground plane 5, and a first plane formed on the dielectric layer 6. The signal line 7 includes second wirings 8, 10, 12 formed so as to cover the signal line 7 via insulating layers 9, 11, and a dielectric layer 13 formed thereon. The second wirings 8, 10, 12 may be covered with ground lines.
[0016]
Here, a method of manufacturing the above-described integrated circuit will be described.
First, a ground plane 5 is formed by depositing Cu (copper) by a normal process, for example, a sputtering method. Next, the dielectric layer 6 is formed using a CVD method or the like. Further, Cu is deposited by a sputtering method or the like. Then, this is patterned to form the signal lines 7 and 8.
[0017]
Alternatively, the signal lines 7 and 8 may be formed by patterning a prepreg material (a plate having Cu deposited on both surfaces of a dielectric layer).
[0018]
At this time, signal lines 8 are arranged on both sides of the signal lines 7 so as to be in parallel with the signal lines 7.
Next, a dielectric layer 9 is formed by a CVD method or the like. After that, Cu is deposited by a sputtering method or the like. Then, the wiring 10 is formed by patterning. The dielectric layer 11 is formed in the same manner as the dielectric layer 9. Next, a through hole 14 is formed using PEP technology or the like.
[0019]
Alternatively, the dielectric layers 9 and 11 may be deposited on the signal lines 7 and 8 by a CVD method or the like, and the wirings 10 and the through holes 14 may be formed using a laser or the like.
[0020]
The wiring 12 and the input land 15 are formed in the same manner as the signal line 7. Next, the dielectric layer 13 is formed by the CVD method or the like, and the through holes 16 and 17 are formed by the PEP technique or the like.
At this time, the signal line 7 is covered with the wirings 8, 10, and 12.
[0021]
The input or output of the signal line 7 is formed by providing a through hole or the like in the wiring 8, 10, 12 or the ground plane 5 as shown in FIG. Also, the wirings 8, 110, and 12 are formed by providing through holes and the like in the same manner as the signal line 7.
[0022]
That is, in this integrated circuit, the upper part and both sides of the signal line 7 for handling the main signal are covered with the wirings 8, 10 and 12, and the lower part of the signal line 7 is surrounded by the ground plane 5. I have.
[0023]
Therefore, by providing the ground plane 5 below such a structure, that is, the signal line 7 for handling the main signal and the wirings 8, 10, and 12 for handling the differential signal, the signal line 7 for handling the main signal and its differential Since the attenuation of the signal transmitted through the wirings 8, 10, and 12 for handling the signal is suppressed, and the main signal 7 is covered with the differential signal, the function of further suppressing the attenuation of the main signal is provided.
[0024]
As a result, by using this integrated circuit to suppress the attenuation of the high-frequency signal, it is possible to develop an information technology device for transmitting accurate data.
[0025]
In the above embodiment, the material of the wiring is limited to Cu, but may be Al or the like.
[0026]
Also, the case where the ground plane 5 is provided below the signal line 7 has been described. However, the ground plane 5 is provided not only below but also above the signal line 7 so that two lines (the signal line 7 and the wirings 8, 10, 12) may be sandwiched from above and below. This structure can also be formed when the integrated circuits of FIG. 2 described as a specific example are stacked (see FIG. 4).
[0027]
Further, the signal line 7 may be covered with the wirings 8, 10, and 12 without the ground plane 5 in FIG. 2 (not shown).
[0028]
Further, as shown in FIG. 5, the signal line 7 may be completely surrounded by the wirings 8, 10, 12, 19, and 20 without any gap.
Further, the signal line 7 may be completely surrounded by the wirings 8, 10, 12, 19, and 20 without any gap, and the ground planes 5 may be provided above and below the wirings 8, 10, 12, 19, and 20 (not shown). Alternatively, the ground plane 5 may be absent in both the upper part and the lower part (not shown).
Further, the wirings 8, 10, 12, 19, and 20 may be covered with ground lines.
[0029]
【The invention's effect】
According to the present invention, the attenuation of the high-frequency component of the signal line 1 can be suppressed by flowing the differential signal of the first signal line to the second wiring or treating it as ground. Further, by transmitting a low-frequency signal to the first signal line and transmitting a high-frequency signal to the second wiring having a long perimeter in cross section, attenuation of the high-frequency signal can be suppressed. .
[0030]
As described above, the present invention can provide a highly reliable semiconductor integrated circuit device because attenuation of a high-frequency signal can be suppressed in an integrated circuit that uses a high-frequency signal.
[Brief description of the drawings]
FIG. 1 is a cross-sectional view of an integrated circuit shown to explain a conventional technique and its problems.
FIG. 2 is a sectional view schematically showing an integrated circuit according to an embodiment of the present invention.
FIG. 3A is a side cross-sectional view illustrating a signal input / output unit in the integrated circuit according to the embodiment shown in FIG. 2;
FIG. 2B is a horizontal sectional view illustrating a signal input / output unit in the integrated circuit according to the embodiment shown in FIG.
FIG. 4 is a sectional view schematically showing an integrated circuit according to an embodiment of the present invention.
FIG. 5 is a sectional view schematically showing an integrated circuit according to an embodiment of the present invention.
[Explanation of symbols]
1, 5 ground planes 2, 4, 6, 9, 11, 13, 18, 21 dielectric layers 3, 7 signal lines 8, 10, 12, 19, 20 wiring (signal lines, ground lines, power supply line)
14, 16, 17 ... Input / output through holes (vias)
15 land for input and output

Claims (5)

An integrated circuit device, comprising: a first signal line on a conductor layer (ground plane) via an insulator layer; and a second wiring covering the first signal line via an insulating layer. 2. The integrated circuit device according to claim 1, further comprising a conductor layer (ground plane) on the second wiring via an insulating layer. An integrated circuit device comprising: a first signal line; and a second wiring that covers the first signal line via an insulating layer, and has no conductor layer (ground plane). 4. The integrated circuit device according to claim 1, wherein the second wiring completely surrounds the first signal line. 5. The integrated circuit device according to claim 1, wherein a ground line covers the second wiring.

Images