JP2004025301A5 - - Google Patents
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- Publication number
- JP2004025301A5 JP2004025301A5 JP2003057944A JP2003057944A JP2004025301A5 JP 2004025301 A5 JP2004025301 A5 JP 2004025301A5 JP 2003057944 A JP2003057944 A JP 2003057944A JP 2003057944 A JP2003057944 A JP 2003057944A JP 2004025301 A5 JP2004025301 A5 JP 2004025301A5
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP02005422A EP1342525A1 (de) | 2002-03-08 | 2002-03-08 | Verfahren und Einrichtung zum Auftragen von Lot auf ein Substrat |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2004025301A JP2004025301A (ja) | 2004-01-29 |
| JP2004025301A5 true JP2004025301A5 (ja) | 2006-05-18 |
Family
ID=27741159
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2003057944A Pending JP2004025301A (ja) | 2002-03-08 | 2003-03-05 | ハンダを基板上に小出しする方法と装置 |
Country Status (4)
| Country | Link |
|---|---|
| EP (1) | EP1342525A1 (ja) |
| JP (1) | JP2004025301A (ja) |
| AT (1) | ATE340048T1 (ja) |
| DE (1) | DE50305098D1 (ja) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| SG106126A1 (en) * | 2002-03-08 | 2004-09-30 | Esec Trading Sa | Method and apparatus for dispensing solder on a substrate |
| US7410092B2 (en) * | 2006-04-21 | 2008-08-12 | International Business Machines Corporation | Fill head for injection molding of solder |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3734550A1 (de) * | 1987-10-13 | 1989-04-27 | Franz Ummen | Hochfrequenzbeheizter lotinjektor |
| US4934309A (en) * | 1988-04-15 | 1990-06-19 | International Business Machines Corporation | Solder deposition system |
| DE3913143C2 (de) * | 1989-04-21 | 1996-09-05 | U T S Uhrentechnik Schwarzwald | Löt- oder Schweißvorrichtung |
| DE59609491D1 (de) * | 1995-07-01 | 2002-08-29 | Esec Trading Sa | Formstempel zum Austragen von flüssigem Lot |
| JPH09232746A (ja) * | 1996-02-27 | 1997-09-05 | Omron Corp | 半田付け装置および半田付け方法 |
| JP3590319B2 (ja) * | 2000-03-10 | 2004-11-17 | 株式会社ジャパンユニックス | ガス噴射式はんだ付け方法及び装置 |
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2002
- 2002-03-08 EP EP02005422A patent/EP1342525A1/de not_active Withdrawn
-
2003
- 2003-03-05 DE DE50305098T patent/DE50305098D1/de not_active Expired - Fee Related
- 2003-03-05 AT AT03100535T patent/ATE340048T1/de not_active IP Right Cessation
- 2003-03-05 JP JP2003057944A patent/JP2004025301A/ja active Pending